WO2020222351A1 - Serially arranged printed circuit board, and test and transfer robot thereof - Google Patents

Serially arranged printed circuit board, and test and transfer robot thereof Download PDF

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Publication number
WO2020222351A1
WO2020222351A1 PCT/KR2019/006356 KR2019006356W WO2020222351A1 WO 2020222351 A1 WO2020222351 A1 WO 2020222351A1 KR 2019006356 W KR2019006356 W KR 2019006356W WO 2020222351 A1 WO2020222351 A1 WO 2020222351A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
ssd
semiconductor
support part
Prior art date
Application number
PCT/KR2019/006356
Other languages
French (fr)
Korean (ko)
Inventor
염동현
Original Assignee
주식회사 네오셈
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Application filed by 주식회사 네오셈 filed Critical 주식회사 네오셈
Publication of WO2020222351A1 publication Critical patent/WO2020222351A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to a flexible printed circuit board and a test transfer robot thereof.
  • a flexible printed circuit board and a test transfer robot thereof that can easily and conveniently perform various tests required in a solid state drive (SSD) semiconductor manufacturing process.
  • SSD solid state drive
  • test processes are performed in the conventional SSD semiconductor manufacturing process, and typical test processes include the BIST test and the FUNCTION test.
  • BIST test since the BIST test is generally conducted first, the test was conducted by connecting the BIST test equipment to terminals formed on a plurality of SSD semiconductors included in the flexible array printed circuit board.
  • the conventional serially arranged printed circuit board includes a plurality of SSD semiconductors, more specifically, the SSD semiconductors are arranged in a plurality of columns and a plurality of rows, and the structure is blocked with a support part between each column. There is a problem in that it is difficult to connect the BIST test equipment because the terminal formed in the terminal is too close to the corresponding support part.
  • the FUNCTION test is conducted after the BIST test is performed, and the SSD semiconductors determined to be good products as a result of the BIST test are individually separated from the flexible array printed circuit board and assembled into the case, and then partially exposed through the case.
  • the test was conducted by connecting the FUNCTION test equipment to the terminal formed in.
  • the process of individually separating the SSD semiconductor from the flexible printed circuit board and the process of assembling the separated SSD semiconductor into the case to proceed with the FUNCTION test becomes meaningless, and furthermore, the FUNCTION test.
  • the process of transferring the SSD semiconductor assembled in the case to the place where the FUNCTION test equipment is installed becomes meaningless, there is a problem that it causes serious damage in terms of time and cost.
  • an unintended collision may occur in the process of transferring the SSD semiconductor assembled in the case.
  • the SSD semiconductor assembled in the case cannot but be determined as defective without even performing the function test.
  • the technical problem to be solved by the present invention is to provide a new structure of a flexible printed circuit board and a test transfer robot for the same, which can easily and conveniently proceed with the BIST test and the FUNCTION test in one place.
  • a flexible printed circuit board for achieving the above technical problem includes a first solid state drive (SSD) semiconductor including a first terminal portion formed on one side, and a first solid state drive (SSD) semiconductor, based on the first SSD semiconductor.
  • SSD solid state drive
  • SSD first solid state drive
  • An N-th SSD semiconductor including an N-th terminal portion (N is a natural number greater than or equal to 2) formed at one side and disposed in parallel at a first predetermined interval along the direction, and mutually support the first SSD semiconductor and the N-th SSD semiconductor, The first support portion disposed at the first predetermined interval, the first SSD semiconductor and the N-th SSD semiconductor, and a second predetermined spaced apart from each other to support each other, the second surrounding the first SSD semiconductor and the N-th SSD semiconductor A support part and a third support part mutually supporting the first SSD semiconductor and the N-th SSD semiconductor and a second support part, the third support part disposed at the second predetermined distance, and the second support part, the first terminal part and the N-th terminal part
  • the first SSD semiconductor and the N-th SSD semiconductor are enclosed in a state in which one side of is formed is opened.
  • the first terminal portion and the N-th terminal portion may be a terminal portion connected to a BIST test equipment and a function test equipment used for a BIST test and a function test for the first SSD semiconductor and the N-th SSD semiconductor.
  • the third support part, a 3-1 support part and the first support part disposed in a direction opposite to the direction in which the first support part is disposed to mutually support the first SSD semiconductor and the second support part It may further include a 3-2 th support part disposed in a direction opposite to the disposed direction to mutually support the Nth SSD semiconductor and the second support part.
  • the third support portion is disposed in a direction opposite to the one side to support the first SSD semiconductor and the second support portion to each other, and the N-th support portion is disposed in a direction opposite to the one side. It may further include a 3-4 support for mutually supporting the SSD semiconductor and the second support.
  • the second support may be in a state in which the one side is open including the first predetermined interval and the second predetermined interval.
  • the second support portion may be in a state in which the one side is open without including the second predetermined interval, and the second predetermined interval is closed.
  • the second support portion is in a state in which the one side is open only by a length corresponding to the first terminal portion and the N-th terminal portion, and corresponds to the second predetermined interval, the first terminal portion, and the N-th terminal portion.
  • One side except for the length may be in a closed state.
  • a test transfer robot for a flexible printed circuit board in which a terminal portion is formed on one side according to an embodiment of the present invention is formed, and the one side is open
  • a control unit for controlling driving of the clamp unit and the clamp unit wherein the clamp unit includes a first clamp unit in contact with a first direction of the series printed circuit board and a first direction of the series printed circuit board And a second tongs portion in contact with a second direction that is a direction different from the first tongs, wherein a plurality of first grooves having a predetermined depth are formed on a surface of the first tongs, and a sensor is disposed in the groove.
  • a plurality of second grooves having a predetermined depth are formed on the first direction surface of the flexible array printed circuit board in contact with the first tongs
  • the sensor is an infrared sensor
  • the infrared sensor Infrared radiation is irradiated on the serially arranged printed circuit board, the irradiated infrared rays are returned, and the calculated first time and a second time longer than the first time are calculated simultaneously with the first clamp. It may be determined as the first direction to which the additional contact will be made and transmitted to the control unit.
  • the first time is a time to return after the irradiated infrared rays collide with the surface in the first direction of the serialized printed circuit board
  • the second time is, the irradiated infrared rays are printed in the serial array. It may be a time to return after colliding with the surface of the second groove formed on the surface of the circuit board in the first direction.
  • a plurality of first protrusions having a predetermined height are formed on a surface of the first clamp unit, and the first protrusion is formed when the first clamp unit and the first direction of the series printed circuit board contact each other. , It can be combined with the second groove.
  • the infrared sensor determines a direction in which a third time, which is a time longer than the second time, is calculated as the one side in the open state, and sets 1 to the number of times the third time is calculated by the one side.
  • the result of the subtraction may be determined as the number of a plurality of SSD semiconductors included in the serialized printed circuit and transmitted to the control unit.
  • a body portion on which the control unit is mounted and a plurality of moving wheels disposed below the body portion may further be included.
  • an arm part connected to the first clamp part and a rotation part disposed between the first clamp part and the arm part may be further included.
  • the second tongs may include a 2-1 tong portion in contact with an upper end of the flexible array printed circuit board in a second direction, and a second tongs contact with a lower end of the flexible array printed circuit board in a second direction.
  • the first terminal portion and the N-th terminal portion formed on one side of the flexible array printed circuit board may be exposed to the outside by opening one side of the printed circuit board. Since the structure is not blocked with a support part, there is an advantage in that it is easy to connect the first terminal part and the N-th terminal part with the BIST test equipment.
  • the second support portion can serve as a protective layer for the first terminal portion, the N-th terminal portion, and the first SSD semiconductor and the N-th SSD semiconductor, it is possible to prevent accidental damage.
  • the BIST test device and the FUNCTION test device are installed within a radius that the arm part can drive through the arm part, it is not necessary to transfer the SSD semiconductor or the soft-array printed circuit board including the SSD semiconductor in a hassle. It is possible to prevent accidental collisions that can be caused by accidents, and there is an effect that the BIST test and the FUNCTION test can be performed easily and conveniently in one place.
  • FIG. 1 is a view showing a top view of a flexible array printed circuit board according to a first embodiment of the present invention.
  • FIG. 2 is a diagram illustrating a first embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
  • FIG. 3 is a diagram illustrating a second embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
  • FIG. 4 is a view showing a third embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a fourth embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
  • FIG. 6 is a diagram showing the configuration of a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention.
  • FIG. 7 is an enlarged view illustrating a clamp included in a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention.
  • FIGS. 8 and 10 are diagrams showing a time when infrared rays are irradiated on a serially arranged printed circuit board and the irradiated infrared rays return when an infrared sensor is used as a sensor.
  • FIG. 9 is a view showing a state in which the protrusion of the flexible printed circuit board and the second groove formed in the clamp portion are coupled.
  • FIG. 11 is a diagram illustrating a state in which a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention performs a BIST test and a function test.
  • FIG. 1 is a diagram showing a top view of a flexible printed circuit board 100 according to a first embodiment of the present invention.
  • the flexible printed circuit board 100 includes a first SSD semiconductor 10, an N-th SSD semiconductor 20, a first support 30, a second support 40, and a third It goes without saying that it may include a support 50, and may further include additional components necessary to achieve the object of the present invention.
  • the first SSD semiconductor 10 is any one of SSD semiconductors disposed on the flexible array printed circuit board 100 according to the first embodiment of the present invention, and is a typical SSD semiconductor without any limitation in standard or size.
  • the first SSD semiconductor 10 has a first terminal portion 11 formed on one side thereof, and the first terminal portion 11 is a BIST test used for a BIST test and a function test for the first SSD semiconductor 10 It is a terminal part connected to the equipment and the function test equipment, and in FIG. 1, one side is shown as the left side of the first SSD semiconductor 10 based on the top view, but this corresponds to one embodiment, and if necessary, not the left side. It goes without saying that any one of the right side, upper side, and lower side may be one side. However, in the following description, for convenience of description, it is assumed that one side is left.
  • the N-th SSD semiconductors 20 are arranged side by side with a first predetermined distance d1 apart from the first SSD semiconductor 10 in a first direction, and like the first SSD semiconductor 10, the N-th SSD semiconductors 10 Terminal portions 21 and N are a natural number of 2 or more).
  • the first direction may be either a horizontal direction or a vertical direction, and although the first direction is illustrated in a vertical direction in FIG. 1, this also corresponds to one embodiment, and if necessary, the horizontal direction is not a vertical direction. It goes without saying that the direction can be the first direction. However, in the following description, for convenience of description, the description will be continued on the premise that the first direction is the vertical direction.
  • the first predetermined interval d1 is the interval between the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and the first predetermined interval d1 is the first SSD semiconductor in the serially arranged printed circuit board 100 later. It can be seen as an interval necessary to easily separate the 10 and the N-th SSD semiconductor 20, and can be freely set according to the design, but only the minimum interval for easy separation is the first predetermined interval d1 It would be desirable to increase the space utilization in the serially arranged printed circuit board 100 by setting it to, for example, the first predetermined interval d1 is the first SSD semiconductor 10 and the Nth SSD semiconductor 20 It would be desirable to set it to about 1/10 to 1/3 of the length in the first direction of ).
  • N is a natural number of 2 or more in the Nth SSD semiconductor 20, the second SSD semiconductor, the third SSD semiconductor, the fourth SSD semiconductor, etc. are used in the flexible printed circuit board 100 according to the first embodiment of the present invention.
  • N is set to 2 to describe the assumption that two SSD semiconductors are included, and the N-th terminal portion 21 formed on one side is a first terminal portion ( Since it is the same as 11), detailed descriptions will be omitted to prevent duplicate descriptions.
  • the first support part 30 mutually supports the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and is disposed at a first predetermined distance d1.
  • the first support part 30 serves as a bridge for mutually supporting the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and thus, the first SSD semiconductor 10 and the first SSD semiconductor 10 It is disposed at a first predetermined distance d1, which is a distance between the Nth SSD semiconductors 20, and later separates the first SSD semiconductor 10 and the Nth SSD semiconductor 20 from the serially arranged printed circuit board 100 In this case, the first support part 30 will be naturally removed from the flexible printed circuit board 100 because there is no object to perform the bridge role.
  • the second support part 40 is disposed to be spaced apart from the first SSD semiconductor 10 and the N-th SSD semiconductor 20 and a second predetermined distance d2 to support each other, but the first SSD semiconductor 10 and the N-th SSD semiconductor Surrounding (20).
  • the second support part 40 surrounds the first SSD semiconductor 10 and the N-th SSD semiconductor 20 in a state in which one side of the first terminal part 11 and the N-th terminal part 21 is opened, Accordingly, the second predetermined interval d2 is not disposed on one side of the first SSD semiconductor 10 and the N-th SSD semiconductor 20, but a detailed description thereof will be described later.
  • This second predetermined interval d2 can also be viewed as an interval necessary to easily separate the first SSD semiconductor 10 and the N-th SSD semiconductor 20, similar to the first predetermined interval d1 described above, and the design
  • the second predetermined interval d2 may be set equal to or different from the first predetermined interval d1.
  • the second support part 40 is shown in an inverted “c” shape, but this corresponds to one embodiment and may be formed in a different shape as necessary.
  • the first SSD semiconductor 10 and the N-th SSD semiconductor 20 can be protected from external shocks by adopting a shape surrounding the first SSD semiconductor 10 and the N-th SSD semiconductor 20 as a basis. It would be desirable to do so.
  • the third support part 50 mutually supports the first SSD semiconductor 10, the N-th SSD semiconductor 20, and the second support part 40, but is disposed at a second predetermined distance d2.
  • the third support part 50 serves as a bridge for mutually supporting the first SSD semiconductor 10 and the N-th SSD semiconductor 20 and the second support part 40, and thus, the first SSD semiconductor
  • the first SSD semiconductor 10 is disposed at a second predetermined distance d2, which is a distance between the 10 and N-th SSD semiconductor 20 and the second support part 40, and later in the serially arranged printed circuit board 100.
  • the N-th SSD semiconductor 20, the third support part 50 like the first support part 30, does not have an object to serve as a bridge, and thus will be naturally removed from the flexible printed circuit board 100. .
  • the third support 50 is disposed in a direction opposite to the direction in which the first support 30 is disposed to support the first SSD semiconductor 10 and the second support 40 to each other.
