JPH1197469A - Manufacture of premold package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance airtightness of a package body and corrosion resistance of a lead frame portion embedded in the package body, by preventing the package body from formation of a hole made by extraction of a support pin, and preventing the opening of the hole from being formed with flashes therearound. SOLUTION: One surface of a covering tape 100 is bonded to a bonding area 24 of a lead frame 20. The lead frame 20 is then loaded on a metal base 30 for resin molding, so that the other surface of the covering tape 100 bonded to the bonding area 24 is in contact with a wall surface of a cavity 38 of the resin molding metal base 30. Thereafter, the cavity 38 of the resin molding metal base 30 is filled with a resin to form a package body. Thus, a portion of the lead frame 20 is embedded in the package body, while the bonding area 24 of the lead frame 20 is kept from the spreaded resin for forming the package body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a part of a lead frame 20 made of a metal such as 42 alloy (iron-nickel alloy) or Cu in a package body 10 made of a resin as shown in FIGS. The present invention relates to a method of manufacturing a pre-mold package for housing a semiconductor chip, in which the inner leads 22 and the like are embedded.

[0002]

2. Description of the Related Art In the manufacture of the above-mentioned pre-mold package, as shown in FIG.
4 is pressed against the inner wall surface of the cavity 38 of the resin mold 30 using the support pins 40 without any gap. When the resin is filled into the cavity 38 of the resin mold 30 and the package body 10 is molded, the resin for molding the package body 10 wraps around and adheres to the bonding area 24 of the lead frame 20. Is preventing. Then, wires and the like for connecting electrodes of the semiconductor chip can be reliably and easily electrically connected to the bonding area 24 without being hindered by the resin.

As shown in FIG. 10, a support pin 40 is slidably inserted into a hole 36 provided in a lower mold 34 of a resin mold 30, for example. Then, the tip of the support pin 40 is connected to the cavity 3 of the resin mold.
8, the support pin 40 can push a predetermined portion of the lead frame 20 that has entered the cavity 38 of the resin mold by the tip of the support pin 40. Then, the bonding area 24 such as the surface of the inner lead 22 of the lead frame 20 located directly above the portion of the lead frame 20 pressed by the tip of the support pin 40 is attached to the inner wall surface of the cavity 38 of the upper mold 32 of the resin mold 30. The contact can be reliably made without any gap.

After the package body 10 is molded in the cavity 38 of the resin mold 30, the support pins 40 are slid through the holes 36 provided in the resin mold 30 to be removed from the package body 10. ing.

[0005]

However, when the pre-molded package is manufactured as described above, the hole 12 from which the support pins 40 are removed is formed in the package body 10 as shown in FIG. I have.
Then, the airtightness of the package body 10 is reduced due to the holes 12. And the package body 10
The semiconductor chip has high airtightness and cannot be accommodated inside.

In addition, a portion of the lead frame 20 which is not embedded in the package body 10 made of resin is generated at the bottom of the hole 12 of the package body. Then, the sealing path of the lead frame 20 to be embedded in the package body 10 is shortened accordingly. Here, the sealing path refers to the distance between the lead frame 20 portion embedded in the package body 10. Then, the airtightness of the part of the package body 10 in which a part of the lead frame 20 is embedded is reduced. And
Moisture easily penetrates into the package body 10 from the package body 10 part in which the part of the lead frame 20 is embedded. And the package body 10
The semiconductor chips housed inside have become susceptible to the adverse effects of moisture.

Further, a part of the lead frame 20 made of metal is exposed at the bottom of the hole 12 of the package body from which the support pins 40 have been removed. Then, the lead frame 2 exposed at the bottom in the hole 12 is formed.
0 part has been corroded.

It is to be noted that the lead frame 20 exposed on the outside of the package body 10 is generally plated with a rust preventive plate.
It was difficult for the plating solution to penetrate into the part of the lead frame 20 exposed at the bottom inside the hole 12 of the package body. And, for that purpose, the hole 12 of the package body is used.
The rust-preventive plating was not properly applied to the portion of the lead frame 20 exposed at the bottom of the inside, and the lead frame 20 portion was corroded.

Further, a predetermined clearance (gap) must be provided between the support pin 40 and the hole 36 of the resin mold in which the support pin 40 is slidably inserted. Resin has entered. Then, resin burrs were formed around the opening of the hole 12 of the package body after the support pins 40 were removed. Therefore, when a pre-molded package is formed by a conventional manufacturing method, the resin burr formed around the opening of the hole 12 of the package body must be cut off by a great deal of trouble. Then, the outer peripheral surface of the package body 10 has to be smoothed.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and a hole from which a support pin is removed is formed in a package body, or a resin burr is formed around an opening of the hole in the package body. It is an object of the present invention to provide a method for manufacturing a pre-molded package, which can prevent air leakage and improve the airtightness of a package body and the corrosion resistance of a lead frame portion embedded in the package body.

