JPH11204574A - Apparatus and method for bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding apparatus which suppresses dust mixing and can efficiently mount electronic components and optical glasses on the front and back surfaces of a board, such as tape carrier package(TCP). SOLUTION: A loader unit 20 for feeding a TCP board, UV-curing type adhesive coating unit 30 for coating a UV-curing type adhesive on the TCP board, glass mounting unit 50 for bonding optical glasses at specified positions on the back surface of the TCP board coated with the UV-curing type adhesive, a UV light irradiating unit 60 for irradiating UV light through the optical glass on the TCP board, a CP coating unit 70 for coating ACP on electrodes CO of the TCP board, a chip mounting unit 80 for mounting electronic components on the TCP board, an unloader unit 90 for unloading the TCP board, which mounts the optical glasses and electronic components and the feeder unit 30 for feeding the TCP board between the units are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a bonding apparatus and a bonding method for mounting a chip such as an IC chip on a substrate such as a TCP (tape carrier package), and to a method for improving productivity.

[0002]

2. Description of the Related Art FIG. 6 is a sectional view showing a semiconductor package 1 used for a CCD device or the like. The semiconductor package 1 includes a TCP substrate 2, a CMOS chip 3 bonded to the front surface 2 a side of the TCP substrate 2, and an optical glass (optical low) mounted on the rear surface 2 b side.
-Pass Filter) 4. In addition,
In FIG. 6, reference numeral 2c denotes a lead portion. Further, a micro lens 3a and a bump electrode 3b are formed on the CMOS chip 3, and the bump electrode 3b is connected to the lead 2c.

[0005] Such a semiconductor package 1 is manufactured by a process as shown in FIG. 7 using a bonding apparatus. That is, a UV curable adhesive is applied to the back surface 2b side of the TCP substrate 2, the optical glass 4 is bonded,
The optical glass 4 is mounted by irradiating V light. Next, an anisotropic conductive paste (hereinafter referred to as “AC”) is formed on the surface 2 a side of the TCP substrate 2.
P (Anisotropic Conductive)
Paste) ". ) Is applied, the bump electrodes 3b of the CMOS chip 3 are positioned so as to correspond to the lead portions 2c, and are mounted by heating and pressing using a bonding tool 6 described later.

Conventionally, a coating device for applying a UV curable adhesive to a TCP substrate, an irradiation device for irradiating UV light, a coating device for applying an anisotropic conductive paste, a bonding device for mounting a chip, and the like are respectively independent. I was

On the other hand, the bonding tool 6 is supported by an elastic member such as a spring 7 as shown in FIG. 8, and presses the CMOS chip 3 using a linear motion mechanism 8. FIG. 9 shows a load cell 9 provided in the linear motion mechanism 7.
6 is a graph showing a change in load detected by the method.

[0006]

The above-described bonding apparatus has the following problems. That is, since the application device for applying the UV-curable adhesive and the irradiation device for irradiating UV light are performed by separate devices, there is a problem that dust is mixed in at the time of transportation and productivity is lowered. Was.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding apparatus and a bonding method capable of efficiently mounting electronic components or optical glass on both front and back surfaces of a substrate such as a TCP tape or the like while preventing dust from being mixed.

[0008]

In order to solve the above-mentioned problems and to achieve the object, according to the first aspect of the present invention, an electronic component is mounted on the front surface of a substrate having electrodes formed on the front surface thereof. Then, in a bonding apparatus that mounts optical glass on the back side of the substrate, a UV-curable adhesive application unit that applies a UV-curable adhesive to the back side of the substrate, and the UV-curable adhesive is applied. An optical glass bonding unit that bonds the optical glass to a predetermined position on the back side of the substrate, and the substrate to which the optical glass is bonded is transmitted through the optical glass and irradiated with UV light to cure the UV curable adhesive. A UV light irradiation unit for mounting the optical glass, an anisotropic conductive paste application unit for applying an anisotropic conductive paste to the electrodes of the substrate, An electronic component positioning unit that positions the electronic component at a predetermined position on the front surface side of the substrate; an electronic component bonding unit that mounts the electronic component on a substrate coated with the anisotropic conductive paste; And a substrate feeder unit for transporting the substrate.

