KR0148076B1 - Supporter of dual side printed circuit board arranged continuously - Google Patents

Supporter of dual side printed circuit board arranged continuously

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Publication number
KR0148076B1
KR0148076B1 KR1019950014291A KR19950014291A KR0148076B1 KR 0148076 B1 KR0148076 B1 KR 0148076B1 KR 1019950014291 A KR1019950014291 A KR 1019950014291A KR 19950014291 A KR19950014291 A KR 19950014291A KR 0148076 B1 KR0148076 B1 KR 0148076B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
sided
double
pedestal
Prior art date
Application number
KR1019950014291A
Other languages
Korean (ko)
Other versions
KR960043997A (en
Inventor
진종만
박종진
권오경
Original Assignee
김광호
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김광호, 삼성전자주식회사 filed Critical 김광호
Priority to KR1019950014291A priority Critical patent/KR0148076B1/en
Publication of KR960043997A publication Critical patent/KR960043997A/en
Application granted granted Critical
Publication of KR0148076B1 publication Critical patent/KR0148076B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은, 양면 연배열 인쇄회로기판의 받침대에 관한 것으로, 상면에 양면 연배열 인쇄회로기판과 상응하는 폭과, 직접회로의 높이만큼 파인 안착홈의 내저면에, 일정폭을 이루며 나란하게 가이드 레일을 형성하고, 상기 가이드 레일에 인쇄회로기판을 받쳐주는 받침판의 하부면으로 형성된 가이드를 결합하여서 구성된 받침판을 제공하기 위한 것이다.The present invention relates to a pedestal of a double-sided arrayed printed circuit board, the upper side of the width corresponding to the double-sided arrayed printed circuit board and the inner bottom surface of the seating grooves, as the height of the integrated circuit, a guide along the same width side by side It is to provide a support plate formed by combining a guide formed by the lower surface of the support plate to form a rail, and supporting the printed circuit board on the guide rail.

Description

양면 연배열 인쇄회로기판의 받침대Pedestal of double-sided printed circuit board

제1도는 정상적인 양면 연배열 인쇄회로기판의 제1면에 직접회로를 탑재한 평면예시도.1 is a planar view showing an integrated circuit mounted on a first surface of a normal double-sided arrayed printed circuit board.

제2도는 직접회로가 탑재되는 영역에 쪽불량이 발생되었을때의 예를 보여주는 실시예시도.2 is an exemplary embodiment showing an example in which a page fault occurs in an area in which an integrated circuit is mounted.

제3도는 종래 기술에 의한 양면 연배열 인쇄회로기판의 받침대를 예시한 사시도.3 is a perspective view illustrating a pedestal of a double-sided arrayed printed circuit board according to the prior art.

제4도는 종래 받침대를 이용하여 쪽불량난 양면 연배열 인쇄회로기판의 제2면에 납을 도포할 때의 회로기판의 변형을 예시한 실시예시도.4 is a view illustrating an example of a deformation of a circuit board when applying lead to a second surface of a double-sided array of double-sided array printed circuit board using a conventional pedestal.

제5도는 본 발명의 양면 연배열 인쇄회로기판의 받침대를 예시한 분리사시도.Figure 5 is an exploded perspective view illustrating the pedestal of the double-sided arrayed printed circuit board of the present invention.

제6도는 본 발명의 받침대에 받침판을 결합한 상태의 일측 단면도.Figure 6 is a side cross-sectional view of the base plate coupled to the base of the present invention.

