JPH11154766A - Light emitting diode, and signaling - Google Patents

Light emitting diode, and signaling

Info

Publication number
JPH11154766A
JPH11154766A JP26702798A JP26702798A JPH11154766A JP H11154766 A JPH11154766 A JP H11154766A JP 26702798 A JP26702798 A JP 26702798A JP 26702798 A JP26702798 A JP 26702798A JP H11154766 A JPH11154766 A JP H11154766A
Authority
JP
Japan
Prior art keywords
curvature
light
radius
light emitting
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26702798A
Other languages
Japanese (ja)
Other versions
JP2980121B2 (en
Inventor
Motokazu Yamada
元量 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
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Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP26702798A priority Critical patent/JP2980121B2/en
Publication of JPH11154766A publication Critical patent/JPH11154766A/en
Application granted granted Critical
Publication of JP2980121B2 publication Critical patent/JP2980121B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract

PROBLEM TO BE SOLVED: To make it possible to reduce light at a given angle from a light emission observing side without a bad influence and increase the luminance of light at a different angel, as an optical signal with respect to a light emitting element sealed with a transparent lens-shaped molding member. SOLUTION: A light emitting diode includes at least two lead terminals 103 and 104, a light emitting element connected electrically, and a transparent molding member 101 molding the light emitting element. The transparent molding member 101 has a top 201 as a projected optical lens. In this case, first to fourth radii of curvature including an optical axis crossing the tip 201 of the transparent molding member 101 having a relation such that the first radius of curvature from the tip 201 to an end 202 is larger than the third radius of curvature from the tip 201 to an end 204, the fourth radius of curvature from the tip 201 to an end 205 is equal to or larger than the second radius of curvature from the tip 201 to an end 203.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、発光素子を透光性
のレンズ状モールド部材にて封止した発光ダイオードに
係わり、特に、信号用など発光観測面側から見て一方の
光を抑制しその抑制の影響を少なくしつつ他方の光を高
輝度に放射させることができる発光ダイオードに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode in which a light-emitting element is sealed with a light-transmitting lens-shaped molding member. The present invention relates to a light emitting diode capable of emitting the other light with high luminance while reducing the influence of the suppression.

【０００２】[0002]

【従来技術】今日、赤色、黄色、青色及び青緑色が１０
００ｍｃｄ以上にも及ぶ超高輝度に発光可能な発光ダイ
オードが開発された。発光ダイオードは、半導体発光素
子であるため振動等に強く長期間安定して発光すること
ができる。また、消費電力が低いという長所もある。さ
らに、発光ダイオードは、半導体素子から単色性ピーク
波長が発光される。そのため、白色灯のように各発光色
のみを表現させるため、カラーフィルターを利用する必
要がない。さらにまた、等方的に放出される光を有効利
用するため大型な反射ミラーを使用する必要がない。し
たがって、発光ダイオードを信号機に利用した場合、外
来光が信号機内部に入射し白色灯の後部に設けられた大
型な反射ミラーで反射してカラー・フィルターを介して
信号機外に放出される疑似点灯現象を生ずることがな
い。したがって、信号機に利用される理想的な光源とし
て発光ダイオードを利用されつつある。BACKGROUND OF THE INVENTION Today, red, yellow, blue and turquoise
Light emitting diodes capable of emitting light with an ultra-high luminance of over 00 mcd have been developed. Since the light emitting diode is a semiconductor light emitting element, it is strong against vibration and the like and can emit light stably for a long period of time. Another advantage is low power consumption. Further, the light emitting diode emits a monochromatic peak wavelength from the semiconductor element. Therefore, it is not necessary to use a color filter because only each emission color is expressed like a white light. Furthermore, it is not necessary to use a large reflecting mirror to effectively use the light emitted isotropically. Therefore, when a light-emitting diode is used in a traffic light, the external light enters the traffic light, is reflected by a large reflecting mirror provided at the rear of the white light, and is emitted outside the traffic light through a color filter. Does not occur. Therefore, a light emitting diode is being used as an ideal light source used for a traffic light.

【０００３】発光ダイオードをより信号用等に効率よく
利用されるためには、反射ミラーをもった信号用光源な
どとは異なり１個ずつの発光ダイオードが所望の指向特
性をもつことが望ましい。信号機用などに利用される発
光ダイオードの配向特性としては、正面高度が高く上方
向へ発光する必要がない。他方、左右方向及び斜め下方
向においては、場所により視認する必要がある場合があ
る。そのため、各発光ダイオードがそれぞれ上記配向特
性を持つ必要がある。In order to use the light emitting diodes more efficiently for signals and the like, it is desirable that each light emitting diode has a desired directional characteristic unlike a signal light source having a reflection mirror. Regarding the orientation characteristics of light emitting diodes used for traffic lights, etc., the front elevation is high and there is no need to emit light upward. On the other hand, in the left-right direction and the diagonally downward direction, it may be necessary to visually recognize depending on the location. Therefore, each light emitting diode needs to have the above-mentioned orientation characteristics.

【０００４】一方、ディスプレイ等に用いられる発光ダ
イオードにも信号用発光ダイオードに近い発光特性が求
められる場合がある。特定方向の光を強めた発光ダイオ
ード例として、特開平５−１２１７８５号、特開平５−
２７５７５２号や特開平８−１６２６７３号などが挙げ
られる。On the other hand, there is a case where a light emitting diode used for a display or the like is required to have a light emitting characteristic close to that of a signal light emitting diode. Examples of a light emitting diode in which light in a specific direction is enhanced include JP-A-5-121785 and JP-A-5-121785.
No. 275752 and JP-A-8-162673.

【０００５】特開平５−２７５７５２号には、図７
（Ａ）、（Ｂ）、（Ｃ）に示す如く、少なくとも２本の
リード端子(703)(704)と、一方のリード端子(703)の先
端にダイボンディングされると共に他方のリード端子(7
04)をワイヤー(705)でボンディングされた発光素子(70
2)と、両リード端子(703)(704)の先端の部分をパッケー
ジする合成樹脂製のレンズ付きモールド部材とから成る
発光ダイオードが開示されている。特に、発光ダイオー
ドのモールド部における外周面の一部に、モールド部に
おける軸線と平行な平面(711)をモールド部におけるレ
ンズ(701)まで延びるように形成した発光ダイオードと
してある。[0005] Japanese Patent Application Laid-Open No. Hei 5-275752 discloses FIG.
As shown in (A), (B) and (C), at least two lead terminals (703) and (704) are die-bonded to the tip of one of the lead terminals (703) and the other lead terminal (7).
04) with a light emitting element (70) bonded with a wire (705).
2) and a light-emitting diode comprising a synthetic resin lens-equipped molded member that packages the tip portions of both lead terminals (703) and (704). In particular, the light emitting diode is formed such that a plane (711) parallel to the axis of the molded part extends to a lens (701) of the molded part on a part of the outer peripheral surface of the molded part of the light emitting diode.

【０００６】このようなレンズ形状とすることにより、
発光素子から出射される光のうちモールド部の外周面に
設けた平面(711)に向かって出射される光は、平面(711)
によって反射する。反射した光は、平面(711)と反対の
方向から出射される。平面(711)と反対の方向から出射
される出射光量分だけ人の目に届く光量をｕｐすること
ができる。したがって、発光ダイオードとしてはそれだ
け光量の小さいものを使用でき、消費電力を節減できる
ことが開示されている。By adopting such a lens shape,
Of the light emitted from the light emitting element, the light emitted toward the plane (711) provided on the outer peripheral surface of the mold portion is a plane (711)
Reflected by The reflected light is emitted from the direction opposite to the plane (711). The amount of light reaching the human eye can be increased by the amount of light emitted from the direction opposite to the plane (711). Therefore, it is disclosed that a light emitting diode having a smaller light amount can be used and power consumption can be reduced.

【０００７】[0007]

【発明が解決しようとする課題】しかし、このように形
成された発光ダイオードは信号用の上記特性を満たすこ
とができないばかりでなく、必ずしも上述の効果を奏し
ない場合がある。発光素子であるＬＥＤチップから放出
された光はモールド部材の形状に沿って集光されるが、
砲弾型のモールド部材の一面を平面(711)状に形成させ
ると、発光素子(702)から発光された光が全反射する。
全反射された光のうち、レンズ正面の曲率にあわせた設
計としてもレンズ正面において全反射される場合があ
る。そのため平面方向に向かって放出された発光素子(7
02)からの光がモールド部材の正面から放出され難くレ
ンズ(701)曲面に沿ってモールド部材内で反射を繰り返
し裏面側（すなわち、非発光観測面）から放出される場
合がある。モールド部材としてエポキシ樹脂を用い空気
中に発光素子からの光を放出される場合、屈折率の違い
から全反射した光も臨界角以下になり外部に放出されな
い。However, the light emitting diode thus formed cannot not only satisfy the above-mentioned characteristics for signals, but also may not always have the above-mentioned effects. The light emitted from the LED chip, which is a light emitting element, is collected along the shape of the mold member,
When one surface of the shell-shaped mold member is formed into a flat surface (711), the light emitted from the light emitting element (702) is totally reflected.
Of the totally reflected light, there is a case where the light is totally reflected at the front of the lens even if the light is designed according to the curvature of the front of the lens. Therefore, the light emitting element (7
The light from 02) is hard to be emitted from the front of the mold member, and may be repeatedly reflected in the mold member along the curved surface of the lens (701) and emitted from the back side (that is, the non-emission observation surface). When light from a light-emitting element is emitted into the air using an epoxy resin as a mold member, light totally reflected is not more than the critical angle due to the difference in refractive index and is not emitted to the outside.