According to a second aspect of the present invention, there is provided a bonding apparatus for mounting an optical glass on one side of a substrate, wherein the UV-curable adhesive is applied to one side of the substrate. A coating unit, an optical glass bonding unit for bonding the optical glass to a predetermined position on one surface side of the substrate coated with the UV-curable adhesive, and the optical glass passing through the substrate to which the optical glass is bonded UV light is irradiated to cure the UV-curable adhesive and mount the optical glass
A light irradiation unit and a substrate feeder unit for transporting the substrate between the units are provided.

According to a third aspect of the present invention, there is provided a bonding apparatus for mounting an electronic component on the one surface side of a substrate having an electrode formed on one surface side thereof, wherein the electrode of the substrate is anisotropically conductive. An anisotropic conductive paste application unit for applying paste, an electronic component positioning unit for positioning the supplied electronic component at a predetermined position on one surface side of the substrate, and applying the electronic component to the anisotropic conductive paste. An electronic component bonding unit for flip-chip mounting on the coated substrate and a substrate feeder unit for transporting the substrate between the units are provided.

According to a fourth aspect of the present invention, in the bonding method, an electronic component is mounted on the front side of the substrate having electrodes formed on the front side, and optical glass is mounted on the rear side of the substrate. A UV-curable adhesive application step of applying a UV-curable adhesive to the back side of the substrate, and an optical glass bonding step of bonding the optical glass to a predetermined position on the back side of the substrate to which the UV-curable adhesive has been applied And a UV light irradiation step of transmitting the optical glass to the substrate to which the optical glass is bonded, irradiating the optical glass with UV light, curing the UV curable adhesive, and mounting the optical glass, and An anisotropic conductive paste application step of applying an anisotropic conductive paste, and electronic component positioning for positioning the supplied electronic component at a predetermined position on the front surface side of the substrate And extent to the electronic component so as to comprise an electronic component bonding step of mounting the substrate coated with the anisotropic conductive paste, and a substrate feeder step of conveying the substrate between the respective steps.

According to a fifth aspect of the present invention, there is provided a bonding method for mounting optical glass on one side of a substrate, wherein the UV-curable adhesive is applied to one side of the substrate. A coating step, an optical glass bonding step of bonding the optical glass to a predetermined position on one surface side of the substrate coated with the UV curable adhesive, and a transmission of the optical glass to the substrate to which the optical glass is bonded. Then, a UV light irradiation step of irradiating UV light to cure the UV curable adhesive to mount the optical glass, and a substrate feeder step of transporting the substrate between the respective steps are provided.

According to a sixth aspect of the present invention, there is provided a bonding method for mounting an electronic component on the one surface of a substrate having an electrode formed on one surface thereof, the method comprising: An anisotropic conductive paste application step of applying paste, an electronic component positioning step of positioning the supplied electronic component at a predetermined position on one surface side of the substrate, and applying the electronic component to the anisotropic conductive paste. An electronic component bonding step of mounting the substrate on the coated substrate and a substrate feeder step of transporting the substrate between the respective steps are provided.

As a result of taking the above measures, the following operation occurs. In other words, according to the first aspect of the present invention, the U.S.A.
It can apply V-curing adhesive, bond optical glass, mount optical glass, apply anisotropic conductive paste, position electronic components, and mount electronic components.
It is possible to suppress the entry of dust and improve the productivity because each operation can be performed independently.

According to the second aspect of the present invention, it is possible to apply the UV curable adhesive, bond the optical glass, and mount the optical glass without taking out the substrate once put out of the apparatus. It is possible to suppress the entry of dust and improve the productivity because each operation can be performed independently.

According to the third aspect of the present invention, the application of the anisotropic conductive paste, the positioning of the electronic component, and the mounting of the electronic component can be performed without taking out the substrate once inserted from the apparatus. It is possible to suppress the entry of dust and improve the productivity because each operation can be performed independently.

According to the fourth aspect of the present invention, the UV-curable adhesive is applied, the optical glass is bonded, the optical glass is mounted, and the anisotropic conductive paste is applied without taking the substrate once put out of the apparatus. Since application, positioning of electronic components, and mounting of electronic components can be performed, contamination of dust can be suppressed, and productivity can be improved since each operation can be performed independently.

