JP2008062511A - Manufacturing process of insert-molded article and mold - Google Patents

Manufacturing process of insert-molded article and mold Download PDF

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JP2008062511A
JP2008062511A JP2006242848A JP2006242848A JP2008062511A JP 2008062511 A JP2008062511 A JP 2008062511A JP 2006242848 A JP2006242848 A JP 2006242848A JP 2006242848 A JP2006242848 A JP 2006242848A JP 2008062511 A JP2008062511 A JP 2008062511A
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contact
terminal
mold
conductive material
insert
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JP4848901B2 (en
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Shinji Ogawa
伸治 小川
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the dislocation of a terminal part and hold the terminal part in a terminal retaining recess when clamped by two-piece mold of upper/lower molds. <P>SOLUTION: An insert-molding 1 is composed of a metal plate material 10 and a resin molding 20. The terminal part 11 placed on one end side of the metal plate material 10 is adhered and interposed from a vertical direction by the terminal retaining recess 34 associated with clamping of the vertical both dies 31 and 32. Further, a bonding face 14 is formed on the other end side of the metal plate material 10. By contact of a presser part 37 with the back face of the bonding face 14, a force is acted in a direction of adhesion of an outer peripheral edge part of the bonding face 14 to a contact face 36. Thus, slidable contact of the surface of the terminal part 11 with the terminal retaining recess 34 controls peeling of metal plating applied on the surface of the terminal part 11 and inflicting a scar on the surface of the terminal part 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、インサート成形品の製造方法および成形型に関するものである。   The present invention relates to a method for manufacturing an insert molded product and a mold.

端子部にめっき処理を施した導電材料をインサート成形してインサート成形品を製造する一般的な方法としては、下記特許文献１に記載のものが知られている。この製造方法によると、下型に凹設された端子保持凹部に導電材料の端子部を挿入して導電材料を支持することでインサート成形時に樹脂が端子部に付着しないようにしている。
特開２００４−１３４２５７公報 As a general method for manufacturing an insert-molded product by insert-molding a conductive material having a terminal portion plated, a method described in Patent Document 1 below is known. According to this manufacturing method, the terminal portion of the conductive material is inserted into the terminal holding recess provided in the lower mold to support the conductive material, so that the resin does not adhere to the terminal portion during insert molding.
JP 2004-134257 A

しかしながら、この製造方法によると、端子部を端子保持凹部に挿入する際に端子部と端子保持凹部の内壁とが摺動することで、端子部のめっきが剥がれたり、端子部表面に傷が付いたりするおそれがある。この対策として、端子保持凹部を構成する内面が２分割されるように成形型の合わせ面の位置を設定し、端子部を分割された端子保持凹部によって密着して挟み込む方法が考えられる。   However, according to this manufacturing method, when the terminal portion is inserted into the terminal holding recess, the terminal portion and the inner wall of the terminal holding recess slide, so that the plating of the terminal portion is peeled off or the surface of the terminal portion is damaged. There is a risk of As a countermeasure against this, a method is conceivable in which the position of the mating surface of the molding die is set so that the inner surface constituting the terminal holding recess is divided into two, and the terminal portion is tightly sandwiched between the divided terminal holding recesses.

しかしながら、この方法では、導電材料が端子保持凹部内から抜けないように押し込む方向と成形型の型閉め方向とが直交することになるため、型閉め時における導電材料の抜け方向への位置ずれを規制することができず、導電材料の抜け止めを行うためのパーツを別途設ける必要がある。したがって、成形型の構造としては、上型と下型と抜け止めパーツとからなる３パーツが必要となり、上下両型からなる２パーツの成形型で端子部を抜け止めすることができなかった。   However, in this method, the direction in which the conductive material is pushed so as not to come out of the terminal holding recess and the mold closing direction of the molding die are orthogonal to each other. It cannot be regulated, and it is necessary to separately provide parts for preventing the conductive material from coming off. Therefore, the structure of the molding die requires three parts consisting of an upper die, a lower die, and retaining parts, and the terminal portion cannot be prevented from being detached by a two-part molding die composed of both upper and lower molds.

本発明は上記のような事情に基づいて完成されたものであって、上下両型からなる２パーツの成形型で型閉め時における端子部の抜け止めを行うとともに端子部を端子保持凹部内に保持することを目的とする。   The present invention has been completed based on the above circumstances, and is a two-part mold composed of both upper and lower molds, which prevents the terminal part from being removed when the mold is closed, and the terminal part is placed in the terminal holding recess. The purpose is to hold.

