KR0145848B1 - Printed circuit board arranged in series - Google Patents
Printed circuit board arranged in seriesInfo
- Publication number
- KR0145848B1 KR0145848B1 KR1019950009655A KR19950009655A KR0145848B1 KR 0145848 B1 KR0145848 B1 KR 0145848B1 KR 1019950009655 A KR1019950009655 A KR 1019950009655A KR 19950009655 A KR19950009655 A KR 19950009655A KR 0145848 B1 KR0145848 B1 KR 0145848B1
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- circuit board
- array
- soft
- mounting portion
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
본 발명은 연배열 인쇄회로기판의 품질을 개선하기 위해, 더미 인쇄회로기판의 가이드 레일 부분에 적어도 하나 이상의 동박부분을 갖고, 메모리 장착부분의 상·하단에 앤드바를 갖지 않는 것을 특징으로 하는 연배열 인쇄회로기판을 제공함으로써, 메모리 모듈 연배열 인쇄회로기판의 품질을 개선하고, 인쇄회로기판 원판의 활용을 극대화할 수 있는 효과가 있다.In order to improve the quality of a soft array printed circuit board, the present invention has at least one copper foil portion in a guide rail portion of a dummy printed circuit board, and a soft array characterized in that it has no end bar at the top and bottom of the memory mounting portion. By providing a printed circuit board, it is possible to improve the quality of the memory module array array printed circuit board and to maximize the utilization of the printed circuit board original board.
Description
제1도는 종래기술에 따른 앤드바가 있는 연배열 인쇄회로기판의 평면도.1 is a plan view of a lead array printed circuit board with an end bar according to the prior art.
제2도는 집적회로를 탑재한 모듈 인쇄회로기판의 평면도.2 is a plan view of a module printed circuit board on which an integrated circuit is mounted.
제3도는 본 발명에 따른 연배열 인쇄회로기판의 평면도.3 is a plan view of a lead array printed circuit board according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 메모리 장착부분 11 : 앤드바10: memory mounting portion 11: end bar
20 : 더미 인쇄회로기판 21 : 구멍20: dummy printed circuit board 21: hole
23 : 인식마크 25 : 가이드 레일 부분23: identification mark 25: guide rail portion
26 : 동박 28 : 모서리26: copper foil 28: corner
40 : 연배열 인쇄회로기판40: lead array printed circuit board
본 발명은 연배열 인쇄회로기판에 있어서, 특히 앤드바를 제거하고, 가이드 레일에 동박을 입힌 연배열 인쇄회로기판에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a soft array printed circuit board, in which an end bar is removed and a copper foil is coated on a guide rail.
일반적으로 전자기기 및 반도체 소자는 점차적으로 규모의 소형화, 고집적화 및 신호의 고속화를 추구하고 있고, 칩 외부적으로 반도체 소자의 정보저장 능력을 향상시키기 위한 수단으로서 반도체 소자의 탑재가 완료된 패키지를 별도의 기판에 복수개를 조합하여 모듈 패키지화시키는 방법이 사용된다.BACKGROUND ART In general, electronic devices and semiconductor devices are gradually pursuing miniaturization, high integration, and high speed of signals, and as a means for improving the information storage capability of semiconductor devices externally to a chip, a package in which semiconductor devices have been mounted is separately provided. A method of module packaging by combining a plurality of substrates is used.
제1도는 종래기술에 따른 앤드바가 있는 연배열 인쇄회로기판이 평면도이다.1 is a plan view of a soft array printed circuit board having an end bar according to the related art.
제2도는 집적회로를 탑재한 모듈 인쇄회로기판의 평면도이다.2 is a plan view of a module printed circuit board on which an integrated circuit is mounted.
제1도 및 제2도를 참조하면, 연배열 인쇄회로기판(40)은 실선 부분으로 도시된 메모리 장착부분(10)과 상기 메모리 장착부분을 제외한 더미 인쇄회로기판(20)을 포함한다.Referring to FIGS. 1 and 2, the soft array printed circuit board 40 includes a memory mounting portion 10 shown as a solid line portion and a dummy printed circuit board 20 except for the memory mounting portion.