According to the fifth aspect of the present invention, the application of the UV curable adhesive, the bonding of the optical glass, and the mounting of the optical glass can be performed without taking out the substrate once charged from the apparatus. It is possible to suppress the entry of dust and improve the productivity because each operation can be performed independently.

According to the sixth aspect of the invention, the application of the anisotropic conductive paste, the positioning of the electronic component, and the mounting of the electronic component can be performed without taking out the substrate once inserted from the apparatus. It is possible to suppress the entry of dust and improve the productivity because each operation can be performed independently.

[0020]

FIG. 1 is a perspective view showing a bonding apparatus 10 according to one embodiment of the present invention. FIG. 2 is a perspective view showing a glass bonding unit 53 incorporated in the bonding apparatus 10, and FIG. 3 is a perspective view showing a chip bonding unit 83 incorporated in the bonding apparatus 10. In the drawings, arrows XYZ indicate three directions orthogonal to each other, in particular, XY indicates a horizontal direction and Z indicates a vertical direction.

The bonding apparatus 10 includes a loader unit 20 for supplying the TCP substrate 2, a feeder unit 30 for transporting the TCP substrate 2 in the direction of arrow X in FIG.
A UV-curable adhesive application unit 40 for applying a UV-curable adhesive to the TCP substrate 2, a glass mounting unit 50 for bonding the optical glass 4 to the TCP substrate 2,
A UV irradiation unit 60 for irradiating the P substrate 2 with UV light to cure the UV curable adhesive, an ACP application unit 70 for applying ACP to the TCP substrate 2, and a CMOS chip 3
Chip mounting units 80 for bonding the TCP substrate 2 to the TCP substrate 2, an unloader unit 90 for accommodating the TCP substrate 2, and a control unit 10 for cooperatively controlling these units.
0. In FIG. 1, reference numeral 11 denotes a frame on which each unit is placed.

The loader unit 20 includes a dedicated magazine 21 for vertically stacking and storing the carrier-packed TCP boards 2 and a transport mechanism 22 disposed adjacent to the dedicated magazine 21. The transport mechanism 22 includes a guide 23 extending in the direction of arrow X in FIG.
3 and a slider 24 reciprocating along
4 is provided with a plate 25 provided to be movable up and down in the direction of arrow Z in FIG. 1, and an elevating mechanism 26 for moving the plate 25 up and down.

The feeder unit 30 includes a guide portion 31 extending in the direction of arrow Y in FIG. 1, and first to third sliders 32 to 34 reciprocating along the guide portion 31.

The first slider 32 has a first chuck 32a and a second chuck 32b for detachably holding a carrier.
Are provided. The second slider 33 is provided with a third chuck 33a and a fourth chuck 33b for detachably holding the carrier. The fourth chuck 33
b is configured to rotate 180 ° between the position α and the position β in FIG.

The third slider 34 has a fifth chuck 34a and a sixth chuck 34b for holding the carrier detachably.
Are provided. UV curing adhesive application unit 4
0 is a guide portion 41 extending in the arrow X direction in FIG.
A slider 42 reciprocating along the guide portion 41,
The UV curing adhesive application stage 43 provided on the slider 42 has one end 41 a of the guide portion 41.
And a coating mechanism 44 provided on the side.

The UV-curable adhesive application stage is 43
Is provided so as to be position-adjustable along the arrow XY directions in FIG. The application mechanism 44 includes a positioning mechanism 44a for positioning a UV-curable adhesive application nozzle 44b, which will be described later, along the directions indicated by arrows XYZ in FIG. 1, and a positioning mechanism 44a.
UV-curable adhesive application nozzle 44 positioned by
b and a CCD camera 44c.

The glass mounting unit 50 includes the optical glass 4
, A glass pickup unit 52 that picks up the optical glass 4 supplied by the glass loader unit 51, a glass bonding unit 53, and a transport mechanism 54.

The glass loader unit 51 includes a tray T1
1 and a positioning mechanism 51b for positioning the holding portion 51a in the directions indicated by arrows XY in FIG. In the tray T, an optical glass 4 coated with a translucent light blue paint serving as a filter is arranged in the center of a transparent glass of about 10 mm square in the tray T1 with its direction aligned. Incidentally, the tray T1 is appropriately replaced by an operator.