上記の目的を達成するための手段として、請求項１の発明は、上型と下型とから構成された成形型を使用してインサート成形を行うインサート成形品の製造方法であって、前記成形型にセットされる導電材料は一部を折り曲げた形状をなし、その一端側にめっき処理が施された端子部が形成され、前記成形型を、前記上下両型により形成されるキャビティを有し、前記上下両型の合わせ面に、前記キャビティを構成する凹部及びこの凹部に連なり前記端子部に密着してこれを挟む端子保持凹部を備える構成とし、前記下型に、前記端子部の突出方向が鉛直方向に対して斜め方向となるように前記導電材料を載置し、前記上下両型の合わせ面のうち前記端子保持凹部を保有する面に対して斜め方向に前記上下両型を型閉めすることで前記端子部が前記端子保持凹部に挟まれ、前記キャビティ内に樹脂を注入することにより、前記端子部を露出させた状態で前記導電材料の周囲に樹脂成形部をインサート成形するところに特徴を有する。   As a means for achieving the above object, the invention of claim 1 is a method of manufacturing an insert-molded product in which insert molding is performed using a molding die composed of an upper die and a lower die. The conductive material set in the mold has a shape in which a part thereof is bent, a terminal portion that is plated is formed on one end thereof, and the mold has a cavity formed by both the upper and lower molds. The upper and lower molds are provided with a concave portion that constitutes the cavity and a terminal holding concave portion that is connected to the concave portion and is in close contact with the terminal portion, and the lower die has a protruding direction of the terminal portion. The conductive material is placed so that is inclined with respect to the vertical direction, and the upper and lower molds are closed obliquely with respect to the surface holding the terminal holding recess among the upper and lower mold mating surfaces. The terminal part by The sandwiched terminal holding recess, by injecting resin into the cavity, has a feature where the insert molded resin portion around the conductive material while exposing the terminal portions.

請求項２の発明は、請求項１に記載のものにおいて、前記導電材料の他端側にボンディング面が形成されるものにおいて、前記キャビティ内面に、型閉め時に前記ボンディング面と非接触で対向して配置された非接触面及びこの非接触面に連なり前記ボンディング面の外周縁部に密着する接触面を備える構成としたところに特徴を有する。   According to a second aspect of the present invention, the bonding surface is formed on the other end side of the conductive material according to the first aspect, and the inner surface of the cavity faces the bonding surface in a non-contact manner when the mold is closed. And a non-contact surface arranged in contact with the non-contact surface and a contact surface that is in close contact with the outer peripheral edge of the bonding surface.

請求項３の発明は、請求項２に記載のものにおいて、前記成形型は、前記凹部に、前記キャビティ内に突出して設けられ、型閉め時に前記導電材料に対し前記ボンディング面の外周縁部を前記接触面に密着させる方向に接触する押さえ部を備える構成としたところに特徴を有する。   According to a third aspect of the present invention, the molding die according to the second aspect is provided in the concave portion so as to protrude into the cavity, and the outer peripheral edge portion of the bonding surface is provided with respect to the conductive material when the die is closed. The present invention is characterized in that it has a configuration including a pressing portion that comes into contact with the contact surface.

請求項４の発明は、上型と下型とから構成され、一部を折り曲げた導電材料の一端側にめっき処理が施された端子部の突出方向が鉛直方向に対して斜め方向となるように前記導電材料をセットし、前記上下両型により形成されるキャビティ内に樹脂を注入することにより、前記端子部を露出させた状態で前記導電材料の周囲に樹脂成形部をインサート成形する成形型であって、前記上下両型の合わせ面に、前記キャビティを構成する凹部及びこの凹部に連なり前記端子部に密着してこれを挟む端子保持凹部が設けられ、前記上下両型の型閉め方向は、前記上下両型の合わせ面のうち前記端子保持凹部を保有する面に対して斜め方向であるところに特徴を有する。   The invention according to claim 4 is constituted by an upper mold and a lower mold, and the projecting direction of the terminal portion plated on one end side of the electrically conductive material partially bent is inclined with respect to the vertical direction. A molding die in which a resin molding part is insert-molded around the conductive material with the terminal part exposed by setting the conductive material in the mold and injecting resin into a cavity formed by the upper and lower molds. The upper and lower molds are provided with a concave portion constituting the cavity and a terminal holding concave portion that is connected to the concave portion and is in close contact with the terminal portion and sandwiches the concave portion. The upper and lower mating surfaces are characterized by being inclined with respect to the surface holding the terminal holding recess.

請求項５の発明は、請求項４に記載のものにおいて、前記導電材料の他端側にボンディング面が形成されるものにおいて、前記キャビティ内面に、型閉め時に前記ボンディング面と非接触で対向して配置された非接触面及びこの非接触面に連なり前記ボンディング面の外周縁部に密着する接触面を備える構成としたところに特徴を有する。   According to a fifth aspect of the present invention, there is provided the method according to the fourth aspect, wherein a bonding surface is formed on the other end side of the conductive material, and the cavity inner surface faces the bonding surface in a non-contact manner when the mold is closed. And a non-contact surface arranged in contact with the non-contact surface and a contact surface that is in close contact with the outer peripheral edge of the bonding surface.