상기 메모리 장착부분(10)의 상·하단에는 앤드바(11)가 형성되어 있고, 상기 더미 인쇄회로기판(20)에는 연배열 인쇄회로기판(40)의 시종(始終)을 식별할 수 있는 인식마크(23)와, 이송장치(도면에 도시되어 있지 않음)의 돌기부분에 삽입되어지는 구멍(21)이 상·하단에 형성되어 있다.End bars 11 are formed at upper and lower ends of the memory mounting portion 10, and the dummy printed circuit board 20 recognizes an identification of a soft array printed circuit board 40. The mark 23 and the hole 21 inserted into the projection part of a conveying apparatus (not shown in figure) are formed in the upper and lower ends.
상기 메모리 장착부분(10)의 좌·우의 말단은 절단기(도면에 도시되어 있지않음)로 개별로 메모리 모듈이 분리되며, 집적회로(30)를 탑재하여 메모리 모듈 제품이완성된다.The left and right ends of the memory mounting portion 10 are individually separated by a cutter (not shown), and a memory module product is completed by mounting the integrated circuit 30.
전술한 종래기술에 따른 구조에 있어서, 인쇄회로기판의 활용에 불필요한 앤드바가 있어 연배열 인쇄회로기판 제작시 원판 활용도를 떨어뜨리고, 납땜 공정에서는 인쇄회로기판이 휘는 결점이 있다.In the above-described structure according to the prior art, there is an end bar that is unnecessary for the utilization of the printed circuit board, which lowers the utilization of the original plate when manufacturing the array of printed circuit boards, and the printed circuit board is bent in the soldering process.
따라서 본 발명의 목적은 메모리 모듈 연배열에 있어서, 앤드바를 제거하고, 가이드레일에 동박부분을 두어 연배열 인쇄회로기판의 품질을 개선하는 연배열 인쇄회로기판을 제공하는데 있다.Accordingly, an object of the present invention is to provide a soft array printed circuit board which improves the quality of a soft array printed circuit board by removing an end bar and placing a copper foil on a guide rail in the memory module lead array.
상기 목적을 달성하기 위하여, 인식마크와 구멍을 갖는 더미 인쇄회로기판 부분과 메모리 모듈 장착부를 갖는 연배열 인쇄회로기판에 있어서, 상기 더미 인쇄회로기판의 가이드 레일 부분에 적어도 하나 이상의 동박부분을 갖고, 메모리 장착부분이 상·하단에 앤드바를 갖지 않는 것을 특징으로 하는 연배열 인쇄회로기판을 제공한다.In order to achieve the above object, in a soft array printed circuit board having a dummy printed circuit board portion having a recognition mark and a hole and a memory module mounting portion, at least one copper foil portion on the guide rail portion of the dummy printed circuit board, Provided is a soft array printed circuit board, characterized in that the memory mounting portion has no end bar at the top and bottom.
이하, 첨부 도면을 참조하여 본 발명을 보다 상세하게 설명하고자 한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
제2도는 집적회로를 탑재한 모듈 인쇄회로기판의 평면도이다.2 is a plan view of a module printed circuit board on which an integrated circuit is mounted.
제3도는 본 발명에 따른 앤드바가 있는 연배열 인쇄회로기판의 평면도이다. 제2도 및 제3도를 참조하면, 연배열 인쇄회로기판(40)은 실선 부분으로 도시된 메모리 장착부분(10)과 상기 메모리 장착부분을 제외한 더미 인쇄회로기판(20)을 포함한다.3 is a plan view of a soft array printed circuit board with an end bar according to the present invention. 2 and 3, the soft array printed circuit board 40 includes a memory mounting portion 10 shown as a solid line portion and a dummy printed circuit board 20 except for the memory mounting portion.