The glass pickup unit 52 includes a positioning mechanism 52a for positioning a head 52b, which will be described later, along the directions indicated by arrows XYZ in FIG.
a head 52b positioned by a
A rotation mechanism 52c provided in the apparatus and operating in the direction of the arrow θ in FIG.
And a suction nozzle 52d supported by the rotation mechanism 52c.
And a CCD camera 52e supported by the head 52b.

The glass bonding unit 53 is shown in FIG.
As shown in FIG.
Positioning mechanism 5 for positioning along the middle arrow XYZ directions
3a, a bonding mechanism 53b positioned by the positioning mechanism 53a, and a bonding mechanism 53
b, a load ball screw mechanism 53c operating in the direction of arrow Z in FIG. 1, a bar 53d vertically moved by the load ball screw mechanism 53c, a load measuring device 53e provided on the bar 53d, and a bar 53d. A head 53g coupled to the distal end via an engaging portion 53f. The head 53g has a bonding tool 53
h and a CCD camera 53i.

The transport mechanism 54 includes a guide portion 54a extending in the direction of arrow X in FIG. 1, a slider 54b reciprocating along the guide portion 54a, and a glass bonding stage 54c supported by the slider 54b. It has.

The UV irradiation unit 60 includes a guide 61 extending in the direction of arrow X in FIG. 1, a slider 62 reciprocating along the guide 61, a stage 63 supported by the slider 62, A UV irradiator 64 arranged on the end 61 a side of the guide 61.

The UV irradiation section 64 is provided with a UV irradiation furnace 6 described later.
1 includes an up-down movement mechanism 64a for moving the 4b up and down along the arrow Z direction in FIG. 1, and a UV irradiation furnace 64b supported by the up-down movement mechanism 64a to irradiate UV light.

The ACP coating unit 70 is indicated by an arrow X in FIG.
A guide portion 71 extending in the direction, a slider 72 reciprocating along the guide portion 71, an ACP coating stage 73 provided on the slider 72, and a guide portion 71 provided on one end 71a side. Provided application mechanism 74.

The ACP coating stage 73 is indicated by an arrow XY in FIG.
It is provided so that the position can be adjusted along the direction. The coating mechanism 74 is a positioning mechanism 74a for positioning an ACP coating nozzle 74b described later along the arrow XYZ directions in FIG.
And the AC positioned by the positioning mechanism 74a.
A P application nozzle 74b and a CCD camera 74c are provided.

The chip mounting unit 80 includes a chip loader unit 81 for supplying chips, a chip pickup unit 82 for picking up the CMOS chips 3 supplied by the chip loader unit 81, a chip bonding unit 83, and a transport mechanism 84. It has.

The chip loader unit 81 has a holding section 81a for holding a tray T2 on which the CMOS chips 3 are arranged.
And a positioning mechanism 81b for positioning the holding portion 81a in the directions indicated by arrows XY in FIG.

The chip pickup unit 82 includes a positioning mechanism 82a for positioning a head 82b, which will be described later, along the directions indicated by arrows XYZ in FIG.
a and a head 82b
A rotation mechanism 82c provided in the apparatus and operating in the direction of the arrow θ in FIG.
And a suction nozzle 82d supported by the rotating mechanism 82c.
And a CCD camera 82e supported by the head 82b.

FIG. 3 shows the chip bonding unit 83.
As shown in FIG.
Positioning mechanism 8 for positioning along the middle arrow XYZ directions
3a, a bonding mechanism 83b positioned by the positioning mechanism 83a, and a bonding mechanism 83
1B, a load ball screw mechanism 83c that operates in the direction of the arrow Z in FIG. 1, a bar 83d that moves up and down by the load ball screw mechanism 83c, a load measuring device 83e provided on the bar 83d, and a bar 83d. A head 83g coupled to the distal end via an engaging portion 83f. The bonding tool 83 is attached to the head 83g.
h and a CCD camera 83i.

The transport mechanism 84 includes a guide portion 84a extending in the direction of arrow X in FIG. 1, a slider 84b reciprocating along the guide portion 84a, and a chip bonding stage 84c supported by the slider 84b. It has.