제7도는 본 발명의 받침대를 이용한 연배열 회로기판에 납을 도포할 때의 실시예시도.7 is a view showing an embodiment of applying lead to a lead array circuit board using the pedestal of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10 : 받침대 11 : 회로기판 안착홈10: base 11: circuit board mounting groove

12 : 가이드 레일 13 : 고정홈12: guide rail 13: fixing groove

14 : 받침판 15 : 가이드14: base plate 15: guide

16 : 고정돌기 18 : 나사구멍16: fixing protrusion 18: screw hole

본 발명은, 양면 연배열 인쇄회로기판의 받침대에 관한 것으로, 특히 쪽불량난 양면 연배열 인쇄회로기판의 제2면에 직접회로를 탑재하기위한 납도포작업시 납도포기에 의한 회로기판의 휨현상을 방지할 수 있도록, 쪽불량난 영역을 받쳐줄 수 있는 연배열 인쇄회로기판의 받침대에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pedestal of a double-sided arrayed printed circuit board, and more particularly, to warpage of a circuit board by a lead spreader during a lead coating operation for mounting a direct circuit on a second surface of a defective double-sided arrayed printed circuit board. The present invention relates to a pedestal of a flexible array printed circuit board which can support a defective area.

일반적으로, 전자기기 및 반도체 소자는 점차적으로 규격의 소형화, 고집적화 및 신호의 고속화를 추구하고, 직접회로 외부적으로 반도체 소자의 정보저장 능력을 향상시키기 위한 수단으로서 반도체 소자의 탑재가 완료된 패키지를 별도의 기판에 복수개씩 조합하여 모듈 패키지화 시키는 방법이 사용된다.BACKGROUND ART In general, electronic devices and semiconductor devices gradually pursue miniaturization, high integration, and high speed of signals, and separately separate packages in which semiconductor devices are mounted as means for improving information storage capability of semiconductor devices externally to integrated circuits. A method of packaging a module by combining a plurality of substrates is used.

제1도는, 양면 연배열 인쇄회로기판을 예시한 평면도이다.1 is a plan view illustrating a double-sided lead array printed circuit board.

양면 연배열 인쇄회로기판은, 직접회로가 탑재되는 영역과; 인쇄회로기판의 처음과 끝을 식별하기위한 인식마크와, 이송장치의 돌기부(도시되지 않음)에 삽입되는 구멍이 상,하단에 구비되고, 동박을 갖는 레일을 포함하는 더미 인쇄회로기판으로 이루어진 것이다.The double-sided arrayed printed circuit board includes: an area in which an integrated circuit is mounted; A recognition mark for identifying the beginning and end of the printed circuit board, and a hole inserted into the projection (not shown) of the transfer device is provided in the upper and lower ends, and consists of a dummy printed circuit board including a rail having copper foil. .

제2도는, 양면 연배열 인쇄회로기판의 적접회로 탑재영역에 쪽불량이 발생되었을때를 예시한 실시예의 평면도로써, 전술한 양면 연배열 인쇄회로기판(20)은, 생산되는 과정에서 직접회로(30)가 탑재되는 영역(21)에 쪽불량이 발생될 경우가 있는데, 이때에는 쪽불량난 직접회로 탑재영역에는 납 도포작업은 이루어지나, 직접회로(30)는 탑재되지 않는다. 상기한 직전회로 탑재영역(21)에 납도포시 정확한 납도포가 이루어질수 있도록 스텐실(40)을 사용하게된다.FIG. 2 is a plan view illustrating an embodiment in which a page fault occurs in an integrated circuit mounting area of a double-sided arrayed printed circuit board. The double-sided arrayed printed circuit board 20 described above includes an integrated circuit in a process of being produced. There is a case where a page fault occurs in the area 21 on which 30 is mounted. In this case, a lead coating operation is performed in the poor circuit integrated area, but the integrated circuit 30 is not mounted. The stencil 40 is used to make accurate lead coating when lead is applied to the immediately preceding circuit mounting region 21.

제3도는, 종래 기술에 의한 양면 연배열 회로기판의 받침대를 예시한 사시도이다.3 is a perspective view illustrating a pedestal of a double-sided arrayed circuit board according to the prior art.

