JPH11289194A - 電子部品実装装置および電子部品実装方法 - Google Patents
電子部品実装装置および電子部品実装方法Info
- Publication number
- JPH11289194A JPH11289194A JP10093131A JP9313198A JPH11289194A JP H11289194 A JPH11289194 A JP H11289194A JP 10093131 A JP10093131 A JP 10093131A JP 9313198 A JP9313198 A JP 9313198A JP H11289194 A JPH11289194 A JP H11289194A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- unit
- electronic
- nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/044—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10093131A JPH11289194A (ja) | 1998-04-06 | 1998-04-06 | 電子部品実装装置および電子部品実装方法 |
| US09/281,222 US6588096B1 (en) | 1998-04-06 | 1999-03-30 | Method employing X-Y tables for simultaneously mounting electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10093131A JPH11289194A (ja) | 1998-04-06 | 1998-04-06 | 電子部品実装装置および電子部品実装方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005087866A Division JP4175335B2 (ja) | 2005-03-25 | 2005-03-25 | 電子部品実装方法 |
| JP2005087865A Division JP2005191601A (ja) | 2005-03-25 | 2005-03-25 | 電子部品実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11289194A true JPH11289194A (ja) | 1999-10-19 |
| JPH11289194A5 JPH11289194A5 (https=) | 2005-09-15 |
Family
ID=14073980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10093131A Pending JPH11289194A (ja) | 1998-04-06 | 1998-04-06 | 電子部品実装装置および電子部品実装方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6588096B1 (https=) |
| JP (1) | JPH11289194A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004084604A1 (ja) * | 2003-03-19 | 2004-09-30 | Yamaha Motor Co., Ltd. | 表面実装機 |
| US7965262B2 (en) | 2002-10-28 | 2011-06-21 | Thomson Licensing | Display device with capacitive energy recovery |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000078114A1 (en) * | 1999-06-16 | 2000-12-21 | Koninklijke Philips Electronics N.V. | Component placement machine |
| JP4551599B2 (ja) * | 1999-11-05 | 2010-09-29 | パナソニック株式会社 | 部品実装装置及び方法 |
| DE60136378D1 (de) * | 2000-08-22 | 2008-12-11 | Matsushita Electric Industrial Co Ltd | Einrichtung und verfahren zur montage von teilen |
| KR100802435B1 (ko) * | 2001-12-17 | 2008-02-13 | 미래산업 주식회사 | 반도체 소자 테스트 핸들러의 소자 이송장치의 작업위치인식방법 |
| JP4341302B2 (ja) * | 2003-06-09 | 2009-10-07 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
| JPWO2006114836A1 (ja) * | 2005-04-07 | 2008-12-11 | 株式会社アドバンテスト | 電子部品のピックアンドプレース機構、電子部品ハンドリング装置および電子部品の吸着方法 |
| DE102007005151A1 (de) | 2007-02-01 | 2008-08-07 | Siemens Ag | Mehrfach-Bestückkopf mit kollektivem Drehantrieb und verfahrbarem Hubantrieb für Bauelement-Halteeinrichtungen |
| EP2852270B1 (en) * | 2012-05-15 | 2020-11-25 | FUJI Corporation | Electronic component mounting machine |
| TWI574847B (zh) * | 2014-10-29 | 2017-03-21 | 財團法人工業技術研究院 | 雙噴頭列印裝置 |
| US11388849B2 (en) * | 2017-01-30 | 2022-07-12 | Fuji Corporation | Component mounting machine, component suctioning method, nozzle disposing method and method for disposing component supplying device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5323528A (en) * | 1993-06-14 | 1994-06-28 | Amistar Corporation | Surface mount placement system |
| JPH07193397A (ja) * | 1993-12-27 | 1995-07-28 | Yamaha Motor Co Ltd | 実装機の吸着ポイント補正装置 |
| US5699448A (en) * | 1995-07-05 | 1997-12-16 | Universal Instruments Corporation | Split field optics for locating multiple components |
| JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
-
1998
- 1998-04-06 JP JP10093131A patent/JPH11289194A/ja active Pending
-
1999
- 1999-03-30 US US09/281,222 patent/US6588096B1/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7965262B2 (en) | 2002-10-28 | 2011-06-21 | Thomson Licensing | Display device with capacitive energy recovery |
| WO2004084604A1 (ja) * | 2003-03-19 | 2004-09-30 | Yamaha Motor Co., Ltd. | 表面実装機 |
| JP2004288745A (ja) * | 2003-03-19 | 2004-10-14 | Yamaha Motor Co Ltd | 表面実装機 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6588096B1 (en) | 2003-07-08 |
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