The unloader unit 90 includes a dedicated magazine 91 for vertically stacking and storing the carrier-packed TCP substrates 2, and a transport mechanism 92 arranged adjacent to the dedicated magazine 91. The transport mechanism 92 is shown in FIG.
A guide portion 93 extending in the middle arrow X direction, a slider 94 reciprocating along the guide portion 93, and a plate 95 provided on the slider 94 and movable vertically in the arrow Z direction in FIG. And an elevating mechanism 96 for moving the plate 95 up and down.

The control unit 100 is provided with a touch panel on which an operator makes various settings, a monitor for displaying images by a CCD camera, and the like. In the bonding apparatus 10 configured as described above, the semiconductor package 1 is manufactured in the process shown in FIG. That is, the plate 2 is adjusted to fit the height of an arbitrary carrier among the carriers housed in the dedicated magazine 21 of the loader unit 20.
The height of 5 is adjusted by operating the lifting mechanism 26.

Next, the carrier in the dedicated magazine 21 is pulled out and transferred onto the plate 25. Then, the slider 24 moves along the guide portion 23, and moves to a position indicated by a two-dot chain line K1.

The carrier on the plate 25 located at the two-dot chain line K1 is moved to the first chuck 32a of the feeder unit 30.
, And the UV curing adhesive application stage positioned at the two-dot chain line K2 is transferred onto the 43. The UV curing adhesive application stage 43 holds the TCP substrate 2 by suction.

The slider 42 is moved toward the end 41 a along the guide portion 41, and the UV-curable adhesive application stage is positioned below the application mechanism 44. Next, two edges of the cutout edge of the TCP substrate 2 are imaged by extracting features of the TCP substrate 2 by the CCD camera 44c. The position deviation from the predetermined reference position of the TCP substrate 2 is calculated from the two points of the notch edge, and the UV curing adhesive application stage 43 corrects the position by the position deviation by the 43. Thus, the UV curable adhesive application nozzle 44b and the TCP substrate 2 can be accurately positioned.

Subsequently, the UV curable adhesive application nozzle 44b is lowered by the positioning mechanism 44a, and the UV curable adhesive is applied around the cutout of the upper surface of the TCP substrate 2. UV
After applying the curable adhesive, the UV curable adhesive application nozzle 4
4b is raised. Then, the UV curing adhesive application stage moves the 43 to the delivery position K2 to the feeder unit 30.

The TCP substrate 2 on which the UV-curable adhesive has been applied is held by the second chuck 32b of the feeder unit 30 at the glass bonding stage 54c positioned at the two-dot chain line K3.
Transfer to the top. The glass bonding stage 54c is T
The CP substrate 2 is held by suction. Then, the slider 54b is moved along the guide portion 54a, and moves to the glass mounting position G.

On the other hand, the optical glass 4 in the tray T1 held on the holding portion 51a is imaged by the CCD camera 52e, and two outer edges of the optical glass 4 are recognized using pattern matching. Then, the position shift amount of the optical glass 4 is calculated from the two points. And the positioning mechanism 5
The positional deviation is corrected by 1b, and the central part of the optical glass 4 is suctioned by applying a negative pressure from another suction device to the center of the optical glass 4 by the suction nozzle 52d.

By operating the rotation mechanism 52c, the suction nozzle 5
2d is rotated by 180 ° in the direction of the arrow θ in FIG. 1, and the positioning mechanism 52a is operated to move to the transfer position on the glass bonding unit 53 side.

Then, the optical glass 4 sucked and held by the suction nozzle 52d is received by the bonding tool 53h, and is moved by the positioning mechanism 53a above the glass bonding stage 54c located at the glass mounting position G.

Next, two edges of the cutout edge of the TCP substrate 2 are imaged by extracting the characteristics of the TCP substrate 2 by the CCD camera 53i. The position shift amount of the TCP substrate 2 is calculated from the two points of the notch edge, and the position shift amount is corrected by the positioning mechanism 53a and the glass bonding stage 54c. Thereby, the bonding tool 53h and T
The alignment with the CP substrate 2 can be accurately performed.

