JPH118275A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability finely without decreasing productivity, for example, through laser machining by using the laser machining technique in a process for providing a groove for controlling a resin application range on the opposite surface of a wiring pattern formation surface. SOLUTION: Grooves 13 for stopping the flow of sealing resin 26 are provided on the opposite surface of the formation surface of a wiring pattern and a concrete lead 12 in a tape substrate 11. The grooves 13 can be utilized for stopping the flow of the sealing resin 26. However, the grooves 13 being located inside are used for stopping the flow of the sealing resin, the groove 13 being located at an inner side is utilized as the appearance standard of a resin flow region in a sealing resin application process, namely as the acceptance criterion for inspecting a sealing resin application range, thus improving reliability. Also, when the grooves 13 are formed, a laser machining technique is used. A fine groove can be machined extremely easily in laser machining technique, so that the lowering of productivity can be made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device in which electronic parts such as semiconductor chips are mounted on a tape substrate and electrically connected to each other, and then a connection portion is sealed with a resin. The present invention relates to a device manufacturing method.

[0002]

2. Description of the Related Art Consumer electronic devices, such as mobile communication devices, have been pursued to be smaller and lighter and have been offered to the market at lower prices. Therefore, the semiconductor device mounted inside the semiconductor device is required to be compact and thin, and also strictly economical.

As shown in FIG. 3, for example, as shown in FIG. 3, an IC or an LSI providing a high function is provided with a contact lead 34 having a wiring pattern provided on a carrier tape (tape substrate) 31 by printing or the like. TAB (Tape) for joining the electrodes of the chip 33 through the bumps 32
In pursuit of Automated Bonding technology, it is compatible with miniaturization and thinning.

In this case, the semiconductor chip 33 is connected to the contact leads 3 of the tape substrate 31 in order to improve protection and reliability.
4 is connected to the sealing resin 3 via the bump 32.
5, so-called TCP (Tape Car)
(Rier Package) technology.

The sealing resin 35 is generally of a face-down type in which a resin is applied from the side opposite to the wiring pattern of the tape substrate 31 (the lower side in FIG. 3). Since it is difficult to accurately control the range, there is a case in which the variation causes a problem that hinders the mounting.

As a countermeasure against this point, for example, Japanese Unexamined Patent Publication No.
In the electronic component mounting apparatus disclosed in Japanese Patent Application Publication No. 7535, a technology is adopted in which a sealing resin flow stop frame is formed on a long printed wiring board base material so as to surround an electronic component storage portion and a bonding hole provided on the base material. Has been proposed. The sealing resin flow stop frame here is formed by screen printing or pad printing of ink (silicone resin ink, etc.) on the surface of the base material, thereby improving productivity, and furthermore, the inner surface of the frame has a zigzag surface. In this case, the sealing resin is prevented from flowing.

[0007]

The first problem is that when the sealing resin flow stopping frame is formed by the above-mentioned conventional technique, the working process becomes complicated. The reason is that in the manufacturing process of semiconductor devices, ink (resin)
This is because an extra step such as screen printing or pad printing which is troublesome increases.

A second problem is that when the sealing resin flow preventing frame is formed by such screen printing or pad printing, it is difficult to perform fine processing. Certainly, as described in Japanese Patent Application Laid-Open No. Hei 8-97535, although finer processing can be performed by pad printing than screen printing, it is necessary to respond to recent ultra-small, thin, and large-scale integrated multi-pin devices. not enough.

The third problem is that, since the conventional sealing resin flow stopping frame is provided so as to protrude from the surface of the base material, for example, laser processing technology or etching technology capable of ultra-fine processing is effective. It is a problem that it cannot be used.

[0010] The present invention has been made in consideration of the above points, and adopts the concept of forming the sealing resin flow stopping frame in the form of a groove, so that it can be finely formed by laser processing or the like. It can be formed without lowering the productivity, and by forming a plurality of grooves around, the appearance standard of the resin flow area at the time of the sealing resin application step, that is,
An object of the present invention is to provide a technique that can be used as a pass / fail criterion for inspection of a sealing resin application range to improve reliability.

