JPH1146069A - Device for forming insulating layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a stable point-contact support without damaging a formed insulating layer, to minimize soiling on the reverse side of a substrate, and to improve handling thereof by forming the insulating layer on one surface of the substrate, and supporting the substrate by a plurality of point supports provided on a tool with the insulting layer formed surface faced down. SOLUTION: A substrate 1 having an insulating layer at least on the reverse surface thereof is supported by a plurality of point supports 6, such as pin- shaped protrusions, provided on a tool 2, with its reverse surface faced down. The plurality of point supports 6 are provided on the tool 2 so as to be placed in the vicinities of the edges of the substrate 1, when supported. There are also provided stoppers 3 and guides 4 each having a stopper 5. The stopper 5 and the guide 4 determine the position of the substrate 1, so as to achieve stable point-contact support of the substrate 1 at the coated surface thereof with the point supports 6. In this way, the front and the reverse of the substrate 1 can be readily provided with high quality coating layers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for forming an insulating layer, and more particularly, to an apparatus for forming an insulating layer useful for forming an insulating layer on a substrate such as a printed wiring board used for electronic equipment and electric equipment. It concerns the device.

[0002]

2. Description of the Related Art In recent years, as electronic equipment and electric equipment have been reduced in size and performance has been improved, printed wiring boards have been required to have higher density, higher performance and higher reliability. Under these circumstances, the printed wiring board has been transitioning from one side to both sides, and further to multilayering. In the course of the shift to multilayering, as a measure for achieving high density, a build-up type multilayer printed wiring board in which a circuit pattern is stacked on an insulating layer on the surface of a core substrate has been proposed. Things.

[0003] The build-up type multilayer printed wiring board has a reduced dead space due to through-holes compared to a multilayer printed wiring board in which a circuit-formed core material and a prepreg as an adhesive layer are collectively laminated and molded. In addition, since the wiring density of the substrate is improved and the insulating layer can be formed thin, as a result, the printed wiring board has been reduced in size and thickness.

By the way, the manufacturing process of the build-up type multilayer printed wiring board has been performed by the following process. [1] Step of forming an insulating layer on the surface of a core substrate (including multilayer) having a conductor circuit on the surface [2] Step of forming a via hole in the obtained insulating layer [3] Insulation having a via hole formed Step of forming a conductor layer on a layer by a method such as copper plating [4] Step of forming a predetermined circuit pattern on the conductor layer by a subtraction method or the like Repeating the above steps [1] to [4] to obtain a desired multilayer A printed wiring board is manufactured. In the process of [3] or [4], a conductor portion is also formed on the inner wall of the via hole, and the electrical connection between the core substrate and the conductor circuit on the insulating layer is established. Was what was being done.

When a conductor layer is formed on an insulating layer by a method such as copper plating, it is desirable to form the conductor layer on both sides of the substrate at the same time in terms of shortening the manufacturing time.
An insulating layer forming apparatus as shown in FIGS. 3A and 3B is used when forming an insulating layer on both front and back surfaces of a substrate (1) or when forming a conductor layer on an insulating layer. Met.

[0006]

However, in such an insulating layer forming apparatus, in the case shown in FIG. 3A, the substrate (1) is turned upside down by turning over the substrate (1).
The support mark of the jig (2) is attached to the insulating layer located on the back surface of the jig or the jig (2) is contaminated, and as a result, the substrate (1) is already formed. That would damage the insulating layer.

In the case shown in FIG. 3 (b), the problem of the support mark of the jig (2) being attached to the insulating layer located on the back surface of the substrate (1) is solved. In order to make the film thickness uniform, it is necessary to install the substrate (1) in equilibrium with the jig (2). As a result, considerable care is required for handling, and productivity is increased. Was reduced.

The present invention has been made in view of the above facts, and has as its object to form an insulating layer on both the front and back surfaces of a substrate or to form a conductor layer on an insulating layer. Accordingly, an object of the present invention is to provide an insulating layer forming apparatus capable of improving handling properties without damaging an already formed insulating layer.

[0009]

According to a first aspect of the present invention, there is provided an apparatus for forming an insulating layer, wherein a substrate having an insulating layer formed at least on a rear surface side is provided with a jig ( 2)
The jig (2) is characterized in that the jig (2) is provided with a point support portion (6) for supporting the back surface of the substrate (1).