  • a 3-2 support part 50-2 disposed in a direction opposite to the direction in which the first support part 30 is disposed to mutually support the N-th SSD semiconductor 20 and the second support part 40, one side
  • the third-third support part 50-3 which is disposed in the opposite direction and mutually supports the first SSD semiconductor 10 and the second support part 40, and the N-th SSD semiconductor 20 and the N-th SSD semiconductor 20 It may further include a 3-4 support (50-4) mutually supporting the second support (40).
  • the first support part 30, the 3-1 support part 50-1, and the 3-3 support part 50-3 are provided on the first SSD semiconductor 10, and the first SSD semiconductor 20 Since the support 30, the 3-2 support 50-2 and the 3-4 support 50-4 are disposed, the first SSD semiconductor 10, the Nth SSD semiconductor 20, and the second support ( 40) It is possible to strengthen the supporting force between, thereby preventing the first SSD semiconductor 10 and the Nth SSD semiconductor 20 from being separated from the lead-array printed circuit board 100 by an unintended impact. have.
  • FIG. 2 is an enlarged top view of the second support part 40 of the serially arranged printed circuit board 100 according to the first embodiment of the present invention shown in FIG. 1. 1 It should be defined as an example.
  • the second support part 40 is It is in the open state including the 1 predetermined distance (d1) and the second predetermined distance (d2), which is in a state in which the second support portion 40 excludes one side of the first terminal portion 11 and the N-th terminal portion 21 It can be viewed as surrounding the first SSD semiconductor 10 and the Nth SSD semiconductor 20.
  • the first terminal portion 11 and the N-th terminal portion 21 formed on one side of the flexible array printed circuit board 100 may be exposed to the outside by opening one side of the printed circuit board 100 itself.
  • FIG. 3 is a top view showing the second embodiment of the second support part 40 except for one side of the first terminal part 11 and the N-th terminal part 21.
  • the series-array printed circuit board 100 in a state in which the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside.
  • the first terminal portion 11 and the N-th terminal portion 21 may serve as a protective layer. This is because the second support portion 40 protrudes from the first terminal portion 11 and the N-th terminal portion 21.
  • FIG 4 is a top view showing a third embodiment of the second support 40.
  • one side of the second support part 40 is open without including the second predetermined distance d2, and that the second predetermined distance d2 is closed. It can be seen that only the first terminal portion 11 and the N-th terminal portion 21 and a first predetermined distance d1 therebetween are exposed to the outside.
  • the first terminal part 11 and the N-th terminal part 21 are exposed to the outside, and the series of printed circuit boards 100 are connected to each other or other objects.
  • the first terminal portion 11 and the N-th terminal portion 21 may serve as a protective layer.
  • the second support part that blocks the second predetermined distance d2 since it may be difficult to connect by 40), in this case, it may be implemented to facilitate cutting by cutting the second support portion 40 blocking the second predetermined distance d2 or processing a predetermined broken line.
  • FIG 5 is a top view showing a fourth embodiment of the second support part 40.
  • the second support part 40 is in a state in which one side of the second support part 40 is open only by a length corresponding to the first terminal part 11 and the N-th terminal part 21, and a second predetermined distance d2, the first terminal part ( 11) and one side except for the lengths corresponding to the N-th terminal portion 21 can be seen as being in a closed state, which can be seen that only the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside.
  • the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside, and the printed circuit board 100 )
  • it can serve as a protective film for the first terminal portion 11 and the N-th terminal portion 21, and furthermore, only the first terminal portion 11 and the N-th terminal portion 21 Since it is exposed to the outside, it may even serve as a protective layer for the first SSD semiconductor 10 and the Nth SSD semiconductor 20.
  • the second predetermined distance d2 and the first SSD semiconductor 10 when the first terminal portion 11 and the N-th terminal portion 21 are connected to the BIST test equipment, the second predetermined distance d2 and the first SSD semiconductor 10 ) And the second support part 40 blocking a part of the N-th SSD semiconductor 20, in this case, the second predetermined distance d2 and the first SSD semiconductor 10 and the N-th SSD semiconductor ( It may be implemented to facilitate cutting by cutting the second support part 40 blocking part of 20) or processing a predetermined broken line.
  • the first to fourth embodiments of the second support 40 included in the flexible printed circuit board 100 according to the first embodiment of the present invention have been described.
  • the first terminal portion 11 and the N-th terminal portion 21 formed on one side of the flexible array printed circuit board 100 may be exposed to the outside by opening one side of the printed circuit board 100 itself. Since it is not a structure in which each row is blocked by a support part, it has the advantage that it is easy to connect the first terminal part 11 and the N-th terminal part 21 and the BIST test equipment, and furthermore, the second support part 40 In this case, since the first terminal portion 11 and the N-th terminal portion 21 and the first SSD semiconductor 10 and the N-th SSD semiconductor 20 can also serve as a protective layer to prevent accidental damage.
  • test transfer robot 200 of the serialized printed circuit 100 according to a second embodiment of the present invention will be described.
  • FIG. 6 is a diagram showing a configuration of a test transfer robot 200 of a flexible printed circuit board 100 according to a second embodiment of the present invention.
  • the test transfer robot 200 of the board of the serialized printed circuit 100 includes a clamp 60, a control unit 70 and a sensor 80, and other objects of the present invention. It goes without saying that it may further include additional components necessary to achieve.
  • the flexible arrangement printed circuit board 100 to be mentioned in the following description includes the flexible arrangement printed circuit board 100 according to the first embodiment of the present invention described above, more specifically, a plurality of SSD semiconductors having terminal portions formed on one side thereof. Including, but assumes that one side is the flexible array printed circuit board 100 in an open state.
  • the clamp unit 60 picks up the flexible printed circuit board 100, and the control unit 70 controls the driving of the clamp unit 60.
  • the control unit 70 may be mounted on the body unit 90, and a plurality of wheels 95 are disposed at the lower end of the body unit 90 to provide a series-array printed circuit according to the second embodiment of the present invention. (100) It can contribute to the movement of the test transfer robot 200 of the substrate, and the arm portion 97 and the rotating portion 98 will be described later.
  • FIG. 7 is an enlarged view illustrating a clamp part 60 included in the test transfer robot 200 of the flexible printed circuit board 100 according to the second embodiment of the present invention.
  • the tongs 60 are in contact with the first direction of the flexible array printed circuit board 100 and the first tongs 60-1 and the first direction of the flexible array printed circuit board 100.
  • the second clamping part 60-2 in contact with the second direction, which is a different direction, is included. Since one side of the serially arranged printed circuit board 100 is open, the clamping part 60 is blocked. It includes a first clamping portion 60-1 and a second clamping portion 60-2 that can contact all of the parts. In this case, since the first direction was previously set as the vertical direction, the second direction may be viewed in a horizontal direction rather than a vertical direction.
  • a plurality of grooves 65 having a predetermined depth may be formed on the surface of the first clamp part 60-1, and the sensor 80 may be disposed in the groove 65, and the sensor 80 This is because if the sensor 80 is placed on the surface as it is, when the flexible printed circuit board 100 is picked up due to the height of the sensor 80 itself, a space may be generated and the picked up flexible printed circuit board 100 may be missed. However, since the sensor 80 has a very low height, if the height is negligible, it may not necessarily be disposed in the groove 65.
  • the sensor 80 may be any known sensor, but the number of SSD semiconductors included in the serially arranged printed circuit board 100 and the first direction in which the first clamping part 60-1 will contact It is desirable to use an infrared sensor to determine.
  • the infrared sensor irradiates infrared rays onto the flexible array printed circuit board 100, calculates the time to return after the irradiated infrared rays collide, and calculates the number of SSD semiconductors included in the flexible array printed circuit board 100 and the first The first direction in which the clamp part 60-1 will contact may be determined.
  • FIG. 8 is a diagram showing the time when infrared rays are irradiated to the serially arranged printed circuit board 100 and the irradiated infrared rays return, when an infrared sensor is used as the sensor 80, and infrared rays irradiated by the infrared sensor disposed above
  • This return time can be viewed as the first time
  • the return time of the infrared light irradiated by the infrared sensor disposed below it can be viewed as the second time
  • the infrared sensor irradiates infrared rays to calculate the first time and the second time at the same time. May be determined as a first direction in which the first clamp unit 60-1 will contact and transmitted to the control unit 70.
  • the first time is a time to return after the irradiated infrared rays collide with the surface in the first direction of the series printed circuit board 100
  • the second time is the time when the irradiated infrared rays return to the first direction of the series printed circuit board 100.
  • This is the time to return after colliding with the surface of the second groove 50-5 formed on the surface in one direction
  • the open side of the flexible printed circuit board 100 according to the first embodiment of the present invention is a BIST test equipment or Since the terminal part connected to the function test equipment is exposed to the outside, it is impossible to connect in a state in contact with the first clamp part (60-1). As a result, a second groove (50-5) is formed on the opposite surface.
  • the second time may be a longer time than the first time.
  • the first clamping part 60-1 a plurality of first protrusions 61 having a predetermined height are formed on the surface, and the formed first protrusion 61 is a first clamping part.
  • the test transfer robot 200 of the serially arranged printed circuit board 100 can determine the direction in which it will contact the serially arranged printed circuit board 100. This is a situation in which the clamp part 60 does not approach the open side of the flexible printed circuit board 100, and in some cases, the clamp part 60 approaches the open side of the flexible printed circuit board 100. You can go. In this case, the clamp part 60 should not pick up the flexible printed circuit board 100, and it should be determined that the direction in which the clamp part 60 approaches is the open side of the flexible printed circuit board 100 by irradiating infrared rays. do. It will be described below.
  • FIG. 10 is a diagram showing the time when infrared rays are irradiated to the series printed circuit board 100 and the irradiated infrared rays return when the infrared sensor is used as the sensor 80, as in FIG. The point is that the tongs 60 are disposed in the open side of the flexible printed circuit board 100.
  • the infrared sensor will irradiate infrared rays as in the case of FIG. 8, and this is indicated as a third time in the drawing.
  • This third time is a time to return after the infrared rays irradiated by the infrared sensor are irradiated at a second predetermined interval and collide with the surface of the 3-1 support 50-1, and the height (or length) of the second predetermined interval is Since the height (or length) of the second groove 50-5 is larger than the height (or length), the third time is inevitably longer than the second time, and accordingly, the direction in which the third time is calculated can be determined as one side in the open state. .
  • the time when infrared rays irradiated by other infrared sensors collide with one side of the SSD semiconductor and return may also be calculated, which will be shorter than the third time, but the third time is the longest time among the time calculated by the infrared sensor. Therefore, the calculation of a time shorter than this is a matter that does not need to be considered in determining one side.
  • the infrared sensor can determine the result of subtracting 1 from the number of times the third time is calculated by one side as the number of a plurality of SSD semiconductors included in the serialized printed circuit and transmit it to the control unit 70, as shown in FIG.
  • the third time is measured three times. This is because when one SSD semiconductor is arranged, two predetermined intervals are arranged along the first direction, and when another SSD semiconductor is arranged side by side, one predetermined interval is overlapped, based on the calculated number of third times. This is because it can be seen as the number of SSD semiconductors by subtracting 1 by.
  • the test transfer robot 200 of the serially arranged printed circuit board 100 determines the number of SSD semiconductors included in the serially arranged printed circuit board 100 to determine the BIST test equipment and The position to be connected to the plurality of terminal parts included in the FUNCTION test equipment or the number of terminal parts that need to be connected can be accurately calculated, but this is similar to the previous case, when the clamping part 60 is open to the open circuit board 100 This is a situation when approaching one side. That is, in order for the clamp unit 60 to calculate the number of SSD semiconductors included in the flexible printed circuit board 100, the picked up flexible printed circuit board 100 is a BIST test equipment and a FUNCTION test equipment. In order to connect with, it is necessary to approach in the opposite direction of the open side, so it is preferable that the control unit 70 allows the clamp unit 60 to approach both the open side and the opposite direction of the open side. .
  • the second clamping part 60-2 is in contact with the second direction of the serially arranged printed circuit board 100, which is on the upper and lower two surfaces with respect to the upper surface of the serially arranged printed circuit board 100. Therefore, a separate extension (not shown) is further included between the first clamping part 60-1 and the second clamping part 60-2 to fit the length of the serially arranged printed circuit board 100 in the first direction. It can also be flexibly adjusted to respond.
  • the control unit 70 causes the extension part (not shown) to It is preferable to make the second clamp part 60-2 in a maximum elongated state and then approach it. Since the lengths in the first direction of the series printed circuit board 100 may be different, their length in the first direction This is because approaching in a state that can include all of them is a way to improve process efficiency.
  • the test transfer robot 200 of the serially arranged printed circuit board 100 includes an arm part 97 connected to the first clamp part 60-1, A rotating portion 98 disposed between the first clamp portion 60-1 and the arm portion 97 may be further included.
  • the arm portion 97 through the arm portion 97 If the BIST test device and the FUNCTION test device are installed within a radius that can be driven, the SSD semiconductor or the flexible array printed circuit board 100 including the SSD semiconductor does not need to be transported cumbersomely, and intentions that may occur in the transport process Unexpected collision can be prevented, and the BIST test and FUNCTION test can be performed easily and conveniently in one place.
  • the SSD semiconductor or serial array printing including the SSD semiconductor through the rotating unit 98 Since the tongs 60 holding the circuit board 100 can be rotated, process efficiency can be improved.

Abstract

A serially arranged printed circuit board according to an embodiment of the present invention comprises: a first solid-state drive (SSD) semiconductor comprising a first terminal portion formed on one side thereof; an Nth SSD semiconductor which is arranged in parallel with and separated from the first SSD semiconductor by a first predetermined distance in a first direction, and comprises an Nth terminal portion (N is a natural number of 2 or more) formed on one side thereof; a first support part which mutually supports the first SSD semiconductor and the Nth SSD semiconductor and is arranged at the first predetermined distance; a second support part which is separated from the first SSD semiconductor and the Nth SSD semiconductor by a second predetermined distance to mutually support the semiconductors, and surrounds the first SSD semiconductor and the Nth SSD semiconductor; and a third support part which mutually supports the first SSD semiconductor, the Nth SSD semiconductor, and the second support part and are arranged at the second predetermined distance, wherein, in a state in which the one side where the first terminal portion and the Nth terminal portion are formed is open, the second support part surrounds the first SSD semiconductor and the Nth SSD semiconductor.

