JP3951418B2 - Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 - Google Patents

Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 Download PDF

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Publication number
JP3951418B2
JP3951418B2 JP05987798A JP5987798A JP3951418B2 JP 3951418 B2 JP3951418 B2 JP 3951418B2 JP 05987798 A JP05987798 A JP 05987798A JP 5987798 A JP5987798 A JP 5987798A JP 3951418 B2 JP3951418 B2 JP 3951418B2
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JP
Japan
Prior art keywords
adhesive
tape
tab
semiconductor device
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05987798A
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English (en)
Japanese (ja)
Other versions
JPH11260865A5 (enExample
JPH11260865A (ja
Inventor
幸綱 小西
幹弘 小倉
将次 木越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
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Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP05987798A priority Critical patent/JP3951418B2/ja
Publication of JPH11260865A publication Critical patent/JPH11260865A/ja
Publication of JPH11260865A5 publication Critical patent/JPH11260865A5/ja
Application granted granted Critical
Publication of JP3951418B2 publication Critical patent/JP3951418B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP05987798A 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 Expired - Fee Related JP3951418B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Publications (3)

Publication Number Publication Date
JPH11260865A JPH11260865A (ja) 1999-09-24
JPH11260865A5 JPH11260865A5 (enExample) 2005-09-02
JP3951418B2 true JP3951418B2 (ja) 2007-08-01

Family

ID=13125831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05987798A Expired - Fee Related JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Country Status (1)

Country Link
JP (1) JP3951418B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327669A (ja) 2002-05-13 2003-11-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及び接着剤
KR100860098B1 (ko) 2008-02-29 2008-09-26 주식회사 이녹스 반도체 패키지용 접착 필름
JP5934171B2 (ja) 2013-11-29 2016-06-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ インターボーザの厚さ決定方法、コンピュータプログラム、インターボーザおよびチップ実装構造体
CN113801605B (zh) * 2021-11-10 2022-03-25 宁波申山新材料科技有限公司 一种低表面能压敏胶粘带及其加工方法

Also Published As

Publication number Publication date
JPH11260865A (ja) 1999-09-24

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