[0011]

In order to achieve the above object, a method of manufacturing a pre-molded package according to the present invention provides a method for accommodating a semiconductor chip in which a part of a lead frame made of metal is embedded in a package body made of resin. The method for manufacturing a pre-mold package according to claim 1, wherein one surface of the covering tape is releasably attached to the bonding area of the lead frame, and the lead frame to which the covering tape is attached is loaded into a resin mold. Then, after the other surface of the covering tape is brought into contact with the inner wall surface of the cavity of the resin mold, the cavity of the resin mold is filled with the resin for molding the package body, and the package body is filled. Molding, and then peeling the covering tape from the bonding area of the lead frame.

In this method of manufacturing a pre-mold package, one surface of a covering tape is attached to a bonding area of a lead frame to be loaded in a resin mold. Therefore, after the lead frame is loaded into the resin mold and the resin is filled into the cavity of the resin mold, the resin for molding the package body adheres to the bonding area of the lead frame and the bonding area. It can be prevented from penetrating into one of the surfaces of the coated tape. Then, the resin can be prevented from wrapping around and adhering to the bonding area of the lead frame.

Further, since it is not necessary to provide a support pin for pressing the bonding area of the lead frame against the inner wall surface of the cavity of the resin mold and a hole for inserting the pin into the resin mold, the resin mold is not required. In the package body molded with resin in the cavity of, the hole from which the support pin was removed is formed, and a part of the lead frame is exposed at the bottom in the hole,
Can be prevented. At the same time, it is possible to prevent the generation of resin burrs that require a troublesome cutting process around the opening of the hole in the package body after the support pins are removed.

In the method of manufacturing a pre-mold package according to the present invention, it is preferable that the other surface of the covering tape is removably adhered to the inner wall surface of the cavity of the resin mold.

In this method of manufacturing a pre-molded package, a lead frame is loaded into the resin mold so that the other surface of the covering tape is adhered to the inner wall surface of the cavity of the resin mold. When filling the mold cavity with resin for molding the package body,
The resin can be reliably prevented from entering between the other surface of the covering tape and the inner wall surface of the cavity of the resin mold to which the resin is adhered. Then, it is possible to prevent the coated tape from being pushed in the direction of detaching from the inner wall surface of the cavity of the resin mold by the invading resin. Then, the lead frame portion having the bonding area to which one surface of the covering tape is stuck is pressed into the cavity of the resin mold and deformed by being bent or the like, and is embedded in the package body. Can be prevented.

Alternatively, in the method of manufacturing a pre-mold package according to the present invention, it is preferable to use a tape made of an elastic material as the covering tape.

In this method for manufacturing a pre-mold package, the elasticity of a covering tape made of an elastic material is used to
The other surface of the covering tape can be brought into close contact with the inner wall surface of the cavity of the resin mold to make contact therewith. When the lead frame is loaded into the resin mold and the resin for molding the package body is filled in the cavity of the resin mold, the resin is brought into contact with the other surface of the covering tape. It is possible to reliably prevent the resin mold from invading the inner wall of the cavity of the resin mold.
Then, it is possible to prevent the coated tape from being pushed in the direction of detaching from the inner wall surface of the cavity of the resin mold by the invading resin. Then, the lead frame portion having the bonding area to which one surface of the covering tape is stuck is pressed into the cavity of the resin mold and deformed by being bent or the like, and is embedded in the package body. Can be prevented.

In the method of manufacturing a pre-molded package according to the present invention, one of the surfaces of the covering tape is irradiated with ultraviolet rays or heated to be able to lose its adhesive strength. It is preferable to use an agent to adhere to the bonding area of the lead frame.

In the method of manufacturing the pre-mold package, the resin is filled in the cavity of the resin mold, and after forming the package body, when the covering tape is peeled off from the bonding area of the lead frame,
By irradiating the covering tape with ultraviolet rays or heating the covering tape, the adhesive force of the adhesive applied to one side of the covering tape to the bonding area of the lead frame is easily and accurately eliminated. Can be. And the coating tape can be easily and reliably peeled off without leaving the adhesive tape together with the adhesive from the bonding area of the lead frame.

[0020]

Next, embodiments of the present invention will be described with reference to the drawings. 1 to 7 show a preferred embodiment of a method of manufacturing a pre-mold package according to the present invention, and FIGS. 1 to 7 are explanatory diagrams of the manufacturing process. Hereinafter, a method of manufacturing the pre-mold package will be described.

In the manufacturing method shown in the figure, as shown in FIGS. 1 and 2, one surface of the covering tape 100 is releasably attached to a bonding area 24 such as the surface of the inner lead 22 of the lead frame 20. I have.