【０００８】このようなモールド部材を利用して、平面
(711)で全反射された発光素子からの光を発光観測面側
に放出させようとすると砲弾形状が強くならざるを得な
い。そのため集光力が強く信号用など左右や下方向にあ
る程度幅(左右方向の半値幅約１５゜〜２０°、下方向
の半値幅約１５゜〜２０°、上方向の半値幅は、０゜で
もよい。）の広い光を得ることができないという問題を
有する。また、発光素子によっては、必ずしもレンズ設
計通りに発光しないという問題を有する。したがって、
本出願人は上記問題点を解決し信号用の利用などに適し
た所望通りの発光特性を効率よく発光可能な発光ダイオ
ードを提供することにある。Using such a mold member, a flat surface
If the light from the light emitting element totally reflected in (711) is to be emitted to the light emission observation surface side, the shape of the shell has to be strengthened. For this reason, the light condensing power is strong, such as for signals, and a certain width in the left and right or downward direction (half-width in the horizontal direction is about 15 ° to 20 °, half-width in the downward direction is about 15 ° to 20 °, half-width in the upward direction is 0 °) ) May not be obtained. Further, there is a problem that some light emitting elements do not always emit light as designed by the lens. Therefore,
It is an object of the present invention to provide a light emitting diode which can solve the above problems and efficiently emit light with desired light emitting characteristics suitable for signal use.

【０００９】[0009]

【課題を解決するための手段】本発明は、少なくとも２
つのリード端子(103)(104)と電気的に接続された発光素
子(102)と、該発光素子(102)を封止し先端(201)が凸状
の光学レンズとなる透光性モールド部材(101)とを有す
る発光ダイオードである。特に、先端(201)を通る光軸
を含む透光性モールド部材(101)の断面を構成する先端
(201)から端部(202)までの第１の曲率半径及び先端(20
1)から他方の端部(203)までの第２の曲率半径と、光軸
を含む断面と垂直をなす断面を構成する先端(201)から
端部(204)までの第３の曲率半径及び先端(201)から他方
の端部(205)までの第４の曲率半径が、第１の曲率半径
の大きさ＜第３の曲率半径の大きさ及び第４の曲率半径
の大きさ≦第２の曲率半径の大きさの関係を満たす発光
ダイオードである。SUMMARY OF THE INVENTION The present invention provides at least two
Light-emitting element (102) electrically connected to the two lead terminals (103) and (104), and a light-transmissive mold member that seals the light-emitting element (102) and forms an optical lens with a convex end (201). (101). In particular, the tip constituting the cross section of the translucent mold member (101) including the optical axis passing through the tip (201)
A first radius of curvature from the (201) to the end (202) and the tip (20
A second radius of curvature from 1) to the other end (203), a third radius of curvature from the tip (201) to the end (204), which constitutes a section perpendicular to the section including the optical axis, and The fourth radius of curvature from the tip (201) to the other end (205) is: the magnitude of the first radius of curvature <the magnitude of the third radius of curvature and the magnitude of the fourth radius of curvature ≦ second Is a light emitting diode satisfying the relationship of the magnitude of the radius of curvature.

【００１０】これにより、不要な上方の光量を低減させ
る一方左右方向及び下方向において広視野角に発光可能
な高輝度発光ダイオードとすることができる。特に、曲
率半径の小さい第１の曲率半径（上）方向からの外来光
の入射を防止しコントラストを向上させることができ
る。また、曲率半径の大きい第３、第４の曲率半径（左
右）や第２の曲率半径（下）方向から視野角の広い発光
特性とすることができる。Thus, it is possible to obtain a high-brightness light emitting diode capable of emitting light with a wide viewing angle in the left-right direction and the downward direction while reducing the unnecessary upper light amount. In particular, it is possible to prevent external light from being incident from the first radius of curvature (upper) direction having a small radius of curvature, thereby improving the contrast. Further, it is possible to obtain a light emission characteristic having a wide viewing angle from the third and fourth radii of curvature (left and right) and the second radius of curvature (downward) having a large radius of curvature.

【００１１】即ち、発光素子から曲率半径の小さい方向
へ向かった光は、視野角が狭く且つ軸上光度を向上させ
ることができる。また、発光素子から曲率半径の大きい
方向へ向かった光は、より視野角の広い発光特性とする
ことができる。That is, light directed from the light emitting element in the direction of a small radius of curvature has a narrow viewing angle and can improve on-axis luminous intensity. In addition, light traveling from the light emitting element in a direction having a large radius of curvature can have light emission characteristics with a wider viewing angle.

【００１２】本発明の請求項２に記載の発光ダイオード
は、第３の曲率半径の大きさと第４の曲率半径の大きさ
が略等しい発光ダイオードである。これにより左右方向
にも均一に指向特性が広く、且つ等しい発光ダイオード
とすることができる本発明の請求項３に記載の発光ダイ
オードは、光軸上の発光観測面側から見て第３及び第４
の曲率半径を構成する断面と、リード端子間(103)、(10
4)の配置方向とが略平行である。これにより、モールド
部材のクラックなどが極めて少なく信頼性の高い発光ダ
イオードとすることができる。A light emitting diode according to a second aspect of the present invention is a light emitting diode having a third radius of curvature substantially equal to a fourth radius of curvature. Thus, the light emitting diode according to the third aspect of the present invention, which has uniform directional characteristics even in the left-right direction and can be made equal, has the third and third light emitting diodes viewed from the light emission observation surface side on the optical axis. 4
(103), (10)
The arrangement direction of 4) is substantially parallel. Thereby, a highly reliable light emitting diode with few cracks in the mold member can be obtained.

【００１３】本発明の請求項４に記載の発光ダイオード
は、リード端子(103)が発光素子(102)からの光を反射す
るカップ(410)を有すると共にカップ(401)内に光軸上の
発光観測面側から見て、透光性モールド部材(101)の第
２の曲率半径、第３の曲率半径及び第４の曲率半径側よ
りも第１の曲率半径側の発光出力が高い配置とさせた発
光素子(102)を有するものである。これにより、発光素
子からの光をより有効に利用し所望通りの発光特性を得
ることができる。According to a fourth aspect of the present invention, in the light emitting diode, the lead terminal (103) has a cup (410) for reflecting the light from the light emitting element (102) and the cup (401) has an optical axis. When viewed from the light emission observation surface side, the light emitting output on the first radius of curvature side is higher than the second radius of curvature, the third radius of curvature, and the fourth radius of curvature of the translucent mold member (101). Having a light emitting element (102). This makes it possible to more effectively use light from the light emitting element and obtain desired light emission characteristics.

【００１４】本発明の請求項５に記載の信号機は、少な
くとも２つのリード端子と電気的に接続された発光素子
と、該発光素子を封止し先端が凸状の光学レンズとなる
透光性モールド部材とを有する発光ダイオードを複数配
置させてある。特に、発光ダイオードは先端を通る光軸
を含む透光性モールド部材の断面を構成する先端から端
部までの第１の曲率半径及び先端から他方の端部までの
第２の曲率半径と、光軸を含む前記断面と垂直をなす断
面を構成する先端から端部までの第３の曲率半径及び先
端から他方の端部までの第４の曲率半径がそれぞれ第１
の曲率半径の大きさ＜第３の曲率半径の大きさ、第４の
曲率半径の大きさ≦第２の曲率半径の大きさの関係を満
たすと共に各発光ダイオードを同一方向に配置してあ
る。これにより、不要な上方の光量を低減させる一方左
右方向及び下方向において広視野角に発光可能な高輝度
信号機とすることができる。According to a fifth aspect of the present invention, there is provided a traffic light device, wherein the light emitting element is electrically connected to at least two lead terminals, and the light transmitting element is a light emitting element which seals the light emitting element and forms an optical lens having a convex end. A plurality of light emitting diodes having a mold member are arranged. In particular, the light-emitting diode has a first radius of curvature from the tip to the end and a second radius of curvature from the tip to the other end that define the cross-section of the translucent mold member including the optical axis passing through the tip. The third radius of curvature from the tip to the end and the fourth radius of curvature from the tip to the other end, which constitute a section perpendicular to the section including the axis, are each a first radius.
And the light-emitting diodes are arranged in the same direction, satisfying the following relationship: magnitude of radius of curvature <magnitude of third radius of curvature, magnitude of fourth radius of curvature ≦ magnitude of second radius of curvature. This makes it possible to provide a high-brightness signal device capable of emitting light with a wide viewing angle in the left-right direction and the downward direction while reducing the unnecessary upper light amount.

【００１５】[0015]

【発明の実施の形態】本発明者は種々の実験の結果、モ
ールド部材を特定形状とさせることにより、一方の指向
角を抑制させ中心高度を向上させつつその他の指向角を
制御できることを見いだし本発明を成すに到った。BEST MODE FOR CARRYING OUT THE INVENTION As a result of various experiments, the present inventor has found that by setting a mold member to a specific shape, it is possible to control one directional angle while improving the center altitude while controlling the other directional angle. The invention has been reached.

