JPH1154907A - Jig for soldering printed circuit board and manufacture of printed circuit board using it - Google Patents
Jig for soldering printed circuit board and manufacture of printed circuit board using itInfo
- Publication number
- JPH1154907A JPH1154907A JP22123697A JP22123697A JPH1154907A JP H1154907 A JPH1154907 A JP H1154907A JP 22123697 A JP22123697 A JP 22123697A JP 22123697 A JP22123697 A JP 22123697A JP H1154907 A JPH1154907 A JP H1154907A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- soldering
- connector
- insertion portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント回路板の
手作業による部品のはんだ付けを、自動はんだ付けし、
且つ、自動はんだ付け時の熱による反りを防ぐプリント
回路板のはんだ付け用治具と、このはんだ付け用治具を
用いたプリント回路板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to automatic soldering of printed circuit boards by manually soldering parts.
The present invention also relates to a printed circuit board soldering jig for preventing warpage due to heat during automatic soldering, and a method of manufacturing a printed circuit board using the soldering jig.
【０００２】[0002]
【従来の技術】従来、プリント回路板の自動ハンダ付け
装置は、図４の（１）に示すようにプリント回路板３０
の両端部を挟む把持部材４０が主であり、このように、
把持部材４０でプリント回路板３０を把持した後に、プ
リント回路板３０に部品を実装し、自動はんだ付けを行
う。2. Description of the Related Art Conventionally, an automatic soldering apparatus for a printed circuit board has a structure as shown in FIG.
Is mainly a gripping member 40 sandwiching both end portions of
After holding the printed circuit board 30 with the holding member 40, the components are mounted on the printed circuit board 30, and automatic soldering is performed.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、自動は
んだ付け装置の把持部材４０でプリント回路板３０の両
端部を挟み搬送をするだけであるために、はんだ付け時
の熱によるプリント回路板３０が図４の（２）に示すよ
うに変形するため、プリント回路板３０をねじなどで締
め付け固定しようとした際、プリント回路板３０上には
んだ付けされた表面実装部品などのはんだ付け部に亀裂
などが発生するという問題点があった。However, since only the both ends of the printed circuit board 30 are conveyed by the gripping members 40 of the automatic soldering apparatus, the printed circuit board 30 due to heat at the time of soldering is not shown. Since the printed circuit board 30 is deformed as shown in (2) of FIG. There was a problem that it occurred.
【０００４】また、図５に示すようなプリント回路板３
０の端面に実装されたコネクタ（実装部品）５０には、
自動はんだ付けができない。すなわち、図６に示すよう
にコネクタ５０のリード端子５１をプリント回路板３０
のスルーホール５２に挿入してはんだ付けすると共に、
コネクタ５０を止め部材３１でプリント回路板３０に固
着した場合には、コネクタ５０はプリント回路板３０の
端面３０ａより外方にＬだけ突出する。このために、上
記した把持部材４０では、プリント回路板３０の両端部
を挟むことができず、自動はんだ付けができなかった。A printed circuit board 3 as shown in FIG.
The connector (mounting component) 50 mounted on the end face of the
Automatic soldering is not possible. That is, as shown in FIG. 6, the lead terminals 51 of the connector 50 are connected to the printed circuit board 30.
And soldering it into the through hole 52 of
When the connector 50 is fixed to the printed circuit board 30 with the stopper member 31, the connector 50 protrudes outward by L from the end surface 30 a of the printed circuit board 30. For this reason, both ends of the printed circuit board 30 could not be sandwiched by the gripping member 40 described above, and automatic soldering could not be performed.
【０００５】そのため、コネクタ５０の場合は、他の部
品の自動はんだ付け後、手作業によるはんだ付け作業を
行うか、端面に実装されるコネクタ５０のリード端子５
１が挿入されるスルーホール５２へのはんだ上がりを防
止するためのマスキングテープの貼り付け作業を行うな
ど作業工数が増えるという問題点があった。For this reason, in the case of the connector 50, after the other components are automatically soldered, a manual soldering operation is performed or the lead terminals 5 of the connector 50 mounted on the end surface are used.
