JPH03209855A - Flat package microcomputer - Google Patents

Flat package microcomputer

Info

Publication number
JPH03209855A
JPH03209855A JP503790A JP503790A JPH03209855A JP H03209855 A JPH03209855 A JP H03209855A JP 503790 A JP503790 A JP 503790A JP 503790 A JP503790 A JP 503790A JP H03209855 A JPH03209855 A JP H03209855A
Authority
JP
Japan
Prior art keywords
flat package
microcomputer
package microcomputer
printed circuit
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP503790A
Other languages
Japanese (ja)
Inventor
Nobuyuki Fukutomi
福冨　信行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP503790A priority Critical patent/JPH03209855A/en
Publication of JPH03209855A publication Critical patent/JPH03209855A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable a flat package microcomputer to be tentatively fixed to a printed board without using a jig and to prevent it from being fixed upside down by a method wherein positioning protrusions for mounting are provided to the rear of the flat package microcomputer. CONSTITUTION:A bonding agent 4 is applied onto a flat package microcomputer mounting position 8 making the microcomputer mounting position 8 of a printed board face 5 upward, and a flat package microcomputer 9 is mounted so as to fit positioning protrusions 10a and 10b provided to the rear side of the flat package microcomputer 9 into flat package positioning insertion holes 11a and 11b provided to the flat package microcomputer mounting position 8 of the printed board 5. By this setup, a flat package microcomputer can be tentatively fixed to a printed board without using a jig, and as a protrusion is provided to the flat package microcomputer, the flat package microcomputer can not be mounted upside down, so that the flat package microcomputer can be prevented from being mounted upside down.

Description

【発明の詳細な説明】 産業上の利用分野 プリント制御基板の制御用マイクロコンピュタ（以下マ
イコンと略す）として使用されるフラットパッケージマ
イコンに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flat package microcomputer used as a control microcomputer (hereinafter abbreviated as microcomputer) for a printed control board in an industrial field of application.

従来の技術 ２　ペー／ 従来のフラットパッケージマイコンのプリント制御基板
への取付には、治具を使用している。例えば第３図に示
す様に、フラットパッケージマイコン３を取付治具１の
フラットパッケージマイコン位置決め用穴２にフラット
パッケージマイコン３をフラットパッケージマイコン３
の裏面が上を向く様に挿入し、次にフラットパッケージ
マイコン３の裏面にボンド４を塗布し、次に、取付治具
１に具備された突起６ａ、６ｂ、６ｃ、６ｄがプリント
基板５の位置決め用穴子ａ　、７ｂ　、７ｃ、了ｄに入
る様にプリント基板６を置いて、プリント基板６の裏面
に設けたフラットパッケージの取付位置８に、フラット
パッケージマイコン３をポンド４にて仮固定している。Conventional Technology 2 Page/ A jig is used to attach a conventional flat package microcomputer to a printed control board. For example, as shown in FIG. 3, the flat package microcomputer 3 is attached to the flat package microcomputer positioning hole 2 of the mounting jig 1.
the back side of the flat package microcomputer 3 faces upward, then apply the bond 4 to the back side of the flat package microcomputer 3, and then align the protrusions 6a, 6b, 6c, and 6d provided on the mounting jig 1 with the printed circuit board 5. Place the printed circuit board 6 so that it enters the positioning holes a, 7b, 7c, and d, and temporarily fix the flat package microcomputer 3 to the mounting position 8 of the flat package provided on the back side of the printed circuit board 6 with a pounder 4. ing.

発明が解決しようとする課題 しかしながら従来の技術だと、取付治具１にフラットパ
ッケージマイコン３を挿入する手間や、プリント基板６
を置く手間や、フラノトパッケジマイコン３を逆挿入す
る恐れがあり、フラットパッケージマイコン３を逆挿入
したままフラット３１、 パッケージマイコン３を半田付けしてし甘うと、プリン
ト基板６の不良品を作ってしまう。Problems to be Solved by the Invention However, with conventional technology, it takes time and effort to insert the flat package microcomputer 3 into the mounting jig 1, and the printed circuit board 6.
If you solder the flat package microcomputer 3 and the flat package microcomputer 3 while inserting the flat package microcomputer 3 in the opposite direction, you may end up producing a defective printed circuit board 6. It ends up.

