JPH11260865A5 - - Google Patents
Info
- Publication number
- JPH11260865A5 JPH11260865A5 JP1998059877A JP5987798A JPH11260865A5 JP H11260865 A5 JPH11260865 A5 JP H11260865A5 JP 1998059877 A JP1998059877 A JP 1998059877A JP 5987798 A JP5987798 A JP 5987798A JP H11260865 A5 JPH11260865 A5 JP H11260865A5
- Authority
- JP
- Japan
- Prior art keywords
- tab
- adhesive
- adhesive layer
- adhesive tape
- integer satisfying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05987798A JP3951418B2 (ja) | 1998-03-11 | 1998-03-11 | Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05987798A JP3951418B2 (ja) | 1998-03-11 | 1998-03-11 | Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11260865A JPH11260865A (ja) | 1999-09-24 |
| JPH11260865A5 true JPH11260865A5 (enExample) | 2005-09-02 |
| JP3951418B2 JP3951418B2 (ja) | 2007-08-01 |
Family
ID=13125831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05987798A Expired - Fee Related JP3951418B2 (ja) | 1998-03-11 | 1998-03-11 | Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3951418B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003327669A (ja) | 2002-05-13 | 2003-11-19 | Hitachi Chem Co Ltd | エポキシ樹脂組成物及び接着剤 |
| KR100860098B1 (ko) | 2008-02-29 | 2008-09-26 | 주식회사 이녹스 | 반도체 패키지용 접착 필름 |
| JP5934171B2 (ja) | 2013-11-29 | 2016-06-15 | インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ | インターボーザの厚さ決定方法、コンピュータプログラム、インターボーザおよびチップ実装構造体 |
| CN113801605B (zh) * | 2021-11-10 | 2022-03-25 | 宁波申山新材料科技有限公司 | 一种低表面能压敏胶粘带及其加工方法 |
-
1998
- 1998-03-11 JP JP05987798A patent/JP3951418B2/ja not_active Expired - Fee Related
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