請求項６の発明は、請求項５に記載のものにおいて、前記成形型は、前記凹部に、前記キャビティ内に突出して設けられ、型閉め時に前記導電材料に対し前記ボンディング面の外周縁部を前記接触面に密着させる方向に接触する押さえ部を備える構成としたところに特徴を有する。   According to a sixth aspect of the present invention, in the method according to the fifth aspect, the molding die is provided in the concave portion so as to protrude into the cavity, and the outer peripheral edge portion of the bonding surface is provided with respect to the conductive material when the die is closed. The present invention is characterized in that it has a configuration including a pressing portion that comes into contact with the contact surface.

＜請求項１および請求項４の発明＞
請求項１および請求項４の発明によると、端子部の突出方向が鉛直方向に対して斜め方向となるように導電材料を下型に載置し、上下両型のうち端子保持凹部を保有する面に対して斜め方向に上下両型を型閉めすることで端子部を端子保持凹部内で密着して挟み込むことができる。したがって、端子保持凹部内に端子部を挿入することが不要となるから、端子部と端子保持凹部の内壁とが摺動することで端子部の表面に施されためっきが剥がれたり、端子部の表面に傷が付く等のおそれがない。 <Invention of Claims 1 and 4>
According to the first and fourth aspects of the invention, the conductive material is placed on the lower mold so that the protruding direction of the terminal portion is oblique with respect to the vertical direction, and the terminal holding recess is held in both the upper and lower molds. By closing both the upper and lower molds in an oblique direction with respect to the surface, the terminal part can be tightly held in the terminal holding recess. Accordingly, since it is not necessary to insert the terminal portion into the terminal holding recess, the plating applied to the surface of the terminal portion is peeled off by sliding the terminal portion and the inner wall of the terminal holding recess, or the terminal portion There is no risk of scratching the surface.

＜請求項２および請求項５の発明＞
請求項２および請求項５の発明によると、型閉め時にボンディング面がキャビティ内面に接触しない構成としたから、ボンディング面に傷が付くことを防ぐことができる。このとき、ボンディング面の外周縁部が接触面に密着しているから、ボンディング面に樹脂が付着するおそれがない。また、ボンディング面を下向きにセットする場合には、ボンディング面の外周縁部を接触面で支持することとなり、端子保持凹部と接触面の２点で支持することができる。したがって、導電材料を安定した姿勢で型閉めすることができる。 <Invention of Claims 2 and 5>
According to the second and fifth aspects of the present invention, since the bonding surface does not come into contact with the cavity inner surface when the mold is closed, it is possible to prevent the bonding surface from being damaged. At this time, since the outer peripheral edge portion of the bonding surface is in close contact with the contact surface, there is no possibility that the resin adheres to the bonding surface. When the bonding surface is set downward, the outer peripheral edge of the bonding surface is supported by the contact surface, and can be supported at two points: the terminal holding recess and the contact surface. Therefore, the conductive material can be closed in a stable posture.

＜請求項３および請求項６の発明＞
請求項３および請求項６の発明によると、上下両型を型閉めすることに伴って押さえ部が導電材料に対しボンディング面の外周縁部を接触面に密着させる方向への分力を生じさせる。したがって、ボンディング面の外周縁部で確実に樹脂の食い切りを行うことができる。 <Invention of Claim 3 and Claim 6>
According to the invention of claim 3 and claim 6, as the upper and lower molds are closed, the holding part generates a component force in a direction in which the outer peripheral edge of the bonding surface is brought into close contact with the contact surface with respect to the conductive material. . Therefore, it is possible to surely cut out the resin at the outer peripheral edge of the bonding surface.

＜実施形態１＞
本発明の実施形態１を図１ないし図６によって説明する。本実施形態における電子制御ユニット（ＥＣＵ）Ｅは、図１に示すように、上方に開口するケース体２と、ケース体２内に配されるインサート成形品１と、ケース体２の開口面側に配される第１回路基板３と、ケース体２の底面側に配される第２回路基板４とを備えている。本実施形態においてインサート成形品１は、第１回路基板３と第２回路基板４との間を導通可能に接続する役割を果たしている。 <Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the electronic control unit (ECU) E in the present embodiment includes a case body 2 that opens upward, an insert molded product 1 that is disposed in the case body 2, and an opening surface side of the case body 2. The first circuit board 3 disposed on the bottom surface of the case body 2 and the second circuit board 4 disposed on the bottom surface side of the case body 2 are provided. In the present embodiment, the insert molded product 1 plays a role of connecting the first circuit board 3 and the second circuit board 4 so as to be conductive.

インサート成形品１は、略Ｌ字状に折り曲げられた形状をなす金属板材（本発明における導電材料に相当する。）１０と、その金属板材１０の外形に沿って配される樹脂成形部２０とから構成されている。このインサート成形品１は、図２に示すように、金属板材１０を成形型３０内にセットし、後述するキャビティＣ内に樹脂を注入することにより、金属板材１０の周囲に樹脂成形部２０をインサート成形することで形成される。   The insert-molded product 1 includes a metal plate material (corresponding to a conductive material in the present invention) 10 formed in a substantially L-shaped shape, and a resin molded portion 20 disposed along the outer shape of the metal plate material 10. It is composed of As shown in FIG. 2, the insert molded product 1 has a metal plate 10 set in a mold 30 and a resin is injected into a cavity C to be described later, thereby forming a resin molded portion 20 around the metal plate 10. It is formed by insert molding.