제3도를 참조하면, 전술한 양면 연배열 인쇄회로기판(20)을 얹어놓고 직접회로(30)를 탑재하는 받침대(10)는, 본체(11)의 상면에 인쇄회로기판(20)과 상응하는 폭과 직접회로의 높이만큼 파여진 안착홈(12)을 형성하고, 상기 안착홈(12)의 내저면에서 관통된 나사구멍(18)을 통하여 나사고정할 수 있도록 구성된 것이다.Referring to FIG. 3, the pedestal 10 on which the above-described double-sided arrayed printed circuit board 20 is mounted and the integrated circuit 30 is mounted corresponds to the printed circuit board 20 on the upper surface of the main body 11. It is configured to form a mounting groove 12 is formed by the width and the height of the integrated circuit to be fixed through the screw hole 18 penetrated in the inner bottom surface of the mounting groove 12.

상기와 같은 종래 받침대는, 쪽불량난 양면 연배열 인쇄회로기판에 직접회로를 탑재할 경우, 안착홈의 밑면이 평편하게 형성되어 있어서 제1면에는 직접회로를 손쉽게 탑재할 수 있으나, 제2면에 직접회로를 탑재할 경우, 제4도에서와 같이 쪽불량난 직접회로 탑재영역이, 허공에 뜬 상태가 되어, 제2면에 납도포시, 납도포기(도시하지 않음)에 의해 양면 연배열 인쇄회로기판에 휨이 발생되어 제품 불량을 일으킬 뿐만아니라, 양면 연배열 인쇄회로기판 표면과 스텐실 사이에 발생된 공간으로 납이 흘러들어가 스텐실의 뒷면에 묻으므로써, 다음 제품에도 악영향을 미치게 되는 문제점이 있었다.In the conventional pedestal as described above, when the direct circuit is mounted on a defective double-sided arrayed printed circuit board, the bottom of the seating groove is flat so that the first circuit can be easily mounted on the first surface. In the case of mounting the integrated circuit on the circuit board, as shown in FIG. 4, the defective integrated circuit mounting area is left in the air, and when the second surface is lead-applied, the double-sided array is printed by a lead-applicator (not shown). The warpage of the circuit board not only causes product defects, but also lead to flow into the space generated between the surface of the double-sided array printed circuit board and the stencil, which is adversely affected by the next product. .

본 발명은, 전술한 문제점을 해결하기 위한 것으로, 쪽불량난 양면 연배열 인쇄회로기판의 직접회로 탑재영역을 받쳐줄 수 있는 받침판을 받침대에 부설하여, 납도포시 발생되는 휨현상에 의한 제품불량을 방지하고, 생산성 향상 및 원가절감은 물론, 고품질의 제품을 제조하기 위한 양면 연배열 인쇄회로기판의 받침대를 제공하는데 그 목적이 있다.The present invention is to solve the above-described problems, by placing a support plate on the pedestal to support the integrated circuit mounting area of the defective double-sided arrayed printed circuit board, to prevent product defects caused by the bending phenomenon generated during lead coating The purpose of the present invention is to provide a pedestal of a double-sided arrayed printed circuit board for manufacturing high quality products, as well as improving productivity and cost.

전술한 목적을 달성하기 위하여, 본체의 상면에 양면 연배열 인쇄회로기판과 상응하는 폭과, 직접회로의 높이만큼 파인 안착홈을 갖는 받침대에서 있어서, 상기 안착홈의 내저면에 일정폭을 이루며 일측면부로 다수의 키홈을 갖는 가이드 레일을 형성하고, 상기 가이드 레일에서 안내되는 가이드를 하부면에 구비한 받침판을 갖는 것을 특징으로 하는 양면 연배열 인쇄회로기판 받침대를 제공하므로서, 달성된다.In order to achieve the above object, in a pedestal having a width corresponding to a double-sided arrayed printed circuit board on the upper surface of the main body, and a seating groove that is dug by the height of the integrated circuit, it has a predetermined width on the inner bottom of the seating groove It is achieved by providing a guide rail having a plurality of key grooves in the side portion, and having a support plate having a guide guided by the guide rail on a lower surface thereof.