【００１６】即ち、モールド部材の形状を上方向、左右
方向や下方向など少なくとも２種類以上の異なる曲率半
径を持つことにより、それぞれ独立した発光特性を示す
ことができる。曲率半径の小さい端面方向からの光を正
面輝度向上に利用しつつ、曲率半径の大きい端面方向か
ら半値幅の広い発光を得ることができるものである。特
に、信号用発光ダイオードのモールド部材としては、光
軸から透光性モールド部材の上方となる第１の曲率半
径、左右方向となる第３の曲率半径、第４の曲率半径及
び下方となる第２の曲率半径が少なくとも第１の曲率＜
第３の曲率＝第４の曲率及び第２の曲率の関係とするこ
とにより、上方への光を正面発光に寄与させつつ、左右
方向や下方の視野角を広くさせることができる。That is, when the shape of the mold member has at least two types of different radii of curvature, such as upward, rightward, leftward, and downward, independent light emission characteristics can be exhibited. Light with a wide half width can be obtained from the end face with a large radius of curvature while utilizing the light from the end face with a small radius of curvature for improving the front luminance. In particular, as the mold member of the signal light emitting diode, the first radius of curvature above the translucent mold member from the optical axis, the third radius of curvature in the left-right direction, the fourth radius of curvature, and the fourth radius of curvature below. 2 has at least a first curvature <
By setting the relationship of the third curvature = the fourth curvature and the second curvature, it is possible to widen the viewing angle in the left-right direction and the lower direction while contributing the upward light to the front emission.

【００１７】以下、本発明の一例を図５に示す。 図５
には、ＧａＰ基板上に発光層としてＡｌＧａＩｎＰ層を
有する赤色が発光可能なＬＥＤチップを発光素子(502)
として利用した。ＬＥＤチップは、半導体接合を挟んで
一対の電極が形成されており、等方的な発光が可能な発
光素子(502)を構成している。次に、マウント・リード
(503)上にＬＥＤチップをＡｇペーストを用いてダイボ
ンディングさせる。他方、インナー・リード(504)と金
線(505)を用いてワイヤーボンディングさせそれぞれ電
気的に接続させた。マウント・リード(503)上に配置さ
れたＬＥＤチップ(502)をエポキシ樹脂のインサート成
形により被覆してモールド部材(501)を形成させた。FIG. 5 shows an example of the present invention. FIG.
A red light-emitting LED chip having an AlGaInP layer as a light-emitting layer on a GaP substrate is used as a light-emitting element (502).
Used as. The LED chip has a pair of electrodes formed with a semiconductor junction interposed therebetween, and constitutes a light emitting element (502) capable of emitting light isotropically. Next, mount leads
(503) The LED chip is die-bonded on top using Ag paste. On the other hand, wire bonding was performed using the inner lead (504) and the gold wire (505), and each was electrically connected. The LED chip (502) arranged on the mount lead (503) was covered by insert molding of epoxy resin to form a molded member (501).

【００１８】形成された発光ダイオードは、先端を通る
光軸を含む透光性モールド部材(501)の断面を構成する
先端から端部までの第１の曲率半径及び第１の曲率半径
と対称な先端から他方の端部までの第２の曲率半径と、
光軸を含む前記断面と垂直をなす断面を構成する先端か
ら端部までの第３の曲率半径及び第３の曲率半径と対称
な先端から他方の端部までの第４の曲率半径が、それぞ
れ第１の曲率半径の大きさ＜第３の曲率半径の大きさ＝
第４の曲率半径の大きさ≦第２の曲率半径の大きさとさ
せてある。また、リード端子間(503)、(504)方向とモー
ルド部材(501)の第１及び第２の曲率半径を構成する断
面とを略平行に配置させてある。第１、第３及び第４の
曲率半径側から効率よく光が取り出せるようにＬＥＤチ
ップ(502)とインナー・リード(504)とを接続させる導電
性ワイヤー(505)を第２の曲率半径側に配置させてあ
る。The formed light emitting diode has a first radius of curvature from a tip to an end forming a cross section of the light-transmitting mold member (501) including an optical axis passing through the tip, and is symmetric with the first radius of curvature. A second radius of curvature from the tip to the other end;
A third radius of curvature from a tip to an end and a fourth radius of curvature from a tip symmetrical to the third radius of curvature forming a section perpendicular to the section including the optical axis from the tip to the other end are respectively The magnitude of the first radius of curvature <the magnitude of the third radius of curvature =
The size of the fourth radius of curvature ≦ the size of the second radius of curvature. Further, the direction between the lead terminals (503) and (504) and the cross section of the mold member (501) forming the first and second radii of curvature are arranged substantially in parallel. A conductive wire (505) for connecting the LED chip (502) and the inner lead (504) to the second radius of curvature so that light can be efficiently extracted from the first, third and fourth radius of curvature. It is arranged.

【００１９】これにより第１の曲率半径側（上方向）の
発光が少なく、且つ第３、第４及び第２の曲率半径側
（左右及び下方向）の視野角が大きく正面、左右、下方
向の輝度が高い信号用に好適な発光ダイオードとするこ
とができる。以下、本発明の構成について詳述する。As a result, light emission on the first radius of curvature side (upward) is small, and the viewing angles on the third, fourth and second radius of curvature sides (left and right and downward) are large. A light emitting diode suitable for a signal with high luminance can be obtained. Hereinafter, the configuration of the present invention will be described in detail.

【００２０】（モールド部材１０１、５０１）モールド
部材(101)(501)は、発光素子(102)(502)、リード端子(1
03)(104)(503)(504)の一部や電気的接続部材(105)(505)
となるワイヤ等を外部から保護すると共に発光素子(10
2)(502)からの光を所望の方向に発光するものである。
本発明のモールド部材(101)(501)は、凸状のレンズ形状
を含み、凸状の略先端から端部までの曲面半径がそれぞ
れ異なる発光ダイオードを構成させてある。そのため、
曲率半径の小さい部位では、発光素子(102)(502)からの
光を光軸上に集光し軸上光度を上げ高効率化を図ること
ができる。(Mold members 101 and 501) The mold members (101) and (501) are composed of the light emitting elements (102) and (502) and the lead terminals (1).
03) (104) (503) (504) and part of electrical connection members (105) (505)
Protect the wires, etc., from
2) It emits light from (502) in a desired direction.
The mold members (101) and (501) of the present invention have a convex lens shape, and constitute light emitting diodes having different curved surface radii from a substantially leading end to an end. for that reason,
In a portion having a small radius of curvature, light from the light emitting elements (102) and (502) can be condensed on the optical axis to increase the on-axis luminous intensity and increase the efficiency.

【００２１】さらに、信号用発光ダイオードなどは、曲
率半径の小さい曲面を太陽光などが入射される上方向に
配置する。これにより、光軸上の正面光度を向上させつ
つ、上方向よりも曲率半径の大きい左右方向や下方向の
光をよりワイドに広げさせることができる。また、曲率
半径の小さい方向から入射する太陽光などの外来光の反
射を減少させることができる。Further, the light emitting diode for signal and the like has a curved surface with a small radius of curvature arranged in an upward direction where sunlight or the like is incident. Thereby, while increasing the front luminous intensity on the optical axis, it is possible to spread the light in the left-right direction and the downward direction having a larger radius of curvature than in the upward direction more widely. In addition, it is possible to reduce the reflection of extraneous light such as sunlight entering from a direction having a small radius of curvature.

【００２２】モールド部材(101)(501)には、着色剤、光
安定化材、拡散剤や蛍光体など種々の添加剤を含有させ
ることもできる。モールド部材(101)(501)に着色剤を含
有させることにより所望外の波長をカットするフィルタ
ーの役目をもたすこともできる。また、拡散剤を含有さ
せることによって発光素子(102)(502)からの指向性を緩
和させ視野角を増やすことができる。さらに、蛍光体を
含有させることで混色光を発光させることもできる。特
に、比較的エネルギーの大きい光を放出可能な窒化物半
導体からなる発光素子と、発光素子から放出される光に
よって励起されそれよりも長波長光を発光する蛍光体と
の組み合わせにより高輝度に混色光が発光可能な発光ダ
イオードとすることができる。発光素子からの光と蛍光
体からの光が互いに補色関係にある場合、白色光を発光
可能となる。このような蛍光体としてセリウムで付活さ
れたイットリウム・アルミニウム・ガーネット系蛍光体
やペリレン系誘導体が好適に挙げられる。The mold members (101) and (501) may contain various additives such as a coloring agent, a light stabilizer, a diffusing agent and a phosphor. By adding a colorant to the mold members (101) and (501), it can also serve as a filter for cutting out unwanted wavelengths. Further, by including a diffusing agent, the directivity from the light emitting elements (102) and (502) can be relaxed and the viewing angle can be increased. Furthermore, mixed-color light can be emitted by including a phosphor. In particular, a high-brightness color mixture is achieved by a combination of a light-emitting element made of a nitride semiconductor that can emit light with relatively high energy and a phosphor that is excited by light emitted from the light-emitting element and emits light of a longer wavelength than that. The light emitting diode can emit light. When the light from the light emitting element and the light from the phosphor have a complementary color relationship with each other, white light can be emitted. Suitable examples of such a phosphor include an yttrium-aluminum-garnet-based phosphor activated with cerium and a perylene-based derivative.

【００２３】モールド部材(101)(501)の具体的材料とし
ては、エポキシ樹脂、ユリア樹脂やイミド樹脂などの耐
候性に優れた透光性樹脂やガラスなどが好適に用いられ
る。また、拡散剤としては、チタン酸バリウム、酸化チ
タン、酸化アルミニウム、酸化珪素等が好適に用いられ
る。このようなモールド部材(101)(501)は、インサート
成形やポッティング法などにより比較的簡単に形成する
ことができる。As a specific material of the mold members (101) and (501), a translucent resin having excellent weather resistance, such as an epoxy resin, a urea resin, or an imide resin, or a glass is preferably used. As the diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like are preferably used. Such mold members (101) and (501) can be formed relatively easily by insert molding or potting.