[0011]

In order to solve the above-mentioned problems, according to the present invention, an electronic component is mounted on a tape substrate having a wiring pattern and a contact lead for the electronic component, and is electrically connected to the tape substrate. A method for manufacturing a semiconductor device in which a resin is applied from the opposite side of a wiring pattern forming surface and sealed in a form including a portion, and a groove for controlling a resin application range is formed on the opposite side of the wiring pattern forming surface. The step of providing the groove includes a step of using a laser processing technique. In this case, there is a marking step of performing a marking on the electronic component for identifying a manufacturing history or the like by laser processing, and the step of forming the groove may be performed in the marking step. Also, the grooves can be formed by a laser processing device used in the stamping process. Further, it is preferable that the groove surrounds the periphery of the electronic component and is located outside a range where the sealing resin is to be applied. Also, a plurality of grooves can be provided. Further, of the plurality of grooves, the first groove located outside the sealing resin application range is used as a groove for stopping the flow of the sealing resin, and the groove located further outside the groove is sealed. It can also be used as a pass / fail criterion for resin application range inspection. It is preferable to use a semiconductor chip for the electronic component. On the other hand, in the present invention, after the electronic component is mounted on the tape substrate having the wiring pattern and the contact lead with the electronic component and electrically connected thereto, at least the connection portion is included in the tape substrate from the side opposite to the wiring pattern forming surface. A method for manufacturing a semiconductor device in which a resin is applied and sealed, the method including a step of providing a groove for controlling a resin application range on a surface opposite to a wiring pattern forming surface, wherein the step of providing the groove includes a half-etching technique. May be employed. Also in this case, a plurality of grooves can be provided outside the sealing resin application range.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to FIGS. FIG.
FIG. 2 is a plan view of a tape substrate on which electronic components are mounted, and FIG.
Is a sectional view thereof. In these figures, 11 is a tape substrate, 12 is a contact lead, and an electrode part on the surface of an electronic component (semiconductor chip) 14 is electrically connected to the contact lead 12 via a bump 23.

A wiring pattern (not shown to avoid complication) on the tape substrate 11 and a contact lead 12
The groove 13 for stopping the flow of the sealing resin 26 is provided on the surface opposite to the surface on which is formed. The plurality of grooves 13 are provided in a form surrounding the periphery of the electronic component 14 (two in FIG. 2 at intervals inside and outside). Care is taken that these grooves 13 are located outside the preset sealing resin application range.

Although all of these grooves 13 can be used for stopping the flow of the sealing resin 26, in the present embodiment, the grooves 13 located inside are used for stopping the flow of the sealing resin, and The groove 13 to be used is used as an external standard of the resin flow region in the encapsulating resin application step, that is, a pass / fail standard for inspection of the encapsulating resin application range, so that the reliability can be improved. ing. Reference numeral 15 denotes a sprocket hole.

In the present embodiment, the groove 13 is formed by using a laser processing technique. This is because the processing of fine grooves can be performed extremely easily by the laser processing technique, and the productivity is not reduced thereby.

From the viewpoint of not lowering the productivity, it is more preferable to adopt the following laser processing step. That is, in the manufacturing process of such a semiconductor device, before performing the resin sealing process, for example, a stamp such as a rod number or a product name for identifying a manufacturing history or the like is performed on the surface of the electronic component 14 by laser processing. . Therefore, in the laser stamping process at this time, the grooves 13 are also laser-processed at the same time, so that the productivity can be prevented from lowering.

As a laser processing device used for laser processing the groove 13, a dedicated laser processing device may be arranged and used, or a laser processing device used in a laser stamping process may be used.
If a special one is used, it can be performed at the same time as the laser marking process, so that productivity can be improved accordingly. On the other hand, if the laser processing step is used, the laser processing apparatus can also be used, which is advantageous in terms of equipment costs.