Subsequently, the ball screw mechanism for load 53c is operated, and the bonding tool 53h is connected via the bar 53d.
Is lowered, and the optical glass 4 is pressed against the TCP substrate 2.
At this time, the bonding load is measured in real time by always taking in the measurement load of the load measuring device 53e.
In this apparatus, since the bonding tool 53h is not supported by an elastic body such as a spring, a measurement error due to aging does not occur, so that highly accurate measurement and appropriate load can be performed. When the bonding load reaches the set load, the load increase is stopped.

After the pressing by the set load has elapsed for a set time, the bonding tool 53h is raised. The glass bonding stage 54c is moved from the glass mounting position G to a transfer position K3 to the feeder unit 30. The TCP substrate 2 on which the optical glass 4 is mounted is transferred by the feeder unit 30 onto the stage 63 located at the two-dot chain line K4. Then, the TCP substrate 2 is moved by the stage 63.
Is held by suction.

Then, the slider 62 is moved to the end 61 a of the guide 61, and the UV of the stage 63
It is positioned below the irradiation furnace 64b. Next, the vertical movement mechanism 64
a is activated to lower the UV irradiation furnace 64 so as to cover the TCP substrate 2 and the stage 63. Then, UV light is irradiated for a set time.

The vertical movement mechanism 64a is operated to activate the UV irradiation furnace 6.
4b is raised, and the stage 63 is moved to the transfer position K4 to the feeder unit 30. The carrier is gripped by the fourth chuck 33b from above the stage 63 located at the transfer position K4, and AC
It is transferred onto the P coating stage 73. At this time, the fourth chuck 33b rotates 180 °, and turns the TCP substrate 2 upside down. Therefore, the bonding surface of the optical glass 4 faces down. The ACP coating stage 73 holds the TCP substrate 2 by suction.

The slider 72 is moved toward the end 71 a along the guide 71, and the ACP coating stage 73 is positioned below the coating mechanism 74. Next, the CCD camera 74
c, two cutout edges of the TCP substrate 2 are imaged by extracting features of the TCP substrate 2. The position shift amount of the TCP substrate 2 is calculated from the two notch edge points, and the position shift amount is corrected by the ACP coating stage 73. Thereby, the ACP application nozzle 74b and the TCP substrate 2 can be accurately positioned.

Subsequently, ACP is performed by the positioning mechanism 74a.
The application nozzle 74b is lowered to apply the ACP around the cutout on the upper surface of the TCP substrate 2. After the application of the ACP, the ACP application nozzle 74b is raised. Then, the ACP coating stage 73 is transferred to the feeder unit 30 at the transfer position K5.
Move to.

The TCP substrate 2 on which ACP has been applied is held by the fifth chuck 34a of the feeder unit 30 by the two-dot chain line K.
The wafer is transferred onto the chip bonding stage 84c located at No. 6. Since two sets of chip mounting units 80 are provided, the side on which mounting is not performed is selected and TCP
The substrate 2 can be transported.

The chip bonding stage 84c is TC
The P substrate 2 is held by suction. Then, the slider 84b is moved along the guide portion 84a, and moves to the chip mounting position C.

On the other hand, the CMOS chip 3 in the tray T2 held on the holding section 81a is imaged by the CCD camera 82e, and the outer edge 2
Recognize places. Then, the displacement amount of the CMOS chip 3 is calculated from the two points. Then, the positioning mechanism 81
b to correct the positional deviation amount, and the suction nozzle 82d
The central part of the MOS chip 3 is sucked by applying a negative pressure from another suction device.

The rotation mechanism 82c is operated, and the suction nozzle 8
1d is rotated by 180 ° in the direction of the arrow θ in FIG. 1, and the positioning mechanism 52a is operated to move to the transfer position on the chip bonding unit 83 side.

Then, the CMOS chip 3 sucked and held by the suction nozzle 82d is received by the bonding tool 83h, and the chip bonding stage 84c positioned at the chip mounting position C by the positioning mechanism 83a.
Move upward.

Next, two edges of the notched portion of the TCP board 2 are imaged by extracting features of the TCP board 2 by the CCD camera 83i. The position shift amount of the TCP substrate 2 is calculated from the two points of the cutout edge, and the position shift amount is corrected by the positioning mechanism 83a and the chip bonding stage 84c. Thereby, the bonding tool 53h and T
The alignment with the CP substrate 2 can be accurately performed.