【００２４】なお、本発明の曲率半径とは、球面におけ
る曲率半径だけでなく、実質的に本発明の効果を奏する
限り放物や楕円などの非球面における近似したものをも
含んでいる。したがって、楕円などの非球面の場合は、
擬似的に短軸の大きさの大小で判断することができる。
同様に、近似した曲率は光軸上の発光観測面側から見た
レンズ倍率で比較することもできる。また、球面と非球
面との組み合わせにおいては、曲率半径と短軸との大小
で判断することもできる。Note that the radius of curvature of the present invention includes not only the radius of curvature of a spherical surface but also an approximation of an aspherical surface such as a paraboloid or an ellipse as long as the effects of the present invention are substantially exerted. Therefore, for an aspheric surface such as an ellipse,
It can be determined in a pseudo manner based on the magnitude of the short axis.
Similarly, the approximate curvature can be compared with the lens magnification viewed from the light emission observation surface side on the optical axis. Further, in a combination of a spherical surface and an aspherical surface, the determination can be made based on the magnitude of the radius of curvature and the minor axis.

【００２５】具体的には、（近似した）第１の曲率を含
むレンズ面の倍率を第１のレンズ倍率、（近似した）第
２の曲率を含むレンズ面の倍率を第２のレンズ倍率、
（近似した）第３の曲率を含むレンズ面の倍率を第３の
レンズ倍率、（近似した）第４の曲率を含むレンズ面の
倍率を第４のレンズ倍率の大きさとそれぞれ分ける。Specifically, the magnification of the lens surface including the (approximately) first curvature is a first lens magnification, the magnification of the lens surface including the (approximately) second curvature is the second lens magnification,
The magnification of the lens surface including the (approximate) third curvature is divided into the third lens magnification, and the magnification of the lens surface including the (approximate) fourth curvature is divided into the magnitude of the fourth lens magnification.

【００２６】モールド部材(101)(501)の部分的レンズ倍
率は、それぞれ第２のレンズ倍率≦第３のレンズ倍率、
第４のレンズ倍率＜第１のレンズ倍率の関係（第２のレ
ンズ倍率≦第３のレンズ倍率＝第４のレンズ倍率＜第１
のレンズ倍率の関係）を満たすこととなる。この場合、
光軸上の発光観測面側から発光ダイオードを観測すると
本発明の特定のモールド形状(101)(501)のレンズ効果に
より、図１の如き、発光素子(102)やリード端子(103)、
(104)が歪に配置されたように観測される。The partial lens magnifications of the mold members (101) and (501) are respectively as follows: second lens magnification ≦ third lens magnification;
The relationship of fourth lens magnification <first lens magnification (second lens magnification ≦ third lens magnification = fourth lens magnification <first lens magnification)
Lens magnification). in this case,
When the light emitting diode is observed from the light emission observation surface side on the optical axis, due to the lens effect of the specific mold shape (101) (501) of the present invention, as shown in FIG.
It is observed that (104) is arranged in the strain.

【００２７】（発光素子１０２、５０２）本発明に用い
られる発光素子(102)(502)は、電力の供給を受けて発光
可能な半導体発光素子である。このような半導体発光素
子は、液相成長法やＭＯＣＶＤ法等により基板上に種々
の半導体材料を積層した構造が挙げられる。半導体発光
素子の発光層に用いられる具体的材料としては、ＧａＡ
ｓ、ＧａＰ、ＧａＡｌＡｓ、ＧａＡｓＰ、ＡｌＧａＩｎ
Ｐ、ＧａＮ、ＩｎＮ、ＡｌＮ、ＩｎＧａＮ、ＩｎＧａＡ
ｌＮ等が好適に挙げられる。発光素子(102)(502)の構造
としては、ＭＩＳ接合、ｐｎ接合、ＰＩＮ接合を有する
ホモ接合、ヘテロ接合やダブルへテロ構造などが挙げら
れる。また、発光層を量子効果が生ずる単一量子井戸構
造や多重量子井戸構造とすることができる。半導体層の
材料やその混晶度によって発光波長を紫外域から赤外域
まで種々選択することができる。(Light-Emitting Elements 102 and 502) The light-emitting elements (102) and (502) used in the present invention are semiconductor light-emitting elements that can emit light when supplied with electric power. Such a semiconductor light emitting device has a structure in which various semiconductor materials are stacked on a substrate by a liquid phase growth method, an MOCVD method, or the like. As a specific material used for the light emitting layer of the semiconductor light emitting element, GaAs
s, GaP, GaAlAs, GaAsP, AlGaIn
P, GaN, InN, AlN, InGaN, InGaAs
1N and the like are preferred. Examples of the structure of the light emitting elements (102) and (502) include a MIS junction, a pn junction, a homo junction having a PIN junction, a hetero junction, and a double hetero structure. Further, the light emitting layer can have a single quantum well structure or a multiple quantum well structure in which a quantum effect occurs. The emission wavelength can be variously selected from the ultraviolet region to the infrared region depending on the material of the semiconductor layer and the degree of mixed crystal thereof.

【００２８】具体的一例として、窒化物系化合物半導体
発光素子を示す。窒化物系化合物半導体発光素子は、サ
ファイヤ基板上にＧａＮ、ＡｌＮやＧａＡｌＮ等のバッ
ファー層を形成しその上にｐｎ接合を有する窒化ガリウ
ム半導体を形成させる。窒化ガリウム系半導体は、不純
物をドープしない状態でｎ型導電性を示す。なお、発光
効率を向上させる等所望のｎ型窒化ガリウム半導体を形
成させる場合は、ｎ型ドーパントとしてＳｉ、Ｇｅ、Ｓ
ｅ、Ｔｅ、Ｃ等を適宜導入することが好ましい。As a specific example, a nitride-based compound semiconductor light emitting device will be described. In a nitride-based compound semiconductor light emitting device, a buffer layer of GaN, AlN, GaAlN, or the like is formed on a sapphire substrate, and a gallium nitride semiconductor having a pn junction is formed thereon. Gallium nitride-based semiconductors exhibit n-type conductivity without being doped with impurities. When a desired n-type gallium nitride semiconductor is formed, such as to improve luminous efficiency, Si, Ge, S
It is preferable to appropriately introduce e, Te, C, and the like.

【００２９】一方、ｐ型窒化ガリウム半導体を形成させ
る場合は、ｐ型ドーパンドであるＺｎ、Ｍｇ、Ｂｅ、Ｃ
ａ、Ｓｒ、Ｂａ等をドープさせる。窒化ガリウム半導体
は、ｐ型ドーパントをドープしただけでは低抵抗化しに
くいためｐ型ドーパント導入後に、低電子線照射、プラ
ズマ照射や熱処理することで低抵抗化させることが好ま
しい。その後、ｐｎ各半導体に電力が供給できるよう、
各半導体のコンタクト層表面をエッチングにより露出さ
せる。各導電型のコンタクト層に電力を供給する電極を
スパッタリング法や真空蒸着法などにより形成させる。
ｐ型電極は、透光性の全面電極(407)としての金属薄膜
と、ワイヤーボンドさせるパッド電極(408)とをそれぞ
れ形成させてある。On the other hand, when a p-type gallium nitride semiconductor is formed, p-type dopants such as Zn, Mg, Be, and C are used.
a, Sr, Ba and the like are doped. Since it is difficult to reduce the resistance of a gallium nitride semiconductor simply by doping it with a p-type dopant, it is preferable to reduce the resistance by introducing a low electron beam, irradiating a plasma, or performing heat treatment after introducing the p-type dopant. Then, so that power can be supplied to each pn semiconductor,
The contact layer surface of each semiconductor is exposed by etching. An electrode for supplying electric power to the contact layer of each conductivity type is formed by a sputtering method, a vacuum evaporation method, or the like.
In the p-type electrode, a metal thin film as a light-transmitting whole surface electrode (407) and a pad electrode (408) to be wire-bonded are formed.

【００３０】成膜された半導体ウエハーは、ダイヤモン
ド製の刃先を有するブレードが回転するダイシングソー
により直接フルカットするか、又は刃先幅よりも広い幅
の溝を切り込んだ後（ハーフカット）、外力によって半
導体ウエハーを割る。あるいは、先端のダイヤモンド針
が往復直線運動するスクライバーにより半導体ウエハー
に極めて細いスクライブライン（経線）を例えば碁盤目
状に引いた後、外力によってウエハーを割り半導体ウエ
ハーからチップ状にカットする。The formed semiconductor wafer is directly full-cut by a dicing saw in which a blade having a diamond cutting edge is rotated, or is cut into a groove having a width larger than the cutting edge width (half cut). Crack semiconductor wafer. Alternatively, a very thin scribe line (meridian) is drawn on the semiconductor wafer, for example, in a checkerboard pattern by a scriber in which a diamond needle at the tip reciprocates linearly, and then the wafer is cut by an external force and cut into chips from the semiconductor wafer.

【００３１】野外などの使用を考慮する場合、高輝度な
半導体材料として黄色、緑色、青色や青緑色等を発光す
る半導体材料として窒化物系化合物半導体（ＩｎxＧａy
Ａｌ zＮ、但し、０≦ｘ、０≦ｙ、０≦ｚ、ｘ＋ｙ＋ｚ
＝１）を用いることが好ましく、同様に、黄色や赤色で
はアルミニウム、インジウム、ガリウム、燐系半導体を
用いることが好ましいが、用途によって種々利用できる
ことは言うまでもない。When considering the use in the outdoors, etc.
Emit yellow, green, blue or blue-green as semiconductor material
Compound semiconductors (InxGay
Al zN, where 0 ≦ x, 0 ≦ y, 0 ≦ z, x + y + z
= 1), and similarly in yellow or red
Uses aluminum, indium, gallium, and phosphorus-based semiconductors
It is preferable to use, but it can be variously used depending on the application.
Needless to say.

