JPH1192990A5 - - Google Patents
Info
- Publication number
- JPH1192990A5 JPH1192990A5 JP1997269302A JP26930297A JPH1192990A5 JP H1192990 A5 JPH1192990 A5 JP H1192990A5 JP 1997269302 A JP1997269302 A JP 1997269302A JP 26930297 A JP26930297 A JP 26930297A JP H1192990 A5 JPH1192990 A5 JP H1192990A5
- Authority
- JP
- Japan
- Prior art keywords
- medium
- pretreatment method
- container
- plating
- plating pretreatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26930297A JP3945872B2 (ja) | 1997-09-16 | 1997-09-16 | めっき前処理方法 |
| KR1019980037903A KR100538301B1 (ko) | 1997-09-16 | 1998-09-15 | 기판도금방법및장치 |
| DE69823952T DE69823952T2 (de) | 1997-09-16 | 1998-09-16 | Verfahren zum Plattieren |
| EP98117559A EP0913497B1 (en) | 1997-09-16 | 1998-09-16 | Method for plating a substrate |
| US09/153,895 US6123984A (en) | 1997-09-16 | 1998-09-16 | Method and apparatus for plating a substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26930297A JP3945872B2 (ja) | 1997-09-16 | 1997-09-16 | めっき前処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1192990A JPH1192990A (ja) | 1999-04-06 |
| JPH1192990A5 true JPH1192990A5 (enExample) | 2004-10-14 |
| JP3945872B2 JP3945872B2 (ja) | 2007-07-18 |
Family
ID=17470460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26930297A Expired - Fee Related JP3945872B2 (ja) | 1997-09-16 | 1997-09-16 | めっき前処理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6123984A (enExample) |
| EP (1) | EP0913497B1 (enExample) |
| JP (1) | JP3945872B2 (enExample) |
| KR (1) | KR100538301B1 (enExample) |
| DE (1) | DE69823952T2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001027357A1 (en) * | 1999-10-12 | 2001-04-19 | Semitool, Inc. | Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station |
| US20050205111A1 (en) * | 1999-10-12 | 2005-09-22 | Ritzdorf Thomas L | Method and apparatus for processing a microfeature workpiece with multiple fluid streams |
| JP4660661B2 (ja) * | 2000-02-22 | 2011-03-30 | コスモ石油株式会社 | プラスチックのメッキ前処理方法、メッキ方法、メッキ物の製造方法及びメッキ装置 |
| AU2001275795A1 (en) * | 2000-08-24 | 2002-03-04 | Hiroe Asai | Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
| CN101147909B (zh) | 2002-05-20 | 2010-06-09 | 松下电器产业株式会社 | 清洗方法 |
| WO2004044281A2 (en) * | 2002-11-12 | 2004-05-27 | The Regents Of The University Of California | Nano-porous fibers and protein membranes |
| US7217749B2 (en) * | 2003-01-20 | 2007-05-15 | Northern Technologies International Corporation | Process for infusing an alkali metal nitrite into a synthetic resinous material |
| US7217750B2 (en) * | 2003-01-20 | 2007-05-15 | Northern Technologies International Corporation | Process for incorporating one or more materials into a polymer composition and products produced thereby |
| JP2004225152A (ja) * | 2003-01-27 | 2004-08-12 | Tokyo Electron Ltd | 基板処理方法および半導体装置の製造方法 |
| CN101459050B (zh) * | 2007-12-14 | 2013-03-27 | 盛美半导体设备(上海)有限公司 | 电化学或化学沉积金属层前预浸润晶片表面的方法和装置 |
| US10221488B2 (en) * | 2015-09-18 | 2019-03-05 | General Electric Company | Supercritical water method for treating internal passages |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2719782B2 (ja) * | 1987-08-19 | 1998-02-25 | イビデン株式会社 | 多層プリント配線板の製造方法 |
| JPH02209729A (ja) * | 1989-02-09 | 1990-08-21 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及び異物除去装置 |
| JPH03127832A (ja) * | 1989-10-13 | 1991-05-30 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及び乾燥装置 |
| KR930019861A (ko) * | 1991-12-12 | 1993-10-19 | 완다 케이. 덴슨-로우 | 조밀상 기체를 이용한 코팅 방법 |
| JPH07283219A (ja) * | 1994-04-13 | 1995-10-27 | Sanyo Electric Co Ltd | 半導体装置および半導体装置の製造方法および半導体装 置の製造装置 |
| JPH09139374A (ja) * | 1995-11-15 | 1997-05-27 | Hitachi Ltd | 表面処理方法および装置ならびにこれにより得られた素子 |
-
1997
- 1997-09-16 JP JP26930297A patent/JP3945872B2/ja not_active Expired - Fee Related
-
1998
- 1998-09-15 KR KR1019980037903A patent/KR100538301B1/ko not_active Expired - Fee Related
- 1998-09-16 US US09/153,895 patent/US6123984A/en not_active Expired - Fee Related
- 1998-09-16 DE DE69823952T patent/DE69823952T2/de not_active Expired - Fee Related
- 1998-09-16 EP EP98117559A patent/EP0913497B1/en not_active Expired - Lifetime
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