JPS4831185A - - Google Patents

Info

Publication number
JPS4831185A
JPS4831185A JP47085020A JP8502072A JPS4831185A JP S4831185 A JPS4831185 A JP S4831185A JP 47085020 A JP47085020 A JP 47085020A JP 8502072 A JP8502072 A JP 8502072A JP S4831185 A JPS4831185 A JP S4831185A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47085020A
Other languages
Japanese (ja)
Other versions
JPS527439B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4831185A publication Critical patent/JPS4831185A/ja
Publication of JPS527439B2 publication Critical patent/JPS527439B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
JP47085020A 1971-08-26 1972-08-26 Expired JPS527439B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00175247A US3856654A (en) 1971-08-26 1971-08-26 Apparatus for feeding and coating masses of workpieces in a controlled atmosphere

Publications (2)

Publication Number Publication Date
JPS4831185A true JPS4831185A (enrdf_load_stackoverflow) 1973-04-24
JPS527439B2 JPS527439B2 (enrdf_load_stackoverflow) 1977-03-02

Family

ID=22639550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47085020A Expired JPS527439B2 (enrdf_load_stackoverflow) 1971-08-26 1972-08-26

Country Status (11)

Country Link
US (1) US3856654A (enrdf_load_stackoverflow)
JP (1) JPS527439B2 (enrdf_load_stackoverflow)
BE (1) BE787884A (enrdf_load_stackoverflow)
CA (1) CA992910A (enrdf_load_stackoverflow)
DE (1) DE2241634B2 (enrdf_load_stackoverflow)
FR (1) FR2165849B1 (enrdf_load_stackoverflow)
GB (1) GB1406509A (enrdf_load_stackoverflow)
HK (1) HK36276A (enrdf_load_stackoverflow)
IT (1) IT962154B (enrdf_load_stackoverflow)
NL (1) NL155314B (enrdf_load_stackoverflow)
SE (1) SE391739B (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187185U (enrdf_load_stackoverflow) * 1975-01-06 1976-07-13
JPS5218585A (en) * 1975-08-05 1977-02-12 Tadano Tekkosho:Kk Double-acting hydraulic cylinder
JPS5797903A (en) * 1980-12-06 1982-06-17 Yunitsuku:Kk Double-acting cylinder
JPS5970764A (ja) * 1982-10-15 1984-04-21 Ulvac Corp プラズマｃｖｄ装置