【００３２】信号用の青色、黄色或いは青緑色が高輝度
に発光可能な発光素子として、通常、窒化物系化合物半
導体を用いた発光素子は、赤色や黄色が発光可能な４元
系のＡｌＩｎＧａＰなどの材料を用いた発光素子と異な
り、同一半導体表面側に正極(408)及び負極(409)の電極
を形成させる場合がある。また、活性層(404)を挟んで
組成の異なるダブルへテロ構造(403)(405)としてある。As a light-emitting element capable of emitting blue, yellow or blue-green light for signals with high luminance, a light-emitting element using a nitride-based compound semiconductor is usually a quaternary AlInGaP capable of emitting red or yellow light. Unlike the light emitting element using the above material, a positive electrode (408) and a negative electrode (409) may be formed on the same semiconductor surface side. In addition, double hetero structures (403) and (405) having different compositions sandwiching the active layer (404) are provided.

【００３３】発光素子(102)から放出される光は、発光
素子(102)の表面から放出されるものの他、ダブルへテ
ロ構造などのため活性層(404)などを導波管の如く伝搬
して放出される光もある。そのため活性層(404)端面側
から放出された光の一部は、発光素子(102)に電力を供
給する電極(409)の陰になる。通常、電極(409)は光を遮
光するＷ、Ａｌ、ＴｉやＩｎなどの金属や合金が用いら
れている。この電極(409)の陰により発光素子の放出さ
れた光は、等方的に均一に発光できない。特に、窒化ガ
リウム系化合物半導体は、可視光に対して透過性がよい
ので顕著に現れることとなる。The light emitted from the light emitting element (102) is not only emitted from the surface of the light emitting element (102), but also propagates through the active layer (404) and the like due to a double hetero structure like a waveguide. Some light is emitted. Therefore, part of the light emitted from the end face side of the active layer (404) is shaded by the electrode (409) for supplying power to the light emitting element (102). Usually, the electrode (409) is made of a metal or alloy such as W, Al, Ti or In which blocks light. The light emitted from the light emitting element cannot be isotropically and uniformly emitted due to the shadow of the electrode (409). In particular, gallium nitride-based compound semiconductors are notable because they have good transparency to visible light.

【００３４】一方、発光ダイオードから放出される光
は、モールド部材(101)(501)により集光させ所望の発光
特性を持たせることができる。しかしながら、モールド
部材(101)(501)により集光された光は、発光素子(102)
(502)から放出された光に大きく依存する。特に、発光
素子(102)(502)からの光を特定方向に発光させるためモ
ールド部材(101)(501)を特定形状とさせた発光ダイオー
ドにおいては、発光素子(102)(502)が配置されたマウン
ト・リード(103)(503)のカップ(410)から放出される光
の指向特性が、光学レンズによる指向特性よりも大きく
影響する。そのため、発光素子(102)(502)から等方的に
均一光が発光されなければ所望通りの発光特性を得難い
傾向にある。On the other hand, the light emitted from the light emitting diode can be condensed by the mold members (101) and (501) to have desired light emitting characteristics. However, the light collected by the mold members (101) and (501) is a light-emitting element (102)
It largely depends on the light emitted from (502). In particular, in a light emitting diode in which the molding members (101) and (501) have a specific shape in order to emit light from the light emitting elements (102) and (502) in a specific direction, the light emitting elements (102) and (502) are arranged. The directivity of light emitted from the cup (410) of the mounted lead (103) (503) has a greater effect than the directivity of the optical lens. Therefore, unless uniform light is emitted from the light-emitting elements (102) and (502), it tends to be difficult to obtain desired light-emitting characteristics.

【００３５】本発明は発光素子(102)(502)から異方性を
持って放出される光とモールド部材(101)(501)の形状を
考慮して発光素子(102)(502)を配置させる。曲率半径
（擬似的な曲率を含む）が大きくレンズ倍率の小さい曲
面においては集光力が低いため発光素子(102)(502)から
の光量が多いことが望ましい。他方、曲率半径（擬似的
な曲率を含む）が小さくレンズ倍率の大きい曲面は、視
野角を広げることに寄与する割合が少なく光軸上は集光
力が高いため発光素子(102)(502)からの光量が比較的少
なくても良い。これらを考慮することにより所望通りの
発光特性を得られる発光ダイオードとしたものである。
すなわち、カップ(410)上に配置された発光素子(102)に
電力を供給することにより光軸上の発光観測面側から放
出される光が均一に放出されない場合、モールド部材(1
01)の曲率半径が最も小さい部位と光軸に対して対称に
発光素子(102)の最も発光の暗い部分が配置されるよう
モールド部材(101)と発光素子(102)を配置させる。In the present invention, the light emitting elements (102) and (502) are arranged in consideration of the light emitted from the light emitting elements (102) and (502) with anisotropy and the shapes of the mold members (101) and (501). Let it. On a curved surface having a large radius of curvature (including a pseudo curvature) and a small lens magnification, the light condensing power is low, so that it is desirable that a large amount of light is emitted from the light emitting elements (102) and (502). On the other hand, a curved surface having a small radius of curvature (including a pseudo curvature) and a large lens magnification has a small contribution to widening the viewing angle and a high light-gathering power on the optical axis, so that the light-emitting elements (102) and (502) The amount of light from the light source may be relatively small. By taking these factors into consideration, a light emitting diode that can obtain desired light emitting characteristics is obtained.
That is, when the light emitted from the light emission observation surface side on the optical axis is not uniformly emitted by supplying power to the light emitting element (102) disposed on the cup (410), the mold member (1
The mold member (101) and the light emitting element (102) are arranged such that the darkest part of the light emitting element (102) is arranged symmetrically with respect to the part having the smallest radius of curvature in (01) and the optical axis.

【００３６】また、発光素子(502)から等方的に発光す
る場合においても導電性ワイヤー(505)の陰になるなど
モールド部材(501)がない場合における光軸上の発光観
測面側からみて暗い部位が生ずる場合がある。この場合
も、モールド部材(501)の曲率半径が最も小さい部位と
光軸に対して対称に光軸上の発光観測面側から見て最も
暗い部位がくるように配置させる。これらにより、最も
効率よく所望の発光特性を得られる発光ダイオードとす
ることができる。Also, when light is emitted from the light emitting element (502) isotropically, it is viewed from the light emission observation surface side on the optical axis when there is no mold member (501) such as behind the conductive wire (505). Dark areas may occur. In this case as well, the mold member (501) is arranged so that the portion having the smallest radius of curvature and the darkest portion as viewed from the light emission observation surface side on the optical axis are symmetrical with respect to the optical axis. Thus, a light-emitting diode that can obtain desired light-emitting characteristics most efficiently can be obtained.

【００３７】（リード端子１０３、１０４、５０３、５
０４）リード端子(103)(104)(503)(504)は、発光素子(1
02)(502)に外部から電力を供給する電極として働く。し
たがって、リード端子(103)(104)(503)(504)は、十分な
電気伝導性とボンデイングワイヤー等との接続性が求め
られる。リード端子(103)(503)上に発光素子(102)(502)
を配置させる場合は、マウントリードなどとして働き、
発光素子(102)(502)を積載させないで導通を採るものは
インナー・リードとして働く。(Lead terminals 103, 104, 503, 5
04) The lead terminals (103), (104), (503) and (504) are
02) Acts as an electrode to supply electric power to (502) from the outside. Therefore, the lead terminals (103), (104), (503), and (504) are required to have sufficient electrical conductivity and connectivity with a bonding wire or the like. Light emitting elements (102) (502) on lead terminals (103) (503)
When it is arranged, it works as a mount lead, etc.
A device that conducts without loading the light emitting elements (102) and (502) functions as an inner lead.

【００３８】本発明において、発光ダイオードからの発
光を効率よく発光させるためには、発光素子の発光部を
光学レンズとなるモールド部材(101)(501)の光軸上に配
置することが好ましい。この場合、光軸上の発光観測面
側から見た先端からの各曲率半径が異なるため曲率半径
の小さい第１の曲率半径側（上方）にリード端子が偏る
こととなる。リード端子とモールド部材との端面との距
離が短い場合は、膨張係数の違いなどにより破壊され易
い傾向にある。そのため、マウント・リードとインナー
・リード間の方向をよりモールド部材(101)(501)端面と
の距離がかせげる平行方向とすることが好ましい。In the present invention, in order to efficiently emit light from the light emitting diode, it is preferable to arrange the light emitting portion of the light emitting element on the optical axis of the mold members (101) and (501) to be optical lenses. In this case, since the respective radii of curvature from the tip viewed from the light emission observation surface side on the optical axis are different, the lead terminals are biased toward the first radius of curvature (upper side) having a smaller radius of curvature. When the distance between the lead terminal and the end face of the mold member is short, the lead terminal tends to be broken due to a difference in expansion coefficient or the like. For this reason, it is preferable that the direction between the mount lead and the inner lead is a parallel direction in which the distance from the end surfaces of the mold members (101) and (501) can be increased.

【００３９】一方、モールド部材(101)(501)の強度が高
い或いは、柔軟性がある場合は、基板の取り付け時にリ
ード端子間（マウント・リード(103)(503)とインナー・
リード(104)(504)間）方向の方が移動しにくいことから
マウント・リード(103)(503)とインナー・リード(104)
(504)間の方向を第１の曲率半径（上方）及び第２の曲
率半径間（下方）方向に配置させることもできる。リー
ド端子間方向は、基板に取り付けても傾斜しにくいこと
から安定した発光特性を得ることができる。On the other hand, if the strength of the mold members (101) and (501) is high or if the mold members are flexible, the distance between the lead terminals (mount lead (103) (503) and inner
(Between the leads (104) and (504)) is more difficult to move, so the mount lead (103) (503) and the inner lead (104)
The direction between (504) can be arranged between the first radius of curvature (upward) and the second radius of curvature (downward). Since the direction between the lead terminals is hardly inclined even when attached to the substrate, stable light emission characteristics can be obtained.