There is a problem that the number of man-hours increases, for example, a work of attaching a masking tape to prevent the solder from flowing up into the through hole 52 into which 1 is inserted.
【０００６】本発明は、上記の問題点に着目して成され
たものであって、その第１の目的とするところは、縁部
に部品（コネクタ）が実装され且つ他の部品が実装され
たプリント回路板の自動はんだ付けを行うことができる
ばかりか、はんだ付け時の熱によるプリント回路板の反
りを防ぐことができるプリント回路板のはんだ付け用治
具を提供することにある。The present invention has been made in view of the above problems, and a first object of the present invention is to mount a component (connector) on an edge and mount another component. Another object of the present invention is to provide a printed circuit board soldering jig capable of not only performing automatic soldering of a printed circuit board but also preventing warpage of the printed circuit board due to heat during soldering.
【０００７】また、本発明の第２の目的とするところ
は、従来自動はんだ付け後に行っていた端面への実装部
品の手作業によるはんだ付けを他の実装部品と一括では
んだ付けすることで作業工数の低減を図ることができる
プリント回路板の製造方法を提供することにある。A second object of the present invention is to perform a manual soldering of a mounted component to an end face, which has been conventionally performed after automatic soldering, by performing a collective soldering with another mounted component. An object of the present invention is to provide a method for manufacturing a printed circuit board, which can reduce the number of steps.
【０００８】[0008]
【課題を解決するための手段】上記の第１の目的を達成
するために、請求項１の発明に係るプリント回路板のは
んだ付け用治具は、枠状のフレームの下面部に、プリン
ト回路板の周縁部を受けるプリント回路板受け板を設
け、前記フレームの上面部に、前記プリント回路板受け
板に受けられた前記プリント回路板の縁部を弾性的に押
える押え手段を設け、前記フレームに前記プリント回路
板の縁部を挿入する縁挿入部を設け、前記フレームに前
記プリント回路板の縁部に実装された実装部品が挿入さ
れる実装部品挿入部と、前記実装部品の止め部が挿入さ
れる実装部品止め挿入部とを設けたことを特徴とする。According to a first aspect of the present invention, a jig for soldering a printed circuit board is provided on a lower surface of a frame-shaped frame. A printed circuit board receiving plate for receiving a peripheral portion of the board; a pressing means for elastically pressing an edge of the printed circuit board received by the printed circuit board receiving plate on an upper surface of the frame; An edge insertion portion for inserting an edge portion of the printed circuit board is provided, and a mounting component insertion portion for inserting a mounting component mounted on the edge portion of the printed circuit board into the frame, and a stop portion for the mounting component. And a mounting component stopper insertion portion to be inserted.
【０００９】かかる構成により、縁部に実装部品が実装
されたプリント回路板をプリント回路板受け板で受け、
実装部品を実装部品挿入部に挿入すると共に、実装部品
の止め部を実装部品止め挿入部に挿入し、押え手段でプ
リント回路板を押えることができる。With this configuration, the printed circuit board having the mounted components mounted on the edge is received by the printed circuit board receiving plate,
The mounting component can be inserted into the mounting component insertion portion, and the stop portion of the mounting component can be inserted into the mounting component stop insertion portion, and the printed circuit board can be pressed by the holding means.
【００１０】このように、はんだ付け用治具に、縁部に
実装部品が実装されたプリント回路板を装着した後に、
このプリント回路板に他の実装部品を実装し、自動はん
だ付けを行うことができるし、プリント回路板はその４
辺で押さえられているので、はんだ付け時の熱での反り
を防ぐことができる。As described above, after the printed circuit board having the mounted components mounted on the edges is mounted on the soldering jig,
Another printed component can be mounted on this printed circuit board and automatic soldering can be performed.
Since it is held by the sides, it is possible to prevent warpage due to heat during soldering.
