JPH0531934U - Substrate warp correction device - Google Patents

Abstract

(57) [Summary] [Structure] In this device, the first frame member 11 and the second frame member 12 are extended while the spring member 15 is extended, and the arrow 20
In the direction of the groove 10 and the warped substrate 10
Sandwich in 3. First frame member 11 and second frame member 12
Is returned to its original state by the spring member 15 and the guide member 16 to correct the warp of the substrate. As a result, the warped substrate 10 can be supported flat, and terminals and soldering operations can be performed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a frame mounting device for collectively mounting a frame in which terminals are arranged on an edge of a board on which an electronic circuit is mounted.

[0002]

[Prior Art]

 A terminal for electrical connection is attached to a circuit component such as a hybrid IC circuit component in which various circuit elements are mounted on a substrate. FIG. 4 shows a side view of a frame mounting device for mounting terminals on a substrate of this type. Further, FIG. 5 shows a plan view thereof.

In the figure, a substrate 1 is set on two rails 2 so as to be slidable in the direction of arrow 3. The substrate 1 is configured to be pushed rightward in the figure by two rod-shaped pushers 4. On the other hand, a frame 6 in which a large number of terminals are arranged is fixed by a clamp 5 to the right end portion of the rail 2. When the substrate 1 is pushed rightward in the drawing by the pusher 4, the edge of the substrate 1 is pressed against the frame 6, and the terminals of the substrate 1 are collectively fit into the substrate 1.

[0004]

[Problems to be solved by the device]

 By the way, in many of the hybrid type circuit components as described above, the substrate thereof is large, and in this case, the substrate may be warped due to high heat applied to the substrate due to the solder reflow process for soldering the components. As described above, when the warped substrate 1 is placed on the rail 2 as shown in FIG. 5 and pushed by the pusher 4, the edge thereof is not accurately aligned with each terminal of the frame 6, and the pusher 4 is pressed. Forcibly pushing the substrate 1 may damage the edge of the substrate 1. Therefore, it was necessary to manually attach the frame to the warped substrate.

However, this has a problem that the mounting work of the frame becomes complicated and the processing time becomes long. In addition, the board is placed on the rail 2, the warpage of the board is accurately detected by a position sensor, etc., the height of each terminal of the frame 6 is finely adjusted according to the board warp, and the board is mounted on the board. Although a configuration may be considered, such a configuration has a drawback that the device becomes complicated and expensive. The present invention has been made in view of the above points, and an object thereof is to provide a frame mounting device that can mount a warped substrate on a frame while correcting the warp. ..

[0006]

[Means for Solving the Problems]

 According to another aspect of the present invention, there is provided a substrate warp enforcement device, which includes a first frame member having a groove for sandwiching one peripheral edge of the substrate, and a second frame member having a groove for sandwiching the other peripheral edge of the substrate. A spring member for elastically connecting the first frame member and the second frame member, and a guide member for restricting the engagement state of the first frame member and the second frame member. It is something to do.

[0007]

[Action]

 In this device, the first frame member 11 and the second frame member 12 are pulled apart in the direction of arrow 20 while the spring member 15 is being stretched, and the peripheral edge of the warped substrate 10 is sandwiched in the groove 13. The first frame member 11 and the second frame member 12 are returned to their original state by the spring member 15 and the guide member 16, and the warp of the substrate is corrected. As a result, the warped substrate 10 is supported flat, and terminals and soldering operations can be performed.

[0008]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. 1A and 1B show an embodiment of a substrate warp correction device according to the present invention. FIG. 1A is a plan view, FIG. 1B is a right side view, and FIG. 1C is an end view. In the figure, this device includes a first frame member 11 and a second frame member 12. Each of the first frame member 11 and the second frame member 12 is provided with a groove 13 that sandwiches the peripheral edge of the substrate 10. The groove 13 is arranged in an L shape on two sides of the first frame member 11 and the second frame member 12, and is configured to surround three sides of the substrate 10 by the two frame members 11 and 12. .. Further, bottom plates 21 having substantially the same shape are attached to the back surfaces of the first frame member 11 and the second frame member 12, respectively, and a void portion formed between the frame members 11 and 12 and the bottom plate 21. A spring member 15 is housed in 24. The gap 24 is surrounded by a cover 22 fitted on the back surface of the bottom plate 21, and the cover 22 is fastened and fixed to the bottom plate 21 and both frame members 11 and 12 by screws 23. Further, a pin-shaped inner member 16 is provided at the abutting portion of the first frame member 11 and the second frame member 12. One end of the guide member 16 is fixed to, for example, the second frame member 12, and the other end is inserted into a blind hole formed in the first frame member 11 so as to be freely inserted and removed.

FIG. 2 shows a perspective view of each part of the apparatus shown in FIG. FIG. 2A is a perspective view showing a state in which the substrate 10 is mounted on the device shown in FIG. FIG. 2B is an enlarged perspective view of the peripheral portion of the spring member 15 in the state shown in FIG. FIG. 2C is an enlarged perspective view around the guide member 16 in the state shown in FIG. As shown in FIG. 2 (a), the device of the present invention operates the guide member 16 to move the first frame member 11 and the second frame member 12 in the directions of arrows 20 while maintaining the relationship between them. Can be pulled apart. The substrate 10 is placed on the upper surfaces of the first frame member 11 and the second frame member 12 in such a state, and its peripheral edge is sandwiched in the groove 13. In this case, the action of the spring member 15 causes the first frame member 11 and the second frame member 12 to be attracted to each other in the direction of the arrow 20 to sandwich the substrate 10.