Subsequently, the ball screw mechanism for load 83c is operated, and the bonding tool 83h is connected via the bar 83d.
Is lowered, and the CMOS chip 3 is pressed against the TCP substrate 2. At this time, the bonding load is measured in real time by always taking in the measurement load of the load measuring device 83e. In this apparatus, since the bonding tool 83h is not supported by an elastic body such as a spring, a measurement error due to aging does not occur, so that high-accuracy measurement and appropriate load can be performed. When the bonding load reaches the set load, the load increase is stopped.

After a predetermined time has elapsed from the pressing by the set load, the bonding tool 83h is raised. The chip bonding stage 84c is moved from the chip mounting position C to a transfer position K6 to the feeder unit 30. The TCP substrate 2 on which the optical glass 4 and the CMOS chip 3 are mounted is transferred by the feeder unit 30 onto the plate 95 located at the two-dot chain line K7. And the guide part 93
The slider 94 is moved along and moves to the front of the dedicated magazine 91. The height of the plate 25 is adjusted by operating the elevating mechanism 96 to match the height of the empty space in the dedicated magazine 91. Next, the carrier on the plate 95 is inserted into the dedicated magazine 95.

The TCP by the feeder unit 30
Transfer of substrate 2 from K1 to K2, transfer from K2 to K3, transfer from K3 to K4, transfer from K4 to K5, K
The transfer from 5 to k6 is performed simultaneously.

That is, the TC by the loader unit 20
Supply of P substrate 2, application of UV curable adhesive to TCP substrate 2 by UV curable adhesive application unit 40, optical glass 4 to TCP substrate 2 by glass mounting unit 50
Bonding, irradiation of UV light by the UV irradiation unit 60, application of ACP to the TCP substrate 2 by the ACP coating unit 70, mounting of the CMOS chip 3 on the TCP substrate 2 by the chip mounting unit 80, and TCP substrate 2 by the unloader unit 90 Each operation of the accommodation is performed in parallel.

Therefore, as soon as the operation with the longest operation time among the operations in each unit is completed, all the TCP substrates 2 in the apparatus are simultaneously transported by the feeder unit 30. Since chip mounting takes the longest time for the operation, two sets of chip mounting units 80 are provided.
As a result, the TC removed from the ACP coating unit 70
By alternately transporting the P board 2 to the two chip mounting units 80, productivity can be improved.

As described above, UV curing adhesive application, optical glass mounting, UV irradiation, ACP application, and chip mounting can be performed by one apparatus. T once put
Since the application and mounting can be performed without taking out the CP substrate 2 from the apparatus, contamination of dust into the module can be minimized. Further, since each processing can be performed in parallel, productivity can be improved and a highly versatile manufacturing apparatus can be realized.

The present invention is not limited to the embodiment. That is, in the above-described embodiment, TC
Although only the case where the optical glass 4 and the chip 3 are mounted on the front and back surfaces of the P substrate 2 has been described, the present invention can also be applied to a device in which a bonding paste is applied to one surface and a chip or the like is flip-chip mounted. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0071]

According to the present invention, it is possible to apply a UV curable adhesive, bond an optical glass, bond an optical glass by UV irradiation, apply an ACP, apply an electronic Since positioning of components, mounting of electronic components, and the like can be performed, mixing of dust can be suppressed, and each operation can be performed independently, so that productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a glass bonding unit incorporated in the bonding apparatus.

FIG. 3 is a perspective view showing a chip bonding unit incorporated in the bonding apparatus.

FIG. 4 is a flowchart showing a bonding step in the bonding apparatus.

FIG. 5 is a graph showing a load change in the chip bonding unit.

FIG. 6 is a cross-sectional view illustrating the structure of a semiconductor package.

FIG. 7 is an explanatory view showing a conventional semiconductor package manufacturing process.

FIG. 8 is a side view showing a configuration of a chip bonding unit incorporated in a conventional semiconductor package manufacturing apparatus.