【００１１】また、上記の第１の目的を達成するため
に、請求項２に記載のプリント回路板のはんだ付け用治
具は、請求項１に記載のプリント回路板のはんだ付け用
治具において、前記押え手段を、側面Ｌ字形状の可動押
え部材を支持部材により前記フレームの上面部に回転可
能に取り付け、前記支持部材に前記可動押え部材を下方
に付勢するばね部材を設けて構成し、前記実装部品挿入
部を、フレームの上面部に押え部材を固着し、この押え
部材に切欠き部を形成して構成し、前記縁挿入部を、前
記押え部材と前記プリント回路板受け板とで構成し、前
記実装部品止め挿入部を、前記プリント回路板受け板に
切欠き部を形成して構成した。According to a second aspect of the present invention, there is provided a printed circuit board soldering jig according to the first aspect. The pressing means is configured such that a movable pressing member having an L-shaped side surface is rotatably attached to an upper surface of the frame by a supporting member, and the supporting member is provided with a spring member for urging the movable pressing member downward. The mounting component insertion portion, a holding member is fixed to the upper surface of the frame, a notch portion is formed in the holding member, the edge insertion portion, the holding member and the printed circuit board receiving plate, And the mounting component stopper insertion portion is formed by forming a cutout portion in the printed circuit board receiving plate.
【００１２】かかる構成により、縁部に実装部品が実装
されたプリント回路板の前、後縁部及び左、右縁部をプ
リント回路板受け板の受け部で受け、実装部品を実装部
品挿入部に挿入すると共に、実装部品の止め部を実装部
品止め挿入部に挿入し、押え部材を回転させて、プリン
ト回路板の周縁部に載せてばね部材の付勢力でプリント
回路板を押えることができる。With this configuration, the front, rear, left, and right edges of the printed circuit board having the mounted components mounted on the edges are received by the receiving portions of the printed circuit board receiving plate, and the mounted components are inserted into the mounted component insertion portion. At the same time, the stop portion of the mounting component is inserted into the mounting component stop insertion portion, the holding member is rotated, and the mounting portion is placed on the periphery of the printed circuit board, and the printed circuit board can be pressed by the urging force of the spring member. .
【００１３】このように、はんだ付け用治具に、縁部に
実装部品が実装されたプリント回路板を装着した後に、
このプリント回路板に他の実装部品を実装し、自動はん
だ付けを行うことができるし、プリント回路板はその４
辺で押さえられているので、はんだ付け時の熱での反り
を防ぐことができる。As described above, after the printed circuit board having the mounted components mounted on the edges is mounted on the soldering jig,
Another printed component can be mounted on this printed circuit board and automatic soldering can be performed.
Since it is held by the sides, it is possible to prevent warpage due to heat during soldering.
【００１４】また、上記の第２の目的を達成するため
に、請求項３の発明に係るプリント回路板の製造方法
は、請求項１又は請求項２又は請求項３に記載のプリン
ト回路板のはんだ付け用治具を用いたことを特徴とす
る。According to a third aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising the steps of: It is characterized by using a soldering jig.
【００１５】したがって、自動はんだ付けする際、縁部
に実装部品が実装されたプリント回路板をはんだ付け用
治具に装着することで、はんだ付け時の熱によるプリン
ト回路板の反りを防止することができるばかりか、自動
はんだ付け後に行っている手作業による実装部品のはん
だ付け作業が、自動はんだ付け可能となり、それに伴い
マスキングテープの貼り付け、剥がし作業も不要とな
り、プリント回路板のはんだ付け作業の工数低減ができ
る。Therefore, when the automatic soldering is performed, the printed circuit board having the mounted components mounted on the edges is mounted on a soldering jig to prevent the printed circuit board from warping due to heat during soldering. In addition to the automatic soldering, the manual soldering work of the mounted parts after the automatic soldering becomes possible, the attaching and detaching work of the masking tape becomes unnecessary, and the soldering work of the printed circuit board Can be reduced.