상기 메모리 장착부분(10)의 상·하단에는 앤드바(11)가 형성되어 있고, 상기 더미 인쇄회로기판(20)에는 연배열 인쇄회로기판(40)의 시종(始終)을 식별할 수 있는 인식마크(23)와, 이송장치(도면에 도시되어 있지 않음)의 돌기부분에 삽입되도록 상·하단에 형성되어 있는 구멍(21)과, 적어도 하나 이상의 동박을 갖는 가이드레일(25)을 포함한다.End bars 11 are formed at upper and lower ends of the memory mounting portion 10, and the dummy printed circuit board 20 recognizes an identification of a soft array printed circuit board 40. The mark 23, the hole 21 formed in the upper and lower ends so that it may be inserted in the projection part of a conveying apparatus (not shown in figure), and the guide rail 25 which has at least one copper foil is included.
상기 메모리 장착부분(10)의 좌·우의 말단은 절단기(도면에 도시되어 있지 않음)로 개별로 메모리 모듈이 분리되며, 집적회로(30)를 탑재하여 메모리 모듈 제품이 완성된다.The left and right ends of the memory mounting portion 10 are individually separated by a cutter (not shown in the drawing), and the memory module product is completed by mounting the integrated circuit 30.
또한, 연배열 인쇄회로기판(40)의 각 모서리(28)는 라운딩되어 있다.In addition, each edge 28 of the soft array printed circuit board 40 is rounded.
상기 앤드바를 제거함으로써, 인쇄회로기판에 불필요한 부분을 없애 메모리모듈 연배열 제작시 원판 활용도를 극대화시켰다. 또한, 상기 가이드레일의 좌·우 양쪽에 동박부분을 두어 납땜공정에서 발생되는 인쇄회로기판의 휨을 방지할 수 있고, 각 모서리에 모따기를 하여 표면실장 공정에서 벨트 위를 인쇄회로기판이 이동시 부드럽게 한다.By removing the end bar, the unnecessary portion of the printed circuit board is eliminated, thereby maximizing the utilization of the original plate when manufacturing the memory module array. In addition, by placing copper foil portions on both the left and right sides of the guide rail, the bending of the printed circuit board generated in the soldering process can be prevented, and chamfering is performed at each corner to smooth the printed circuit board on the belt during the surface mounting process. .
본 발명에 의한 구조에 따르면, 앤드바를 제거하고, 가이드레일에 동박부분을 두어 메모리 모듈 연배열 인쇄회로기판의 품질을 개선하고, 인쇄회로기판 원판의 활용을 극대화할 수 있는 이점(利點)이 있다.According to the structure according to the present invention, by removing the end bar, by placing the copper foil portion on the guide rail to improve the quality of the memory module soft array printed circuit board, and to maximize the utilization of the printed circuit board have.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950009655A KR0145848B1 (en) | 1995-04-24 | 1995-04-24 | Printed circuit board arranged in series |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950009655A KR0145848B1 (en) | 1995-04-24 | 1995-04-24 | Printed circuit board arranged in series |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960040093A KR960040093A (en) | 1996-11-25 |
| KR0145848B1 true KR0145848B1 (en) | 1998-10-01 |
Family
ID=19412816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950009655A KR0145848B1 (en) | 1995-04-24 | 1995-04-24 | Printed circuit board arranged in series |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0145848B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9674958B2 (en) | 2014-06-05 | 2017-06-06 | Samsung Electronics Co., Ltd. | Printed circuit boards and semiconductor packages |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030029427A (en) * | 2001-10-08 | 2003-04-14 | 삼신써키트 주식회사 | Design and Manufacturing method of FPC & PCB for the decomposition and selective recombination of the product |
-
1995
- 1995-04-24 KR KR1019950009655A patent/KR0145848B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9674958B2 (en) | 2014-06-05 | 2017-06-06 | Samsung Electronics Co., Ltd. | Printed circuit boards and semiconductor packages |
Also Published As
| Publication number | Publication date |
|---|---|
| KR960040093A (en) | 1996-11-25 |
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