JPH1148129A - 研磨パッド及び板状材の研磨方法 - Google Patents

研磨パッド及び板状材の研磨方法

Info

Publication number
JPH1148129A
JPH1148129A JP21317497A JP21317497A JPH1148129A JP H1148129 A JPH1148129 A JP H1148129A JP 21317497 A JP21317497 A JP 21317497A JP 21317497 A JP21317497 A JP 21317497A JP H1148129 A JPH1148129 A JP H1148129A
Authority
JP
Japan
Prior art keywords
polishing
polishing pad
groove
pad
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP21317497A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1148129A5 (enExample
Inventor
Toru Iseda
徹 伊勢田
Yoichi Ozawa
洋一 小沢
Hiroshi Kimura
宏 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP21317497A priority Critical patent/JPH1148129A/ja
Publication of JPH1148129A publication Critical patent/JPH1148129A/ja
Publication of JPH1148129A5 publication Critical patent/JPH1148129A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP21317497A 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法 Withdrawn JPH1148129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21317497A JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21317497A JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Publications (2)

Publication Number Publication Date
JPH1148129A true JPH1148129A (ja) 1999-02-23
JPH1148129A5 JPH1148129A5 (enExample) 2005-05-26

Family

ID=16634779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21317497A Withdrawn JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Country Status (1)

Country Link
JP (1) JPH1148129A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
JP2006159380A (ja) * 2004-12-10 2006-06-22 Toyo Tire & Rubber Co Ltd 研磨パッドおよび半導体デバイスの製造方法
US7192340B2 (en) 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
JP2008068389A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd 研磨方法及び研磨装置
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6749714B1 (en) 1999-03-30 2004-06-15 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
KR100471527B1 (ko) * 1999-03-30 2005-03-09 가부시키가이샤 니콘 연마체, 연마장치, 연마방법 및 반도체 소자의 제조방법
US7192340B2 (en) 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
US7329170B2 (en) 2000-12-01 2008-02-12 Toyo Tire & Rubber Co., Ltd. Method of producing polishing pad
US7641540B2 (en) 2000-12-01 2010-01-05 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad
US7762870B2 (en) 2000-12-01 2010-07-27 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad
JP2006159380A (ja) * 2004-12-10 2006-06-22 Toyo Tire & Rubber Co Ltd 研磨パッドおよび半導体デバイスの製造方法
JP2008068389A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd 研磨方法及び研磨装置
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法

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