Description

연배열 인쇄 회로 기판 및 이의 테스트 이송 로봇Serial array printed circuit board and its test transfer robot
본 발명은 연배열 인쇄 회로 기판 및 이의 테스트 이송 로봇에 관한 것이다. 보다 자세하게는, SSD(Solid State Drive) 반도체 제조 공정에서 요구되는 다양한 테스트를 손쉽고 간편하게 진행할 수 있는 연배열 인쇄 회로 기판 및 이의 테스트 이송 로봇에 관한 것이다. The present invention relates to a flexible printed circuit board and a test transfer robot thereof. In more detail, it relates to a flexible printed circuit board and a test transfer robot thereof that can easily and conveniently perform various tests required in a solid state drive (SSD) semiconductor manufacturing process.
종래의 SSD 반도체 제조 공정에는 다양한 테스트 공정이 진행되며, 대표적인 테스트 공정으로 BIST 테스트와 FUNCTION 테스트를 들 수 있다. 이 경우, BIST 테스트가 먼저 진행되는 것이 일반적인바, 연배열 인쇄 회로 기판이 포함하는 복수 개의 SSD 반도체 상에 형성된 단자에 BIST 테스트 장비를 연결시켜 테스트를 진행하였다. Various test processes are performed in the conventional SSD semiconductor manufacturing process, and typical test processes include the BIST test and the FUNCTION test. In this case, since the BIST test is generally conducted first, the test was conducted by connecting the BIST test equipment to terminals formed on a plurality of SSD semiconductors included in the flexible array printed circuit board.
그러나 종래의 연배열 인쇄 회로 기판이 복수 개의 SSD 반도체를 포함하기에, 보다 구체적으로 복수 개의 열과 복수 개의 행으로 SSD 반도체를 배열하고, 각각의 열 사이는 지지부로 막혀있는 구조임에 따라 SSD 반도체 상에 형성된 단자가 해당 지지부와 지나치게 근접하게 됨으로써 BIST 테스트 장비를 연결시키기 어렵다는 문제점이 있다. However, since the conventional serially arranged printed circuit board includes a plurality of SSD semiconductors, more specifically, the SSD semiconductors are arranged in a plurality of columns and a plurality of rows, and the structure is blocked with a support part between each column. There is a problem in that it is difficult to connect the BIST test equipment because the terminal formed in the terminal is too close to the corresponding support part.
한편, FUNCTION 테스트는 BIST 테스트가 수행된 이후에 진행되며, BIST 테스트 결과 양품으로 판정된 SSD반도체에 대해 연배열 인쇄 회로 기판에서 일일이 분리하여 케이스에 조립한 후, 케이스를 통해 일부 노출된SSD 반도체 상에 형성된 단자에 FUNCTION 테스트 장비를 연결시켜 테스트를 진행하였다.On the other hand, the FUNCTION test is conducted after the BIST test is performed, and the SSD semiconductors determined to be good products as a result of the BIST test are individually separated from the flexible array printed circuit board and assembled into the case, and then partially exposed through the case. The test was conducted by connecting the FUNCTION test equipment to the terminal formed in.
이 경우, FUNCTION 테스트 결과 불량으로 판정된다면 FUNCTION 테스트를 진행하기 위해 연배열 인쇄 회로 기판에서 SSD 반도체를 일일이 분리하는 공정, 분리한 SSD 반도체를 케이스에 조립하는 공정 모두가 무의미해 지며, 더 나아가 FUNCTION 테스트를 진행하기 위해 FUNCTION 테스트 장비가 설치된 곳으로 케이스에 조립된 SSD 반도체를 이송하는 공정까지 모두 무의미해지는바, 시간 및 비용의 측면에서 심각한 손해를 유발한다는 문제점이 있다. 아울러, 케이스에 조립된 SSD 반도체를 이송하는 공정에서 의도치 않은 충돌 사고가 발생할 수도 있는바, 이 경우 케이스에 조립된 SSD 반도체는 FUNCTION 테스트를 진행하지도 못한 채, 불량으로 판정될 수밖에 없다. In this case, if the result of the FUNCTION test is determined to be defective, the process of individually separating the SSD semiconductor from the flexible printed circuit board and the process of assembling the separated SSD semiconductor into the case to proceed with the FUNCTION test becomes meaningless, and furthermore, the FUNCTION test. In order to proceed, even the process of transferring the SSD semiconductor assembled in the case to the place where the FUNCTION test equipment is installed becomes meaningless, there is a problem that it causes serious damage in terms of time and cost. In addition, an unintended collision may occur in the process of transferring the SSD semiconductor assembled in the case. In this case, the SSD semiconductor assembled in the case cannot but be determined as defective without even performing the function test.
이는 종래의 연배열 인쇄 회로 기판의 구조로 인해 BIST 테스트와 FUNCTION 테스트를 별도의 장소에서 진행할 수밖에 없기 때문인바, BIST 테스트와 FUNCTION 테스트를 한 장소에서 손쉽고 간편하게 진행할 수 있는 새로운 구조의 연배열 인쇄 회로 기판과 이의 테스트 이송 로봇이 요구된다. 본 발명은 이에 관한 것이다. This is because the BIST test and FUNCTION test can only be carried out in separate places due to the structure of the conventional series printed circuit board. This is a new structured series printed circuit board that allows the BIST test and FUNCTION test to be carried out easily and conveniently in one place. And its test transfer robot is required. The present invention relates to this.
본 발명이 해결하고자 하는 기술적 과제는 BIST 테스트와 FUNCTION 테스트를 한 장소에서 손쉽고 간편하게 진행할 수 있는 새로운 구조의 연배열 인쇄 회로 기판과 이의 테스트 이송 로봇을 제공하는 것이다. The technical problem to be solved by the present invention is to provide a new structure of a flexible printed circuit board and a test transfer robot for the same, which can easily and conveniently proceed with the BIST test and the FUNCTION test in one place.
본 발명의 기술적 과제들은 이상에서 언급한 기술적 과제들로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 통상의 기술자에게 명확하게 이해될 수 있을 것이다. The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.
상기 기술적 과제를 달성하기 위한 본 발명의 일 실시 예에 따른 연배열 인쇄 회로 기판은 일측에 형성된 제1 단자부를 포함하는 제1 SSD (Solid State Drive) 반도체, 상기 제1 SSD 반도체를 기준으로 제1 방향을 따라 제1 소정 간격 이격하여 나란하게 배치되되, 일측에 형성된 제N 단자부(N은 2 이상의 자연수)를 포함하는 제N SSD 반도체, 상기 제1 SSD 반도체와 제N SSD 반도체를 상호 지지하되, 상기 제1 소정 간격에 배치된 제1 지지부, 상기 제1 SSD 반도체 및 제N SSD 반도체와 제2 소정 간격 이격하여 배치되어 상호 지지하되, 상기 제1 SSD 반도체 및 제 N SSD 반도체를 둘러싸는 제2 지지부 및 상기 제1 SSD 반도체 및 제N SSD 반도체와 제2 지지부를 상호 지지하되, 상기 제2 소정 간격에 배치된 제3 지지부를 포함하며, 상기 제2 지지부는, 상기 제1 단자부 및 제N 단자부가 형성된 일측이 개방된 상태에서 상기 제1 SSD 반도체 및 제 N SSD 반도체를 둘러싼다. A flexible printed circuit board according to an embodiment of the present invention for achieving the above technical problem includes a first solid state drive (SSD) semiconductor including a first terminal portion formed on one side, and a first solid state drive (SSD) semiconductor, based on the first SSD semiconductor. An N-th SSD semiconductor including an N-th terminal portion (N is a natural number greater than or equal to 2) formed at one side and disposed in parallel at a first predetermined interval along the direction, and mutually support the first SSD semiconductor and the N-th SSD semiconductor, The first support portion disposed at the first predetermined interval, the first SSD semiconductor and the N-th SSD semiconductor, and a second predetermined spaced apart from each other to support each other, the second surrounding the first SSD semiconductor and the N-th SSD semiconductor A support part and a third support part mutually supporting the first SSD semiconductor and the N-th SSD semiconductor and a second support part, the third support part disposed at the second predetermined distance, and the second support part, the first terminal part and the N-th terminal part The first SSD semiconductor and the N-th SSD semiconductor are enclosed in a state in which one side of is formed is opened.
일 실시 예에 따르면, 상기 제1 단자부 및 제N 단자부는, 상기 제1 SSD 반도체 및 제N SSD 반도체에 대한 BIST 테스트 및 FUNCTION 테스트에 이용되는 BIST 테스트 장비 및 FUNCTION 테스트 장비와 연결되는 단자부일 수 있다. According to an embodiment, the first terminal portion and the N-th terminal portion may be a terminal portion connected to a BIST test equipment and a function test equipment used for a BIST test and a function test for the first SSD semiconductor and the N-th SSD semiconductor. .
일 실시 예에 따르면, 상기 제3 지지부는, 상기 제1 지지부가 배치된 방향과 반대 방향에 배치되어 상기 제1 SSD 반도체와 제2 지지부를 상호 지지하는 제3-1 지지부 및 상기 제1 지지부가 배치된 방향과 반대 방향에 배치되어 상기 제N SSD 반도체와 제2 지지부를 상호 지지하는 제3-2 지지부를 더 포함할 수 있다. According to an embodiment, the third support part, a 3-1 support part and the first support part disposed in a direction opposite to the direction in which the first support part is disposed to mutually support the first SSD semiconductor and the second support part It may further include a 3-2 th support part disposed in a direction opposite to the disposed direction to mutually support the Nth SSD semiconductor and the second support part.
일 실시 예에 따르면, 상기 제3 지지부는, 상기 일측과 반대 방향에 배치되어 상기 제1 SSD 반도체와 제2 지지부를 상호 지지하는 제3-3 지지부 및 상기 일측과 반대 방향에 배치되어 상기 제N SSD 반도체와 제2 지지부를 상호 지지하는 제3-4 지지부를 더 포함할 수 있다. According to an embodiment, the third support portion is disposed in a direction opposite to the one side to support the first SSD semiconductor and the second support portion to each other, and the N-th support portion is disposed in a direction opposite to the one side. It may further include a 3-4 support for mutually supporting the SSD semiconductor and the second support.
일 실시 예에 따르면, 상기 제2 지지부는, 상기 일측이 상기 제1 소정 간격 및 제2 소정 간격까지 포함하여 개방된 상태일 수 있다. According to an embodiment, the second support may be in a state in which the one side is open including the first predetermined interval and the second predetermined interval.
일 실시 예에 따르면, 상기 제2 지지부는, 상기 일측이 상기 제2 소정 간격을 포함하지 않고 개방된 상태이며, 상기 제2 소정 간격은 막혀 있는 상태일 수 있다. According to an embodiment, the second support portion may be in a state in which the one side is open without including the second predetermined interval, and the second predetermined interval is closed.
일 실시 예에 따르면, 상기 제2 지지부는, 상기 일측이 상기 제1 단자부 및 제N 단자부에 대응하는 길이만큼만 개방된 상태이며, 상기 제2 소정 간격, 상기 제1 단자부 및 제N 단자부에 대응하는 길이만큼을 제외한 일측은 막혀 있는 상태일 수 있다. According to an embodiment, the second support portion is in a state in which the one side is open only by a length corresponding to the first terminal portion and the N-th terminal portion, and corresponds to the second predetermined interval, the first terminal portion, and the N-th terminal portion. One side except for the length may be in a closed state.
상기 기술적 과제를 달성하기 위한 본 발명의 일 실시 예에 따른 일측에 단자부가 형성된 복수 개의 SSD 반도체를 포함하되, 상기 일측이 개방된 상태인 연배열 인쇄 회로 기판의 테스트 이송 로봇은 상기 연배열 인쇄 회로를 집어드는 집게부 및 상기 집게부의 구동을 제어하는 제어부를 포함하며, 상기 집게부는, 상기 연배열 인쇄 회로 기판의 제1 방향과 접촉하는 제1 집게부 및 상기 연배열 인쇄 회로 기판의 제1 방향과 상이한 방향인 제2 방향과 접촉하는 제2 집게부를 포함하고, 상기 제1 집게부는, 표면에 소정 깊이의 제1 홈이 복수 개 형성되며, 상기 홈에 센서가 배치된다. In order to achieve the above technical problem, a test transfer robot for a flexible printed circuit board in which a terminal portion is formed on one side according to an embodiment of the present invention is formed, and the one side is open And a control unit for controlling driving of the clamp unit and the clamp unit, wherein the clamp unit includes a first clamp unit in contact with a first direction of the series printed circuit board and a first direction of the series printed circuit board And a second tongs portion in contact with a second direction that is a direction different from the first tongs, wherein a plurality of first grooves having a predetermined depth are formed on a surface of the first tongs, and a sensor is disposed in the groove.
일 실시 예에 따르면, 상기 제1 집게부와 접촉하는 연배열 인쇄 회로 기판의 제1 방향 표면에는 소정 깊이의 제2 홈이 복수 개 형성되며, 상기 센서는, 적외선 센서이고, 상기 적외선 센서는, 상기 연배열 인쇄 회로 기판에 적외선을 조사하고, 상기 조사한 적외선이 돌아오는 시간을 산정하며, 산정된 제1 시간과 상기 제1 시간보다 긴 시간인 제2 시간이 동시에 산정되는 방향을 상기 제1 집게부가 접촉할 제1 방향으로 결정하여 상기 제어부에 전달할 수 있다. According to an embodiment, a plurality of second grooves having a predetermined depth are formed on the first direction surface of the flexible array printed circuit board in contact with the first tongs, the sensor is an infrared sensor, and the infrared sensor, Infrared radiation is irradiated on the serially arranged printed circuit board, the irradiated infrared rays are returned, and the calculated first time and a second time longer than the first time are calculated simultaneously with the first clamp. It may be determined as the first direction to which the additional contact will be made and transmitted to the control unit.
일 실시 예에 따르면, 상기 제1 시간은, 상기 조사한 적외선이 상기 연배열 인쇄 회로 기판의 제1 방향 표면과 충돌한 후 돌아오는 시간이며, 상기 제2 시간은, 상기 조사한 적외선이 상기 연배열 인쇄 회로 기판의 제1 방향 표면에 형성된 제2 홈의 표면과 충돌한 후 돌아오는 시간일 수 있다. According to an embodiment, the first time is a time to return after the irradiated infrared rays collide with the surface in the first direction of the serialized printed circuit board, and the second time is, the irradiated infrared rays are printed in the serial array. It may be a time to return after colliding with the surface of the second groove formed on the surface of the circuit board in the first direction.