이하, 첨부 도면을 참조하여 본 발명을 보다 상세하게 설명하고자 한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

제5도, 제6도 및 제7도는, 본 발명에 의한 실시예로써, 제5도는 양면 연배열 인쇄회로기판의 받침대를 예시한 분리 사시도이다. 제7도는, 본 발명의 받침대를 이용한 양면 연배열 인쇄회로기판에 납을 도포할 때의 실시예시도 이다.5, 6 and 7 are embodiments according to the present invention, and FIG. 5 is an exploded perspective view illustrating a pedestal of a double-sided arrayed printed circuit board. 7 is an exemplary view of applying lead to a double-sided arrayed printed circuit board using the pedestal of the present invention.

제5도를 참조하면, 본체(11)의 상면에 양면 연배열 인쇄회로기판(20)과 상응하는 폭과, 직접회로(30)의 높이만큼 파인 안착홈(12)의 내저면에, 가이드 레일(13)이 형성되며, 상기 가이드 레일은, 일정폭을 이루며 본체(11)의 길이 방향과 나란하게 형성되어 있다.Referring to FIG. 5, a guide rail is provided on an inner bottom surface of the seating groove 12 which is formed on the upper surface of the main body 11, the width corresponding to the double-sided arrayed printed circuit board 20, and the height of the integrated circuit 30. 13 is formed, and the said guide rail is formed in parallel with the longitudinal direction of the main body 11, forming a fixed width | variety.

상기 가이드 레일(13)의 일측면부에는, 다수의 고정홈들(14)이 형성되어 있으며, 상기 고정홈들(14)은, 가이드 레일(13)를 따라 움직이는 받침판(15)이 쪽불량난 직접회로 탑재영역(21)부위에 위치할 수 있게끔 등간격으로 형성되어 있다.On one side of the guide rail 13, a plurality of fixing grooves 14 are formed, the fixing grooves 14, the support plate 15 moving along the guide rail 13 is a direct failure It is formed at equal intervals so that it can be located in the circuit mounting area 21 part.

전술한, 가이드 레일(13)에는, 가이드 레일에서 안내되는 가이드(16)를 하부면으로 형성한 받침판(15)이 결합되며, 상기 가이드에는 상기한 고정홈(14)에 끼워지는 고정돌기(17)가 형성되어 있다.As described above, the guide rail 13 is coupled to the support plate 15 formed with the guide 16 guided by the guide rail as a lower surface, and the fixing protrusion 17 fitted into the fixing groove 14 in the guide. ) Is formed.

상기 받침판(15)은 양면 연배령 인쇄회로기판(20)의 직접회로 탑재영역(21)과 같은 폭으로 형성되고, 안착홈(12)표면으로부터 직접회로의(30)두께 높이로 설치되어 진다.The supporting plate 15 is formed to have the same width as the integrated circuit mounting area 21 of the double-sided printed circuit board 20, and is installed at the thickness of the integrated circuit 30 from the surface of the mounting groove 12.

제7도는, 본 발명의 받침대를 이용한 양면 연배열 인쇄회로기판에 납을 도포할 때의 실시예시도 이다.7 is an exemplary view of applying lead to a double-sided arrayed printed circuit board using the pedestal of the present invention.

제7도를 참조하면, 직접회로 탑재영역(21)중 일부영역에 쪽불량난 양면 연배열 인쇄회로기판(20)에 직접회로(30)를 탑재함에 있어, 특히 쪽불량난 양면 연배열 인쇄회로기판(20)의 제2면에 직접회로(30)를 탑재할 때, 쪽불량난 직접회로 탑재영역(21)의 제1면을 받침대(10)의 받침판(15)으로 받친다음, 납도포기로 납도포작업이 이루어지는 것이다.Referring to FIG. 7, in the case where the integrated circuit 30 is mounted on the double-sided arrayed printed circuit board 20 which is poor in a part of the integrated circuit mounting area 21, in particular, the double-sided arrayed printed circuit which is poor in page When mounting the integrated circuit 30 on the second surface of the substrate 20, the first surface of the poor integrated circuit mounting area 21 is supported by the support plate 15 of the pedestal 10, and then Lead coating is done.