樹脂成形部２０は、図１に示すように、ケース体２の底面と一体となるようにインサート成形されている。金属板材１０の一端側（図１における長尺側の上端側）は上方に突出する形態であって、樹脂成形部２０の上端部から端子部１１が突出している。金属板材１０の他端側（図１における短尺側の右端側）は右方に突出する形態であって、前記他端側における樹脂成形部２０の上面側に露出した部分がボンディング面１４とされている。本実施形態において端子部１１およびボンディング面１４の表面には、めっき処理が施されている。ボンディング面１４の右方に隣接する第２回路基板４には、図示しないランド部が形成されており、ボンディング面１４と前記したランド部とは、ワイヤ６によって電気的接続が取られている。   As shown in FIG. 1, the resin molded portion 20 is insert-molded so as to be integrated with the bottom surface of the case body 2. One end side of the metal plate 10 (the long side upper end side in FIG. 1) protrudes upward, and the terminal portion 11 protrudes from the upper end portion of the resin molded portion 20. The other end side (the right end side on the short side in FIG. 1) of the metal plate 10 protrudes to the right, and the portion exposed on the upper surface side of the resin molded portion 20 on the other end side is the bonding surface 14. ing. In the present embodiment, the surfaces of the terminal portion 11 and the bonding surface 14 are plated. A land portion (not shown) is formed on the second circuit board 4 adjacent to the right side of the bonding surface 14, and the bonding surface 14 and the land portion described above are electrically connected by a wire 6.

端子部１１はプレスフィット端子であって、図６に示すように、端子部１１の上下方向における略中央部には、撓み空間１３を間に挟んで幅方向外側に膨らんだ一対の弾性当接部１２が配されている。一方、第１回路基板３には、上下方向に貫通するスルーホール５が形成されている。弾性当接部１２は、スルーホール５内に挿入されると、弾性当接部１２が撓み空間１３側に弾性変形し、その開き方向への弾性力によりスルーホール５の内周に押し付けられて、スルーホール５の接点部（図示せず）と電気的に接続されている。これにより、第１回路基板３と第２回路基板４とがインサート成形品１を通じて電気的に接続される。また、各端子部１１はインサート成形時には金型３０内の隔壁３９により隔離状態で配されている。隔壁３９は、後述する端子保持凹部３４の内壁のうち側面部分を構成している。さらに、隔壁３９と弾性当接部１２との間に隙間を設けることで、端子部１１が隔壁３９と摺動して弾性当接部１２の表面に形成された端子めっきが剥がれることを規制している。   The terminal portion 11 is a press-fit terminal, and as shown in FIG. 6, a pair of elastic abutments that swell outward in the width direction with the bending space 13 in between are disposed at a substantially central portion in the vertical direction of the terminal portion 11. Part 12 is arranged. On the other hand, a through hole 5 penetrating in the vertical direction is formed in the first circuit board 3. When the elastic contact portion 12 is inserted into the through hole 5, the elastic contact portion 12 is elastically deformed toward the bending space 13, and is pressed against the inner periphery of the through hole 5 by the elastic force in the opening direction. The contact portion (not shown) of the through hole 5 is electrically connected. As a result, the first circuit board 3 and the second circuit board 4 are electrically connected through the insert molded product 1. Further, each terminal portion 11 is arranged in an isolated state by a partition wall 39 in the mold 30 at the time of insert molding. The partition wall 39 constitutes a side surface portion of the inner wall of the terminal holding recess 34 described later. Further, by providing a gap between the partition wall 39 and the elastic contact portion 12, it is possible to regulate that the terminal portion 11 slides on the partition wall 39 and the terminal plating formed on the surface of the elastic contact portion 12 is peeled off. ing.

成形型３０は上型３１と下型３２とから構成され、型閉め方向が上下方向に設定されている。上型３１と下型３２が型閉めされた状態において成形型３０内には、図２に示すように、樹脂成形部２０をインサート成形するためのキャビティＣが形成されている。上下両型３１，３２の合わせ面には、キャビティＣを構成する凹部３３と、凹部３３と連なり端子部１１に密着してこれを挟む端子保持凹部３４とが形成されている。上下両型３１，３２の合わせ面のうち端子保持凹部３４を保有する面３５は、上下両型３１，３２の型閉め方向に対して斜め方向（本実施形態においては略４５°の傾斜角度をなす方向）となるように設定されている。したがって、端子部１１は、鉛直方向に対して斜め方向となるように（上下両型３１，３２の合わせ面のうち端子保持凹部３４を保有する面３５と同じ傾きをもって）下型３２上に載置される。そして、端子部１１は、型閉めに伴って端子保持凹部３４によって上下方向から密着して挟み込まれる。   The mold 30 is composed of an upper mold 31 and a lower mold 32, and the mold closing direction is set to the vertical direction. In the state where the upper mold 31 and the lower mold 32 are closed, a cavity C for insert molding the resin molded portion 20 is formed in the mold 30 as shown in FIG. On the mating surfaces of the upper and lower molds 31, 32, there are formed a recess 33 constituting the cavity C and a terminal holding recess 34 which is connected to the recess 33 and is in close contact with the terminal portion 11 to sandwich it. Of the mating surfaces of the upper and lower molds 31 and 32, the surface 35 holding the terminal holding recess 34 is inclined with respect to the mold closing direction of the upper and lower molds 31 and 32 (in this embodiment, an inclined angle of approximately 45 °). Direction). Therefore, the terminal part 11 is mounted on the lower mold 32 so as to be inclined with respect to the vertical direction (with the same inclination as the surface 35 holding the terminal holding recess 34 among the mating surfaces of the upper and lower molds 31, 32). Placed. And the terminal part 11 is closely_contact | adhered from the up-down direction by the terminal holding recessed part 34 with mold closing.

