JPH11185850A - 回路基板の接続構造、及びその接続状態判断方法 - Google Patents
回路基板の接続構造、及びその接続状態判断方法Info
- Publication number
- JPH11185850A JPH11185850A JP9358260A JP35826097A JPH11185850A JP H11185850 A JPH11185850 A JP H11185850A JP 9358260 A JP9358260 A JP 9358260A JP 35826097 A JP35826097 A JP 35826097A JP H11185850 A JPH11185850 A JP H11185850A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- signal line
- connection
- connection structure
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9358260A JPH11185850A (ja) | 1997-12-25 | 1997-12-25 | 回路基板の接続構造、及びその接続状態判断方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9358260A JPH11185850A (ja) | 1997-12-25 | 1997-12-25 | 回路基板の接続構造、及びその接続状態判断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11185850A true JPH11185850A (ja) | 1999-07-09 |
| JPH11185850A5 JPH11185850A5 (enrdf_load_html_response) | 2005-04-14 |
Family
ID=18458371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9358260A Withdrawn JPH11185850A (ja) | 1997-12-25 | 1997-12-25 | 回路基板の接続構造、及びその接続状態判断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11185850A (enrdf_load_html_response) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006126294A (ja) * | 2004-10-26 | 2006-05-18 | Toshiba Matsushita Display Technology Co Ltd | 平面表示装置 |
| JP2010060813A (ja) * | 2008-09-03 | 2010-03-18 | Hitachi Displays Ltd | 表示装置 |
| CN105929319A (zh) * | 2016-04-20 | 2016-09-07 | 浪潮电子信息产业股份有限公司 | 一种基于异方性导电胶的测试设备连接方法 |
-
1997
- 1997-12-25 JP JP9358260A patent/JPH11185850A/ja not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006126294A (ja) * | 2004-10-26 | 2006-05-18 | Toshiba Matsushita Display Technology Co Ltd | 平面表示装置 |
| JP2010060813A (ja) * | 2008-09-03 | 2010-03-18 | Hitachi Displays Ltd | 表示装置 |
| US8836675B2 (en) | 2008-09-03 | 2014-09-16 | Japan Display Inc. | Display device to reduce the number of defective connections |
| CN105929319A (zh) * | 2016-04-20 | 2016-09-07 | 浪潮电子信息产业股份有限公司 | 一种基于异方性导电胶的测试设备连接方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20030094305A1 (en) | Pressure-welded structure of flexible circuit boards | |
| KR100257028B1 (ko) | 구동 회로 접속 구조 및 그 접속 구조를 포함하는 디스플레이 장치 | |
| US8013334B2 (en) | Bonding structure of circuit substrate for instant circuit inspecting | |
| JPS61123868A (ja) | パネル基板の位置合せ保証方法 | |
| JPWO2009004894A1 (ja) | 表示モジュール、液晶表示装置、及び表示モジュールの製造方法 | |
| US6300998B1 (en) | Probe for inspecting liquid crystal display panel, and apparatus and method for inspecting liquid crystal display panel | |
| CN100516887C (zh) | 探测装置的制造方法 | |
| JP3202525B2 (ja) | 電気回路基板及びそれを備えた表示装置 | |
| JP2001056477A (ja) | 液晶表示装置及びその検査方法 | |
| JPH10209581A (ja) | プリント配線板、液晶表示装置及び電子機器 | |
| JPH04216589A (ja) | 電子回路の接続構造 | |
| JP2003262884A (ja) | 液晶表示装置 | |
| JPH11185850A (ja) | 回路基板の接続構造、及びその接続状態判断方法 | |
| US6603467B1 (en) | Method and apparatus for LCD panel power up test | |
| JP4661300B2 (ja) | 液晶モジュール | |
| JP2514236B2 (ja) | 表示装置 | |
| JP2003090856A (ja) | 配線基板の実装検査方法 | |
| JP2001264794A (ja) | 液晶表示装置の製造方法 | |
| JPH11135909A (ja) | 電子機器及びフレキシブル配線板 | |
| JP2003158354A (ja) | 配線基板の実装検査方法 | |
| JPH10301137A (ja) | 液晶表示装置 | |
| JPH10301138A (ja) | 液晶表示装置 | |
| KR19980048605A (ko) | 액정표시모듈 | |
| JP2000235191A (ja) | 液晶表示装置 | |
| JP3553864B2 (ja) | Lcdパネル促進テスト方法およびそのための構造物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040609 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040609 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060810 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060815 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20061002 |