【００１６】[0016]
【発明の実施の形態】以下、本発明の実施の形態例を図
面を参照して説明する。図１は本発明に係るプリント回
路板のはんだ付け用治具の斜視図、図２は図１のＡ部の
拡大図、図３は図１のＢ−Ｂ線に沿う断面図である。Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of a jig for soldering a printed circuit board according to the present invention, FIG. 2 is an enlarged view of a portion A in FIG. 1, and FIG. 3 is a cross-sectional view taken along line BB in FIG.
【００１７】本発明に係るプリント回路板のはんだ付け
用治具は、平面視で長方形の枠状のフレーム１を有して
おり、このフレーム１は、その短手方向の互いに対向す
る部位である前、後側部位１Ａ、１Ｂと、その長手方向
の互いに対向する部位である左、右側部位１Ｃ、１Ｄと
を有している。The jig for soldering a printed circuit board according to the present invention has a frame 1 having a rectangular frame shape in a plan view, and the frames 1 are portions opposed to each other in the short direction. It has front and rear portions 1A and 1B, and left and right portions 1C and 1D, which are portions facing each other in the longitudinal direction.
【００１８】そして、フレーム１の前、後側部位１Ａ、
１Ｂ及び左、右側部位１Ｃ、１Ｄの下面部には、プリン
ト回路板受け板２、３が２枚重ねにした状態で固着して
あり、プリント回路板受け板２、３の一部は、フレーム
１の前、後側部位１Ａ、１Ｂ及び左、右側部位１Ｃ、１
Ｄの内縁部よりフレーム１の内方に突出していて、この
突出部分が受け部４になっている。なおプリント回路板
受け板２、３はガラスエポキシン基材等の比較的耐熱性
の高い材料で作成してある。The front and rear portions 1A of the frame 1
The printed circuit board receiving plates 2 and 3 are fixed to the lower surfaces of the left and right portions 1C and 1D in a state where two printed circuit board receiving plates 2 and 3 are overlapped. 1 and the left and right portions 1C and 1
D protrudes inward from the inner edge of the frame 1, and this protruding portion serves as a receiving portion 4. Note that the printed circuit board receiving plates 2 and 3 are made of a material having relatively high heat resistance such as a glass epoxy base material.
【００１９】フレーム１の前側部位１Ａの上面部には、
その左右方向に所定の間隔をおいて複数個の押え手段で
ある押え機構部Ｋが設けてある。これらの押え機構部Ｋ
は、図３に示すように側面Ｌ字形状の可動押え部材５を
備えており、この可動押さ部材５の水平部５ａには孔部
６が設けてある。そして、この可動押え部材５は、孔部
６に挿入された支持部材７によりフレーム１の前側部位
１Ａの上面部に回転可能に取り付けてあり、支持部材７
には可動押え部材５を下方に付勢するばね部材８が設け
てある。また、フレーム１の前側部位１Ａの上面部に
は、断面Ｌ字形状の補強部材９が固着してある。On the upper surface of the front part 1A of the frame 1,
A plurality of pressing mechanisms K as pressing means are provided at predetermined intervals in the left-right direction. These holding mechanism K
As shown in FIG. 3, a movable pressing member 5 having an L-shaped side surface is provided, and a hole 6 is provided in a horizontal portion 5a of the movable pressing member 5. The movable pressing member 5 is rotatably attached to the upper surface of the front portion 1A of the frame 1 by a supporting member 7 inserted into the hole 6.
Is provided with a spring member 8 for urging the movable pressing member 5 downward. Further, a reinforcing member 9 having an L-shaped cross section is fixed to the upper surface of the front portion 1A of the frame 1.