本発明は上記課題を解決するフラットパッケジマイコン
を提供するものである。The present invention provides a flat package microcomputer that solves the above problems.

課題を解決するだめの手段 上記課題を解決するだめ、フラットパッケージマイコン
の裏面に、位置決め用の突起物を設けたものである。Means for Solving the Problem In order to solve the above problem, a projection for positioning is provided on the back surface of the flat package microcomputer.

作　　　用 プリント基板に位置決め用の穴を設け、その穴にフラッ
トパッケージマイコンの突起物が入る様にして、治具を
使用せずにフラットパッケージマイコンをプリント基板
に仮固定でき、かつ、フラットパッケージマイコンに突
起物があるため、フラットパッケージマイコンを逆に取
付ることかできないので、フラットパッケージマイコン
の逆取付けを防止することができる。By making a positioning hole on the printed circuit board and inserting the protrusion of the flat package microcomputer into the hole, the flat package microcomputer can be temporarily fixed on the printed circuit board without using a jig. Since there is a protrusion on the mount, the flat package microcomputer can only be mounted in the opposite direction, so it is possible to prevent the flat package microcomputer from being mounted in the opposite direction.

実施例 以下、本発明の一実施例たるフラットパッケジマイコン
を図を参考に洋間する。EXAMPLE Below, a flat package microcomputer which is an example of the present invention will be explained with reference to the drawings.

第１図はフラットパッケージマイコンを示し、フラット
パッケージマイコン９の裏面に取付位置決め用の突起物
１０ａをフラットパッケージマイコン９の中心に、突起
物１ｏｂをフラノトパソケジマイコン９の１角に設えた
構成となっている。FIG. 1 shows a flat package microcomputer, in which a protrusion 10a for mounting and positioning is provided on the back side of the flat package microcomputer 9 at the center of the flat package microcomputer 9, and a protrusion 1ob is provided at one corner of the flat package microcomputer 9. It becomes.

第２図は、フラットパッケージマイコンをプリント基板
に仮固定することを示す図であり、プリント基板５のフ
ラットパッケージマイコン取付位置８を上側になる様に
し、フラットパッケージマイコン取付位置８の所にボン
ド４を塗布し、本発明のフラットパッケージマイコン９
の裏側に設けられた位置決め用突起物１０ａ、１ｏｂが
、プリント基板６のフラットパッケージマイコン取付位
置８に設けられた、フラットパッケージ位置決め用挿入
穴１１ａ、１１ｂに入る様に、本発明のフラットパッケ
ージマイコン９を置くことによシ、フラットパッケージ
マイコン９をプリント基板５のフラットパッケージマイ
コン取付位置８にボンド４にて仮固定することができる
。FIG. 2 is a diagram showing the temporary fixing of the flat package microcomputer to the printed circuit board, with the flat package microcomputer mounting position 8 of the printed circuit board 5 facing upward, and the bond 4 placed at the flat package microcomputer mounting position 8. flat package microcomputer 9 of the present invention.
The flat package microcomputer of the present invention is inserted into the flat package positioning insertion holes 11a and 11b provided at the flat package microcomputer mounting position 8 of the printed circuit board 6 so that the positioning protrusions 10a and 1ob provided on the back side of the flat package microcomputer 9, the flat package microcomputer 9 can be temporarily fixed to the flat package microcomputer mounting position 8 of the printed circuit board 5 with the bond 4.

