JPH1154685A5 - - Google Patents

Info

Publication number
JPH1154685A5
JPH1154685A5 JP1997218098A JP21809897A JPH1154685A5 JP H1154685 A5 JPH1154685 A5 JP H1154685A5 JP 1997218098 A JP1997218098 A JP 1997218098A JP 21809897 A JP21809897 A JP 21809897A JP H1154685 A5 JPH1154685 A5 JP H1154685A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
leads
semiconductor device
main surface
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997218098A
Other languages
English (en)
Japanese (ja)
Other versions
JP3688440B2 (ja
JPH1154685A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP21809897A priority Critical patent/JP3688440B2/ja
Priority claimed from JP21809897A external-priority patent/JP3688440B2/ja
Publication of JPH1154685A publication Critical patent/JPH1154685A/ja
Publication of JPH1154685A5 publication Critical patent/JPH1154685A5/ja
Application granted granted Critical
Publication of JP3688440B2 publication Critical patent/JP3688440B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP21809897A 1997-07-29 1997-07-29 半導体装置 Expired - Fee Related JP3688440B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21809897A JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21809897A JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005127878A Division JP4049782B2 (ja) 2005-04-26 2005-04-26 半導体装置

Publications (3)

Publication Number Publication Date
JPH1154685A JPH1154685A (ja) 1999-02-26
JPH1154685A5 true JPH1154685A5 (cs) 2005-01-20
JP3688440B2 JP3688440B2 (ja) 2005-08-31

Family

ID=16714608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21809897A Expired - Fee Related JP3688440B2 (ja) 1997-07-29 1997-07-29 半導体装置

Country Status (1)

Country Link
JP (1) JP3688440B2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10366942B2 (en) 2005-05-11 2019-07-30 Toshiba Memory Corporation Semiconductor device with sealed semiconductor chip

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
JP5619128B2 (ja) * 2005-05-11 2014-11-05 株式会社東芝 半導体装置
TWI273636B (en) 2005-08-02 2007-02-11 Chipmos Technologies Inc Chip package having asymmetric molding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10366942B2 (en) 2005-05-11 2019-07-30 Toshiba Memory Corporation Semiconductor device with sealed semiconductor chip
US10872844B2 (en) 2005-05-11 2020-12-22 Toshiba Memory Corporation Semiconductor device with sealed semiconductor chip

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