【００２０】フレーム１の後側部位１Ｂの上面部には、
断面Ｌ字形状の押え部材１０が固着してある。この押え
部材１０の内縁部には、平面視で長方形状に切欠き部よ
り成るコネクタ挿入部（実装部品挿入部）１１が形成し
てあり、コネクタ挿入部１１間の部位が押え部１５にな
っていて、これらの押え部１５と受け部４とで縁挿入部
１２を構成している。On the upper surface of the rear portion 1B of the frame 1,
A holding member 10 having an L-shaped cross section is fixed. A connector insertion portion (mounting component insertion portion) 11 formed of a notch in a rectangular shape in a plan view is formed on an inner edge portion of the holding member 10, and a portion between the connector insertion portions 11 serves as a holding portion 15. The holding portion 15 and the receiving portion 4 constitute the edge insertion portion 12.
【００２１】また、フレーム１の後側部位１Ｂの下面部
にも、プリント回路板受け板２、２が２枚重ねにした状
態で固着してあり、プリント回路板受け板３には、コネ
クタ挿入部１１に対応させて切欠きからなるコネクタ止
め挿入部（実装部品止め挿入部）１９が形成してある。Also, two printed circuit board receiving plates 2 are fixedly attached to the lower surface of the rear portion 1B of the frame 1 in a state where two printed circuit board receiving plates 2 are stacked. A connector stopper insertion portion (mounting component stopper insertion portion) 19 formed of a notch is formed corresponding to the portion 11.
【００２２】また、フレーム１の左、右側部位１Ｃ、１
Ｄの上面部には取手部材２０が固着してあり、これらの
取手部材２０の中央部には切欠き部２１が形成してあ
る。そして、これらの切欠き部２１内には押え機構部２
２が設けてある。この押え機構部２２は、上記した押え
機構部４と同構成であるために、同一符号を付して説明
を省略する。取手部材２０は、プリント回路板受け板
２、３と同様比較的耐熱性の高い材料で成形してあり、
フレーム１の熱を吸収し、自動はんだ付け後作業者が持
ち運びできるようにしてある。The left and right portions 1C, 1
A handle member 20 is fixed to the upper surface of D, and a notch 21 is formed at the center of the handle member 20. The press mechanism 2 is provided in these notches 21.
2 are provided. Since the press mechanism 22 has the same configuration as the press mechanism 4 described above, the same reference numerals are given and the description is omitted. The handle member 20 is formed of a material having relatively high heat resistance like the printed circuit board receiving plates 2 and 3.
The heat of the frame 1 is absorbed so that a worker can carry it after automatic soldering.
【００２３】次に、上記のように構成されたプリント回
路板のはんだ付け用治具の使用を説明する。Next, the use of the printed circuit board soldering jig configured as described above will be described.
【００２４】まず、はんだ付け用治具をコンベア（図示
せず）に載せ、縁部にコネクタ（実装部品）５０が実装
されたプリント回路板３０を、はんだ付け用治具に装着
する。この場合、プリント回路板３０の後縁部３０ｂは
押え部１５と受け部４とからなる縁挿入部１２に挿入さ
れ、プリント回路板３０の前縁部３０ａ、左、右縁部３
０ｃ、３０ｄはプリント回路板受け板２、３の受け部４
に受けられ、コネクタ３１はコネクタ挿入部１１に挿入
されると共に、プリント回路板３０の裏面に形成された
止め部材３１がコネクタ止め挿入部（実装部品止め挿入
部）１９に挿入される。First, the soldering jig is placed on a conveyor (not shown), and the printed circuit board 30 on which the connector (mounting component) 50 is mounted on the edge is mounted on the soldering jig. In this case, the rear edge portion 30b of the printed circuit board 30 is inserted into the edge insertion portion 12 including the holding portion 15 and the receiving portion 4, and the front edge portion 30a, the left and right edge portions 3 of the printed circuit board 30 are provided.
0c and 30d are receiving portions 4 of the printed circuit board receiving plates 2 and 3.
The connector 31 is inserted into the connector insertion portion 11, and the stop member 31 formed on the back surface of the printed circuit board 30 is inserted into the connector stop insertion portion (mounting component stop insertion portion) 19.
