JPS4990234A - - Google Patents

Info

Publication number
JPS4990234A
JPS4990234A JP48119487A JP11948773A JPS4990234A JP S4990234 A JPS4990234 A JP S4990234A JP 48119487 A JP48119487 A JP 48119487A JP 11948773 A JP11948773 A JP 11948773A JP S4990234 A JPS4990234 A JP S4990234A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48119487A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4990234A publication Critical patent/JPS4990234A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP48119487A 1972-12-18 1973-10-25 Pending JPS4990234A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00316278A US3833481A (en) 1972-12-18 1972-12-18 Electroforming nickel copper alloys

Publications (1)

Publication Number Publication Date
JPS4990234A true JPS4990234A (fi) 1974-08-28

Family

ID=23228346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48119487A Pending JPS4990234A (fi) 1972-12-18 1973-10-25

Country Status (8)

Country Link
US (1) US3833481A (fi)
JP (1) JPS4990234A (fi)
BE (1) BE804107A (fi)
CA (1) CA1019274A (fi)
DE (1) DE2359924A1 (fi)
GB (1) GB1435208A (fi)
IT (1) IT995341B (fi)
NL (1) NL7310599A (fi)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130388A (ja) * 1989-10-14 1991-06-04 Dowa Mining Co Ltd アルミニウム合金素材のメッキ処理法
WO2013157639A1 (ja) 2012-04-19 2013-10-24 ディップソール株式会社 銅－ニッケル合金電気めっき浴及びめっき方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL76592A (en) * 1985-10-06 1989-03-31 Technion Res & Dev Foundation Method for electrodeposition of at least two metals from a single solution
MY111621A (en) * 1993-12-16 2000-09-27 Kiyokawa Plating Ind Co Ltd Method for producing metal film resistor
TW317575B (fi) * 1994-01-21 1997-10-11 Olin Corp
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
US6547946B2 (en) * 2000-04-10 2003-04-15 The Regents Of The University Of California Processing a printed wiring board by single bath electrodeposition
DE60211808T2 (de) * 2001-07-31 2006-10-19 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe Plattierte Kupferlegierung und Verfahren zu ihre Herstellung
US6992389B2 (en) * 2004-04-28 2006-01-31 International Business Machines Corporation Barrier for interconnect and method
CN102393409A (zh) * 2011-07-14 2012-03-28 徐志花 新型高效用于硝基苯检测的NiCu/Cu电化学传感器及其制备方法
CN103484904A (zh) * 2013-10-08 2014-01-01 昆山纯柏精密五金有限公司 一种铁基五金件的镀铜工艺
JP6439172B2 (ja) * 2014-08-08 2018-12-19 ディップソール株式会社 銅−ニッケル合金電気めっき浴
CH713970A1 (fr) * 2017-07-12 2019-01-15 Sa De La Manufacture Dhorlogerie Audemars Piguet & Cie Composant horloger en alliage binaire CuNi amagnétique.
CN113774442B (zh) * 2021-09-23 2023-02-17 中冶赛迪技术研究中心有限公司 一种基于内生析出法的纳米复合镀层及其制备工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
DE576585C (de) * 1931-05-13 1933-05-13 Julius Winkler Jr Verfahren zur Herstellung legierter galvanischer Niederschlaege
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
GB957808A (en) * 1962-02-09 1964-05-13 Ass Elect Ind Electrodeposition of copper-nickel alloy

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03130388A (ja) * 1989-10-14 1991-06-04 Dowa Mining Co Ltd アルミニウム合金素材のメッキ処理法
WO2013157639A1 (ja) 2012-04-19 2013-10-24 ディップソール株式会社 銅－ニッケル合金電気めっき浴及びめっき方法
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method

Also Published As

Publication number Publication date
BE804107A (nl) 1973-12-17
NL7310599A (fi) 1974-06-20
CA1019274A (en) 1977-10-18
GB1435208A (en) 1976-05-12
DE2359924A1 (de) 1974-06-20
US3833481A (en) 1974-09-03
IT995341B (it) 1975-11-10

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