【００４０】マウント・リード(103)上に発光素子(102)
を配置させる場合は、熱硬化性樹脂などによって行うこ
とができる。具体的には、エポキシ樹脂、シリコーン樹
脂、アクリル樹脂やイミド樹脂などが挙げられる。ま
た、発光素子(502)とマウント・リード(503)とを接着さ
せると共に電気的に接続させるためにはＡｇペースト、
カーボンペースト、ＩＴＯや金属バンプ等を用いること
ができる。さらに、各発光素子(102)(502)の発光効率を
向上させるためにカップ表面に反射機能を持たせても良
い。Light emitting element (102) on mount lead (103)
Can be made of a thermosetting resin or the like. Specific examples include an epoxy resin, a silicone resin, an acrylic resin, and an imide resin. Further, in order to bond and electrically connect the light emitting element (502) and the mounting lead (503), an Ag paste,
Carbon paste, ITO, metal bumps and the like can be used. Further, a reflection function may be provided on the cup surface in order to improve the luminous efficiency of each light emitting element (102) (502).

【００４１】リード端子(103)(104)(503)(504)に用いら
れる具体的な比抵抗としては、３００μΩ・ｃｍ以下が
好ましく、より好ましくは、３μΩ・ｃｍ以下である。
また、発光素子からの発熱を効率よく外部に逃がすべく
リード端子(103)(104)(503)(504)は、熱伝導度がよいこ
とが求められる。特に、発光素子(102)(502)が配置され
るマウント・リード(103)(503)は、他のリード端子(10
4)(504)よりも表面積を大きくさせ放熱性を向上させる
ことが好ましい。リード端子(103)(104)(503)(504)の具
体的な熱伝導性は、０．０１ｃａｌ／（ｓ）（ｃｍ2）
（℃／ｃｍ）以上が好ましく、より好ましくは ０．５
ｃａｌ／（ｓ）（ｃｍ2）（℃／ｃｍ）以上である。ま
た、これらの条件を満たす材料としては、鉄、銅、鉄入
り銅、錫入り銅等が挙げられる。The specific resistance used for the lead terminals (103), (104), (503) and (504) is preferably 300 μΩ · cm or less, more preferably 3 μΩ · cm or less.
In addition, the lead terminals (103), (104), (503), and (504) are required to have good thermal conductivity in order to efficiently release heat generated from the light emitting element to the outside. In particular, the mounting leads (103) and (503) on which the light emitting elements (102) and (502) are arranged have other lead terminals (10
4) It is preferable to improve the heat radiation by increasing the surface area as compared with (504). The specific thermal conductivity of the lead terminals (103), (104), (503), and (504) is 0.01 cal / (s) (cm 2 ).
(° C./cm) or more, more preferably 0.5
cal / (s) (cm 2 ) (° C./cm) or more. Materials satisfying these conditions include iron, copper, iron-containing copper, and tin-containing copper.

【００４２】また、発光素子(102)(502)とリード端子(1
03)(104)(503)(504)とを電気的に接続させるためには電
気的接続部材が用いられる。電気的接続部材は、発光素
子(102)(502)とリード端子(103)(104)(503)(504)とを金
属線で接続させた導電性ワイヤー(105)(505)でも良い
し、導電ペーストや金属バンプで形成させても良い。電
気的接続部材は、オーミック性、機械的接続性、電気伝
導性及び熱伝導性がよいものが求められる。電気的接続
部材の熱伝導度としては０．０１ｃａｌ／（ｓ）（ｃｍ
2）（℃／ｃｍ）以上が好ましく、より好ましくは０．
５ｃａｌ／（ｓ）（ｃｍ2）（℃／ｃｍ）以上である。
具体的には、金、銅、白金、アルミニウム等及びそれら
の合金を用いたボンデイングワイヤーが挙げられる。ま
た、銀、カーボン、ＩＴＯ等の導電性フィラーを樹脂で
充填した導電性接着剤等を用いることもできる。作業性
を考慮してアルミニウム線あるいは金線が好ましい。以
下、本発明の実施例について詳述するが、これのみに限
られないことはいうまでもない。Further, the light emitting elements (102) and (502) and the lead terminals (1)
An electrical connection member is used to electrically connect the 03, 104, 503, and 504. The electrical connection member may be a conductive wire (105) (505) in which the light emitting element (102) (502) and the lead terminal (103) (104) (503) (504) are connected by a metal wire, It may be formed by a conductive paste or a metal bump. The electrical connection member is required to have good ohmic properties, mechanical connectivity, electrical conductivity, and thermal conductivity. The thermal conductivity of the electrical connection member is 0.01 cal / (s) (cm
2 ) (° C./cm) or higher, more preferably 0.1 ° C./cm or higher.
5 cal / (s) (cm 2 ) (° C./cm) or more.
Specifically, a bonding wire using gold, copper, platinum, aluminum, or the like, or an alloy thereof may be used. Alternatively, a conductive adhesive or the like in which a conductive filler such as silver, carbon, or ITO is filled with a resin can be used. Aluminum wire or gold wire is preferable in consideration of workability. Hereinafter, embodiments of the present invention will be described in detail, but it is needless to say that the present invention is not limited thereto.

【００４３】[0043]

【実施例】（実施例１）発光素子として、発光ピークが
５００ｎｍのＩｎＧａＮ半導体を発光層に用いたＬＥＤ
チップは、洗浄されたサファイア基板(401)上に、ＴＭ
Ｇ（トリメチルガリウム）ガス、ＴＭＩ（トリメチルイ
ンジュウム）ガス、窒素ガス及びドーパントガスをキャ
リアガスと共に流し、ＭＯＣＶＤ法で窒化物系化合物半
導体を成膜させることにより形成させた。成膜時に、ド
ーパントガスとしてＳｉＨ4とＣｐ2Ｍｇと、を切り換え
ることによってｎ型導電性やｐ型導電性を有する窒化ガ
リウム半導体を形成させる。発光素子としては、ｎ型導
電性を有する窒化ガリウム半導体であるコンタクト層(4
03)と、ｐ型導電性を有する窒化ガリウムアルミニウム
半導体であるクラッド層(405)、ｐ型導電性を有するコ
ンタクト層(406)を形成させた。ｎ型導電性を有するコ
ンタクト層(403)と、ｐ型導電性を有するクラッド層(40
5)との間に厚さ約３ｎｍであり、単一量子井戸構造とさ
れるノンドープＩｎＧａＮの活性層(404)を形成した。
（なお、サファイア基板上(401)には、低温で窒化ガリ
ウムを形成させバッファ層(402)としてある。） 同一半導体表面側から正極(407)(408)及び負極(409)の
電極を取るためにｎ型半導体であるコンタクト層(403)
の一部までｐ型半導体層側から半導体層を部分的に除去
させてある。除去され露出したｎ型コンタクト層となる
半導体(403)表面には、活性層(404)の厚みを越える厚さ
の電極(409)がスパッタリング法により形成されてい
る。他方、ｐ型コンタクト層上には透明電極及びパッド
電極を形成させてある。こうして出来上がった半導体ウ
エハーをスクライブラインを引いた後、外力により分割
させ発光素子として青緑色が発光可能なＬＥＤチップを
形成させた。ＬＥＤチップに電力を供給すると青緑色光
が発光可能なＬＥＤチップが形成された。発光している
ＬＥＤチップの放射方向を調べた結果、ｎ型コンタクト
層上に形成された電極は、活性層から放出される光を遮
光する。発光観測面側から見て、活性層(404)から放出
された光のうちｎ型電極(409)の延長方向には発光が少
なく最も暗く観測された。(Example 1) As a light emitting element, an LED using an InGaN semiconductor having a light emission peak of 500 nm for a light emitting layer.
The chip is placed on a cleaned sapphire substrate (401) by TM
G (trimethyl gallium) gas, TMI (trimethyl indium) gas, nitrogen gas and dopant gas were flowed together with a carrier gas, and a nitride-based compound semiconductor was formed by MOCVD. At the time of film formation, a gallium nitride semiconductor having n-type conductivity or p-type conductivity is formed by switching between SiH 4 and Cp 2 Mg as a dopant gas. As the light emitting element, a contact layer (4) made of a gallium nitride semiconductor having n-type conductivity is used.
03), a cladding layer (405) of a gallium aluminum nitride semiconductor having p-type conductivity, and a contact layer (406) having p-type conductivity. A contact layer (403) having n-type conductivity and a cladding layer (40
A non-doped InGaN active layer (404) having a thickness of about 3 nm and a single quantum well structure was formed between the active layer (404).
(Note that gallium nitride is formed at a low temperature on the sapphire substrate (401) to form a buffer layer (402).) To take the positive electrode (407) and the negative electrode (409) from the same semiconductor surface side The contact layer which is an n-type semiconductor (403)
Is partially removed from the p-type semiconductor layer side. An electrode (409) having a thickness exceeding the thickness of the active layer (404) is formed on the surface of the semiconductor (403) serving as an n-type contact layer which has been removed and exposed by a sputtering method. On the other hand, a transparent electrode and a pad electrode are formed on the p-type contact layer. After a scribe line was drawn on the semiconductor wafer thus completed, the wafer was divided by an external force to form an LED chip capable of emitting blue-green light as a light emitting element. An LED chip capable of emitting blue-green light when power was supplied to the LED chip was formed. As a result of examining the radiation direction of the emitting LED chip, the electrode formed on the n-type contact layer blocks light emitted from the active layer. When viewed from the light emission observation surface side, of the light emitted from the active layer (404), light emission was observed in the direction of extension of the n-type electrode (409) and was the darkest.