【００２５】そして、押え機構部Ｋの押え部材５を回転
させて、プリント回路板３０の周縁部に載せてばね部材
８の付勢力でプリント回路板３を押える。Then, the presser member 5 of the presser mechanism K is rotated and placed on the periphery of the printed circuit board 30 to press the printed circuit board 3 by the urging force of the spring member 8.
【００２６】このように、はんだ付け用治具にプリント
回路板３０を装着した後に、プリント回路板３０に他の
実装部品を実装し、自動はんだ付けを行う。この時、プ
リント回路板３０はその４辺で押さえられているので、
はんだ付け時の熱での反りを防ぐことができる。After the printed circuit board 30 is mounted on the soldering jig as described above, another mounting component is mounted on the printed circuit board 30 and automatic soldering is performed. At this time, since the printed circuit board 30 is pressed on its four sides,
Warpage due to heat during soldering can be prevented.
【００２７】はんだ付け終了後は、押え機構部Ｋの押え
部材５を外方に回転させて、プリント回路板３の押えを
解除し、はんだ付け用治具よりプリント回路板３０を取
り外し次工程へ送る。After the soldering is completed, the holding member 5 of the holding mechanism K is rotated outward to release the holding of the printed circuit board 3, and the printed circuit board 30 is removed from the soldering jig to proceed to the next step. send.
【００２８】上記した実施の形態例によれば、縁部にコ
ネクタ５０が実装されたプリント回路板３０の前、後縁
部３０ａ、３０ｂ及び左、右縁部３０ｃ、３０ｄをプリ
ント回路板受け板２、３の受け部４で受け、コネクタ５
０をコネクタ挿入部１１に挿入すると共に、コネクタ５
０の止め部３１をコネクタ止め挿入部１９に挿入し、押
え部材５を回転させて、プリント回路板３０の周縁部に
載せてばね部材８の付勢力でプリント回路板３０を押え
ることができる。According to the above-described embodiment, the front and rear edges 30a and 30b and the left and right edges 30c and 30d of the printed circuit board 30 having the connector 50 mounted on the edge are connected to the printed circuit board receiving plate. Received by a few receiving portions 4 and a connector 5
0 into the connector insertion portion 11 and the connector 5
By inserting the retaining portion 31 into the connector retaining insertion portion 19 and rotating the retaining member 5, the retaining member 5 is placed on the periphery of the printed circuit board 30, and the printed circuit board 30 can be pressed by the urging force of the spring member 8.
【００２９】このように、はんだ付け用治具に、縁部に
コネクタ５０が実装されたプリント回路板３０を装着し
た後に、プリント回路板３０に他の実装部品を実装し、
自動はんだ付けを行うことができるし、プリント回路板
３０はその４辺で押さえられているので、はんだ付け時
の熱での反りを防ぐことができる。As described above, after the printed circuit board 30 having the connector 50 mounted on the edge thereof is mounted on the soldering jig, another mounting component is mounted on the printed circuit board 30.
Automatic soldering can be performed, and the printed circuit board 30 is held down on its four sides, so that warpage due to heat during soldering can be prevented.
【００３０】また、自動はんだ付けする際、従来自動は
んだ付け後に行っている手作業によるコネクタ５０のは
んだ付け作業が、自動はんだ付け可能となり、それに伴
いマスキングテープの貼り付け、剥がし作業も不要とな
り、プリント回路板３０のはんだ付け作業の工数低減が
できる。In the automatic soldering, the manual soldering work of the connector 50 which has been conventionally performed after the automatic soldering can be automatically soldered, so that the attaching and detaching work of the masking tape becomes unnecessary. The number of steps for soldering the printed circuit board 30 can be reduced.
【００３１】[0031]
【発明の効果】以上説明したように、本発明のプリント
回路板のはんだ付け用治具によれば、縁部に実装部品が
実装されたプリント回路板をプリント回路板受け板で受
け、実装部品を実装部品挿入部に挿入すると共に、実装
部品の止め部を実装部品止め挿入部に挿入し、押え手段
でプリント回路板を押えることができる。As described above, according to the jig for soldering a printed circuit board of the present invention, the printed circuit board having the mounted components mounted on the edges is received by the printed circuit board receiving plate, Can be inserted into the mounting component insertion portion, and the stop portion of the mounting component can be inserted into the mounting component stop insertion portion, and the printed circuit board can be pressed by the holding means.