図２において下型３２のキャビティ内面のうちボンディング面１４と対向している面は非接触面３８である。また、この非接触面３８と連なり、ボンディング面１４の外周縁部と接触している面は接触面３６である。金属板材１０は、図２に示すように、成形型３０内にセットされた状態では、端子部１１が端子保持凹部３４を構成する下側傾斜面に支持されるとともに、ボンディング面１４の外周縁部が接触面３６に支持されるようになっている。すなわち、金属板材１０は、本実施形態のようにボンディング面１４が下向きとなる場合には、２点支持されることで安定した姿勢で型閉めされることになる。   In FIG. 2, the surface of the cavity inner surface of the lower mold 32 that faces the bonding surface 14 is a non-contact surface 38. Further, a surface that is continuous with the non-contact surface 38 and is in contact with the outer peripheral edge of the bonding surface 14 is a contact surface 36. As shown in FIG. 2, when the metal plate 10 is set in the forming die 30, the terminal portion 11 is supported by the lower inclined surface constituting the terminal holding recess 34 and the outer peripheral edge of the bonding surface 14. The part is supported by the contact surface 36. That is, when the bonding surface 14 faces downward as in the present embodiment, the metal plate 10 is supported at two points, and the mold is closed in a stable posture.

凹部３３において接触面３６と対向する面には、押さえ部３７が下方に突出して形成されている。押さえ部３７は、型閉めに伴ってボンディング面１４の裏面に当接し、端子部１１が端子保持凹部３４内へ押し込まれる方向（ボンディング面１４の外周縁部を接触面３６に密着させる方向）に作用を受ける。したがって、ボンディング面１４の外周縁部で確実に樹脂の食い切りを行うことがなされる。そして、樹脂を凹部３３内に注入した後、インサート成形後における樹脂成形部２０の外面には、図５に示すように、押さえ部３７による型抜き孔２２が形成されることになる。   A pressing portion 37 is formed on the surface of the concave portion 33 that faces the contact surface 36 so as to protrude downward. The pressing portion 37 comes into contact with the back surface of the bonding surface 14 when the mold is closed, and the terminal portion 11 is pushed into the terminal holding recess 34 (the direction in which the outer peripheral edge portion of the bonding surface 14 is in close contact with the contact surface 36). Affected. Therefore, the resin is surely cut off at the outer peripheral edge portion of the bonding surface 14. And after inject | pouring resin in the recessed part 33, as shown in FIG. 5, the die cutting hole 22 by the pressing part 37 will be formed in the outer surface of the resin molding part 20 after insert molding.

ところで、樹脂成形部２０において端子部１１側の端部のうち、端子部１１を挟んでボンディング面１４と反対側には、図５に示すように、傾斜面２１が形成されている。傾斜面２１は、図３に示すように、インサート成形後においては上型３１のうち成形型３０の型抜き方向に沿う垂直面３３Ａに当接するようにしている。このように、図２において一点破線で示したような角部２３を設けずに、傾斜面２１としているのは、インサート成形後に角部２３がオーバーハング状となり、角部２３と凹部３３とが当たり合うことで、上下両型３１，３２を上下方向に引き抜くことができなくなるのを防ぐためである。   By the way, as shown in FIG. 5, the inclined surface 21 is formed in the resin molding part 20 in the edge part by the side of the terminal part 11 on the opposite side to the bonding surface 14 on both sides of the terminal part 11. As shown in FIG. As shown in FIG. 3, the inclined surface 21 comes into contact with a vertical surface 33 </ b> A of the upper mold 31 along the mold drawing direction of the upper mold 31 after the insert molding. In this way, the inclined surface 21 is not provided with the corner portion 23 as shown by the one-dot broken line in FIG. 2, but the corner portion 23 becomes overhanged after the insert molding, and the corner portion 23 and the recess portion 33 are formed. This is in order to prevent the upper and lower molds 31 and 32 from being able to be pulled out in the vertical direction.