Specifically, an adhesive tape made of an elastic material such as a synthetic resin, which is generally called a "thermopeel tape", is used for the covering tape 100. Then, an adhesive applied to one surface of the coating tape 100, by irradiating ultraviolet rays or by heating, using an adhesive capable of eliminating its adhesive strength, One surface of the covering tape 100 is adhered to the bonding area 24 of the lead frame.

Next, as shown in FIG. 3, the lead frame 20 having one surface of the covering tape 100 adhered to the bonding area 24 is loaded in the resin mold 30. Then, for example, the inner leads 22 of the lead frame 20 portion embedded in the package body 10 are formed.
Are projected into the space inside the cavity 38 of the resin mold 30. For example, the outer lead 26 of the portion of the lead frame 20 protruding outside the package body 10
The middle part is the upper mold 32 and the lower mold 3 of the resin mold 30.
And 4 between them.

Inner lead 22 of lead frame 20
The other surface of the covering tape 100 in which one surface is adhered to the bonding area 24 such as the surface, as shown in FIG.
The upper surface 32 of the resin mold 30 is in contact with the inner wall surface of the cavity 38.

More specifically, as shown in FIG. 3, the other surface of the covering tape 100 covering the bonding area 24 of the lead frame 20 is covered with the covering tape 10 made of an elastic material.
Using the elasticity of 0, the upper mold 32 is brought into contact with the inner wall surface of the cavity 38 without any gap.

Next, a resin for molding the package body 10 is filled in the cavity 38 of the resin mold 30 to form the package body 10. And FIG.
And resin package body 1 as shown in FIG.
0, the inner leads 22 of a part of the lead frame 20.
And the like are formed into a pre-mold package.

Thereafter, the covering tape 100 covering the bonding area 24 is peeled off from the bonding area 24 of the lead frame 20.

At this time, the covering tape 100 is irradiated with ultraviolet rays or the covering tape 100 is heated,
The adhesive force of the adhesive stuck on one side of the covering tape 100 to the bonding area 24 of the lead frame 20 is lost. And the covering tape 1 together with the adhesive
00 is peeled off from the bonding area 24 of the lead frame 20 without being left.

Then, as shown in FIGS. 6 and 7, a part of the inner lead 22 of the lead frame 20 is embedded in the package body 10 made of resin, and the surface of the inner lead 22 of the lead frame 20 is bonded. The area 24 is exposed outside the package body 10;
A pre-mold package is formed.

The method of manufacturing the pre-mold package shown in FIGS. 1 to 7 includes the above steps. In the method of manufacturing the pre-mold package, when the resin for molding the package body 10 is filled in the cavity 38 of the resin mold 30, the resin is bonded to the bonding area 24 of the lead frame 20 and the coating adhered thereto. It is possible to prevent intrusion between the tape 100 and one surface. Then, the resin can be prevented from entering the bonding area 24 of the lead frame 20 and attaching thereto.

Also, the other surface of the covering tape 100 made of an elastic material can be
It can be brought into close contact with the inner wall surface of the cavity 38 of the resin mold 30 to make contact therewith. When the resin for molding the package body 10 is filled in the cavity 38 of the resin mold 30, the package body is placed between the other surface of the covering tape 100 and the inner wall surface of the cavity 38 of the resin mold 30. 10 It is possible to prevent the resin for molding from entering. Then, the resin is applied to the covering tape 10.
It is possible to prevent the portion of the lead frame 20 to which the “0” is stuck from being pushed into the cavity 38 of the resin mold 30 and deformed. Then, the part of the lead frame 20 to which the covering tape 100 is adhered is
It can be prevented from being embedded in a deformed state.

When peeling the covering tape 100 from the bonding area 24 of the lead frame 20, the covering tape 100 is irradiated with ultraviolet rays or the covering tape 100 is heated, so that one of the covering tape 100 is heated. The adhesive force of the adhesive stuck on the surface to the bonding area 24 of the lead frame 20 can be eliminated. Then, the covering tape 100 can be easily and reliably peeled off from the bonding area 24 of the lead frame 20 together with the adhesive. Then, it is possible to prevent the covering tape 100 and a part of the adhesive from remaining in the bonding area 24 of the lead frame 20, thereby preventing a wire or the like from being properly bonded to the bonding area 24.

In the above-described method for manufacturing a pre-mold package, the other surface of the covering tape 100 having one surface adhered to the bonding area 24 of the lead frame 20 is attached to the inner wall surface of the cavity 38 of the resin mold 30. Alternatively, it may be releasably attached using an adhesive or the like.
Then, the resin for molding the package body 10 filled in the cavity 38 of the resin mold 30 is between the other surface of the covering tape 100 and the inner wall surface of the cavity 38 of the resin mold 30 with which the covering tape 100 is in contact. May be surely prevented from invading.