The insulating layer forming apparatus according to a second aspect of the present invention is characterized in that the point support (6) is variable.

According to a third aspect of the present invention, there is provided an apparatus for forming an insulating layer, wherein a stopper (3) for contacting an end face of the substrate (1) is provided on a side of the point support (6). .

According to a fourth aspect of the present invention, in the insulating layer forming apparatus, the point support section (6) is provided near an end face other than a certain one end face among all end faces of the substrate (1). It is characterized by.

According to a fifth aspect of the present invention, in the insulating layer forming apparatus, after the substrate (1) is supported on the jig (2), the point supporting portion (6) is provided on the substrate (1). ), A point support (6) is separately provided in the vicinity of a certain one end surface among the end surfaces other than the end surface provided with ()).

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings according to embodiments.

FIG. 1 is a perspective view of an insulating layer forming apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of an insulating layer forming apparatus according to another embodiment of the present invention.

As shown in FIG. 1 or FIG. 2, in the apparatus for forming an insulating layer according to the present invention, a jig (2) with a substrate (1) on which an insulating layer is formed at least on the back side is placed with the back side down. In the insulating layer forming apparatus supported on the substrate, a point support portion (6) for supporting the back surface of the substrate (1) is provided on the jig (2).

When a multilayer printed wiring board of a build-up type is used as a substrate (1) and an insulating layer is formed on both the front and back surfaces of the substrate (1), the insulating layer is formed one by one, and then the surface of the insulating layer is plated or the like. In this case, a method of collectively forming a circuit pattern can be exemplified.

Specific examples of the method for forming an insulating layer on both the front and back surfaces of the substrate (1) include a bar coater, a curtain coater, a roll coater, a table coater, a slot coater, a spin coater, a screen printing, and a dip method. Is what you can do.

The conditions for drying the coating film on the front surface of the substrate (1) are not limited as long as the coating film on the back surface of the substrate (1) does not drip. It is not intended to be limiting.

In the present invention, an insulating layer is formed on each surface of the substrate (1) by applying a resin solution using, for example, a bar coater. That is, a desired insulating layer can be formed by evaporating and removing the solvent in the resin liquid by a dryer or the like after the application of the resin liquid. By adjusting the evaporation amount of the solvent and turning the substrate (1) upside down when a predetermined tackiness is obtained on the surface of the coating film, a resin liquid film is formed in the same manner as described above. Is what you can do.

According to the present invention, even when the tacking on the back surface is not sufficiently removed, the substrate (1) may be supported by point contact even if it is as shown in FIGS. As a result, scratches, stains and changes in film thickness of the coating film can be minimized, and as a result, a coating film that does not hinder practical performance can be produced on the front and back of the substrate (1). You can do it.

Here, since the point support section (6) is difficult to see from the upper surface of the substrate (1), the point support section (6) is as close as possible to the end face of the substrate (1). As described above, it is preferable that the guide (4) as shown in FIGS. 1 and 2 is provided. Further, after the substrate (1) is set on the jig (2), a stopper (5) as shown in FIGS. 1 and 2 so as not to shift or move.
Is preferable. Such stoppers (5) and guides (4) are very useful for positioning the substrate (1), and the position supported by the point support (6) does not change for each substrate (1). Thus, the same position can always be supported. That is,
The work efficiency is very good.

As the stopper (5) and the guide (4),
In the case shown in FIGS. 1 and 2, the cross-section is substantially L-shaped, but is not limited to this, and may be a simple flat plate or another shape. Things.

As shown in FIGS. 1 and 2, the point support portion (6) supports the back surface of the substrate (1) and is provided on the jig (2). It is. The point support portion (6) includes, for example, a pin-shaped protrusion, a conical shape, and the like, but is not limited thereto, and may adopt various forms. is there.

In order to improve the releasability from the coating film, for example, the surface of the point support (6) may be coated with Teflon.

Further, by adjusting the height of the point support portion (6), the thickness unevenness of the coating film due to the flow of the resin liquid can be reduced, and the film thickness can be made uniform.
Examples of the adjustment of the height of the tie support portion (6) include a member capable of adjusting the height by rotation such as a screw, a plug-in member such as a nail, and a connection member such as a cap. However, it is not particularly limited.