本実施形態は以上のような構造であって、続いてその作用を説明する。
まず、端子部１１が鉛直方向に対して斜め方向となるように金属板材１０を下型３２に載置する。金属板材１０は、端子部１１が端子保持凹部３４に支持されるとともに、ボンディング面１４の外周縁部が接触面３６に支持される。次に、上下両型３１，３２の型閉めを行う。型閉めが完了すると、図２に示すように、成形型３０内には、凹部３３により構成されるキャビティＣと、端子保持凹部３４とが形成される。このとき、端子部１１は、端子保持凹部３４によって上下方向から挟み込まれる。また、ボンディング面１４の裏面には、押さえ部３７が当接することによって、端子部１１が端子保持凹部３４内へ押し込まれるとともに、ボンディング面１４の外周縁部が接触面３６に密着する。 The present embodiment has the above-described structure, and the operation thereof will be described subsequently.
First, the metal plate 10 is placed on the lower mold 32 so that the terminal portion 11 is inclined with respect to the vertical direction. In the metal plate 10, the terminal portion 11 is supported by the terminal holding recess 34, and the outer peripheral edge portion of the bonding surface 14 is supported by the contact surface 36. Next, the upper and lower molds 31 and 32 are closed. When the mold closing is completed, as shown in FIG. 2, the cavity C constituted by the concave portion 33 and the terminal holding concave portion 34 are formed in the molding die 30. At this time, the terminal portion 11 is sandwiched by the terminal holding recess 34 from above and below. Further, when the pressing portion 37 contacts the back surface of the bonding surface 14, the terminal portion 11 is pushed into the terminal holding recess 34, and the outer peripheral edge portion of the bonding surface 14 is in close contact with the contact surface 36.

続いて、図３に示すように、キャビティＣ内に樹脂を注入する。このとき、ボンディング面１４の外周縁部は、接触面３６に密着して接触しているため、ボンディング面１４に樹脂が付着することが規制される。また、端子部１１は、端子保持凹部３４によって上下方向から密着して挟まれているから、樹脂が付着することが規制される。この後、図４に示すように、上下両型３１，３２の型抜きを行う。この型抜きに際しては、押さえ部３７及び傾斜面２１が上下方向（上下両型３１，３２の型抜き方向）に形成されているため、上下両型３１，３２をそのまま型抜きすることができる。   Subsequently, as shown in FIG. 3, a resin is injected into the cavity C. At this time, since the outer peripheral edge portion of the bonding surface 14 is in close contact with and in contact with the contact surface 36, the adhesion of the resin to the bonding surface 14 is restricted. Moreover, since the terminal part 11 is closely stuck by the terminal holding recessed part 34 from the up-down direction, it is controlled that resin adheres. Thereafter, as shown in FIG. 4, the upper and lower molds 31 and 32 are cut out. At the time of die cutting, since the pressing portion 37 and the inclined surface 21 are formed in the vertical direction (the die cutting direction of the upper and lower molds 31, 32), the upper and lower molds 31, 32 can be punched as they are.

以上のように本実施形態においては、以下に示す効果を奏することができる。
１．端子部１１の突出方向が鉛直方向に対して斜め方向となるように金属板材１０を下型３２に載置し、上下両型３１，３２のうち端子保持凹部３４を保有する面に対して斜め方向に上下両型３１，３２を型閉めすることで端子部１１を端子保持凹部３４内で密着して挟み込むことができる。したがって、端子保持凹部３４内に端子部１１を挿入することが不要となるから、端子部１１と端子保持凹部３４の内壁とが摺動することで端子部１１の表面に施されためっきが剥がれたり、端子部１１の表面に傷が付く等のおそれがない。 As described above, in the present embodiment, the following effects can be achieved.
1. The metal plate 10 is placed on the lower mold 32 so that the protruding direction of the terminal portion 11 is oblique with respect to the vertical direction, and oblique to the surface of the upper and lower molds 31 and 32 that holds the terminal holding recess 34. By closing both the upper and lower molds 31 and 32 in the direction, the terminal portion 11 can be tightly held in the terminal holding recess 34. Accordingly, since it is not necessary to insert the terminal portion 11 into the terminal holding recess 34, the plating applied to the surface of the terminal portion 11 is peeled off when the terminal portion 11 and the inner wall of the terminal holding recess 34 slide. Or the surface of the terminal portion 11 is not damaged.

２．型閉め時にボンディング面１４がキャビティ内面に接触しない構成としたから、ボンディング面１４に傷が付くことを防ぐことができる。このとき、ボンディング面１４の外周縁部が接触面３６に密着しているから、ボンディング面１４に樹脂が付着するおそれがない。また、ボンディング面１４を下向きにセットする場合には、ボンディング面１４の外周縁部を接触面３６で支持することとなり、端子保持凹部３４と接触面３６の２点で支持することができる。したがって、金属板材１０を安定した姿勢で型閉めすることができる。   2. Since the bonding surface 14 does not contact the inner surface of the cavity when the mold is closed, the bonding surface 14 can be prevented from being damaged. At this time, since the outer peripheral edge portion of the bonding surface 14 is in close contact with the contact surface 36, there is no possibility that the resin adheres to the bonding surface 14. When the bonding surface 14 is set downward, the outer peripheral edge of the bonding surface 14 is supported by the contact surface 36, and can be supported at two points, the terminal holding recess 34 and the contact surface 36. Therefore, the metal plate 10 can be closed with a stable posture.