【００３２】このように、はんだ付け用治具に、縁部に
実装部品が実装されたプリント回路板を装着した後に、
プリント回路板に他の実装部品を実装し、自動はんだ付
けを行うことができるし、プリント回路板はその４辺で
押さえられているので、はんだ付け時の熱での反りを防
ぐことができる。As described above, after the printed circuit board having the mounted components mounted on the edges is mounted on the soldering jig,
Another mounting component can be mounted on the printed circuit board to perform automatic soldering, and since the printed circuit board is held down on its four sides, warpage due to heat during soldering can be prevented.
【００３３】また、本発明のプリント回路板の製造方法
によれば、自動はんだ付けする際、プリント回路板をは
んだ付け用治具に装着することで、はんだ付け時の熱に
よるプリント回路板の反りを防止することができるばか
りか、自動はんだ付け後に行っている手作業による実装
部品のはんだ付け作業が、自動はんだ付け可能となり、
それに伴いマスキングテープの貼り付け、剥がし作業も
不要となり、端面に実装された部品のプリント回路板を
製作する際の作業工数の低減ができる。Further, according to the method of manufacturing a printed circuit board of the present invention, when the automatic soldering is performed, the printed circuit board is mounted on a jig for soldering, so that the printed circuit board is warped due to heat during soldering. In addition to preventing soldering, manual soldering of mounted components after automatic soldering becomes possible,
Accordingly, the work of attaching and detaching a masking tape is not required, and the number of man-hours for manufacturing a printed circuit board of components mounted on an end surface can be reduced.
【図１】本発明に係るプリント回路板のはんだ付け用治
具の斜視図である。FIG. 1 is a perspective view of a jig for soldering a printed circuit board according to the present invention.
【図２】図１のＡ部の拡大図である。FIG. 2 is an enlarged view of a portion A in FIG.
【図３】図１のＢ−Ｂ線に沿う断面図である。FIG. 3 is a sectional view taken along line BB of FIG. 1;
【図４】（１）は従来のプリント回路板の自動ハンダ付
け装置の斜視図である。（２）ははんだ付け時の熱で反
り返ったプリント回路板の説明図である。FIG. 4A is a perspective view of a conventional automatic soldering apparatus for printed circuit boards. (2) is explanatory drawing of the printed circuit board which warped by the heat at the time of soldering.
【図５】プリント回路板の端面における部品実装の斜視
図である。FIG. 5 is a perspective view of component mounting on an end face of the printed circuit board.
【図６】（１）（２）はプリント回路板の端面における
部品実装の説明図である。FIGS. 6A and 6B are explanatory diagrams of component mounting on an end face of a printed circuit board.