The point supporting portion (6) may support the edge of the substrate (1) as long as it supports the back surface of the substrate (1). It may support the inside of the. However, it is preferable that the point support portion (6) is formed at a position where the point support portion (6) does not contact a circuit or the like of the substrate (1).

According to the present invention, by adopting such a structure, the coated surface of the substrate (1) can be made to have a stable point contact support at the point support portion (6) for supporting the back surface of the substrate (1). As a result, a high-quality coating film can be easily formed on the front and back of the substrate (1). Moreover, the substrate (1)
Can also be minimized as dirt on the back surface of the substrate.

That is, when an insulating layer is formed on both the front and back surfaces of the substrate (1) or when a conductor layer is formed on the insulating layer, the already formed insulating layer is not damaged and the handling property is improved. It can be improved.

When the point support (6) is variable as shown in FIG. 2, the balance of the substrate (1) can be adjusted by using the variable point support (6). The adjustment can be made even more easily.

Further, as shown in FIG. 1 and FIG. 2, if a stopper (3) is provided on the side of the point support (6) to contact the end face of the substrate (1), the stopper ( According to 3), the position where the substrate (1) is installed with respect to the jig (2) is determined by itself, and the positioning performance is dramatically improved, and the work efficiency is very good.

It is needless to say that the stopper (5) and the guide (4) shown in FIGS. 1 and 2 serve the same role as the stopper (3) described above.

In particular, as shown in FIGS. 1 and 2, the point support portion (6) is provided near an end surface other than a certain one end surface among all the end surfaces of the substrate (1). ,
With such an arrangement of the point support portions (6), the substrate (1) is stably supported, and the warpage of the substrate (1) is surely reduced. That is, even if the thickness of the substrate (1) is reduced, the substrate (1) can be stably mounted on the jig (2).

In this case, if the shape of the substrate (1) is, for example, a quadrilateral, the total number of end faces of the substrate (1) is four end faces, and three of the four end faces other than one end face are included. Point support portions (6) are provided near the end faces.

As shown in FIG. 2, the jig (2)
After the substrate (1) is supported on the substrate, the substrate (1)
In the above, when the point support portion (6) is separately provided near one end surface among the end surfaces other than the end surface provided with the point support portion (6), the substrate is placed on the jig (2). After (1) is installed, the substrate (1) can be more stably installed on the jig (2). That is, the degree of equilibrium of the substrate (1) is more reliably improved.

Specifically, as shown in FIG. 2, a long hole (8) is provided on the jig (2), and the jig (2) slides freely from one end to the other. If a movable point support (7) is provided, the substrate (1) can be placed on the jig (2).
After the is supported, the substrate (1) may be provided with a point support portion (6) separately provided near an end surface other than the end surface provided with the point support portion (6). Things.

According to the insulating layer forming apparatus of the present invention, as shown in FIGS. 1 and 2, the jig (2) is placed on the substrate (1) having the surface on which the insulating layer is formed at least on the back side with the back side down. ), The insulating layer forming apparatus supported on
Since the jig (2) is provided with a point support portion (6) for supporting the back surface of the substrate (1), the point support portion (6) for supporting the back surface of the substrate (1) supports the substrate (1). The coated surface can be used as a stable point contact support, and a high-quality coated film can be easily formed on the front and back of the substrate (1).
In addition, dirt on the back surface of the substrate (1) can be minimized.

That is, when an insulating layer is formed on both the front and back surfaces of the substrate (1) or when a conductor layer is formed on the insulating layer, the already formed insulating layer is not damaged and the handling property is improved. It can be improved.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments.

Example 1 The substrate (1) was manufactured through the following steps [1] to [5].
An insulating layer was formed on both sides. [1] The surface of the printed circuit board (1) on which a pattern was formed by the subtra method was washed with 10 wt% sulfuric acid to roughen the surface of the copper circuit portion. [2] The entire surface of the substrate (1) is wet-coated with a solder resist insulating resin (manufactured by Tamura Kaken Co., Ltd., DSR2200) with a bar coater to about 40 μm, and then the insulating layer forming apparatus as shown in FIG. Air dry 10 minutes, temperature 80 ° C 1
Drying was performed for 5 minutes. [3] The substrate (1) is turned upside down, and in the same manner as in the step [2], a solder resist insulating resin is wet-coated with a bar coater to about 40 μm on the entire surface.
Using an insulating layer forming apparatus as shown in Table 2, drying was performed in air for 10 minutes and at a temperature of 80 ° C. for 30 minutes. [4] The solder resist insulating resin was exposed with a predetermined mask, and then developed with a 1 wt% sodium carbonate solution. [5] After post-curing at a temperature of 150 ° C. for 60 minutes, post-exposure was performed at 1000 mJ.