In such a case, the covering tape 10
Alternatively, a tape made of a hard material having no elasticity may be used. In this case, the other surface of the covering tape 100 made of the hard material is securely brought into close contact with the inner wall surface of the cavity 38 of the resin mold 30 using an adhesive or the like. Because it can be.

Further, one surface of the covering tape 100 may be attached to the bonding area 24 of the lead frame 20 using a general-purpose adhesive. However, in such a case, the adhesive may be covered with the covering tape 100 together with the adhesive.
It is preferable to select an adhesive which is unlikely to remain as much as possible in the bonding area 24 of the lead frame 20 when the adhesive is peeled from the bonding area 24 of the lead frame 20.

[0036]

As described above, according to the method of manufacturing a pre-mold package of the present invention, a bonding area such as an inner lead of a lead frame for electrically connecting a wire or the like for connecting an electrode of a semiconductor chip. In addition, it is possible to easily and reliably prevent the package body molding resin molded in the cavity of the resin mold from coming around and attaching.

Further, it is possible to prevent a hole from which a support pin is removed from being formed in a package body molded in the cavity of the resin mold so that a part of the lead frame is exposed at the bottom of the hole. it can. And
It is possible to prevent the airtightness of the package main body from being reduced and the corrosion resistance of the lead frame portion embedded in the package main body from being deteriorated.

Further, it is possible to prevent a hole from which the support pin is removed from being formed in the package main body, thereby preventing the sealing path of the lead frame portion embedded in the package main body from being shortened. Then, it is possible to prevent the airtightness of the package body portion in which the lead frame is embedded from being reduced.

Further, a hole from which the support pin is removed is formed in the package body, and formation of a resin burr around the opening of the hole can be prevented. Then, it is possible to eliminate troublesome cutting work of the resin burr formed around the opening of the hole.

Further, with the support pins, the bonding area, such as the surface of each inner lead, which cannot be accurately pressed against the inner wall surface of the cavity of the resin mold and is arranged at a very small pitch on the lead frame, can be easily formed without gaps with the covering tape. And it can be covered accurately. Then, it is possible to easily and reliably prevent the resin for molding the package main body from going around and adhering to the bonding area.

Further, it is not necessary to provide the support pins and the holes for inserting the pins in the resin mold for molding the package body. Further, the resin mold can be greatly simplified and its manufacture can be facilitated.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a manufacturing process of a method for manufacturing a pre-mold package according to the present invention.

FIG. 2 is a diagram illustrating a manufacturing process of a method for manufacturing a pre-mold package according to the present invention.

FIG. 3 is a diagram illustrating a manufacturing process of a method for manufacturing a pre-mold package according to the present invention.

FIG. 4 is an explanatory view of a manufacturing process of the method for manufacturing a pre-mold package of the present invention.

FIG. 5 is a sectional view taken along line AA of FIG. 4;

FIG. 6 is a partial plan view of a pre-mold package formed by the manufacturing method of the present invention.

FIG. 7 is a sectional view taken along the line BB of FIG. 6;

FIG. 8 is a partial plan view of a pre-mold package.

9 is a sectional view taken along the line CC in FIG. 8;

FIG. 10 is a view illustrating a manufacturing process of a conventional method for manufacturing a pre-mold package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Package main body 12 Hole of package main body from which support pin was removed 20 Lead frame 22 Inner lead 24 Lead frame bonding area 26 Outer lead 30 Resin molding die 38 Cavity 100 Coating tape

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/50 H01L 23/50 Y // B29L 31:34

Claims (4)

[Claims] 1. A method of manufacturing a pre-mold package for accommodating a semiconductor chip in which a part of a lead frame made of metal is embedded in a package body made of resin, wherein one of a cover tape and a bonding area is provided in a bonding area of the lead frame. The releasably adhered surface was loaded in a resin mold, and the other surface of the coated tape was brought into contact with the cavity inner wall surface of the resin mold. Thereafter, the resin for molding the package body is filled in the cavity of the resin mold to form the package body, and thereafter, the covering tape is peeled from the bonding area of the lead frame. Manufacturing method of pre-mold package. 2. The method according to claim 1, wherein the other surface of the covering tape is releasably attached to an inner wall surface of a cavity of a resin mold.
The manufacturing method of the pre-mold package described in the above. 3. The method according to claim 1, wherein a tape made of an elastic material is used as the covering tape. 4. A method for applying one side of a covering tape to a bonding area of a lead frame using an adhesive capable of losing its adhesive force by irradiating or heating ultraviolet rays. Claim 1, 2 or 3 to wear
The manufacturing method of the pre-mold package described in the above.