１ フレーム ２ プリント回路板受け板 ３ プリント回路板受け板 ４ 受け部 ５ 可動押え部材 ７ 支持部材 ８ ばね部材 １１ コネクタ挿入部（実装部品挿入部） １２ 縁挿入部 １９ コネクタ止め挿入部（実装部品止め挿入部） ３０ プリント回路板 ３１ 止め部 ５０ コネクタ（実装部品） REFERENCE SIGNS LIST 1 frame 2 printed circuit board receiving plate 3 printed circuit board receiving plate 4 receiving portion 5 movable holding member 7 supporting member 8 spring member 11 connector insertion portion (mounting component insertion portion) 12 edge insertion portion 19 connector stopper insertion portion (mounting component stopper) Insertion part) 30 Printed circuit board 31 Stop part 50 Connector (mounting part)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐久間 武雄 福島県郡山市字船場向94番地 株式会社日 立テレコムテクノロジー内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeo Sakuma 94, Kojiyama-shi, Fukushima Prefecture
Claims (3)
路板の周縁部を受けるプリント回路板受け板を設け、 前記フレームの上面部に、前記プリント回路板受け板に
受けられた前記プリント回路板の縁部を弾性的に押える
押え手段を設け、 前記フレームに前記プリント回路板の縁部を挿入する縁
挿入部を設け、 前記フレームに前記プリント回路板の縁部に実装された
実装部品が挿入される実装部品挿入部と、前記実装部品
の止め部が挿入される実装部品止め挿入部とを設けたこ
とを特徴とするプリント回路板のはんだ付け用治具。1. A printed circuit board receiving plate for receiving a peripheral portion of a printed circuit board is provided on a lower surface of a frame-like frame, and the printed circuit received by the printed circuit board receiving plate is provided on an upper surface of the frame. Holding means for elastically pressing an edge of the board; an edge insertion portion for inserting an edge of the printed circuit board in the frame; and a mounting component mounted on the edge of the printed circuit board in the frame. A jig for soldering a printed circuit board, comprising: a mounting component insertion portion to be inserted; and a mounting component stopper insertion portion into which a stopper of the mounting component is inserted.
材により前記フレームの上面部に回転可能に取り付け、
前記支持部材に前記可動押え部材を下方に付勢するばね
部材を設けて構成し、 前記実装部品挿入部を、フレームの上面部に押え部材を
固着し、この押え部材に切欠き部を形成して構成し、 前記縁挿入部を、前記押え部材と前記プリント回路板受
け板とで構成し、 前記実装部品止め挿入部を、前記プリント回路板受け板
に切欠き部を形成して構成した請求項１に記載のプリン
ト回路板のはんだ付け用治具。2. The pressing means, wherein a movable pressing member is rotatably attached to an upper surface of the frame by a supporting member,
The supporting member is provided with a spring member for urging the movable pressing member downward, and the mounting component insertion portion is formed by fixing a pressing member to an upper surface portion of a frame, and forming a notch in the pressing member. The edge insertion portion is constituted by the pressing member and the printed circuit board receiving plate, and the mounting component fixing insertion portion is formed by forming a cutout portion in the printed circuit board receiving plate. Item 2. A jig for soldering a printed circuit board according to Item 1.
回路板のはんだ付け用治具を用いるようにしたことを特
徴とするプリント回路板の製造方法。3. A method for manufacturing a printed circuit board, wherein the jig for soldering a printed circuit board according to claim 1 or 2 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22123697A JPH1154907A (en) | 1997-08-04 | 1997-08-04 | Jig for soldering printed circuit board and manufacture of printed circuit board using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22123697A JPH1154907A (en) | 1997-08-04 | 1997-08-04 | Jig for soldering printed circuit board and manufacture of printed circuit board using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1154907A true JPH1154907A (en) | 1999-02-26 |
Family
ID=16763610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22123697A Pending JPH1154907A (en) | 1997-08-04 | 1997-08-04 | Jig for soldering printed circuit board and manufacture of printed circuit board using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1154907A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544851A (en) * | 2010-11-05 | 2012-07-04 | 泰科电子日本合同会社 | Circuit board assembly, connector, and soldering method therefor |
| CN111101119A (en) * | 2019-12-23 | 2020-05-05 | 奥士康科技股份有限公司 | Multifunctional gold hanging basket and using method thereof |
-
1997
- 1997-08-04 JP JP22123697A patent/JPH1154907A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544851A (en) * | 2010-11-05 | 2012-07-04 | 泰科电子日本合同会社 | Circuit board assembly, connector, and soldering method therefor |
| EP2451257A3 (en) * | 2010-11-05 | 2014-03-26 | Tyco Electronics Japan G.K. | Circuit board assembly, connector, and soldering method therefor |
| CN111101119A (en) * | 2019-12-23 | 2020-05-05 | 奥士康科技股份有限公司 | Multifunctional gold hanging basket and using method thereof |
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