IT962154B - Metodi ed apparati per alimentare e rivestire masse di pezzi da lavorare in una atmosfera controllata - Google Patents

Metodi ed apparati per alimentare e rivestire masse di pezzi da lavorare in una atmosfera controllata

Info

Publication number
IT962154B
IT962154B IT5225172A IT5225172A IT962154B IT 962154 B IT962154 B IT 962154B IT 5225172 A IT5225172 A IT 5225172A IT 5225172 A IT5225172 A IT 5225172A IT 962154 B IT962154 B IT 962154B
Authority
IT
Italy
Prior art keywords
pieces
feeding
work
equipment
methods
Prior art date
Application number
IT5225172A
Other languages
English (en)
Italian (it)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of IT962154B publication Critical patent/IT962154B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
IT5225172A 1971-08-26 1972-08-18 Metodi ed apparati per alimentare e rivestire masse di pezzi da lavorare in una atmosfera controllata IT962154B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00175247A US3856654A (en) 1971-08-26 1971-08-26 Apparatus for feeding and coating masses of workpieces in a controlled atmosphere

Publications (1)

Publication Number Publication Date
IT962154B true IT962154B (it) 1973-12-20

Family

ID=22639550

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5225172A IT962154B (it) 1971-08-26 1972-08-18 Metodi ed apparati per alimentare e rivestire masse di pezzi da lavorare in una atmosfera controllata

Country Status (11)