As shown in FIG. 2 (b), the spring member 15 is housed in a space 24 formed between the bottom plate 21 and the first frame member 11. Composed. Both ends thereof are respectively fixed to both ends of the void portion 24. The cover 22 is for protecting the spring member 15. As a result, the spring member 15 exerts a force that draws the first frame member 11 and the second frame member 12 toward each other. As shown in FIG. 2C, the guide member 16 is fixed to, for example, the second frame member 12, and the guide member 16 is inserted into the first frame member 11 so that the guide member 16 can be freely inserted and removed. A blind hole 25 having a large inner diameter is formed. The substrate warp straightening device of the present invention having the above-described structure inserts the base plate 10 into the grooves 13 of the first frame member 11 and the second frame member 12 in the manner shown in FIG. While holding it, use the pusher as explained above to push it against the frame and attach the terminal.

FIG. 3 shows a modification of the substrate warp correction device of the present invention. The device shown in FIG. 1 is suitable for attaching a terminal or the like to one side edge of the substrate. On the other hand, the device shown in FIG. 3 is suitable for soldering a substrate. If the warped board is sent to the soldering bath, it may cause soldering failure. Therefore, it is preferable to use such a device to correct the warp of the substrate and send it to the soldering bath. Note that such an apparatus is suitable for soldering while preventing warpage of a board on which large and unstable components such as a toroidal coil are mounted.

FIG. 3A is a plan view of the device, FIG. 3B is a right side view thereof, and FIG. 3C is an end view thereof. As shown in FIG. 3 (a), this device includes a first frame member 31 and a second frame member 32. Further, two grooves 33 are formed in each of the first frame member 31 and the second frame member 32, as shown in FIG. 3B. That is, the frame members 31 and 32 can sandwich two substrates at the same time. On the other hand, the first frame member 31 and the second frame member 32 are provided with through holes 41 and 44, respectively. The spring member 35 is housed in the through hole 41. On the other hand, a pair of through holes 44 are provided on the left and right of the through hole 41, and the guide member 36 is inserted into these.

Long grooves 42 are formed at both ends of the through hole 41. The long groove 42 is for accommodating a pin 43 for fixing both ends of the spring member 35. Further, the guide member 36 has one end fixed to the first frame member 31 and the other end fitted in a through hole 44 formed in the second frame member 32 and having a slightly large inner diameter so that the guide member 36 can be inserted and removed. It is assumed that In addition, in order to exert the above effects, it is desirable to set the width of the groove to be larger than the thickness of the substrate to be used by 0.1 to 0.2 mm and the depth thereof to be 0.5 mm to 1 mm. .. Further, the first frame member and the second frame member may be made of, for example, aluminum. In addition, as shown in Fig. 3, the device that sandwiches two boards sandwiches the two boards so that the surfaces to be soldered face each other, and after soldering one side, turn the inside out It is possible to handle such as soldering.

The substrate warp correction device shown in FIG. 3 having the above-described configuration has the first frame member 31 and the second frame member 31 in the arrow 20 direction, as in the embodiment of FIG. 1 described above with reference to FIG. The frame member 32 can be separated from the frame member 32 and the substrate can be sandwiched therebetween. As a result, the warped substrate can be flattened and sandwiched. The spring member 35 exerts an action of attracting the first frame member 31 and the second frame member 32 with a constant force. Further, the guide member 36 maintains the positional relationship between the first frame member 31 and the second frame member 32 constant, and exerts an action of restricting the engagement state between the two. The present invention is not limited to the above embodiments. The above-described shapes and sizes of the first frame member and the second frame member, and the shape of the groove for sandwiching the substrate may be variously modified for the same purpose. Also, the number and shape of spring members may be freely changed.

[0015]

[Effect of the device]

 As described above, the board warp correction device of the present invention corrects the board warp by sandwiching the peripheral portion of the board without touching the parts on the board. At this time, the spring member and the guide member exert an action of separating the first frame member and the second frame member while keeping the engaged state of the first frame member and the second frame member constant, and then pulling them apart. This makes it possible to perform terminal attachment or soldering while correcting the warp of the board.

[Brief description of drawings]

1A and 1B show an embodiment of a substrate warp correction device of the present invention, FIG. 1A is a plan view thereof, FIG. 1B is a right side view, and FIG. 1C is an end view.

2A and 2B are perspective views of various parts of the substrate warp correction device of the present invention in use, wherein FIG. 2A is a perspective view before a substrate is sandwiched, and FIG. ,
(C) is a perspective view of a guide member in the state of (a).

FIG. 3 shows a modified example of the present invention, in which (a) is a plan view thereof, (b) is a right side view, and (c) is an end view.

FIG. 4 is a side view of a conventional frame mounting device.

5 is a plan view of the device of FIG.

[Explanation of symbols]

 10 substrate 11 first frame member 12 second frame member 13 groove 15 spring member 16 guide member

Claims (1)

[Scope of utility model registration request] 1. A first frame member having a groove for sandwiching one peripheral edge of a substrate, a second frame member having a groove for sandwiching the other peripheral edge of the substrate, the first frame member and the first frame member. A warp correction device for a substrate, comprising: a spring member that elastically connects the two frame members; and a guide member that restricts an engaged state of the first frame member and the second frame member.