The depth of the groove 13 is preferably as deep as possible from the viewpoint of the resin flow stopping function. However, this groove 13
Is a groove that goes around, so that the strength of the tape substrate 11 must be considered. In consideration of these points, it is preferable that the thickness be equal to or less than half the thickness, though it depends on the thickness of the tape substrate 11. By doing so, both the function of the groove 13 and the strength of the tape substrate 11 can be considered.

Regarding the method of forming the groove 13, besides laser processing, it can be formed by using, for example, a half etching technique. In this case, if the grooves 13 are formed in the manufacturing process for forming the wiring patterns, the contact leads 12, and the like on the tape substrate 11, the productivity does not decrease so much.

According to the present embodiment, when the sealing resin 26 is applied, the resin flowing out of the preset sealing resin application range enters the groove 13 as shown in FIG. It is stopped. The sealing resin 26 in the state shown in FIG. 2 is stopped by the groove 13 located inside,
Since it does not enter the groove 13 located on the outside, in this state, it is possible to adopt a method of judging a good product as an appearance standard. Of course, it can also be used as a pass / fail criterion using an inspection device or the like that optically determines the state of the outer groove 13.

As another function of the groove 13, as shown in FIG. 2, the boundary between the surface of the tape substrate 11 and the sealing resin 26 does not protrude from the surface of the tape substrate 11. It is possible to form a difficult bonding shape. From this point, it is very effective to use the groove 13.

The number of the grooves 13 may be three or more.
The number and shape of the grooves, such as a meandering shape and a zigzag shape, do not matter.

As described above, according to the present invention, by forming the sealing resin flow stopping frame in the form of a groove, it can be formed finely by laser processing or the like without lowering the productivity. In addition, by forming a plurality of grooves around the periphery, it can be used as a reference for the appearance of the resin flow area at the time of the sealing resin application step, that is, used as a pass / fail criterion for inspection of the sealing resin application range, and Performance can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a conventional sealing resin flow stopping frame.

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 tape substrate 12 contact lead 13 groove for preventing sealing resin from flowing 14 electronic component (semiconductor chip) 15 sprocket hole 23 bump 26 sealing resin 31 tape substrate 32 bump 33 electronic component (semiconductor chip) 34 contact lead 35 sealing resin

Claims (9)

[Claims] After mounting an electronic component on a tape substrate having a wiring pattern and a contact lead to the electronic component and electrically connecting the component, a resin including at least the connection portion from a side opposite to a wiring pattern forming surface is formed of a resin. A method for manufacturing a semiconductor device, in which a groove for controlling a resin application range is provided on a surface opposite to the surface on which the wiring pattern is formed, wherein the groove is provided by a laser processing technique. A method for manufacturing a semiconductor device, comprising: 2. A marking process for performing a marking for identifying a manufacturing history or the like on the electronic component by laser processing, wherein a step of forming the groove is performed in the marking process. A method for manufacturing a semiconductor device according to claim 1. 3. The method according to claim 2, wherein the groove is formed by a laser processing device used in the stamping step. 4. The method according to claim 1, wherein the groove surrounds the periphery of the electronic component and is located outside a range in which a sealing resin is to be applied. 5. The method according to claim 1, wherein a plurality of the grooves are provided.
A method for manufacturing a semiconductor device according to claim 4. 6. A groove located outside the sealing resin application range among the plurality of grooves, which is used as a groove for stopping the flow of the sealing resin, and a groove located further outside the groove. To
The method for manufacturing a semiconductor device according to claim 5, wherein the method is used as a pass / fail criterion for inspection of a sealing resin application range. 7. The method according to claim 1, wherein the electronic component is a semiconductor chip. 8. After mounting an electronic component on a tape substrate having a wiring pattern and a contact lead for the electronic component and electrically connecting the electronic component to the tape substrate, a resin including at least the connection portion is formed from a side opposite to the wiring pattern forming surface. A step of providing a groove for controlling a resin application range on a surface opposite to the wiring pattern forming surface, wherein the step of providing the groove includes a half-etching technique. A method for manufacturing a semiconductor device, comprising: 9. The method of manufacturing a semiconductor device according to claim 8, wherein a plurality of the grooves are provided outside a sealing resin application range.