JPH1125755A - 金属系相互接続性の複合材料 - Google Patents

金属系相互接続性の複合材料

Info

Publication number
JPH1125755A
JPH1125755A JP6765598A JP6765598A JPH1125755A JP H1125755 A JPH1125755 A JP H1125755A JP 6765598 A JP6765598 A JP 6765598A JP 6765598 A JP6765598 A JP 6765598A JP H1125755 A JPH1125755 A JP H1125755A
Authority
JP
Japan
Prior art keywords
porous
axis
composite
porous material
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6765598A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1125755A5 (https=
Inventor
Carmine G Meola
ジー．メオラ カーマイン
Daniel D Johnson
ディー．ジョンソン ダニエル
Donald R Banks
アール．バンクス ドナルド
Joseph G Ameen
ジー．アミーン ジョセフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of JPH1125755A publication Critical patent/JPH1125755A/ja
Publication of JPH1125755A5 publication Critical patent/JPH1125755A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24826—Spot bonds connect components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
JP6765598A 1997-03-04 1998-03-04 金属系相互接続性の複合材料 Pending JPH1125755A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/810846 1997-03-04
US08/810,846 US5910354A (en) 1997-03-04 1997-03-04 Metallurgical interconnect composite

Publications (2)

Publication Number Publication Date
JPH1125755A true JPH1125755A (ja) 1999-01-29
JPH1125755A5 JPH1125755A5 (https=) 2005-09-02

Family

ID=25204858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6765598A Pending JPH1125755A (ja) 1997-03-04 1998-03-04 金属系相互接続性の複合材料

Country Status (4)

Country Link
US (1) US5910354A (https=)
EP (1) EP0863550A3 (https=)
JP (1) JPH1125755A (https=)
KR (1) KR19980079862A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649516B2 (en) 2001-06-05 2003-11-18 Kabushiki Kaisha Toshiba Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions
US6906423B1 (en) 2001-06-05 2005-06-14 Kabushiki Kaisha Toshiba Mask used for exposing a porous substrate
JP2005191382A (ja) * 2003-12-26 2005-07-14 Toshiba Corp 複合部材の製造方法、および複合部材形成用基材
US7329458B2 (en) 2003-03-25 2008-02-12 Kabushiki Kaisha Toshiba Wiring member and method of manufacturing the same

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW322613B (en) * 1997-03-10 1997-12-11 guang-long Lin Continuous method of implementing solder bump on semiconductor wafer electrode
US6372624B1 (en) * 1997-08-04 2002-04-16 Micron Technology, Inc. Method for fabricating solder bumps by wave soldering
US6703114B1 (en) * 2002-10-17 2004-03-09 Arlon Laminate structures, methods for production thereof and uses therefor
EP1687670B1 (en) 2003-11-19 2014-03-12 University of Florida Research Foundation, Inc. A method to contact patterned electrodes on porous substrates and devices thereby
JP5528250B2 (ja) * 2010-07-30 2014-06-25 日東電工株式会社 配線回路基板の製造方法
US9888584B2 (en) 2014-12-31 2018-02-06 Invensas Corporation Contact structures with porous networks for solder connections, and methods of fabricating same
WO2019217503A1 (en) 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
AU2018422666B2 (en) * 2018-05-08 2022-03-10 W. L. Gore & Associates, Inc. Flexible and stretchable printed circuits on stretchable substrates
WO2019216883A1 (en) * 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible printed circuits for dermal applications
IL307854A (en) 2021-04-19 2023-12-01 Gore & Ass A composite material that includes hierarchical and nanoporous metal in a porous polymer substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
SE392582B (sv) * 1970-05-21 1977-04-04 Gore & Ass Forfarande vid framstellning av ett porost material, genom expandering och streckning av en tetrafluoretenpolymer framstelld i ett pastabildande strengsprutningsforfarande
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
US5194316A (en) * 1988-02-05 1993-03-16 Raychem Limited Laminar polymeric sheet
DE68929282T2 (de) * 1988-11-09 2001-06-07 Nitto Denko Corp., Ibaraki Leitersubstrat, Filmträger, Halbleiteranordnung mit dem Filmträger und Montagestruktur mit der Halbleiteranordnung
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5456004A (en) * 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
US5498467A (en) * 1994-07-26 1996-03-12 W. L. Gore & Associates, Inc. Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
US5698496A (en) * 1995-02-10 1997-12-16 Lucent Technologies Inc. Method for making an anisotropically conductive composite medium

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649516B2 (en) 2001-06-05 2003-11-18 Kabushiki Kaisha Toshiba Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions
US6906423B1 (en) 2001-06-05 2005-06-14 Kabushiki Kaisha Toshiba Mask used for exposing a porous substrate
US7329458B2 (en) 2003-03-25 2008-02-12 Kabushiki Kaisha Toshiba Wiring member and method of manufacturing the same
JP2005191382A (ja) * 2003-12-26 2005-07-14 Toshiba Corp 複合部材の製造方法、および複合部材形成用基材

Also Published As

Publication number Publication date
EP0863550A3 (en) 1999-01-07
EP0863550A2 (en) 1998-09-09
US5910354A (en) 1999-06-08
KR19980079862A (ko) 1998-11-25

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