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573985A5 (enrdf_load_stackoverflow) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
AU507748B2 (en) * 1976-06-10 1980-02-28 University Of Sydney, The Reactive sputtering
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4172021A (en) * 1978-10-13 1979-10-23 Western Electric Company, Inc. Method and glow-suppression devices for transporting a gas across a voltage drop
US4268374A (en) * 1979-08-09 1981-05-19 Bell Telephone Laboratories, Incorporated High capacity sputter-etching apparatus
US4756815A (en) 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4436602A (en) 1981-11-27 1984-03-13 Varian Associates, Inc. Blocking shield and method for contouring the thickness of sputter coated layers
JPS58197262A (ja) * 1982-05-13 1983-11-16 Canon Inc 量産型真空成膜装置及び真空成膜法
DE3306870A1 (de) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4522697A (en) * 1983-12-22 1985-06-11 Sputtered Films, Inc. Wafer processing machine
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
US4508612A (en) * 1984-03-07 1985-04-02 International Business Machines Corporation Shield for improved magnetron sputter deposition into surface recesses
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
FR2594102B1 (fr) * 1986-02-12 1991-04-19 Stein Heurtey Installation flexible automatisee de traitement thermochimique rapide
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US4952294A (en) * 1988-03-15 1990-08-28 Collins George J Apparatus and method for in-situ generation of dangerous polyatomic gases, including polyatomic radicals
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5059292A (en) * 1989-02-28 1991-10-22 Collins George J Single-chamber apparatus for in-situ generation of dangerous polyatomic gases and radicals from a source material contained within a porous foamed structure
DE59205106D1 (de) * 1991-12-27 1996-02-29 Balzers Hochvakuum Vakuumbehandlungsanlage und deren Verwendungen
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with cathodically vaporized connections and method for depositing cathodically vaporized connections on varistors.
DE4235677C2 (de) * 1992-10-22 1996-10-31 Balzers Hochvakuum Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren
DE4235674C2 (de) * 1992-10-22 2000-12-28 Balzers Ag Liechtenstein Kammer für den Transport von Werkstücken in Vakuumatmosphäre, Kammerkombination und Verfahren zum Transportieren eines Werkstückes
DE4235676C2 (de) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vakuumkammer zum Transport scheibenförmiger Werkstücke in einer Vakuumanlage
US5421979A (en) * 1993-08-03 1995-06-06 Photran Corporation Load-lock drum-type coating apparatus
DE4341635C2 (de) * 1993-12-07 2002-07-18 Unaxis Deutschland Holding Vakuumbeschichtungsanlage
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
DE19537267C1 (de) * 1994-10-19 1996-07-04 Grc Glass Refining Center Ges Verfahren zum Aufbringen von dünnen farbigen Schichten auf Substrate mit gekrümmten Oberflächen, insbesondere auf rotationssymmetrische Substrate, sowie Vorrichtung zur Durchführung des Verfahrens
DE19624609B4 (de) * 1996-06-20 2009-04-16 Leybold Optics Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf Substrate, beispielsweise auf Scheinwerferreflektoren
DE19626861B4 (de) * 1996-07-04 2009-04-16 Leybold Optics Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf Substrate, beispielsweise auf Scheinwerferreflektoren
DE19642852A1 (de) 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate
US6210540B1 (en) * 2000-03-03 2001-04-03 Optical Coating Laboratory, Inc. Method and apparatus for depositing thin films on vertical surfaces
US20020110700A1 (en) * 2001-02-12 2002-08-15 Hein Gerald F. Process for forming decorative films and resulting products
US20100218721A1 (en) * 2007-09-05 2010-09-02 Atomic Energy Council - Institute Of Nuclear Energy Research Hollow-cathode discharge apparatus for plasma-based processing
KR101458909B1 (ko) * 2008-04-03 2014-11-07 삼성디스플레이 주식회사 인 라인 설비
CN102080214B (zh) * 2009-11-30 2013-06-05 鸿富锦精密工业（深圳）有限公司 镀膜装置
TW201122148A (en) * 2009-12-24 2011-07-01 Hon Hai Prec Ind Co Ltd Chemical vapor deposition device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340176A (en) * 1965-07-28 1967-09-05 Western Electric Co Vacuum processing machine
FR1502647A (enrdf_load_stackoverflow) * 1965-12-17 1968-02-07
US3451912A (en) * 1966-07-15 1969-06-24 Ibm Schottky-barrier diode formed by sputter-deposition processes
US3501393A (en) * 1967-05-05 1970-03-17 Litton Systems Inc Apparatus for sputtering wherein the plasma is confined by the target structure
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5187185U (enrdf_load_stackoverflow) * 1975-01-06 1976-07-13
JPS5218585A (en) * 1975-08-05 1977-02-12 Tadano Tekkosho:Kk Double-acting hydraulic cylinder
JPS5797903A (en) * 1980-12-06 1982-06-17 Yunitsuku:Kk Double-acting cylinder
JPS5970764A (ja) * 1982-10-15 1984-04-21 Ulvac Corp プラズマｃｖｄ装置

Also Published As

Publication number Publication date
NL7211410A (enrdf_load_stackoverflow) 1973-02-28
JPS527439B2 (enrdf_load_stackoverflow) 1977-03-02
CA992910A (en) 1976-07-13
DE2241634A1 (de) 1973-03-01
FR2165849B1 (enrdf_load_stackoverflow) 1975-03-07
FR2165849A1 (enrdf_load_stackoverflow) 1973-08-10
BE787884A (fr) 1972-12-18
HK36276A (en) 1976-06-18
DE2241634B2 (de) 1974-11-21
IT962154B (it) 1973-12-20
NL155314B (nl) 1977-12-15
GB1406509A (en) 1975-09-17
US3856654A (en) 1974-12-24
SE391739B (sv) 1977-02-28

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