Country Link
US (1) US3856654A (enrdf_load_stackoverflow)
JP (1) JPS527439B2 (enrdf_load_stackoverflow)
BE (1) BE787884A (enrdf_load_stackoverflow)
CA (1) CA992910A (enrdf_load_stackoverflow)
DE (1) DE2241634B2 (enrdf_load_stackoverflow)
FR (1) FR2165849B1 (enrdf_load_stackoverflow)
GB (1) GB1406509A (enrdf_load_stackoverflow)
HK (1) HK36276A (enrdf_load_stackoverflow)
IT (1) IT962154B (enrdf_load_stackoverflow)
NL (1) NL155314B (enrdf_load_stackoverflow)
SE (1) SE391739B (enrdf_load_stackoverflow)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573985A5 (enrdf_load_stackoverflow) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
JPS5519289Y2 (enrdf_load_stackoverflow) * 1975-01-06 1980-05-08
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber
JPS5218585A (en) * 1975-08-05 1977-02-12 Tadano Tekkosho:Kk Double-acting hydraulic cylinder
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
AU507748B2 (en) * 1976-06-10 1980-02-28 University Of Sydney, The Reactive sputtering
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4172021A (en) * 1978-10-13 1979-10-23 Western Electric Company, Inc. Method and glow-suppression devices for transporting a gas across a voltage drop
US4268374A (en) * 1979-08-09 1981-05-19 Bell Telephone Laboratories, Incorporated High capacity sputter-etching apparatus
US4756815A (en) 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4647266A (en) * 1979-12-21 1987-03-03 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
JPS5797903A (en) * 1980-12-06 1982-06-17 Yunitsuku:Kk Double-acting cylinder
US4436602A (en) 1981-11-27 1984-03-13 Varian Associates, Inc. Blocking shield and method for contouring the thickness of sputter coated layers
JPS58197262A (ja) * 1982-05-13 1983-11-16 Canon Inc 量産型真空成膜装置及び真空成膜法
JPS5970764A (ja) * 1982-10-15 1984-04-21 Ulvac Corp プラズマｃｖｄ装置
DE3306870A1 (de) * 1983-02-26 1984-08-30 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4522697A (en) * 1983-12-22 1985-06-11 Sputtered Films, Inc. Wafer processing machine
US4523985A (en) * 1983-12-22 1985-06-18 Sputtered Films, Inc. Wafer processing machine
US4508612A (en) * 1984-03-07 1985-04-02 International Business Machines Corporation Shield for improved magnetron sputter deposition into surface recesses
US4491509A (en) * 1984-03-09 1985-01-01 At&T Technologies, Inc. Methods of and apparatus for sputtering material onto a substrate
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
FR2594102B1 (fr) * 1986-02-12 1991-04-19 Stein Heurtey Installation flexible automatisee de traitement thermochimique rapide
US4812217A (en) * 1987-04-27 1989-03-14 American Telephone And Telegraph Company, At&T Bell Laboratories Method and apparatus for feeding and coating articles in a controlled atmosphere
US4952294A (en) * 1988-03-15 1990-08-28 Collins George J Apparatus and method for in-situ generation of dangerous polyatomic gases, including polyatomic radicals
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5059292A (en) * 1989-02-28 1991-10-22 Collins George J Single-chamber apparatus for in-situ generation of dangerous polyatomic gases and radicals from a source material contained within a porous foamed structure
DE59205106D1 (de) * 1991-12-27 1996-02-29 Balzers Hochvakuum Vakuumbehandlungsanlage und deren Verwendungen
US5565838A (en) * 1992-05-28 1996-10-15 Avx Corporation Varistors with sputtered terminations
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with cathodically vaporized connections and method for depositing cathodically vaporized connections on varistors.
DE4235677C2 (de) * 1992-10-22 1996-10-31 Balzers Hochvakuum Vakuumkammer, Vakuumbehandlungsanlage mit einer solchen Kammer sowie Transportverfahren
DE4235674C2 (de) * 1992-10-22 2000-12-28 Balzers Ag Liechtenstein Kammer für den Transport von Werkstücken in Vakuumatmosphäre, Kammerkombination und Verfahren zum Transportieren eines Werkstückes
DE4235676C2 (de) * 1992-10-22 1997-08-28 Balzers Hochvakuum Vakuumkammer zum Transport scheibenförmiger Werkstücke in einer Vakuumanlage
US5421979A (en) * 1993-08-03 1995-06-06 Photran Corporation Load-lock drum-type coating apparatus
DE4341635C2 (de) * 1993-12-07 2002-07-18 Unaxis Deutschland Holding Vakuumbeschichtungsanlage
US5791895A (en) * 1994-02-17 1998-08-11 Novellus Systems, Inc. Apparatus for thermal treatment of thin film wafer
DE19537267C1 (de) * 1994-10-19 1996-07-04 Grc Glass Refining Center Ges Verfahren zum Aufbringen von dünnen farbigen Schichten auf Substrate mit gekrümmten Oberflächen, insbesondere auf rotationssymmetrische Substrate, sowie Vorrichtung zur Durchführung des Verfahrens
DE19624609B4 (de) * 1996-06-20 2009-04-16 Leybold Optics Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf Substrate, beispielsweise auf Scheinwerferreflektoren
DE19626861B4 (de) * 1996-07-04 2009-04-16 Leybold Optics Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf Substrate, beispielsweise auf Scheinwerferreflektoren
DE19642852A1 (de) 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate
US6210540B1 (en) * 2000-03-03 2001-04-03 Optical Coating Laboratory, Inc. Method and apparatus for depositing thin films on vertical surfaces
US20020110700A1 (en) * 2001-02-12 2002-08-15 Hein Gerald F. Process for forming decorative films and resulting products
US20100218721A1 (en) * 2007-09-05 2010-09-02 Atomic Energy Council - Institute Of Nuclear Energy Research Hollow-cathode discharge apparatus for plasma-based processing
KR101458909B1 (ko) * 2008-04-03 2014-11-07 삼성디스플레이 주식회사 인 라인 설비
CN102080214B (zh) * 2009-11-30 2013-06-05 鸿富锦精密工业（深圳）有限公司 镀膜装置
TW201122148A (en) * 2009-12-24 2011-07-01 Hon Hai Prec Ind Co Ltd Chemical vapor deposition device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340176A (en) * 1965-07-28 1967-09-05 Western Electric Co Vacuum processing machine
FR1502647A (enrdf_load_stackoverflow) * 1965-12-17 1968-02-07
US3451912A (en) * 1966-07-15 1969-06-24 Ibm Schottky-barrier diode formed by sputter-deposition processes
US3501393A (en) * 1967-05-05 1970-03-17 Litton Systems Inc Apparatus for sputtering wherein the plasma is confined by the target structure
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system

Also Published As

Publication number Publication date
NL7211410A (enrdf_load_stackoverflow) 1973-02-28
JPS527439B2 (enrdf_load_stackoverflow) 1977-03-02
CA992910A (en) 1976-07-13
DE2241634A1 (de) 1973-03-01
FR2165849B1 (enrdf_load_stackoverflow) 1975-03-07
FR2165849A1 (enrdf_load_stackoverflow) 1973-08-10
BE787884A (fr) 1972-12-18
HK36276A (en) 1976-06-18
JPS4831185A (enrdf_load_stackoverflow) 1973-04-24
DE2241634B2 (de) 1974-11-21
NL155314B (nl) 1977-12-15
GB1406509A (en) 1975-09-17
US3856654A (en) 1974-12-24
SE391739B (sv) 1977-02-28

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