일 실시 예에 따르면, 상기 제1 집게부는, 표면에 소정 높이의 제1 돌기가 복수 개 형성되며, 상기 제1 돌기는, 상기 제1 집게부와 연배열 인쇄 회로 기판의 제1 방향이 접촉 시, 상기 제2 홈과 결합할 수 있다. According to an embodiment, a plurality of first protrusions having a predetermined height are formed on a surface of the first clamp unit, and the first protrusion is formed when the first clamp unit and the first direction of the series printed circuit board contact each other. , It can be combined with the second groove.
일 실시 예에 따르면, 상기 적외선 센서는, 상기 제2 시간보다 긴 시간인 제3 시간이 산정되는 방향을 상기 개방된 상태인 일측으로 결정하며, 상기 일측에서 제3 시간이 산정된 횟수에 1을 감산한 결과를 상기 연배열 인쇄 회로가 포함하는 복수 개의 SSD 반도체의 개수로 결정하여 상기 제어부에 전달할 수 있다. According to an embodiment, the infrared sensor determines a direction in which a third time, which is a time longer than the second time, is calculated as the one side in the open state, and sets 1 to the number of times the third time is calculated by the one side. The result of the subtraction may be determined as the number of a plurality of SSD semiconductors included in the serialized printed circuit and transmitted to the control unit.
일 실시 예에 따르면, 상기 제어부가 실장되는 바디부 및 상기 바디부 하단에 복수 개 배치된 이동용 휠(Wheel)을 더 포함할 수 있다. According to an embodiment, a body portion on which the control unit is mounted and a plurality of moving wheels disposed below the body portion may further be included.
일 실시 예에 따르면, 상기 제1 집게부와 연결되는 아암(Arm)부 및 상기 제1 집게부와 아암부 사이에 배치된 회전부를 더 포함할 수 있다. According to an embodiment, an arm part connected to the first clamp part and a rotation part disposed between the first clamp part and the arm part may be further included.
일 실시 예에 따르면, 상기 제2 집게부는, 상기 연배열 인쇄 회로 기판의 제2 방향의 상단과 접촉하는 제2-1 집게부, 상기 연배열 인쇄 회로 기판의 제2 방향의 하단과 접촉하는 제2-2 집게부 및 상기 제2-1 집게부와 상기 제1 집게부 사이, 상기 제2-2 집게부와 상기 제2 집게부 사이에 배치되는 신장부를 더 포함하며, 상기 제어부는, 상기 제2-1 집게부가 상기 연배열 인쇄 회로 기판의 제2 방향의 상단과 접촉할 때까지, 상기 제2-2 집게부가 상기 연배열 인쇄 회로 기판의 제2 방향의 하단과 접촉할 때까지 상기 신장부를 제어할 수 있다. According to an embodiment, the second tongs may include a 2-1 tong portion in contact with an upper end of the flexible array printed circuit board in a second direction, and a second tongs contact with a lower end of the flexible array printed circuit board in a second direction. 2-2 tongs and between the 2-1 tongs and the first tongs, further comprising an extension portion disposed between the 2 to 2 tongs and the second tongs, wherein the control unit comprises: 2-1 until the tongs contact the upper end in the second direction of the flexible arrangement printed circuit board, the extension part until the 2-2 tongs contact the lower end in the second direction of the flexible arrangement printed circuit board Can be controlled.
상기와 같은 본 발명에 따르면, 연배열 인쇄 회로 기판의 일측 자체가 개방됨으로써 일측에 형성된 제1 단자부 및 제N 단자부는 외부로 노출될 수 있는바, 종래의 연배열 인쇄 회로 기판과 같이 각각의 열 사이가 지지부로 막혀있는 구조가 아니기 때문에 제1 단자부 및 제N 단자부와 BIST 테스트 장비를 연결시키기 용이하다는 장점이 있다는 효과가 있다.According to the present invention as described above, the first terminal portion and the N-th terminal portion formed on one side of the flexible array printed circuit board may be exposed to the outside by opening one side of the printed circuit board. Since the structure is not blocked with a support part, there is an advantage in that it is easy to connect the first terminal part and the N-th terminal part with the BIST test equipment.
또한, 제2 지지부를 통해 제1 단자부 및 제N 단자부 그리고 제1 SSD 반도체 및 제N SSD 반도체에 대한 보호막 역할까지 수행할 수 있으므로 의도치 않은 파손을 방지할 수 있다는 효과가 있다. In addition, since the second support portion can serve as a protective layer for the first terminal portion, the N-th terminal portion, and the first SSD semiconductor and the N-th SSD semiconductor, it is possible to prevent accidental damage.
또한, 아암부를 통해 아암부가 구동할 수 있는 반경 내에 BIST 테스트 장치와 FUNCTION 테스트 장치를 설치한 경우, SSD 반도체 또는 SSD 반도체를 포함하는 연배열 인쇄 회로 기판을 번거롭게 이송하지 않아도 되며, 이송하는 공정에서 발생할 수 있는 의도치 않은 충돌 사고를 방지할 수 있고, BIST 테스트와 FUNCTION 테스트를 한 장소에서 손쉽고 간편하게 진행할 수 있다는 효과가 있다.In addition, if the BIST test device and the FUNCTION test device are installed within a radius that the arm part can drive through the arm part, it is not necessary to transfer the SSD semiconductor or the soft-array printed circuit board including the SSD semiconductor in a hassle. It is possible to prevent accidental collisions that can be caused by accidents, and there is an effect that the BIST test and the FUNCTION test can be performed easily and conveniently in one place.
본 발명의 효과들은 이상에서 언급한 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 아래의 기재로부터 통상의 기술자에게 명확하게 이해될 수 있을 것이다.The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.
도 1은 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판의 상면도를 도시한 도면이다. 1 is a view showing a top view of a flexible array printed circuit board according to a first embodiment of the present invention.
도 2는 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판의 제2 지지부의 제1 실시 예를 도시한 도면이다. 2 is a diagram illustrating a first embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
도 3은 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판의 제2 지지부의 제2 실시 예를 도시한 도면이다. 3 is a diagram illustrating a second embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
도 4는 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판의 제2 지지부의 제3 실시 예를 도시한 도면이다. 4 is a view showing a third embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
도 5는 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판의 제2 지지부의 제4 실시 예를 도시한 도면이다. 5 is a diagram illustrating a fourth embodiment of a second support part of a flexible printed circuit board according to a first embodiment of the present invention.
도 6은 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판의 테스트 이송 로봇의 구성을 도시한 도면이다. 6 is a diagram showing the configuration of a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention.
도 7은 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판의 테스트 이송 로봇이 포함하는 집게부를 확대하여 도시한 도면이다. FIG. 7 is an enlarged view illustrating a clamp included in a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention.
도 8 및 도 10은 적외선 센서를 센서로 사용하는 경우, 연배열 인쇄 회로 기판에 적외선을 조사하고, 조사한 적외선이 돌아오는 시간을 표시한 도면이다. 8 and 10 are diagrams showing a time when infrared rays are irradiated on a serially arranged printed circuit board and the irradiated infrared rays return when an infrared sensor is used as a sensor.
도 9는 연배열 인쇄 회로 기판의 돌기와 집게부에 형성된 제2 홈이 결합하는 모습을 도시한 도면이다. 9 is a view showing a state in which the protrusion of the flexible printed circuit board and the second groove formed in the clamp portion are coupled.
도 11은 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판의 테스트 이송 로봇이 BIST 테스트와 FUNCTION 테스트를 수행하는 모습을 도시한 도면이다. 11 is a diagram illustrating a state in which a test transfer robot for a flexible printed circuit board according to a second embodiment of the present invention performs a BIST test and a function test.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시 예를 상세히 설명한다. 본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시 예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 게시되는 실시 예에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시 예들은 본 발명의 게시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 결정될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments to be posted below, but may be implemented in various different forms, and only these embodiments make the posting of the present invention complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to the possessor, and the invention is only determined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.
다른 결정이 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. Unless otherwise determined, all terms (including technical and scientific terms) used in the present specification may be used with meanings that can be commonly understood by those of ordinary skill in the art to which the present invention belongs.
또한, 일반적으로 사용되는 사전에 결정되어 있는 용어들은 명백하게 특별히 결정되어 있지 않는 한 이상적으로 또는 과도하게 해석되지 않는다. 본 명세서에서 사용된 용어는 실시 예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다.In addition, generally used terms determined in advance are not interpreted ideally or excessively unless clearly specifically determined. The terms used in the present specification are for describing exemplary embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase.
명세서에서 사용되는 "포함한다 (comprises)" 및/또는 "포함하는 (comprising)"은 언급된 구성 요소, 단계, 동작 및/또는 소자는 하나 이상의 다른 구성 요소, 단계, 동작 및/또는 소자의 존재 또는 추가를 배제하지 않는다.As used in the specification, "comprises" and/or "comprising" refers to the presence of one or more other components, steps, actions and/or elements, and/or elements, steps, actions and/or elements mentioned. Or does not exclude additions.
이하, 본 발명에 대하여 첨부된 도면에 따라 보다 상세히 설명한다.Hereinafter, the present invention will be described in more detail according to the accompanying drawings.
도 1은 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)의 상면도를 도시한 도면이다. 1 is a diagram showing a top view of a flexible printed circuit board 100 according to a first embodiment of the present invention.
본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)은 제1 SSD 반도체(10), 제N SSD 반도체(20), 제1 지지부(30), 제2 지지부(40) 및 제3 지지부(50)를 포함할 수 있으며, 기타 본 발명의 목적을 달성함에 있어서 필요한 부가적인 구성들을 더 포함할 수 있음은 물론이다. The flexible printed circuit board 100 according to the first embodiment of the present invention includes a first SSD semiconductor 10, an N-th SSD semiconductor 20, a first support 30, a second support 40, and a third It goes without saying that it may include a support 50, and may further include additional components necessary to achieve the object of the present invention.
제1 SSD 반도체(10)는 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)에 배치되는 SSD 반도체 중 어느 하나이며, 규격이나 크기에 제한이 없는 통상적인 SSD 반도체이다. The first SSD semiconductor 10 is any one of SSD semiconductors disposed on the flexible array printed circuit board 100 according to the first embodiment of the present invention, and is a typical SSD semiconductor without any limitation in standard or size.
한편, 제1 SSD 반도체(10)는 일측에 제1 단자부(11)가 형성되어 있는바, 제1 단자부(11)는 제1 SSD 반도체(10)에 대한 BIST 테스트 및 FUNCTION 테스트에 이용되는 BIST 테스트 장비 및 FUNCTION 테스트 장비와 연결되는 단자부이며, 도 1에는 일측이 상면도를 기준으로 제1 SSD 반도체(10)의 좌측으로 도시되어 있으나, 이는 하나의 실시 예에 해당하며, 필요에 따라 좌측이 아닌 우측, 상측, 하측 중 어느 하나가 일측이 될 수 있음은 물론이다. 그러나 이하의 설명에서는 설명의 편의상 일측이 좌측임을 전제로 설명을 이어가도록 한다. Meanwhile, the first SSD semiconductor 10 has a first terminal portion 11 formed on one side thereof, and the first terminal portion 11 is a BIST test used for a BIST test and a function test for the first SSD semiconductor 10 It is a terminal part connected to the equipment and the function test equipment, and in FIG. 1, one side is shown as the left side of the first SSD semiconductor 10 based on the top view, but this corresponds to one embodiment, and if necessary, not the left side. It goes without saying that any one of the right side, upper side, and lower side may be one side. However, in the following description, for convenience of description, it is assumed that one side is left.
제N SSD 반도체(20)는 제1 SSD 반도체(10)를 기준으로 제1 방향을 따라 제1 소정 간격(d1) 이격하여 나란하게 배치되며, 제1 SSD 반도체(10)와 마찬가지로 일측에 제N 단자부(21, N은 2 이상의 자연수)가 형성된다. The N-th SSD semiconductors 20 are arranged side by side with a first predetermined distance d1 apart from the first SSD semiconductor 10 in a first direction, and like the first SSD semiconductor 10, the N-th SSD semiconductors 10 Terminal portions 21 and N are a natural number of 2 or more).
여기서 제1 방향은 가로 방향 또는 세로 방향 중 어느 한 방향일 수 있으며, 도 1에는 제1 방향이 세로 방향으로 도시되어 있으나, 이 역시 하나의 실시 예에 해당하며, 필요에 따라 세로 방향이 아닌 가로 방향이 제1 방향이 될 수 있음은 물론이다. 그러나 이하의 설명에서는 설명의 편의상 제1 방향이 세로 방향임을 전제로 설명을 이어가도록 한다. Here, the first direction may be either a horizontal direction or a vertical direction, and although the first direction is illustrated in a vertical direction in FIG. 1, this also corresponds to one embodiment, and if necessary, the horizontal direction is not a vertical direction. It goes without saying that the direction can be the first direction. However, in the following description, for convenience of description, the description will be continued on the premise that the first direction is the vertical direction.
제1 소정 간격(d1)은 제1 SSD 반도체(10)와 제N SSD 반도체(20) 사이의 간격인바, 제1 소정 간격(d1)은 추후 연배열 인쇄 회로 기판(100)에서 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 용이하게 분리하기 위해 필요한 간격으로 볼 수 있으며, 설계에 따라 자유롭게 설정 가능하다 할 것이나, 용이한 분리를 위한 최소한의 간격만을 제1 소정 간격(d1)으로 설정하여 연배열 인쇄 회로 기판(100) 내의 공간 활용성을 증대시키는 것이 바람직하다 할 것이며, 예를 들어, 제1 소정 간격(d1)은 제1 SSD 반도체(10)와 제N SSD 반도체(20)의 제1 방향의 길이인 세로 길이의 약 1/10 내지 1/3으로 설정하는 것이 바람직하다 할 것이다. The first predetermined interval d1 is the interval between the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and the first predetermined interval d1 is the first SSD semiconductor in the serially arranged printed circuit board 100 later. It can be seen as an interval necessary to easily separate the 10 and the N-th SSD semiconductor 20, and can be freely set according to the design, but only the minimum interval for easy separation is the first predetermined interval d1 It would be desirable to increase the space utilization in the serially arranged printed circuit board 100 by setting it to, for example, the first predetermined interval d1 is the first SSD semiconductor 10 and the Nth SSD semiconductor 20 It would be desirable to set it to about 1/10 to 1/3 of the length in the first direction of ).