【００４４】銀メッキした鉄入り銅製のリード端子(10
3)(104)の先端にカップ(410)を有するマウント・リード
(103)にＬＥＤチップ(102)をエポキシ樹脂でダイボンデ
ィングした。マウント・リード(103)に設けられたＬＥ
Ｄチップ(102)の配置は、リード端子(103)(104)間方向
とＬＥＤチップ(102)の電極(408)(409)間方向とが略垂
直に配置させてある。ＬＥＤチップ(102)の各電極(408)
(409)とマウント・リード(103)及びインナー・リード(1
04)とをそれぞれ直径が３０μｍの金線(105)でワイヤー
ボンディングし電気的導通を取った。The silver-plated iron-containing copper lead terminals (10
3) Mount lead with cup (410) at the tip of (104)
The LED chip (102) was die-bonded to (103) with an epoxy resin. LE provided on the mount lead (103)
The arrangement of the D chip (102) is such that the direction between the lead terminals (103) and (104) is substantially perpendicular to the direction between the electrodes (408) and (409) of the LED chip (102). Each electrode (408) of LED chip (102)
(409), mount lead (103) and inner lead (1
04) was wire-bonded with a gold wire (105) having a diameter of 30 μm to obtain electrical continuity.

【００４５】一方、モールド部材(101)の金型として、
第１の曲率半径（上方）、第３、第４の曲率半径（左右
方向）及び第２の曲率半径（下方）の大きさが第１の曲
率半径の大きさ＜第３の曲率半径の大きさ＝第４の曲率
半径の大きさ＜第２の曲率半径の大きさの関係を満たす
凸状の透光性モールド部材(101)が形成可能な凹部を形
成させている。On the other hand, as a mold of the mold member (101),
The magnitude of the first radius of curvature (upper), the third and fourth radii of curvature (left and right), and the second radius of curvature (lower) are smaller than the magnitude of the first radius of curvature <the magnitude of the third radius of curvature. A concave portion is formed in which a convex translucent mold member (101) that satisfies the relationship of (a) = the size of the fourth radius of curvature <the size of the second radius of curvature is formed.

【００４６】凹部内に活性層(404)からの光を遮光する
ｎ型電極(409)と第２の曲率半径を持った曲面とが最も
近づくようにＬＥＤチップ(102)が配置されたリード端
子(103)(104)を配置し、エポキシ樹脂を注入した。エポ
キシ樹脂を１４０℃５時間で硬化させた。形成されたモ
ールド部材(101)の先端(201)は、ＬＥＤチップ(102)の
光軸上に配置されている。A lead terminal on which an LED chip (102) is arranged so that an n-type electrode (409) for blocking light from the active layer (404) and a curved surface having a second radius of curvature are closest to each other in the recess. (103) and (104) were arranged, and an epoxy resin was injected. The epoxy resin was cured at 140 ° C. for 5 hours. The tip (201) of the formed mold member (101) is arranged on the optical axis of the LED chip (102).

【００４７】形成された発光ダイオードは、透光性モー
ルド部材(101)の先端(201)を通る光軸を含む断面を構成
する先端(201)から端部(202)までの第１の曲率半径の大
きさが約３であり、先端(201)から他方の端部(203)まで
の第２の曲率半径の大きさが約３．７５である。また、
前記断面と垂直をなす光軸を含む断面を構成する先端(2
01)から端部(204)までの第３の曲率半径及び先端(201)
から他方の端部(205)までの第４の曲率半径の大きさ
が、それぞれ約３．５とさせてある。また、ＬＥＤチッ
プ(102)とモールド部材(101)の配置は、ＬＥＤチップ(1
01)から放出されてカップ(410)で反射した光が最も暗い
方向にモールド部材(101)の曲率半径の小さい面が配置
されている。The formed light emitting diode has a first radius of curvature from the tip (201) to the end (202) constituting a cross section including the optical axis passing through the tip (201) of the translucent mold member (101). Is about 3 and the size of the second radius of curvature from the tip (201) to the other end (203) is about 3.75. Also,
The tip (2) that constitutes a section including an optical axis perpendicular to the section
Third radius of curvature and tip (201) from 01) to end (204)
The magnitude of the fourth radius of curvature from to the other end (205) is about 3.5. In addition, the arrangement of the LED chip (102) and the mold member (101) is based on the LED chip (1).
The surface of the mold member (101) having a small radius of curvature is arranged in a direction in which the light emitted from the (01) and reflected by the cup (410) is the darkest.

【００４８】形成された発光ダイオードに電力を供給し
て、左右の配向特性方向及び上下の配向特性を調べた。
発光強度が最も高いところを１００％とし相対発光強度
を図６に示す。上方向の光が少なく左右及び下方向に視
野角が広い高輝度発光ダイオードとすることができるこ
とが確認できた。Power was supplied to the formed light emitting diode, and the left and right orientation characteristic directions and the upper and lower orientation characteristics were examined.
FIG. 6 shows the relative luminous intensity assuming that the highest luminous intensity is 100%. It was confirmed that a high-brightness light-emitting diode with little upward light and a wide viewing angle in the left, right, and downward directions could be obtained.

【００４９】（実施例２）透光性モールド部材(101)の
先端(201)を通る光軸を含む断面を構成する先端(201)か
ら端部(202)までの第１の曲率半径の大きさ（楕円の短
軸）が約３．２であり、長軸は約４．１とする。先端(2
01)から他方の端部(203)までの第２の曲率半径の大きさ
（楕円の短軸）が約３．６であり、長軸が約４．５５と
する。また、前記断面と垂直をなす光軸を含む断面を構
成する先端(201)から端部(204)までの第３の曲率半径
（楕円の短軸）及び先端(201)から他方の端部(205)まで
の第４の曲率半径（楕円の短軸）の大きさが、それぞれ
約３．５とさせる。また、この楕円の長軸を４．３５と
した楕円で表される非球面とした以外は実施例１と同様
にして発光ダイオードを形成させた。(Embodiment 2) The first radius of curvature from the tip (201) to the end (202) constituting a cross section including the optical axis passing through the tip (201) of the translucent mold member (101). The length (short axis of the ellipse) is about 3.2, and the long axis is about 4.1. Tip (2
The magnitude of the second radius of curvature (the minor axis of the ellipse) from 01) to the other end (203) is about 3.6, and the major axis is about 4.55. Further, a third radius of curvature (short axis of the ellipse) from the tip (201) to the end (204), which constitutes a section including the optical axis perpendicular to the section, and the other end ( The magnitudes of the fourth radius of curvature (short axis of the ellipse) up to 205) are each set to about 3.5. Further, a light emitting diode was formed in the same manner as in Example 1, except that the major axis of the ellipse was 4.35, and the aspheric surface was represented by an ellipse.

【００５０】形成された発光ダイオードのモールド形状
は、先端を通る光軸を含む透光性モールド部材の断面を
構成する先端から端部までを含む第１のレンズ倍率、先
端から他方の端部までを含む第２のレンズ倍率、光軸を
含む前記断面と垂直をなす断面を構成する先端から端部
までを含む第３のレンズ倍率及び先端から他方の端部ま
でを含む第４のレンズ倍率がそれぞれ、第２のレンズ倍
率＜第３のレンズ倍率＝第４のレンズ倍率＜第１のレン
ズ倍率の関係を満たしてある。なお、形成された発光ダ
イオードを発光観測面側から観測するとモールド部材の
外周連続した曲線を構成すると共に第１、第３及び第４
の曲率半径を含む上方の曲面は楕円を構成するのに対
し、第２、第３及び第４の曲率半径を含む下方の曲面は
半円を構成している。また、楕円は、半円の半径よりも
小さい短軸を有ている。The molded shape of the formed light emitting diode has a first lens magnification including a section from the tip to the end which constitutes a cross section of the translucent mold member including the optical axis passing through the tip, from the tip to the other end. The second lens magnification including the optical axis, the third lens magnification including the cross section perpendicular to the cross section including the optical axis from the front end to the end, and the fourth lens magnification including the front to the other end include Each satisfies the relationship of second lens magnification <third lens magnification = fourth lens magnification <first lens magnification. When the formed light emitting diode is observed from the light emission observation surface side, the light emitting diode forms a continuous curve on the outer periphery of the mold member, and the first, third and fourth curves are formed.
The upper curved surface including the radius of curvature forms an ellipse, while the lower curved surface including the second, third, and fourth radii of curvature forms a semicircle. Also, the ellipse has a minor axis smaller than the radius of the semicircle.

【００５１】こうして形成された発光ダイオードの発光
特性は実施例１と同様に左右、下方向に広く上方向に狭
くすることができる。形成された発光ダイオードの指向
特性をそれぞれ揃えて発光観測面側から見て円状となる
よう基板に３００個配置させる。基板に設けられた配線
パターンと各発光ダイオードが点灯可能なように半田付
けさせる。これを樹脂筐体に配置させると共に樹脂筐体
の前面に透光性のケースを設けてある。なお、発光ダイ
オード間には外来光からの光を吸収してコントラスト比
を向上させ得るための西日対策パネルを配置させてあ
る。西日対策パネルには暗色系の黒色に着色した樹脂繊
維を植毛加工させてある。発光ダイオードが配置された
基板、西日対策パネルを樹脂筐体と透光性のケース内に
配置すると共に固定してパッキンで封止することにより
ＬＥＤユニットを構成する。The light emitting characteristics of the light emitting diode thus formed can be widened left and right, downward, and narrowed upward as in the first embodiment. The formed light emitting diodes are arranged on the substrate so that the directivity characteristics of the formed light emitting diodes are aligned and circular when viewed from the light emission observation surface side. The wiring pattern provided on the substrate and each light emitting diode are soldered so as to be lit. This is arranged in a resin housing, and a translucent case is provided on the front surface of the resin housing. It should be noted that between the light emitting diodes, there is arranged a West Japan countermeasure panel for absorbing external light to improve the contrast ratio. The West Japan countermeasures panel has a flocked resin fiber colored dark black. The LED unit is configured by arranging the substrate on which the light emitting diodes are arranged and the sun protection panel in a resin case and a translucent case, and fixing and sealing them with packing.