FIG. 9 is a graph showing a load change in the chip bonding unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor package 2 ... TCP board 3 ... CMOS chip 4 ... Optical glass 10 ... Bonding apparatus 11 ... Stand 20 ... Loader unit 30 ... Feeder unit 40 ... UV curing adhesive application unit 50 ... Glass mounting unit 51 ... Glass loader unit 52 ... Glass pickup unit 53 ... Glass bonding unit 54 ... Transport mechanism 60 ... UV irradiation unit 70 ... ACP coating unit 80 ... Chip mounting unit 81 ... Chip loader unit 82 ... Chip pickup unit 83 ... Chip bonding unit 84 ... Transport mechanism 90 ... Unloader unit 100 ... Control unit

Claims (6)

[Claims] 1. A bonding apparatus for mounting electronic components on the front side of a substrate having electrodes formed on the front side thereof and mounting optical glass on the rear side of the substrate, wherein a UV curing type is mounted on the rear side of the substrate. A UV-curable adhesive application unit for applying an adhesive, an optical glass bonding unit for bonding the optical glass to a predetermined position on the back side of the substrate to which the UV-curable adhesive has been applied, A UV light irradiating unit for mounting the optical glass by irradiating the optical glass with the UV light through the optical glass to cure the UV curable adhesive, and applying an anisotropic conductive paste to the electrodes of the substrate An anisotropic conductive paste application unit, and an electronic component positioning unit for positioning the supplied electronic component at a predetermined position on the surface of the substrate Bonding apparatus characterized by comprising an electronic component bonding unit that implements the electronic components on a substrate coated with the anisotropic conductive paste, and a substrate feeder unit for transporting the substrate between the respective units. 2. A bonding apparatus for mounting optical glass on one surface of a substrate, wherein a UV-curable adhesive is applied to one surface of the substrate.
A V-curable adhesive application unit, an optical glass bonding unit for bonding the optical glass to a predetermined position on one surface of the substrate coated with the UV-curable adhesive, and a substrate on which the optical glass is bonded. A UV light irradiating unit for irradiating UV light through the optical glass and curing the UV curable adhesive to mount the optical glass, and a substrate feeder unit for transporting the substrate between the units. A bonding apparatus characterized in that: 3. A bonding apparatus for mounting an electronic component on one surface of a substrate having electrodes formed on one surface thereof, wherein an anisotropic conductive paste is applied to the electrodes of the substrate. A paste application unit, an electronic component positioning unit for positioning the supplied electronic component at a predetermined position on one surface side of the substrate, and an electronic component for mounting the electronic component on the substrate coated with the anisotropic conductive paste A bonding apparatus comprising: a bonding unit; and a substrate feeder unit that transports the substrate between the units. 4. A bonding method in which electronic components are mounted on the front side of a substrate having electrodes formed on the front side, and optical glass is mounted on the rear side of the substrate. A UV curing adhesive application step of applying an adhesive; an optical glass bonding step of bonding the optical glass to a predetermined position on the back surface side of the substrate on which the UV curing adhesive is applied; UV light irradiating step of mounting the optical glass by irradiating the optical glass with UV light through the optical glass to cure the UV curable adhesive, and applying an anisotropic conductive paste to the electrodes of the substrate An anisotropic conductive paste application step; an electronic component positioning step of positioning the supplied electronic component at a predetermined position on the front surface side of the substrate; Bonding wherein the electronic component bonding step of mounting the anisotropic conductive paste coated substrate, that has a substrate feeder step of conveying the substrate between the respective steps. 5. A bonding method for mounting optical glass on one surface of a substrate, wherein a UV-curable adhesive is applied to one surface of the substrate.
A V-curable adhesive application step, an optical glass bonding step of bonding the optical glass to a predetermined position on one surface side of the substrate coated with the UV-curable adhesive, A UV light irradiation step of irradiating UV light through the optical glass and curing the UV curable adhesive to mount the optical glass, and a substrate feeder step of transporting the substrate between the respective steps is provided. A bonding method. 6. A bonding method for mounting an electronic component on the one surface of a substrate having electrodes formed on one surface thereof, wherein an anisotropic conductive paste is applied to the electrodes of the substrate. A paste application step, an electronic component positioning step of positioning the supplied electronic component at a predetermined position on one surface side of the substrate, and an electronic component mounting the electronic component on a substrate coated with the anisotropic conductive paste A bonding method, comprising: a bonding step; and a substrate feeder step of transporting the substrate between the respective steps.