３．上下両型３１，３２を型閉めすることに伴って押さえ部３７が金属板材１０に対しボンディング面１４の外周縁部を接触面３６に密着させる方向への分力を生じさせる。したがって、ボンディング面１４の外周縁部で確実に樹脂の食い切りを行うことができる。   3. As the upper and lower molds 31 and 32 are closed, the pressing portion 37 generates a component force in the direction in which the outer peripheral edge portion of the bonding surface 14 is brought into close contact with the contact surface 36 with respect to the metal plate material 10. Therefore, it is possible to reliably cut out the resin at the outer peripheral edge of the bonding surface 14.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施態様も本発明の技術的範囲に含まれる。
（１）実施形態１ではボンディング面１４を設けたものを例示したが、本発明によれば、ボンディング面１４は必ずしも設けなくてもよく、金属板材１０の他端側が樹脂成形部２０から突出する雄型端子を設けてもよい。
（２）実施形態１では金属板材１０の一端側がプレスフィット端子となっているものを例示したが、本発明によれば、必ずしもプレスフィット端子でなくてもよく、例えば、雄型端子であってもよい。
（３）実施形態１では接触面３６が凹部３３の下型３２側に設けられ、押さえ部３７が凹部３３の上型３１側に設けられているものを例示したが、本発明によれば、ボンディング面１４を金属板材１０の他端側の上面側に形成するようにすることで接触面３６と押さえ部３７を共用化し、接触面３６（押さえ部３７）を凹部３３の上型３１側に設けるようにしてもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) Although the example in which the bonding surface 14 is provided is illustrated in the first embodiment, according to the present invention, the bonding surface 14 is not necessarily provided, and the other end side of the metal plate 10 protrudes from the resin molding portion 20. A male terminal may be provided.
(2) In the first embodiment, the metal plate member 10 is illustrated as having a press-fit terminal on one end side. However, according to the present invention, the press-fit terminal is not necessarily used. Also good.
(3) In the first embodiment, the contact surface 36 is provided on the lower mold 32 side of the concave portion 33 and the pressing portion 37 is provided on the upper mold 31 side of the concave portion 33, but according to the present invention, By forming the bonding surface 14 on the upper surface side of the other end of the metal plate 10, the contact surface 36 and the pressing portion 37 are shared, and the contact surface 36 (the pressing portion 37) is placed on the upper mold 31 side of the recess 33. You may make it provide.

実施形態１における電位制御ユニットの断面図Sectional drawing of the electric potential control unit in Embodiment 1. そのインサート成形品の型閉じ状態で樹脂注入前における断面図Cross-sectional view of the insert molded product in the closed state before resin injection そのインサート成形品の型閉じ状態で樹脂注入後における縦断面図Longitudinal sectional view after resin injection with the insert molded product closed そのインサート成形品の樹脂注入後で型開き状態における断面図Sectional view in the mold open state after resin injection of the insert molded product そのインサート成形品の断面図Cross section of the insert molding そのインサート成形品の型閉じ状態で樹脂注入後における横断面図Cross-sectional view of the insert molded product after resin injection with the mold closed

符号の説明Explanation of symbols

１…インサート成形品
１０…金属板材（導電材料）
１１…端子部
１４…ボンディング面
２０…樹脂成形部
３０…成形型
３１…上型
３２…下型
３３…凹部
３４…端子保持凹部
３５…端子保持凹部を保有する面
３６…接触面
３７…押さえ部
３８…非接触面
Ｃ…キャビティ DESCRIPTION OF SYMBOLS 1 ... Insert molded product 10 ... Metal plate material (conductive material)
DESCRIPTION OF SYMBOLS 11 ... Terminal part 14 ... Bonding surface 20 ... Resin molding part 30 ... Mold 31 ... Upper mold 32 ... Lower mold 33 ... Recessed part 34 ... Terminal holding recessed part 35 ... Surface holding a terminal holding recessed part 36 ... Contact surface 37 ... Holding part 38 ... Non-contact surface C ... Cavity

Claims (6)

