JPH1148129A5 - - Google Patents

Info

Publication number
JPH1148129A5
JPH1148129A5 JP1997213174A JP21317497A JPH1148129A5 JP H1148129 A5 JPH1148129 A5 JP H1148129A5 JP 1997213174 A JP1997213174 A JP 1997213174A JP 21317497 A JP21317497 A JP 21317497A JP H1148129 A5 JPH1148129 A5 JP H1148129A5
Authority
JP
Japan
Prior art keywords
resin
polishing
fluororesin
lands
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997213174A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1148129A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP21317497A priority Critical patent/JPH1148129A/ja
Priority claimed from JP21317497A external-priority patent/JPH1148129A/ja
Publication of JPH1148129A publication Critical patent/JPH1148129A/ja
Publication of JPH1148129A5 publication Critical patent/JPH1148129A5/ja
Withdrawn legal-status Critical Current

Links

JP21317497A 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法 Withdrawn JPH1148129A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21317497A JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21317497A JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Publications (2)

Publication Number Publication Date
JPH1148129A JPH1148129A (ja) 1999-02-23
JPH1148129A5 true JPH1148129A5 (enExample) 2005-05-26

Family

ID=16634779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21317497A Withdrawn JPH1148129A (ja) 1997-08-07 1997-08-07 研磨パッド及び板状材の研磨方法

Country Status (1)

Country Link
JP (1) JPH1148129A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1312742C (zh) * 1999-03-30 2007-04-25 株式会社尼康 抛光垫、抛光机及制造半导体器件的方法
CN100484718C (zh) 2000-12-01 2009-05-06 东洋橡膠工业株式会社 研磨垫用缓冲层
JP4621014B2 (ja) * 2004-12-10 2011-01-26 東洋ゴム工業株式会社 研磨パッドおよび半導体デバイスの製造方法
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法

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