한편, 제N SSD 반도체(20)는 N이 2 이상의 자연수이기 때문에 제2 SSD 반도체, 제3 SSD 반도체, 제4 SSD 반도체 등이 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)에 더 포함될 수 있으나, 설명의 편의상 도 1에 도시된 바와 같이 N을 2로 설정하여 SSD 반도체를 2개 포함하는 것을 전제로 설명하도록 하며, 일측에 형성된 제N 단자부(21)는 제1 단자부(11)와 동일하므로 중복 서술을 방지하기 위해 자세한 설명은 생략하도록 한다. On the other hand, since N is a natural number of 2 or more in the Nth SSD semiconductor 20, the second SSD semiconductor, the third SSD semiconductor, the fourth SSD semiconductor, etc. are used in the flexible printed circuit board 100 according to the first embodiment of the present invention. However, for convenience of explanation, as illustrated in FIG. 1, N is set to 2 to describe the assumption that two SSD semiconductors are included, and the N-th terminal portion 21 formed on one side is a first terminal portion ( Since it is the same as 11), detailed descriptions will be omitted to prevent duplicate descriptions.
제1 지지부(30)는 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 상호 지지하며, 제1 소정 간격(d1)에 배치된다. The first support part 30 mutually supports the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and is disposed at a first predetermined distance d1.
이러한 제1 지지부(30)는 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 상호 지지하는 브릿지(Bridge) 역할을 수행하며, 브릿지 역할을 수행하기에 제1 SSD 반도체(10)와 제N SSD 반도체(20) 사이의 간격인 제1 소정 간격(d1)에 배치되는 것이며, 추후 연배열 인쇄 회로 기판(100)에서 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 분리하는 경우, 제1 지지부(30)는 브릿지 역할을 수행할 대상이 없어지므로 연배열 인쇄 회로 기판(100)에서 자연스럽게 제거될 것이다.The first support part 30 serves as a bridge for mutually supporting the first SSD semiconductor 10 and the N-th SSD semiconductor 20, and thus, the first SSD semiconductor 10 and the first SSD semiconductor 10 It is disposed at a first predetermined distance d1, which is a distance between the Nth SSD semiconductors 20, and later separates the first SSD semiconductor 10 and the Nth SSD semiconductor 20 from the serially arranged printed circuit board 100 In this case, the first support part 30 will be naturally removed from the flexible printed circuit board 100 because there is no object to perform the bridge role.
제2 지지부(40)는 제1 SSD 반도체(10) 및 제N SSD 반도체(20)와 제2 소정 간격(d2) 이격하여 배치되어 상호 지지하되, 제1 SSD 반도체(10) 및 제 N SSD 반도체(20)를 둘러싼다. The second support part 40 is disposed to be spaced apart from the first SSD semiconductor 10 and the N-th SSD semiconductor 20 and a second predetermined distance d2 to support each other, but the first SSD semiconductor 10 and the N-th SSD semiconductor Surrounding (20).
여기서 제2 소정 간격(d2)은 도 1을 참조하면 4개가 존재함을 확인할 수 있는바, 제1 SSD 반도체(10) 및 제N SSD 반도체(20)를 상호 지지하는 제1 지지부(30)가 배치된 영역을 제외한 나머지 영역을 제2 소정 간격(d2)으로 볼 수 있다. Here, it can be seen that there are four second predetermined intervals d2 with reference to FIG. 1. As a result, the first support part 30 mutually supporting the first SSD semiconductor 10 and the N-th SSD semiconductor 20 The remaining areas other than the arranged areas may be viewed at a second predetermined interval d2.
한편, 제2 지지부(40)는 제1 단자부(11) 및 제N 단자부(21)가 형성된 일측이 개방된 상태에서 제1 SSD 반도체(10) 및 제 N SSD 반도체(20)를 둘러싸는바, 그에 따라 제2 소정 간격(d2)은 제1 SSD 반도체(10) 및 제 N SSD 반도체(20)의 일측에는 배치되지 않으나, 이에 대한 자세한 설명은 후술하도록 한다. Meanwhile, the second support part 40 surrounds the first SSD semiconductor 10 and the N-th SSD semiconductor 20 in a state in which one side of the first terminal part 11 and the N-th terminal part 21 is opened, Accordingly, the second predetermined interval d2 is not disposed on one side of the first SSD semiconductor 10 and the N-th SSD semiconductor 20, but a detailed description thereof will be described later.
이러한 제 2 소정 간격(d2) 역시 앞서 설명한 제1 소정 간격(d1)과 마찬가지로 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 용이하게 분리하기 위해 필요한 간격으로도 볼 수 있으며, 설계에 따라 자유롭게 설정 가능하다 할 것인바, 제2 소정 간격(d2)을 제1 소정 간격(d1)과 동일하게 설정하거나 상이하게 설정할 수도 있을 것이다. This second predetermined interval d2 can also be viewed as an interval necessary to easily separate the first SSD semiconductor 10 and the N-th SSD semiconductor 20, similar to the first predetermined interval d1 described above, and the design The second predetermined interval d2 may be set equal to or different from the first predetermined interval d1.
한편, 제2 지지부(40)는 도 1을 참조하면, 뒤집힌 "ㄷ" 형상으로 도시되어 있으나, 이는 하나의 실시 예에 해당하며, 필요에 따라 다른 형상으로 형성될 수 있음은 물론이다. 단 어느 경우에나 제1 SSD 반도체(10) 및 제 N SSD 반도체(20)를 둘러싸는 형상을 기본으로 채택하여 외부 충격으로부터 제1 SSD 반도체(10) 및 제 N SSD 반도체(20)를 보호할 수 있도록 함이 바람직하다 할 것이다. Meanwhile, referring to FIG. 1, the second support part 40 is shown in an inverted “c” shape, but this corresponds to one embodiment and may be formed in a different shape as necessary. However, in any case, the first SSD semiconductor 10 and the N-th SSD semiconductor 20 can be protected from external shocks by adopting a shape surrounding the first SSD semiconductor 10 and the N-th SSD semiconductor 20 as a basis. It would be desirable to do so.
제3 지지부(50)는 제1 SSD 반도체(10) 및 제N SSD 반도체(20)와 제2 지지부(40)를 상호 지지하되, 제2 소정 간격(d2)에 배치된다.The third support part 50 mutually supports the first SSD semiconductor 10, the N-th SSD semiconductor 20, and the second support part 40, but is disposed at a second predetermined distance d2.
이러한 제3 지지부(50)는 제1 SSD 반도체(10) 및 제N SSD 반도체(20)와 제2 지지부(40)를 상호 지지하는 브릿지 역할을 수행하며, 브릿지 역할을 수행하기에 제1 SSD 반도체(10) 및 제N SSD 반도체(20)와 제2 지지부(40) 사이의 간격인 제2 소정 간격(d2)에 배치되는 것이며, 추후 연배열 인쇄 회로 기판(100)에서 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 분리하는 경우, 제3 지지부(50) 역시 제1 지지부(30)와 마찬가지로 브릿지 역할을 수행할 대상이 없어져 연배열 인쇄 회로 기판(100)에서 자연스럽게 제거될 것이다.The third support part 50 serves as a bridge for mutually supporting the first SSD semiconductor 10 and the N-th SSD semiconductor 20 and the second support part 40, and thus, the first SSD semiconductor The first SSD semiconductor 10 is disposed at a second predetermined distance d2, which is a distance between the 10 and N-th SSD semiconductor 20 and the second support part 40, and later in the serially arranged printed circuit board 100. ) And the N-th SSD semiconductor 20, the third support part 50, like the first support part 30, does not have an object to serve as a bridge, and thus will be naturally removed from the flexible printed circuit board 100. .
한편, 제3 지지부(50)는 제1 지지부(30)가 배치된 방향과 반대 방향에 배치되어 제1 SSD 반도체(10)와 제2 지지부(40)를 상호 지지하는 제3-1 지지부(50-1), 제1 지지부(30)가 배치된 방향과 반대 방향에 배치되어 제N SSD 반도체(20)와 제2 지지부(40)를 상호 지지하는 제3-2 지지부(50-2), 일측과 반대 방향에 배치되어 제1 SSD 반도체(10)와 제2 지지부(40)를 상호 지지하는 제3-3 지지부(50-3) 및 일측과 반대 방향에 배치되어 제N SSD 반도체(20)와 제2 지지부(40)를 상호 지지하는 제3-4 지지부(50-4)를 더 포함할 수 있다. 이를 통해 제1 SSD 반도체(10)에는 제1 지지부(30), 제3-1 지지부(50-1) 및 제3-3 지지부(50-3)가, 제N SSD 반도체(20)에는 제1 지지부(30), 제3-2 지지부(50-2) 및 제3-4 지지부(50-4)가 배치되므로, 제1 SSD 반도체(10), 제N SSD 반도체(20) 및 제2 지지부(40) 사이의 지지력이 강화될 수 있으며, 그에 따라 제1 SSD 반도체(10)와 제N SSD 반도체(20)가 연배열 인쇄 회로 기판(100)에서 의도치 않은 충격에 의해 분리되는 것을 방지할 수 있다. On the other hand, the third support 50 is disposed in a direction opposite to the direction in which the first support 30 is disposed to support the first SSD semiconductor 10 and the second support 40 to each other. -1), a 3-2 support part 50-2 disposed in a direction opposite to the direction in which the first support part 30 is disposed to mutually support the N-th SSD semiconductor 20 and the second support part 40, one side The third-third support part 50-3 which is disposed in the opposite direction and mutually supports the first SSD semiconductor 10 and the second support part 40, and the N-th SSD semiconductor 20 and the N-th SSD semiconductor 20 It may further include a 3-4 support (50-4) mutually supporting the second support (40). Through this, the first support part 30, the 3-1 support part 50-1, and the 3-3 support part 50-3 are provided on the first SSD semiconductor 10, and the first SSD semiconductor 20 Since the support 30, the 3-2 support 50-2 and the 3-4 support 50-4 are disposed, the first SSD semiconductor 10, the Nth SSD semiconductor 20, and the second support ( 40) It is possible to strengthen the supporting force between, thereby preventing the first SSD semiconductor 10 and the Nth SSD semiconductor 20 from being separated from the lead-array printed circuit board 100 by an unintended impact. have.
지금까지 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)의 구성에 대하여 설명하였다. 이하, 도 2 내지 도 5를 참조하여 앞서 설명을 보류한 제2 지지부(40)에 대해 자세히 설명하도록 한다. So far, the configuration of the flexible printed circuit board 100 according to the first embodiment of the present invention has been described. Hereinafter, with reference to FIGS. 2 to 5 will be described in detail with respect to the second support portion 40 that has been previously described.
도 2는 도 1에 도시된 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)의 제2 지지부(40)를 확대하여 도시한 상면도이며, 이를 제2 지지부(40)의 제1 실시 예로 규정하도록 한다. FIG. 2 is an enlarged top view of the second support part 40 of the serially arranged printed circuit board 100 according to the first embodiment of the present invention shown in FIG. 1. 1 It should be defined as an example.
도 2를 참조하면, 제2 지지부(40)가 제1 단자부(11) 및 제N 단자부(21)가 형성된 일측이 개방된 상태임을 확인할 수 있는바, 보다 구체적으로 제2 지지부(40)는 제1 소정 간격(d1) 및 제2 소정 간격(d2)까지 포함하여 개방된 상태이며, 이는 제2 지지부(40)가 제1 단자부(11) 및 제N 단자부(21)가 형성된 일측을 제외한 상태에서 제1 SSD 반도체(10)와 제N SSD 반도체(20)를 둘러싸는 것으로 볼 수 있다. Referring to FIG. 2, it can be seen that one side of the second support part 40 and the first terminal part 11 and the N-th terminal part 21 is open. More specifically, the second support part 40 is It is in the open state including the 1 predetermined distance (d1) and the second predetermined distance (d2), which is in a state in which the second support portion 40 excludes one side of the first terminal portion 11 and the N-th terminal portion 21 It can be viewed as surrounding the first SSD semiconductor 10 and the Nth SSD semiconductor 20.
이 경우 연배열 인쇄 회로 기판(100)의 일측 자체가 개방됨으로써 일측에 형성된 제1 단자부(11) 및 제N 단자부(21)는 외부로 노출될 수 있는바, 종래의 연배열 인쇄 회로 기판과 같이 각각의 열 사이가 지지부로 막혀있는 구조가 아니기 때문에 제1 단자부(11) 및 제N 단자부(21)와 BIST 테스트 장비를 연결시키기 용이하다는 장점이 있다. In this case, the first terminal portion 11 and the N-th terminal portion 21 formed on one side of the flexible array printed circuit board 100 may be exposed to the outside by opening one side of the printed circuit board 100 itself. There is an advantage in that it is easy to connect the first terminal portion 11 and the N-th terminal portion 21 with the BIST test equipment because the structure between each row is not blocked by the support portion.
더 나아가, 제2 지지부(40)를 제1 단자부(11) 및 제N 단자부(21)가 형성된 일측을 제외한 상태에서 제2 지지부(40)의 제2 실시 예를 도시한 상면도인 도 3과 같이 제1 단자부(11) 및 제N 단자부(21)가 형성된 위치보다 길게 구현함으로써, 제1 단자부(11) 및 제N 단자부(21)가 외부로 노출된 상태에서 연배열 인쇄 회로 기판(100)끼리 또는 다른 물체와 충돌이 발생하는 경우 제1 단자부(11) 및 제N 단자부(21)에 대한 보호막 역할을 수행할 수도 있다. 제2 지지부(40)가 제1 단자부(11) 및 제N 단자부(21) 보다 튀어나와 있기 때문이다. Further, the second support part 40 is shown in FIG. 3 which is a top view showing the second embodiment of the second support part 40 except for one side of the first terminal part 11 and the N-th terminal part 21. Likewise, by implementing longer than the position where the first terminal portion 11 and the N-th terminal portion 21 are formed, the series-array printed circuit board 100 in a state in which the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside. When a collision occurs with each other or with another object, the first terminal portion 11 and the N-th terminal portion 21 may serve as a protective layer. This is because the second support portion 40 protrudes from the first terminal portion 11 and the N-th terminal portion 21.
도 4는 제2 지지부(40)의 제3 실시 예를 도시한 상면도이다. 4 is a top view showing a third embodiment of the second support 40.
도 4를 참조하면, 제2 지지부(40)는 일측이 제2 소정 간격(d2)을 포함하지 않고 개방된 상태이며, 제2 소정 간격(d2)은 막혀 있는 상태임을 확인할 수 있는바, 이는 제1 단자부(11) 및 제N 단자부(21)와 이들 사이의 제1 소정 간격(d1)만 외부로 노출된 것으로 볼 수 있다. Referring to FIG. 4, it can be seen that one side of the second support part 40 is open without including the second predetermined distance d2, and that the second predetermined distance d2 is closed. It can be seen that only the first terminal portion 11 and the N-th terminal portion 21 and a first predetermined distance d1 therebetween are exposed to the outside.
이 경우, 제2 지지부(40)의 제2 실시 예에서 설명한 것과 마찬가지로 제1 단자부(11) 및 제N 단자부(21)가 외부로 노출된 상태에서 연배열 인쇄 회로 기판(100)끼리 또는 다른 물체와 충돌이 발생하는 경우 제1 단자부(11) 및 제N 단자부(21)에 대한 보호막 역할을 수행할 수 있다. 단, 제2 지지부(40)의 제2 실시 예와 다르게 제1 단자부(11) 및 제N 단자부(21)가 BIST 테스트 장비와 연결되는 경우 제2 소정 간격(d2)을 막고 있는 제2 지지부(40)에 의해 연결이 어려울 수 있으므로 이 경우 제2 소정 간격(d2)을 막고 있는 제2 지지부(40)를 절단하거나 소정의 파쇄 점선을 가공하여 절단이 용이할 수 있도록 구현할 수 있을 것이다. In this case, as described in the second embodiment of the second support part 40, the first terminal part 11 and the N-th terminal part 21 are exposed to the outside, and the series of printed circuit boards 100 are connected to each other or other objects. When a collision occurs, the first terminal portion 11 and the N-th terminal portion 21 may serve as a protective layer. However, unlike in the second embodiment of the second support part 40, when the first terminal part 11 and the N-th terminal part 21 are connected to the BIST test equipment, the second support part that blocks the second predetermined distance d2 ( Since it may be difficult to connect by 40), in this case, it may be implemented to facilitate cutting by cutting the second support portion 40 blocking the second predetermined distance d2 or processing a predetermined broken line.
도 5는 제2 지지부(40)의 제4 실시 예를 도시한 상면도이다. 5 is a top view showing a fourth embodiment of the second support part 40.
도 5를 참조하면, 제2 지지부(40)는 일측이 제1 단자부(11) 및 제N 단자부(21)에 대응하는 길이만큼만 개방된 상태이며, 제2 소정 간격(d2), 제1 단자부(11) 및 제N 단자부(21)에 대응하는 길이를 제외한 일측은 막혀 있는 상태임을 확인할 수 있는바, 이는 제1 단자부(11) 및 제N 단자부(21)만 외부로 노출된 것으로 볼 수 있다. Referring to FIG. 5, the second support part 40 is in a state in which one side of the second support part 40 is open only by a length corresponding to the first terminal part 11 and the N-th terminal part 21, and a second predetermined distance d2, the first terminal part ( 11) and one side except for the lengths corresponding to the N-th terminal portion 21 can be seen as being in a closed state, which can be seen that only the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside.
이 경우, 제2 지지부(40)의 제2 실시 예 및 제3 실시 예에서 설명한 것과 마찬가지로 제1 단자부(11) 및 제N 단자부(21)가 외부로 노출된 상태에서 연배열 인쇄 회로 기판(100)끼리 또는 다른 물체와 충돌이 발생하는 경우 제1 단자부(11) 및 제N 단자부(21)에 대한 보호막 역할을 수행할 수 있으며, 더 나아가 제1 단자부(11) 및 제N 단자부(21)만 외부로 노출되기에 제1 SSD 반도체(10) 및 제N SSD 반도체(20)에 대한 보호막 역할까지 수행할 수 있다. 단, 제2 지지부(40)의 제3 실시 예와 마찬가지로 제1 단자부(11) 및 제N 단자부(21)가 BIST 테스트 장비와 연결되는 경우 제2 소정 간격(d2)과 제1 SSD 반도체(10) 및 제N SSD 반도체(20)의 일부를 막고 있는 제2 지지부(40)에 의해 연결이 어려울 수 있으므로 이 경우 제2 소정 간격(d2) 과 제1 SSD 반도체(10) 및 제N SSD 반도체(20)의 일부를 막고 있는 제2 지지부(40)를 절단하거나 소정의 파쇄 점선을 가공하여 절단이 용이할 수 있도록 구현할 수 있을 것이다. In this case, as described in the second and third embodiments of the second support portion 40, the first terminal portion 11 and the N-th terminal portion 21 are exposed to the outside, and the printed circuit board 100 ) When a collision occurs with each other or with another object, it can serve as a protective film for the first terminal portion 11 and the N-th terminal portion 21, and furthermore, only the first terminal portion 11 and the N-th terminal portion 21 Since it is exposed to the outside, it may even serve as a protective layer for the first SSD semiconductor 10 and the Nth SSD semiconductor 20. However, as in the third embodiment of the second support portion 40, when the first terminal portion 11 and the N-th terminal portion 21 are connected to the BIST test equipment, the second predetermined distance d2 and the first SSD semiconductor 10 ) And the second support part 40 blocking a part of the N-th SSD semiconductor 20, in this case, the second predetermined distance d2 and the first SSD semiconductor 10 and the N-th SSD semiconductor ( It may be implemented to facilitate cutting by cutting the second support part 40 blocking part of 20) or processing a predetermined broken line.
지금까지 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)이 포함하는 제2 지지부(40)의 제1 실시 예 내지 제4 실시 예에 대하여 설명하였다. 본 발명에 따르면 연배열 인쇄 회로 기판(100)의 일측 자체가 개방됨으로써 일측에 형성된 제1 단자부(11) 및 제N 단자부(21)는 외부로 노출될 수 있는바, 종래의 연배열 인쇄 회로 기판과 같이 각각의 열 사이가 지지부로 막혀있는 구조가 아니기 때문에 제1 단자부(11) 및 제N 단자부(21)와 BIST 테스트 장비를 연결시키기 용이하다는 장점이 있으며, 더 나아가 제2 지지부(40)를 통해 경우 제1 단자부(11) 및 제N 단자부(21) 그리고 제1 SSD 반도체(10) 및 제N SSD 반도체(20)에 대한 보호막 역할까지 수행할 수 있으므로 의도치 않은 파손을 방지할 수 있다. So far, the first to fourth embodiments of the second support 40 included in the flexible printed circuit board 100 according to the first embodiment of the present invention have been described. According to the present invention, the first terminal portion 11 and the N-th terminal portion 21 formed on one side of the flexible array printed circuit board 100 may be exposed to the outside by opening one side of the printed circuit board 100 itself. Since it is not a structure in which each row is blocked by a support part, it has the advantage that it is easy to connect the first terminal part 11 and the N-th terminal part 21 and the BIST test equipment, and furthermore, the second support part 40 In this case, since the first terminal portion 11 and the N-th terminal portion 21 and the first SSD semiconductor 10 and the N-th SSD semiconductor 20 can also serve as a protective layer to prevent accidental damage.
이하, 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로(100)의 테스트 이송 로봇(200)에 대하여 설명하도록 한다. Hereinafter, a test transfer robot 200 of the serialized printed circuit 100 according to a second embodiment of the present invention will be described.
도 6은 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)의 구성을 도시한 도면이다. 6 is a diagram showing a configuration of a test transfer robot 200 of a flexible printed circuit board 100 according to a second embodiment of the present invention.
본 발명의 제2 실시 예에 따른 연배열 인쇄 회로(100) 기판의 테스트 이송 로봇(200)은 집게부(60), 제어부(70) 및 센서(80)를 포함하며, 기타 본 발명의 목적을 달성함에 있어서 필요한 부가적인 구성들을 더 포함할 수 있음은 물론이다. The test transfer robot 200 of the board of the serialized printed circuit 100 according to the second embodiment of the present invention includes a clamp 60, a control unit 70 and a sensor 80, and other objects of the present invention. It goes without saying that it may further include additional components necessary to achieve.
한편, 이하의 설명에서 언급할 연배열 인쇄 회로 기판(100)은 앞서 설명한 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100), 보다 구체적으로 일측에 단자부가 형성된 복수 개의 SSD 반도체를 포함하되, 일측이 개방된 상태인 연배열 인쇄 회로 기판(100)임을 전제로 한다. On the other hand, the flexible arrangement printed circuit board 100 to be mentioned in the following description includes the flexible arrangement printed circuit board 100 according to the first embodiment of the present invention described above, more specifically, a plurality of SSD semiconductors having terminal portions formed on one side thereof. Including, but assumes that one side is the flexible array printed circuit board 100 in an open state.
집게부(60)는 연배열 인쇄 회로 기판(100)을 집어들며, 제어부(70)는 이러한 집게부(60)의 구동을 제어한다. 아울러, 제어부(70)는 바디부(90)에 실장될 수 있으며, 바디부(90)의 하단에는 복수 개의 휠(Wheel, 95)이 배치되어 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로(100) 기판의 테스트 이송 로봇(200)의 이동에 이바지할 수 있으며, 아암(Arm)부(97)와 회전부(98)에 대해서는 후술하도록 한다. The clamp unit 60 picks up the flexible printed circuit board 100, and the control unit 70 controls the driving of the clamp unit 60. In addition, the control unit 70 may be mounted on the body unit 90, and a plurality of wheels 95 are disposed at the lower end of the body unit 90 to provide a series-array printed circuit according to the second embodiment of the present invention. (100) It can contribute to the movement of the test transfer robot 200 of the substrate, and the arm portion 97 and the rotating portion 98 will be described later.
도 7은 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)이 포함하는 집게부(60)를 확대하여 도시한 도면이다. FIG. 7 is an enlarged view illustrating a clamp part 60 included in the test transfer robot 200 of the flexible printed circuit board 100 according to the second embodiment of the present invention.
도 7을 참조하면, 집게부(60)는 연배열 인쇄 회로 기판(100)의 제1 방향과 접촉하는 제1 집게부(60-1) 및 연배열 인쇄 회로 기판(100)의 제1 방향과 상이한 방향인 제2 방향과 접촉하는 제2 집게부(60-2)를 포함하는 것을 확인할 수 있는바, 연배열 인쇄 회로 기판(100)이 일측이 개방된 상태이기에, 집게부(60)는 막혀있는 모든 부분과 접촉할 수 있는 제1 집게부(60-1) 및 제2 집게부(60-2)를 포함하는 것이다. 이 경우 앞서 제1 방향을 세로 방향이라 설정하였으므로 제2 방향은 세로 방향이 아닌 가로 방향으로 볼 수 있을 것이다. Referring to FIG. 7, the tongs 60 are in contact with the first direction of the flexible array printed circuit board 100 and the first tongs 60-1 and the first direction of the flexible array printed circuit board 100. It can be seen that the second clamping part 60-2 in contact with the second direction, which is a different direction, is included. Since one side of the serially arranged printed circuit board 100 is open, the clamping part 60 is blocked. It includes a first clamping portion 60-1 and a second clamping portion 60-2 that can contact all of the parts. In this case, since the first direction was previously set as the vertical direction, the second direction may be viewed in a horizontal direction rather than a vertical direction.
이 경우 제1 집게부(60-1) 표면에는 소정 깊이의 홈(65)이 복수 개 형성될 수 있으며, 해당 홈(65)에는 센서(80)가 배치될 수 있는바, 센서(80)가 표면에 그대로 배치되는 경우 센서(80) 자체의 높이로 인해 연배열 인쇄 회로 기판(100)을 집어 든 경우, 공간이 발생하여 집어 든 연배열 인쇄 회로 기판(100)을 놓칠 수 있기 때문이다. 그러나 센서(80)가 아주 낮은 높이를 가짐으로써 그 높이를 무시할 수 있을 정도의 경우라면 반드시 홈(65)에 배치되지 않아도 무방할 것이다. In this case, a plurality of grooves 65 having a predetermined depth may be formed on the surface of the first clamp part 60-1, and the sensor 80 may be disposed in the groove 65, and the sensor 80 This is because if the sensor 80 is placed on the surface as it is, when the flexible printed circuit board 100 is picked up due to the height of the sensor 80 itself, a space may be generated and the picked up flexible printed circuit board 100 may be missed. However, since the sensor 80 has a very low height, if the height is negligible, it may not necessarily be disposed in the groove 65.
한편, 홈(65)의 개수 또는 홈(65)에 배치되는 센서(80)의 개수는 많을수록 좋으나, 이는 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)의 제조 단가를 상승시킬 수 있으므로 통상적인 연배열 인쇄 회로 기판(100)이 포함하는 SSD 반도체의 개수, 제1 방향으로 배치된 제1 소정 간격 및 제2 소정 간격의 개수에 대응하여 배치하는 것이 바람직하다 할 것이다. 예를 들어, 연배열 인쇄 회로 기판(100)이 2개의 SSD 반도체를 포함한다면, 제1 방향으로 배치된 제1 소정 간격 및 제2 소정 간격은 3개가 되므로, 센서(80)를 5개를 배치할 수 있을 것이다. On the other hand, the more the number of grooves 65 or the number of sensors 80 disposed in the grooves 65 is, the better, but this is the test transfer robot 200 of the flexible printed circuit board 100 according to the second embodiment of the present invention. ), so it is possible to increase the manufacturing cost of the printed circuit board 100, so it is necessary to arrange it in correspondence with the number of SSD semiconductors, the first predetermined intervals arranged in the first direction, and the number of the second predetermined intervals. It would be desirable. For example, if the serially arranged printed circuit board 100 includes two SSD semiconductors, since the first predetermined interval and the second predetermined interval arranged in the first direction are three, five sensors 80 are arranged. I will be able to do it.
이러한 센서(80)는 공지된 어떠한 센서를 사용하여도 무방하나, 연배열 인쇄 회로 기판(100)이 포함하고 있는 SSD 반도체의 개수 그리고 제1 집게부(60-1)가 접촉할 제1 방향을 결정하기 위해 적외선 센서를 사용하는 것이 바람직하다. 이 경우, 적외선 센서는 연배열 인쇄 회로 기판(100)에 적외선을 조사하고, 조사한 적외선이 충돌되어 돌아오는 시간을 산정해 연배열 인쇄 회로 기판(100)이 포함하고 있는 SSD 반도체의 개수 그리고 제1 집게부(60-1)가 접촉할 제1 방향을 결정할 수 있다. The sensor 80 may be any known sensor, but the number of SSD semiconductors included in the serially arranged printed circuit board 100 and the first direction in which the first clamping part 60-1 will contact It is desirable to use an infrared sensor to determine. In this case, the infrared sensor irradiates infrared rays onto the flexible array printed circuit board 100, calculates the time to return after the irradiated infrared rays collide, and calculates the number of SSD semiconductors included in the flexible array printed circuit board 100 and the first The first direction in which the clamp part 60-1 will contact may be determined.
도 8은 적외선 센서를 센서(80)로 사용하는 경우, 연배열 인쇄 회로 기판(100)에 적외선을 조사하고, 조사한 적외선이 돌아오는 시간을 표시한 도면인바, 위쪽에 배치된 적외선 센서가 조사한 적외선이 돌아오는 시간을 제1 시간, 아래쪽에 배치된 적외선 센서가 조사한 적외선이 돌아오는 시간을 제2 시간으로 볼 수 있으며, 적외선 센서는 적외선을 조사하여 제1 시간과 제2 시간이 동시에 산정되는 방향을 제1 집게부(60-1)가 접촉할 제1 방향으로 결정하여 제어부(70)에 전달할 수 있다. FIG. 8 is a diagram showing the time when infrared rays are irradiated to the serially arranged printed circuit board 100 and the irradiated infrared rays return, when an infrared sensor is used as the sensor 80, and infrared rays irradiated by the infrared sensor disposed above This return time can be viewed as the first time, and the return time of the infrared light irradiated by the infrared sensor disposed below it can be viewed as the second time, and the infrared sensor irradiates infrared rays to calculate the first time and the second time at the same time. May be determined as a first direction in which the first clamp unit 60-1 will contact and transmitted to the control unit 70.
보다 구체적으로, 제1 시간은 조사한 적외선이 연배열 인쇄 회로 기판(100)의 제1 방향 표면과 충돌한 후 돌아오는 시간이며, 제2 시간은 조사한 적외선이 연배열 인쇄 회로 기판(100)의 제1 방향 표면에 형성된 제2 홈(50-5)의 표면과 충돌한 후 돌아오는 시간인바, 본 발명의 제1 실시 예에 따른 연배열 인쇄 회로 기판(100)의 개방된 일측은 BIST 테스트 장비 또는 FUNCTION 테스트 장비와 연결되는 단자부가 외부로 노출되는 영역이기 때문에 제1 집게부(60-1)와 접촉한 상태에서의 연결은 불가능한바, 반대편의 표면에 제2 홈(50-5)을 형성하여 제1 집게부(60-1)가 접촉할 제1 방향으로 결정할 수 있는 것이다. 이 경우, 조사한 적외선은 제2 홈(50-5)의 높이만큼 더 진행한 후, 표면과 충돌되어 돌아올 것이므로 제2 시간은 제1 시간보다 긴 시간이라 할 수 있을 것이다. More specifically, the first time is a time to return after the irradiated infrared rays collide with the surface in the first direction of the series printed circuit board 100, and the second time is the time when the irradiated infrared rays return to the first direction of the series printed circuit board 100. This is the time to return after colliding with the surface of the second groove 50-5 formed on the surface in one direction, and the open side of the flexible printed circuit board 100 according to the first embodiment of the present invention is a BIST test equipment or Since the terminal part connected to the function test equipment is exposed to the outside, it is impossible to connect in a state in contact with the first clamp part (60-1). As a result, a second groove (50-5) is formed on the opposite surface. It can be determined as the first direction in which the first tongs 60-1 will contact. In this case, the irradiated infrared rays will travel further as much as the height of the second groove 50-5 and then collide with the surface and return, so the second time may be a longer time than the first time.
한편, 이러한 제1 집게부(60-1)는 도 9에 도시된 바와 같이 표면에 소정 높이의 제1 돌기(61)를 복수 개 형성하고, 형성한 제1 돌기(61)는 제1 집게부(60-1)와 연배열 인쇄 회로 기판(100)의 제1 방향이 접촉 시, 제2 홈(50-5)과 결합하여 연배열 인쇄 회로 기판(100)의 이송 시, 집어 든 연배열 인쇄 회로 기판(100)을 놓치거나 흔들리는 상황을 방지할 수 있다. Meanwhile, as shown in FIG. 9, in the first clamping part 60-1, a plurality of first protrusions 61 having a predetermined height are formed on the surface, and the formed first protrusion 61 is a first clamping part. When (60-1) and the first direction of the flexible array printed circuit board 100 are in contact, combined with the second groove (50-5) to transfer the flexible array printed circuit board 100, picked up flexible array printing A situation in which the circuit board 100 is missed or shaken can be prevented.
상기 설명한 방식을 통해 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)은 연배열 인쇄 회로 기판(100)과 접촉할 방향을 결정할 수 있으나, 이는 어디까지나 집게부(60)가 연배열 인쇄 회로 기판(100)의 개방된 일측으로 다가가지 않을 경우의 상황이며, 경우에 따라 집게부(60)가 연배열 인쇄 회로 기판(100)의 개방된 일측으로 다가갈 수도 있다. 이 경우 집게부(60)는 연배열 인쇄 회로 기판(100)을 집어 들면 안되며, 적외선을 조사하여 집게부(60)가 다가가는 방향이 연배열 인쇄 회로 기판(100)의 개방된 일측임을 판단해야 한다. 이하 설명하도록 한다. Through the above-described method, the test transfer robot 200 of the serially arranged printed circuit board 100 according to the second embodiment of the present invention can determine the direction in which it will contact the serially arranged printed circuit board 100. This is a situation in which the clamp part 60 does not approach the open side of the flexible printed circuit board 100, and in some cases, the clamp part 60 approaches the open side of the flexible printed circuit board 100. You can go. In this case, the clamp part 60 should not pick up the flexible printed circuit board 100, and it should be determined that the direction in which the clamp part 60 approaches is the open side of the flexible printed circuit board 100 by irradiating infrared rays. do. It will be described below.
도 10은 도 8과 마찬가지로 적외선 센서를 센서(80)로 사용하는 경우, 연배열 인쇄 회로 기판(100)에 적외선을 조사하고, 조사한 적외선이 돌아오는 시간을 표시한 도면이며, 도 8과의 차이점은 집게부(60)가 연배열 인쇄 회로 기판(100)의 개방된 일측 방향에 배치되어 있다는 점이다. FIG. 10 is a diagram showing the time when infrared rays are irradiated to the series printed circuit board 100 and the irradiated infrared rays return when the infrared sensor is used as the sensor 80, as in FIG. The point is that the tongs 60 are disposed in the open side of the flexible printed circuit board 100.
이 경우, 적외선 센서는 도 8의 경우와 마찬가지로 적외선을 조사할 것이며, 이를 도면에 제3 시간으로 표시하였다. 이러한 제3 시간은 적외선 센서가 조사한 적외선이 제2 소정 간격으로 조사되어 제3-1 지지부(50-1)의 표면과 충돌한 후 돌아오는 시간인바, 제2 소정 간격의 높이(또는 길이)는 제2 홈(50-5)의 높이(또는 길이)보다 크기 때문에 제3 시간은 제2 시간보다 긴 시간일 수밖에 없으며, 그에 따라 제3 시간이 산정되는 방향을 개방된 상태인 일측으로 결정할 수 있다. 한편, 다른 적외선 센서가 조사한 적외선이 SSD 반도체의 일측과 충돌하여 돌아오는 시간 역시 산정될 수 있을 것이며, 이는 제3 시간보다 짧을 것이나, 제3 시간은 적외선 센서가 산정하는 시간 중, 가장 긴 시간이기 때문에 이보다 짧은 시간이 산정되는 것은 일측을 결정함에 있어서 고려하지 않아도 되는 사항이라 할 것이다. In this case, the infrared sensor will irradiate infrared rays as in the case of FIG. 8, and this is indicated as a third time in the drawing. This third time is a time to return after the infrared rays irradiated by the infrared sensor are irradiated at a second predetermined interval and collide with the surface of the 3-1 support 50-1, and the height (or length) of the second predetermined interval is Since the height (or length) of the second groove 50-5 is larger than the height (or length), the third time is inevitably longer than the second time, and accordingly, the direction in which the third time is calculated can be determined as one side in the open state. . On the other hand, the time when infrared rays irradiated by other infrared sensors collide with one side of the SSD semiconductor and return may also be calculated, which will be shorter than the third time, but the third time is the longest time among the time calculated by the infrared sensor. Therefore, the calculation of a time shorter than this is a matter that does not need to be considered in determining one side.
더 나아가 적외선 센서는 일측에서 제3 시간이 산정된 횟수에 1을 감산한 결과를 연배열 인쇄 회로가 포함하는 복수 개의 SSD 반도체의 개수로 결정하여 제어부(70)에 전달할 수 있는바, 도 10을 참조하면, 2개의 SSD 반도체를 포함하는 경우 제3 시간이 3회 측정됨을 확인할 수 있다. 이는 1개의 SSD 반도체가 배치되는 경우 제1 방향을 따라 2개의 소정 간격이 배치되며, 또 다른 SSD 반도체가 나란하게 배치되는 경우 1개의 소정 간격이 중복되기 때문이며, 산정된 제3 시간의 횟수를 기준으로 1을 감산하면 SSD 반도체의 개수로 볼 수 있기 때문이다.Furthermore, the infrared sensor can determine the result of subtracting 1 from the number of times the third time is calculated by one side as the number of a plurality of SSD semiconductors included in the serialized printed circuit and transmit it to the control unit 70, as shown in FIG. Referring to, in the case of including two SSD semiconductors, it can be seen that the third time is measured three times. This is because when one SSD semiconductor is arranged, two predetermined intervals are arranged along the first direction, and when another SSD semiconductor is arranged side by side, one predetermined interval is overlapped, based on the calculated number of third times. This is because it can be seen as the number of SSD semiconductors by subtracting 1 by.
이러한 경우, 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)은 연배열 인쇄 회로 기판(100)이 포함하는 SSD 반도체의 개수를 결정하여 BIST 테스트 장비 및 FUNCTION 테스트 장비가 포함하는 복수 개의 단자부와 연결될 위치 또는 연결이 필요한 단자부의 개수를 정확하게 산정할 수 있을 것이나, 이는 앞의 경우와 마찬가지로 집게부(60)가 연배열 인쇄 회로 기판(100)의 개방된 일측으로 다가가는 경우의 상황이다. 즉, 집게부(60)가 연배열 인쇄 회로 기판(100)이 포함하는 SSD 반도체의 개수를 산정하기 위해서는 개방된 일측으로, 집어 든 연배열 인쇄 회로 기판(100)을 BIST 테스트 장비 및 FUNCTION 테스트 장비와 연결시키기 위해서는 개방된 일측의 반대 방향으로 다가가야 하므로, 제어부(70)는 집게부(60)로 하여금 개방된 일측 그리고 개방된 일측의 반대 방향 모두에 대하여 다가갈 수 있도록 함이 바람직하다 할 것이다. In this case, the test transfer robot 200 of the serially arranged printed circuit board 100 according to the second embodiment of the present invention determines the number of SSD semiconductors included in the serially arranged printed circuit board 100 to determine the BIST test equipment and The position to be connected to the plurality of terminal parts included in the FUNCTION test equipment or the number of terminal parts that need to be connected can be accurately calculated, but this is similar to the previous case, when the clamping part 60 is open to the open circuit board 100 This is a situation when approaching one side. That is, in order for the clamp unit 60 to calculate the number of SSD semiconductors included in the flexible printed circuit board 100, the picked up flexible printed circuit board 100 is a BIST test equipment and a FUNCTION test equipment. In order to connect with, it is necessary to approach in the opposite direction of the open side, so it is preferable that the control unit 70 allows the clamp unit 60 to approach both the open side and the opposite direction of the open side. .
더 나아가, 제2 집게부(60-2)는 연배열 인쇄 회로 기판(100)의 재2 방향과 접촉하며, 이는 연배열 인쇄 회로 기판(100)의 상면을 기준으로 위쪽과 아래쪽 2개의 면에 해당하므로 제1 집게부(60-1)와 제2 집게부(60-2) 사이에 별도의 신장부(미도시)를 더 포함하여 연배열 인쇄 회로 기판(100)의 제1 방향의 길이에 대응할 수 있도록 유동적으로 조절할 수도 있다. 이 경우, 앞서 설명한 집게부(60)가 연배열 인쇄 회로 기판(100)의 개방된 일측 그리고 개방된 일측의 반대 방향 모두에 대하여 다가가는 경우, 제어부(70)는 신장부(미도시)로 하여금 제2 집게부(60-2)를 최대 신장 상태로 만든 후 다가가도록 함이 바람직한바, 연배열 인쇄 회로 기판(100)의 제1 방향의 길이가 제각각 상이할 수 있기 때문에 이들의 제1 방향 길이를 모두 포함할 수 있는 상태에서 다가가는 것이 공정 효율성을 향상시킬 수 있는 방법이기 때문이다. Furthermore, the second clamping part 60-2 is in contact with the second direction of the serially arranged printed circuit board 100, which is on the upper and lower two surfaces with respect to the upper surface of the serially arranged printed circuit board 100. Therefore, a separate extension (not shown) is further included between the first clamping part 60-1 and the second clamping part 60-2 to fit the length of the serially arranged printed circuit board 100 in the first direction. It can also be flexibly adjusted to respond. In this case, when the clamping part 60 described above approaches both the open side of the flexible printed circuit board 100 and the opposite direction of the open side, the control unit 70 causes the extension part (not shown) to It is preferable to make the second clamp part 60-2 in a maximum elongated state and then approach it. Since the lengths in the first direction of the series printed circuit board 100 may be different, their length in the first direction This is because approaching in a state that can include all of them is a way to improve process efficiency.
한편, 본 발명의 제2 실시 예에 따른 연배열 인쇄 회로 기판(100)의 테스트 이송 로봇(200)은 앞서 설명을 보류한 제1 집게부(60-1)와 연결되는 아암부(97)와 제1 집게부(60-1)과 아암부(97) 사이에 배치된 회전부(98)를 더 포함할 수 있는바, 도 11에 도시된 바와 같이 아암부(97)를 통해 아암부(97)가 구동할 수 있는 반경 내에 BIST 테스트 장치와 FUNCTION 테스트 장치를 설치한 경우, SSD 반도체 또는 SSD 반도체를 포함하는 연배열 인쇄 회로 기판(100)을 번거롭게 이송하지 않아도 되며, 이송하는 공정에서 발생할 수 있는 의도치 않은 충돌 사고를 방지할 수 있고, BIST 테스트와 FUNCTION 테스트를 한 장소에서 손쉽고 간편하게 진행할 수 있다. 더 나아가, BIST 테스트 장치와 FUNCTION 테스트 장치의 규격이 단자가 제1 방향으로 배치된 경우 또는 제2 방향으로 배치된 경우라 할지라도 회전부(98)를 통해 SSD 반도체 또는 SSD 반도체를 포함하는 연배열 인쇄 회로 기판(100)을 집고 있는 집게부(60)를 회전시킬 수 있으므로 공정 효율성이 향상될 수 있다. On the other hand, the test transfer robot 200 of the serially arranged printed circuit board 100 according to the second embodiment of the present invention includes an arm part 97 connected to the first clamp part 60-1, A rotating portion 98 disposed between the first clamp portion 60-1 and the arm portion 97 may be further included. As shown in FIG. 11, the arm portion 97 through the arm portion 97 If the BIST test device and the FUNCTION test device are installed within a radius that can be driven, the SSD semiconductor or the flexible array printed circuit board 100 including the SSD semiconductor does not need to be transported cumbersomely, and intentions that may occur in the transport process Unexpected collision can be prevented, and the BIST test and FUNCTION test can be performed easily and conveniently in one place. Furthermore, even when the standard of the BIST test device and the FUNCTION test device is arranged in the first direction or in the second direction, the SSD semiconductor or serial array printing including the SSD semiconductor through the rotating unit 98 Since the tongs 60 holding the circuit board 100 can be rotated, process efficiency can be improved.
이상 첨부된 도면을 참조하여 본 발명의 실시 예들을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시 예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.Although the embodiments of the present invention have been described with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features. You can understand. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects.

Claims (14)

  1. 일측에 형성된 제1 단자부를 포함하는 제1 SSD (Solid State Drive) 반도체;A first solid state drive (SSD) semiconductor including a first terminal portion formed on one side;
    상기 제1 SSD 반도체를 기준으로 제1 방향을 따라 제1 소정 간격 이격하여 나란하게 배치되되, 일측에 형성된 제N 단자부(N은 2 이상의 자연수)를 포함하는 제N SSD 반도체; An N-th SSD semiconductor disposed in parallel with a first predetermined distance apart from the first SSD semiconductor in a first direction, and including an N-th terminal portion (N is a natural number of 2 or more) formed on one side of the first SSD semiconductor;
    상기 제1 SSD 반도체와 제N SSD 반도체를 상호 지지하되, 상기 제1 소정 간격에 배치된 제1 지지부; A first support portion that supports the first SSD semiconductor and the Nth SSD semiconductor and is disposed at the first predetermined interval;
    상기 제1 SSD 반도체 및 제N SSD 반도체와 제2 소정 간격 이격하여 배치되어 상호 지지하되, 상기 제1 SSD 반도체 및 제 N SSD 반도체를 둘러싸는 제2 지지부; 및A second support portion disposed to be spaced apart from the first SSD semiconductor and the Nth SSD semiconductor to support each other by a second predetermined distance, and surrounding the first SSD semiconductor and the Nth SSD semiconductor; And
    상기 제1 SSD 반도체 및 제N SSD 반도체와 제2 지지부를 상호 지지하되, 상기 제2 소정 간격에 배치된 제3 지지부;A third support part mutually supporting the first SSD semiconductor, the N-th SSD semiconductor, and the second support part, and disposed at the second predetermined intervals;
    를 포함하는 연배열 인쇄 회로 기판에 있어서, In the serially arranged printed circuit board comprising a,
    상기 제2 지지부는, The second support part,
    상기 제1 단자부 및 제N 단자부가 형성된 일측이 개방된 상태에서 상기 제1 SSD 반도체 및 제 N SSD 반도체를 둘러싸는,Surrounding the first SSD semiconductor and the Nth SSD semiconductor in a state in which one side of the first terminal portion and the N-th terminal portion is opened,
    연배열 인쇄 회로 기판.Soft array printed circuit board.
  2. 제1항에 있어서,The method of claim 1,
    상기 제1 단자부 및 제N 단자부는, The first terminal portion and the N-th terminal portion,
    상기 제1 SSD 반도체 및 제N SSD 반도체에 대한 BIST 테스트 및 FUNCTION 테스트에 이용되는 BIST 테스트 장비 및 FUNCTION 테스트 장비와 연결되는 단자부인, A terminal part connected to the BIST test equipment and the FUNCTION test equipment used for the BIST test and function test for the first SSD semiconductor and the N-th SSD semiconductor,
    연배열 인쇄 회로 기판. Soft array printed circuit board.
  3. 제1항에 있어서,The method of claim 1,
    상기 제3 지지부는, The third support part,
    상기 제1 지지부가 배치된 방향과 반대 방향에 배치되어 상기 제1 SSD 반도체와 제2 지지부를 상호 지지하는 제3-1 지지부; 및A 3-1 support part disposed in a direction opposite to the direction in which the first support part is disposed to mutually support the first SSD semiconductor and the second support part; And
    상기 제1 지지부가 배치된 방향과 반대 방향에 배치되어 상기 제N SSD 반도체와 제2 지지부를 상호 지지하는 제3-2 지지부;A 3-2 support part disposed in a direction opposite to the direction in which the first support part is disposed to mutually support the Nth SSD semiconductor and the second support part;
    를 더 포함하는 연배열 인쇄 회로 기판.A flexible printed circuit board comprising a further.
  4. 제3항에 있어서,The method of claim 3,
    상기 제3 지지부는, The third support part,
    상기 일측과 반대 방향에 배치되어 상기 제1 SSD 반도체와 제2 지지부를 상호 지지하는 제3-3 지지부; 및A third-third support part disposed in a direction opposite to the one side to mutually support the first SSD semiconductor and the second support part; And
    상기 일측과 반대 방향에 배치되어 상기 제N SSD 반도체와 제2 지지부를 상호 지지하는 제3-4 지지부; A 3-4th support portion disposed in a direction opposite to the one side to mutually support the Nth SSD semiconductor and the second support portion;
    를 더 포함하는 연배열 인쇄 회로 기판.A flexible printed circuit board comprising a further.
  5. 제1항에 있어서,The method of claim 1,
    상기 제2 지지부는, The second support part,
    상기 일측이 상기 제1 소정 간격 및 제2 소정 간격까지 포함하여 개방된 상태인,The one side is open including the first predetermined interval and the second predetermined interval,
    연배열 인쇄 회로 기판.Soft array printed circuit board.
  6. 제1항에 있어서,The method of claim 1,
    상기 제2 지지부는, The second support part,
    상기 일측이 상기 제2 소정 간격을 포함하지 않고 개방된 상태이며,The one side is in an open state without including the second predetermined interval,
    상기 제2 소정 간격은 막혀 있는 상태인,The second predetermined interval is in a closed state,
    연배열 인쇄 회로 기판.Soft array printed circuit board.
  7. 제1항에 있어서,The method of claim 1,
    상기 제2 지지부는, The second support part,
    상기 일측이 상기 제1 단자부 및 제N 단자부에 대응하는 길이만큼만 개방된 상태이며, The one side is open only by a length corresponding to the first terminal portion and the N-th terminal portion,
    상기 제2 소정 간격, 상기 제1 단자부 및 제N 단자부에 대응하는 길이만큼을 제외한 일측은 막혀 있는 상태인, One side of the second predetermined interval, except for a length corresponding to the first terminal portion and the N-th terminal portion, is in a closed state,
    연배열 인쇄 회로 기판. Soft array printed circuit board.
  8. 일측에 단자부가 형성된 복수 개의 SSD 반도체를 포함하되, 상기 일측이 개방된 상태인 연배열 인쇄 회로 기판의 테스트 이송 로봇에 있어서, In the test transfer robot for a flexible printed circuit board comprising a plurality of SSD semiconductors having a terminal portion formed on one side, the one side is open,
    상기 연배열 인쇄 회로를 집어드는 집게부; 및A tong portion for picking up the serialized printed circuit; And
    상기 집게부의 구동을 제어하는 제어부;A control unit for controlling the driving of the clamp unit;
    를 포함하며, Including,
    상기 집게부는, The tongs part,
    상기 연배열 인쇄 회로 기판의 제1 방향과 접촉하는 제1 집게부; 및A first tong portion in contact with a first direction of the serially arranged printed circuit board; And
    상기 연배열 인쇄 회로 기판의 제1 방향과 상이한 방향인 제2 방향과 접촉하는 제2 집게부;A second clamping portion in contact with a second direction, which is a direction different from the first direction of the serialized printed circuit board;
    를 포함하고, Including,
    상기 제1 집게부는, The first tongs part,
    표면에 소정 깊이의 제1 홈이 복수 개 형성되며, 상기 홈에 센서가 배치되는, A plurality of first grooves having a predetermined depth are formed on the surface, and a sensor is disposed in the groove,
    연배열 인쇄 회로 기판의 테스트 이송 로봇.A test transfer robot for a flexible printed circuit board
  9. 제8항에 있어서,The method of claim 8,
    상기 제1 집게부와 접촉하는 연배열 인쇄 회로 기판의 제1 방향 표면에는 소정 깊이의 제2 홈이 복수 개 형성되며, A plurality of second grooves having a predetermined depth are formed on the surface in the first direction of the series printed circuit board in contact with the first tongs,
    상기 센서는, The sensor,
    적외선 센서이고, Infrared sensor,
    상기 적외선 센서는, The infrared sensor,
    상기 연배열 인쇄 회로 기판에 적외선을 조사하고, 상기 조사한 적외선이 돌아오는 시간을 산정하며, 산정된 제1 시간과 상기 제1 시간보다 긴 시간인 제2 시간이 동시에 산정되는 방향을 상기 제1 집게부가 접촉할 제1 방향으로 결정하여 상기 제어부에 전달하는, Infrared radiation is irradiated on the serially arranged printed circuit board, the irradiated infrared rays are returned, and the calculated first time and a second time longer than the first time are calculated simultaneously with the first clamp Determining the first direction the additional contact will be delivered to the control unit,
    연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for flexible printed circuit boards.
  10. 제9항에 있어서,The method of claim 9,
    상기 제1 시간은, The first time,
    상기 조사한 적외선이 상기 연배열 인쇄 회로 기판의 제1 방향 표면과 충돌한 후 돌아오는 시간이며, It is the time to return after the irradiated infrared rays collide with the first direction surface of the flexible array printed circuit board,
    상기 제2 시간은,The second time,
    상기 조사한 적외선이 상기 연배열 인쇄 회로 기판의 제1 방향 표면에 형성된 제2 홈의 표면과 충돌한 후 돌아오는 시간인,It is the time to return after the irradiated infrared rays collide with the surface of the second groove formed on the first direction surface of the serially arranged printed circuit board,
    연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for flexible printed circuit boards.
  11. 제9항에 있어서,The method of claim 9,
    상기 제1 집게부는, The first tongs part,
    표면에 소정 높이의 제1 돌기가 복수 개 형성되며, A plurality of first protrusions having a predetermined height are formed on the surface,
    상기 제1 돌기는, The first protrusion,
    상기 제1 집게부와 연배열 인쇄 회로 기판의 제1 방향이 접촉 시, 상기 제2 홈과 결합하는, When the first tongs part and the first direction of the serially arranged printed circuit board are in contact with each other,
    연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for flexible printed circuit boards.
  12. 제9항에 있어서, The method of claim 9,
    상기 적외선 센서는, The infrared sensor,
    상기 제2 시간보다 긴 시간인 제3 시간이 산정되는 방향을 상기 개방된 상태인 일측으로 결정하며, A direction in which a third time, which is a time longer than the second time, is calculated as the one side of the open state,
    상기 일측에서 제3 시간이 산정된 횟수에 1을 감산한 결과를 상기 연배열 인쇄 회로가 포함하는 복수 개의 SSD 반도체의 개수로 결정하여 상기 제어부에 전달하는, Determining a result of subtracting 1 from the number of times the third time is calculated by the one side as the number of a plurality of SSD semiconductors included in the serialized printed circuit and transmitting it to the control unit,
    연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for flexible printed circuit boards.
  13. 제8항에 있어서, The method of claim 8,
    상기 제어부가 실장되는 바디부; 및A body on which the control unit is mounted; And
    상기 바디부 하단에 복수 개 배치된 이동용 휠(Wheel);A plurality of moving wheels disposed under the body portion;
    을 더 포함하는 연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for a flexible printed circuit board comprising a further.
  14. 제8항에 있어서,The method of claim 8,
    상기 제1 집게부와 연결되는 아암(Arm)부; 및An arm part connected to the first clamp part; And
    상기 제1 집게부와 아암부 사이에 배치된 회전부;A rotating portion disposed between the first clamp portion and the arm portion;
    를 더 포함하는 연배열 인쇄 회로 기판의 테스트 이송 로봇. A test transfer robot for a flexible printed circuit board comprising a further.
PCT/KR2019/006356 2019-05-02 2019-05-28 Serially arranged printed circuit board, and test and transfer robot thereof WO2020222351A1 (en)

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KR0148076B1 (en) * 1995-05-31 1998-10-01 김광호 Supporter of dual side printed circuit board arranged continuously
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KR0148076B1 (en) * 1995-05-31 1998-10-01 김광호 Supporter of dual side printed circuit board arranged continuously
US6114866A (en) * 1997-09-08 2000-09-05 Mitsubishi Electric Systems Lsi Design Corporation Semiconductor device test board and method for evaluating semiconductor devices
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