上型と下型とから構成された成形型を使用してインサート成形を行うインサート成形品の製造方法であって、
前記成形型にセットされる導電材料は一部を折り曲げた形状をなし、その一端側にめっき処理が施された端子部が形成され、
前記成形型を、
前記上下両型により形成されるキャビティを有し、
前記上下両型の合わせ面に、前記キャビティを構成する凹部及びこの凹部に連なり前記端子部に密着してこれを挟む端子保持凹部を備える構成とし、
前記下型に、前記端子部の突出方向が鉛直方向に対して斜め方向となるように前記導電材料を載置し、前記上下両型の合わせ面のうち前記端子保持凹部を保有する面に対して斜め方向に前記上下両型を型閉めすることで前記端子部が前記端子保持凹部に挟まれ、前記キャビティ内に樹脂を注入することにより、前記端子部を露出させた状態で前記導電材料の周囲に樹脂成形部をインサート成形するインサート成形品の製造方法。 A method for manufacturing an insert-molded product in which insert molding is performed using a mold composed of an upper mold and a lower mold,
The conductive material set in the mold has a shape in which a part thereof is bent, and a terminal portion subjected to plating treatment is formed on one end side thereof,
The mold is
Having a cavity formed by the upper and lower molds;
On the mating surfaces of the upper and lower molds, a concave portion constituting the cavity and a terminal holding concave portion that is connected to the concave portion and is in close contact with the terminal portion, and sandwiching the concave portion are provided.
The conductive material is placed on the lower mold so that the protruding direction of the terminal portion is oblique with respect to the vertical direction, and the surface holding the terminal holding recess among the mating surfaces of the upper and lower molds. By closing the upper and lower molds in an oblique direction, the terminal part is sandwiched between the terminal holding recesses, and by injecting resin into the cavity, the terminal part is exposed and the conductive material is A method for manufacturing an insert-molded product in which a resin-molded portion is insert-molded around. 前記導電材料の他端側にボンディング面が形成されるものにおいて、前記キャビティ内面に、型閉め時に前記ボンディング面と非接触で対向して配置された非接触面及びこの非接触面に連なり前記ボンディング面の外周縁部に密着する接触面を備える構成としたことを特徴とする請求項１記載のインサート成形品の製造方法。 A bonding surface is formed on the other end side of the conductive material, and a non-contact surface that is disposed in contact with the bonding surface in a non-contact manner when the mold is closed, and a non-contact surface arranged in contact with the non-contact surface. 2. The method of manufacturing an insert-molded product according to claim 1, wherein a contact surface that is in close contact with the outer peripheral edge of the surface is provided. 前記成形型は、前記凹部に、前記キャビティ内に突出して設けられ、型閉め時に前記導電材料に対し前記ボンディング面の外周縁部を前記接触面に密着させる方向に接触する押さえ部を備える構成としたことを特徴とする請求項２記載のインサート成形品の製造方法。 The molding die includes a pressing portion provided in the concave portion so as to protrude into the cavity and contacting the conductive material in a direction in which the outer peripheral edge portion of the bonding surface is in close contact with the contact surface when the die is closed. The method for producing an insert-molded product according to claim 2, wherein 上型と下型とから構成され、
一部を折り曲げた導電材料の一端側にめっき処理が施された端子部の突出方向が鉛直方向に対して斜め方向となるように前記導電材料をセットし、前記上下両型により形成されるキャビティ内に樹脂を注入することにより、前記端子部を露出させた状態で前記導電材料の周囲に樹脂成形部をインサート成形する成形型であって、
前記上下両型の合わせ面に、前記キャビティを構成する凹部及びこの凹部に連なり前記端子部に密着してこれを挟む端子保持凹部が設けられ、
前記上下両型の型閉め方向は、前記上下両型の合わせ面のうち前記端子保持凹部を保有する面に対して斜め方向である成形型。 It consists of an upper mold and a lower mold,
A cavity formed by the upper and lower molds, in which the conductive material is set so that the protruding direction of the terminal portion plated on one end side of the conductive material with a part bent is oblique to the vertical direction A molding die that insert-molds a resin molding portion around the conductive material in a state where the terminal portion is exposed by injecting a resin therein,
On the mating surfaces of the upper and lower molds, there are provided a concave portion that constitutes the cavity and a terminal holding concave portion that is in contact with the terminal portion and is sandwiched between the concave portion and the concave portion,
The mold closing direction of both the upper and lower molds is an oblique direction with respect to the surface holding the terminal holding recess among the mating surfaces of the upper and lower molds. 前記導電材料の他端側にボンディング面が形成されるものにおいて、前記キャビティ内面に、型閉め時に前記ボンディング面と非接触で対向して配置された非接触面及びこの非接触面に連なり前記ボンディング面の外周縁部に密着する接触面を備える構成としたことを特徴とする請求項４記載の成形型。 A bonding surface is formed on the other end side of the conductive material, and a non-contact surface that is disposed in contact with the bonding surface in a non-contact manner when the mold is closed, and a non-contact surface arranged in contact with the non-contact surface. The molding die according to claim 4, comprising a contact surface that is in close contact with an outer peripheral edge of the surface. 前記成形型は、前記凹部に、前記キャビティ内に突出して設けられ、型閉め時に前記導電材料に対し前記ボンディング面の外周縁部を前記接触面に密着させる方向に接触する押さえ部を備える構成としたことを特徴とする請求項５記載の成形型。 The molding die includes a pressing portion provided in the concave portion so as to protrude into the cavity and contacting the conductive material in a direction in which the outer peripheral edge portion of the bonding surface is in close contact with the contact surface when the die is closed. The mold according to claim 5, wherein
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