JPH11329997A - 貼り合わせ基材とその作製方法 - Google Patents

貼り合わせ基材とその作製方法

Info

Publication number
JPH11329997A
JPH11329997A JP13391198A JP13391198A JPH11329997A JP H11329997 A JPH11329997 A JP H11329997A JP 13391198 A JP13391198 A JP 13391198A JP 13391198 A JP13391198 A JP 13391198A JP H11329997 A JPH11329997 A JP H11329997A
Authority
JP
Japan
Prior art keywords
substrate
ion
layer
bonded
implanted layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP13391198A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11329997A5 (enExample
Inventor
Kiyobumi Sakaguchi
清文 坂口
Nobuhiko Sato
信彦 佐藤
Takao Yonehara
隆夫 米原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP13391198A priority Critical patent/JPH11329997A/ja
Publication of JPH11329997A publication Critical patent/JPH11329997A/ja
Publication of JPH11329997A5 publication Critical patent/JPH11329997A5/ja
Withdrawn legal-status Critical Current

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  • Element Separation (AREA)
JP13391198A 1998-05-15 1998-05-15 貼り合わせ基材とその作製方法 Withdrawn JPH11329997A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13391198A JPH11329997A (ja) 1998-05-15 1998-05-15 貼り合わせ基材とその作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13391198A JPH11329997A (ja) 1998-05-15 1998-05-15 貼り合わせ基材とその作製方法

Publications (2)

Publication Number Publication Date
JPH11329997A true JPH11329997A (ja) 1999-11-30
JPH11329997A5 JPH11329997A5 (enExample) 2005-09-29

Family

ID=15115986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13391198A Withdrawn JPH11329997A (ja) 1998-05-15 1998-05-15 貼り合わせ基材とその作製方法

Country Status (1)

Country Link
JP (1) JPH11329997A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084738A1 (en) * 2001-04-06 2002-10-24 Shin-Etsu Handotai Co.,Ltd. Soi wafer and its manufacturing method
WO2009011152A1 (ja) * 2007-07-13 2009-01-22 National University Corporation Tohoku University Ｓｏｉ基板およびｓｏｉ基板を用いた半導体装置
JP2011091264A (ja) * 2009-10-23 2011-05-06 Japan Atomic Energy Agency 基板加工方法および半導体装置の製造方法
KR20140142699A (ko) * 2012-03-05 2014-12-12 소이텍 반도체 온 절연체 구조를 테스트하는 방법 및 이러한 구조의 제조를 위한 그 테스트의 적용

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084738A1 (en) * 2001-04-06 2002-10-24 Shin-Etsu Handotai Co.,Ltd. Soi wafer and its manufacturing method
US7560313B2 (en) 2001-04-06 2009-07-14 Shin-Etsu Handotai Co., Ltd. SOI wafer and method for producing the same
WO2009011152A1 (ja) * 2007-07-13 2009-01-22 National University Corporation Tohoku University Ｓｏｉ基板およびｓｏｉ基板を用いた半導体装置
JPWO2009011152A1 (ja) * 2007-07-13 2010-09-16 国立大学法人東北大学 Ｓｏｉ基板およびｓｏｉ基板を用いた半導体装置
JP2011091264A (ja) * 2009-10-23 2011-05-06 Japan Atomic Energy Agency 基板加工方法および半導体装置の製造方法
KR20140142699A (ko) * 2012-03-05 2014-12-12 소이텍 반도체 온 절연체 구조를 테스트하는 방법 및 이러한 구조의 제조를 위한 그 테스트의 적용

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