As described above, the build-up type multilayer printed wiring board obtained by forming the insulating layer on both the front and back surfaces of the substrate (1) does not damage the insulating layer and has a stable coating surface. Point contact support
Because of good handleability, the obtained multilayer printed wiring board had a uniform coating film thickness without any deviation in the coating film.

[0042]

According to the apparatus for forming an insulating layer according to the first aspect of the present invention, the point support (6) for supporting the back surface of the substrate (1).
Thus, the coated surface of the substrate (1) can be used as a stable point contact support, and a high-quality coated film can be easily formed on the front and back of the substrate (1). In addition, dirt on the back surface of the substrate (1) can be minimized.

That is, when an insulating layer is formed on both the front and back surfaces of the substrate (1) or when a conductor layer is formed on the insulating layer, the already formed insulating layer is not damaged and the handling property is improved. It can be improved.

According to the insulating layer forming apparatus of the second aspect of the present invention, in addition to the case of the first aspect, the degree of balance of the substrate (1) is adjusted by using the variable point support (6). The adjustment can be made even more easily.

According to the insulating layer forming apparatus of the third aspect of the present invention, in addition to the case of the first or second aspect,
The position where the substrate (1) is installed with respect to the jig (2) is naturally determined by the stopper (3), so that the positioning property is dramatically improved, and the work efficiency is very good. .

According to the apparatus for forming an insulating layer according to a fourth aspect of the present invention, in addition to the case described in any one of the first to third aspects, the substrate (1) is arranged with such an arrangement of the point support portions (6). )
Are stably supported, and the warpage of the substrate (1) is reliably reduced. That is, even if the thickness of the substrate (1) is reduced, the substrate (1) can be stably mounted on the jig (2).

According to the apparatus for forming an insulating layer according to a fifth aspect of the present invention, in addition to the first aspect, the substrate (1) is set on the jig (2). From
The substrate (1) can be more stably mounted on the jig (2). That is, the degree of equilibrium of the substrate (1) is more reliably improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an insulating layer forming apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of an insulating layer forming apparatus according to another embodiment of the present invention.

3 (a) and 3 (b) are perspective views of an insulating layer forming apparatus according to a conventional example.

[Explanation of symbols]

 1 substrate 2 jig 3 stopper 6 point support

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shoichi Fujimori 1048 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Inventor Isao Hirata 1048 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Works, Ltd. (72) Inventor Hiroaki Fujiwara 1048 Kadoma Kadoma, Osaka Pref.Matsushita Electric Works, Ltd. (72) Inventor Kiyoaki Ihara 1048 Odaka Kadoma, Kadoma, Osaka Pref.Matsushita Electric Works, Ltd. 1048 Okadoma Kadoma, Kadoma City, Osaka Prefecture (72) Yoshihiro Nakagawa, Inventor Yoshihiro Nakagawa 1048 Okadoma Kadoma, Kadoma City, Osaka Prefecture (72) Inventor Masayuki Ishihara 1048 Okadoma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd.

Claims (5)

[Claims] 1. An insulating layer forming apparatus comprising a substrate having an insulating layer formed at least on a back surface side and supported on a jig with the back surface down, a point support for supporting the back surface of the substrate. An insulating layer forming apparatus, wherein a part is provided on the jig. 2. An insulating layer forming apparatus according to claim 1, wherein said point support is variable. 3. The apparatus according to claim 1, wherein a stopper is provided on a side of said point supporting portion to contact an end surface of said substrate.
Alternatively, the insulating layer forming apparatus according to claim 2. 4. The formation of an insulating layer according to claim 1, wherein said point support portion is provided near an end surface other than a certain one end surface among all end surfaces of said substrate. apparatus. 5. After the substrate is supported on the jig, a point support portion is separately provided near an end surface of the substrate other than the end surface on which the point support portion is provided. The insulating layer forming apparatus according to any one of claims 1 to 4, wherein: