JPH11192571A5 - - Google Patents

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Publication number
JPH11192571A5
JPH11192571A5 JP1998001518A JP151898A JPH11192571A5 JP H11192571 A5 JPH11192571 A5 JP H11192571A5 JP 1998001518 A JP1998001518 A JP 1998001518A JP 151898 A JP151898 A JP 151898A JP H11192571 A5 JPH11192571 A5 JP H11192571A5
Authority
JP
Japan
Prior art keywords
laser
laser beam
processing
branching
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998001518A
Other languages
English (en)
Japanese (ja)
Other versions
JP3853499B2 (ja
JPH11192571A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP00151898A priority Critical patent/JP3853499B2/ja
Priority claimed from JP00151898A external-priority patent/JP3853499B2/ja
Publication of JPH11192571A publication Critical patent/JPH11192571A/ja
Publication of JPH11192571A5 publication Critical patent/JPH11192571A5/ja
Application granted granted Critical
Publication of JP3853499B2 publication Critical patent/JP3853499B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP00151898A 1998-01-07 1998-01-07 レーザー加工装置 Expired - Fee Related JP3853499B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP00151898A JP3853499B2 (ja) 1998-01-07 1998-01-07 レーザー加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00151898A JP3853499B2 (ja) 1998-01-07 1998-01-07 レーザー加工装置

Publications (3)

Publication Number Publication Date
JPH11192571A JPH11192571A (ja) 1999-07-21
JPH11192571A5 true JPH11192571A5 (enExample) 2005-01-20
JP3853499B2 JP3853499B2 (ja) 2006-12-06

Family

ID=11503728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP00151898A Expired - Fee Related JP3853499B2 (ja) 1998-01-07 1998-01-07 レーザー加工装置

Country Status (1)

Country Link
JP (1) JP3853499B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1173303A1 (en) * 1999-04-27 2002-01-23 GSI Lumonics Inc. A system and method for material processing using multiple laser beams
US6875951B2 (en) 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
JP4780881B2 (ja) * 2001-09-28 2011-09-28 京セラ株式会社 プリプレグシートのレーザによる穿孔方法
JP2004185322A (ja) * 2002-12-03 2004-07-02 Sumitomo Heavy Ind Ltd 加工計画方法及び装置
WO2007077630A1 (ja) * 2006-01-06 2007-07-12 Mitsubishi Denki Kabushiki Kaisha レーザ加工装置、プログラム作成装置およびレーザ加工方法
KR100794062B1 (ko) * 2006-07-06 2008-01-10 미쓰비시덴키 가부시키가이샤 레이저 가공 장치, 프로그램 작성 장치 및 레이저 가공 방법
JP4933424B2 (ja) * 2006-09-28 2012-05-16 三菱電機株式会社 レーザ加工装置
US9421638B2 (en) 2006-12-22 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method using the same technical field
CN101687281B (zh) 2007-06-28 2012-06-27 松下电器产业株式会社 激光加工装置
CN105722340A (zh) * 2015-12-25 2016-06-29 惠州中京电子科技有限公司 一种pcb板的盲孔加工方法
JP6484204B2 (ja) * 2016-09-09 2019-03-13 ファナック株式会社 ガルバノスキャナ
CN114505602B (zh) * 2022-04-19 2022-07-01 中国工程物理研究院激光聚变研究中心 一种多轴旋切扫描系统的使用方法
CN116390361B (zh) * 2023-06-07 2023-10-20 淄博芯材集成电路有限责任公司 基于回旋型镭射轨迹优化x型镭射孔应力均匀性的方法
CN120460938B (zh) * 2025-07-14 2025-09-30 西南交通大学 一种激光钻孔方法

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