発明の効果 ６　・＼ 本発明のフラットパッケージマイコンは、数句治具を使
用せずにフラットパッケージマイコンをプリント基板に
仮固定できるので、工数や治具式を削減することができ
、かつ、フラソトパッケジマイコンに具備された２つの
位置決め用突起物によシ、フラットパッケージマイコン
の逆取付を防止する事ができ、プリント基板の不良率を
削減することができる。Effect of the invention 6 ・＼ The flat package microcomputer of the present invention can temporarily fix the flat package microcomputer to a printed circuit board without using a jig, which reduces the number of man-hours and the number of jigs. The two positioning protrusions provided on the flat package microcomputer can prevent the flat package microcomputer from being mounted in the opposite direction, thereby reducing the defective rate of printed circuit boards.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示すフラットパッケージマ
イクロコンピュータ（以下マイコンと略す）の斜視図、
第２図は同フラントパッケージマイコンをプリント基板
に仮固定しようとする状態を示す斜視図、第３図は従来
のフラットバッケジマイコンをプリント基板に仮固定し
ようとする状態を示す斜視図である。 ９・・・・・・フラットパッケージマイコン、１０ａ。 １０ｂ・・・・・・フラットパッケージマイコン位置決
め用突起物。FIG. 1 is a perspective view of a flat package microcomputer (hereinafter abbreviated as microcomputer) showing one embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which the flat package microcomputer is being temporarily fixed to a printed circuit board, and FIG. 3 is a perspective view showing a state in which a conventional flat package microcomputer is being temporarily fixed to a printed circuit board. 9...Flat package microcomputer, 10a. 10b... Protrusion for positioning the flat package microcomputer.

Claims (2)

【特許請求の範囲】[Claims] （１）プリント制御基板の制御用マイコンの１つとして
使用される、フラットパッケージマイコンにおいて、前
記フラットパッケージマイコンの裏面に取付け位置決め
用の複数の突起物を設けたことを特徴としたフラットパ
ッケージマイクロコンピュータ。(1) A flat package microcomputer used as one of the control microcomputers of a printed control board, characterized in that a plurality of protrusions for mounting and positioning are provided on the back surface of the flat package microcomputer. . （２）フラットパッケージマイクロコンピュータのパッ
ケージの一部を凸として取付位置決め用の突起物を形成
したフラットパッケージマイクロコンピュータ。(2) A flat package microcomputer in which a part of the package of the flat package microcomputer is made convex to form a protrusion for mounting positioning.
JP503790A 1990-01-12 1990-01-12 Flat package microcomputer Pending JPH03209855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP503790A JPH03209855A (en) 1990-01-12 1990-01-12 Flat package microcomputer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP503790A JPH03209855A (en) 1990-01-12 1990-01-12 Flat package microcomputer

Publications (1)

Publication Number Publication Date
JPH03209855A true JPH03209855A (en) 1991-09-12

Family

ID=11600255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP503790A Pending JPH03209855A (en) 1990-01-12 1990-01-12 Flat package microcomputer

Country Status (1)

Country Link
JP (1) JPH03209855A (en)

Similar Documents

Publication Publication Date Title
US4449769A (en) Substrate for mounting electric parts
JPH03145186A (en) Semiconductor module
JPH03209855A (en) Flat package microcomputer
JPH04101491A (en) Mounting method for chip component
JPH0312993A (en) Soldering method in electronic circuit package
JPH01292894A (en) Thick film hybrid integrated circuit
JPH0498780A (en) Ic socket
JPH0364876A (en) Lead terminal fitting to electronic parts
JPH0534136Y2 (en)
JPS6235695A (en) Soldering of double side packaged part
JPH0677620A (en) Electronic component mounting structure
JPH0347354Y2 (en)
JPS5824459Y2 (en) Electrical component mounting board
JPH04345083A (en) Printed wiring board for three-dimensional mounting and its manufacture
JPH06125170A (en) External memory device
JPS6228117Y2 (en)
JPS62219685A (en) Method of mounting electronic device
JPS60107896A (en) Printed board unit
JPS616890A (en) Chip carrier mounting structure
JPS59177986U (en) Mounting structure of sub-printed circuit board to printed circuit board
JP2522153B2 (en) Resin-sealed semiconductor device
JPH1154907A (en) Jig for soldering printed circuit board and manufacture of printed circuit board using it
JPS5871689A (en) Jig for flexible board
JPS6224697A (en) Mounting of electronic component
JPH03215964A (en) Semiconductor package and mounting board thereof