이상 설명된 바와 같이, 본 발명의 양면 연배열 인쇄회로기판의 받침대는, 받침대의 상면으로 형성된 안착홈에 가이드 레일을 형성하고, 상기 가이드 레일에 쪽불량난 양면 연배열 인쇄회로기판의 직접회로의 탑재영역을 받쳐줄 수 있는 받침판을 부설함으로써, 쪽불량난 양면 연배열 인쇄회로기판에 납도포시, 인쇄회로기판의 휨에 의한 제품 불량을 방지하였을 뿐만 아니라, 종래와 같이, 스텐실의 뒷면에 묻은 납으로 인한 제품불량등을 방지하여, 생산성 향상 및 원가절감은 물론, 고품질의 제품을 제조할 수 있는 잇점이 있다.As described above, the pedestal of the double-sided arrayed printed circuit board of the present invention, the guide rail is formed in the seating groove formed on the upper surface of the pedestal, and the guide rail of the integrated circuit of the double-sided arrayed printed circuit board By installing a support plate that can support the mounting area, it prevents product defects caused by the warpage of the printed circuit board when lead is applied to a defective double-sided array of printed circuit boards. By preventing the product defects, such as productivity improvement and cost reduction, there is an advantage that can manufacture high quality products.

Claims (3)

본체(11)의 상면에 양면 연배열 인쇄회로기판(20)과 상응하는 폭과, 직접회로의 높이만큼 파인 안착홈(12)을 갖는 받침대(10)에 있어서, 상기 안착홈(12)의 내저면에, 일측면부로 다수의 고정홈들(14)을 갖는 가이드 레일(13)이 형성되고, 상기 가이드 레일에는 받침판(15)의 하부면으로 형성된 가이드(16)가 결합되며, 상기 가이드(16)에는 고정홈들(16)에 선택적으로 끼워지는 고정돌기(17)를 구비한 것을 특징으로 하는 양면 연배열 인쇄회로기판의 받침대.In the pedestal 10 having a width corresponding to the double-sided arrayed printed circuit board 20 on the upper surface of the main body 11, and the mounting groove 12 is dug by the height of the integrated circuit, the inside of the mounting groove 12 At the bottom, a guide rail 13 having a plurality of fixing grooves 14 is formed as one side portion, and the guide 16 formed as the lower surface of the support plate 15 is coupled to the guide rail, and the guide 16 ) Is a pedestal of the double-sided arrayed printed circuit board, characterized in that it comprises a fixing projection (17) selectively fitted in the fixing grooves (16). 제1항에 있어서, 상기 받침판(15)은, 직접회로 탑재영역(21)의 폭을 갖는 것을 특징으로 하는 양면 연배열 인쇄회로기판의 받침대.The pedestal of claim 1, wherein the support plate (15) has a width of an integrated circuit mounting area (21). 제1항에 있어서, 상기 받침판(15)은, 안착홈(12)의 내저면 표면으로부터 직접회로(30)의 높이로 설치된 것을 특징으로 하는 양면 연배열 인쇄회로기판의 받침대.The pedestal according to claim 1, wherein the support plate (15) is installed at the height of the integrated circuit (30) from the inner bottom surface of the seating groove (12).
KR1019950014291A 1995-05-31 1995-05-31 Supporter of dual side printed circuit board arranged continuously KR0148076B1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2020222351A1 (en) * 2019-05-02 2020-11-05 주식회사 네오셈 Serially arranged printed circuit board, and test and transfer robot thereof

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Publication number Priority date Publication date Assignee Title
CN109508076A (en) * 2018-11-17 2019-03-22 徐州市奥仕捷电子机箱有限公司 A kind of series connection line apparatus of cabinet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020222351A1 (en) * 2019-05-02 2020-11-05 주식회사 네오셈 Serially arranged printed circuit board, and test and transfer robot thereof
KR20200127436A (en) * 2019-05-02 2020-11-11 주식회사 네오셈 Seriately arrayed printed circuit board and transfer robot for testing thereof

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