【００５２】こうして形成されたＬＥＤユニットをアル
ミの灯箱に収納することにより信号機を形成させた。信
号機の各発光ダイオードに電力を供給することにより上
方向に光量を抑制しつつ正面高度が高く且つ、左右及び
下方向に光量が多い信号機とすることができる。The signal unit was formed by housing the LED unit thus formed in an aluminum light box. By supplying power to each light emitting diode of the traffic light, a traffic light having a high front elevation and a large light volume in the left, right, and downward directions while suppressing the light amount in the upward direction can be provided.

【００５３】（実施例３）ＬＥＤチップを構成するＩｎ
の組成を少なくして青色が発光可能な窒化物半導体から
なる発光素子とすると共にＬＥＤチップ上にセリウムで
付活されたイットリウム・アルミニウム・ガーネット系
蛍光体としてＹ0.8Ｇｄ0.2Ａｌ5Ｏ12：Ｃｅが含有され
たエポキシ樹脂をマウント・リードのカップ内に配置し
た以外は実施例１と同様にして発光ダイオードを構成さ
せた。形成された発光ダイオードは実施例１とほぼ同様
に中心光度が高く、左右及び下方向の半値角の広い発光
ダイオードを構成することができた。また、ＬＥＤチッ
プからの青色光と共に蛍光体からの黄色光が発光され白
色が観測された。(Embodiment 3) In forming an LED chip
Y 0.8 as yttrium-aluminum-garnet fluorescent material activated with cerium on the LED chip with the blue color light-emitting element comprising a light emitting capable nitride semiconductor with less composition of Gd 0.2 Al 5 O 12: Ce A light emitting diode was constructed in the same manner as in Example 1 except that the epoxy resin containing was placed in the cup of the mount lead. The light-emitting diode thus formed has a high center luminous intensity almost in the same manner as in Example 1, and a light-emitting diode having a wide half value angle in the left, right, and downward directions can be formed. In addition, yellow light was emitted from the phosphor together with blue light from the LED chip, and white light was observed.

【００５４】[0054]

【発明の効果】本発明は、モールド部材を特定形状とす
ることにより、不要な上方の光量を低減させる一方左右
方向及び下方向において広視野角に発光可能な高輝度発
光ダイオードとするものである。また、外来光からの反
射の影響が少なく信号用に優れた発光ダイオードとする
ことができるものである。According to the present invention, a high-intensity light emitting diode capable of emitting light with a wide viewing angle in the left-right direction and the downward direction while reducing the unnecessary upper light amount by forming the mold member into a specific shape. . In addition, a light emitting diode which is less affected by reflection from extraneous light and is excellent in signal use can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図１】図１は、発光観測面側から見た本発明の発光ダ
イオードを示す模式的正面図である。FIG. 1 is a schematic front view showing a light emitting diode of the present invention viewed from a light emission observation surface side.

【図２】図２は本発明の発光特性を示す模式的断面図で
あり、図２（Ａ）は図１のＸ−Ｘ方向の模式的説明図を
示し、図２（Ｂ）は図１のＹ−Ｙ方向の模式的説明図を
示す。FIG. 2 is a schematic cross-sectional view showing light emission characteristics of the present invention, FIG. 2 (A) is a schematic explanatory view in the XX direction of FIG. 1, and FIG. 2 (B) is FIG. 5 is a schematic explanatory view in the YY direction of FIG.

【図３】図３は、本発明の発光ダイオードの正面からみ
た各構成部材の配置を表し図２のＺ−Ｚ方向の模式的横
断面図を示す。FIG. 3 is a schematic cross-sectional view in ZZ direction of FIG. 2 showing an arrangement of each component viewed from the front of the light emitting diode of the present invention.

【図４】図４は、本発明に用いられるカップに配置され
た発光素子の発光特性を示す模式的説明図であり、図４
（Ａ）は模式的部分正面図、図４（Ｂ）は図４（Ａ）の
Ｘ−Ｘ断面図である。FIG. 4 is a schematic explanatory view showing light emission characteristics of a light emitting element arranged in a cup used in the present invention.
4A is a schematic partial front view, and FIG. 4B is a sectional view taken along line XX of FIG. 4A.

【図５】図５は、本発明の他の発光ダイオードを示し、
図５（Ａ）は発光ダイオードの正面からみた各構成部材
の配置を表した模式図であり、図５（Ｂ）は図５（Ａ）
のＸ−Ｘ方向の模式的断面図を示し、図５（Ｃ）は図５
（Ａ）のＹ−Ｙ方向の模式的断面図を示す。FIG. 5 shows another light emitting diode of the present invention,
FIG. 5A is a schematic diagram showing the arrangement of each component viewed from the front of the light emitting diode, and FIG.
5 (C) shows a schematic cross-sectional view in the XX direction of FIG.
FIG. 2A is a schematic cross-sectional view in the YY direction.

【図６】図６（Ａ）は、本発明の発光ダイオードの上下
方向の配向特性を示し、図６（Ｂ）は、本発明の発光ダ
イオードの左右方向の配向特性を示す。FIG. 6A shows the vertical alignment characteristics of the light emitting diode of the present invention, and FIG. 6B shows the horizontal alignment characteristics of the light emitting diode of the present invention.

【図７】図７は、本発明と比較のために示す発光ダイオ
ードの模式図であり、図７（Ａ）は、発光ダイオードの
正面からみた各構成部材の配置を表した模式図であり、
図７（Ｂ）は図７（Ａ）のＸ−Ｘ方向の模式的断面図を
示し、図７（Ｃ）は図７（Ａ）のＹ−Ｙ方向の模式的断
面図を示す。FIG. 7 is a schematic view of a light emitting diode shown for comparison with the present invention, and FIG. 7 (A) is a schematic view showing an arrangement of each component viewed from the front of the light emitting diode;
7B shows a schematic cross-sectional view in the XX direction of FIG. 7A, and FIG. 7C shows a schematic cross-sectional view in the YY direction of FIG. 7A.

【符号の説明】[Explanation of symbols]

１０１、５０１・・・モールド部材 １０２、５０２・・・発光素子 １０３、１０４、５０３、５０４・・・リード端子 １０５、５０５・・・電気的接続部材 ２０１・・・透光性モールド部材の先端 ２０２・・・第１の曲率半径の端部 ２０３・・・第２の曲率半径の端部 ２０４・・・第３の曲率半径の端部 ２０５・・・第４の曲率半径の端部 ４０１・・・サファイア基板 ４０２・・・バッファ層 ４０３・・・ｎ型コンタクト層 ４０４・・・活性層 ４０５・・・ｐ型クラッド層 ４０６・・・ｐ型コンタクト層 ４０７・・・全面電極 ４０８・・・パッド電極 ４０９・・・ｎ型電極 ４１０・・・カップの内壁 101, 501: Mold member 102, 502: Light emitting element 103, 104, 503, 504: Lead terminal 105, 505: Electrical connection member 201: Tip 202 of the translucent mold member ... End of the first radius of curvature 203 ... End of the second radius of curvature 204 ... End of the third radius of curvature 205 ... End of the fourth radius of curvature 401・ Sapphire substrate 402 ・ ・ ・ Buffer layer 403 ・ ・ ・ N-type contact layer 404 ・ ・ ・ Active layer 405 ・ ・ ・ P-type cladding layer 406 ・ ・ ・ P-type contact layer 407 ・ ・ ・ Full surface electrode 408 ・ ・ ・ Pad Electrode 409: n-type electrode 410: Inner wall of cup

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 少なくとも２つのリード端子(103)(104)
と電気的に接続された発光素子(102)と、該発光素子(10
2)を封止し先端(201)が凸状の光学レンズとなる透光性
モールド部材(101)とを有する発光ダイオードであっ
て、 前記先端(201)を通る光軸を含む透光性モールド部材(10
1)の断面を構成する先端(201)から端部(202)までの第１
の曲率半径及び先端(201)から他方の端部(203)までの第
２の曲率半径と、光軸を含む前記断面と垂直をなす断面
を構成する先端(201)から端部(204)までの第３の曲率半
径及び先端(201)から他方の端部(205)までの第４の曲率
半径が、それぞれ次の関係を満たすことを特徴とする発
光ダイオード。第１の曲率半径の大きさ＜第３の曲率半
径の大きさ及び第４の曲率半径の大きさ≦第２の曲率半
径の大きさAt least two lead terminals (103) (104)
A light emitting element (102) electrically connected to the light emitting element (10
A light-emitting diode having a light-transmitting mold member (101) that seals 2) and the tip (201) is a convex optical lens, the light-transmitting mold including an optical axis passing through the tip (201). Members (10
The first section from the tip (201) to the end (202) constituting the cross section of 1)
Radius of curvature and a second radius of curvature from the tip (201) to the other end (203), and from the tip (201) to the end (204), which constitutes a cross section perpendicular to the cross section including the optical axis. Wherein the third radius of curvature and the fourth radius of curvature from the tip (201) to the other end (205) satisfy the following relationships, respectively. The size of the first radius of curvature <the size of the third radius of curvature and the size of the fourth radius of curvature ≦ the size of the second radius of curvature 【請求項２】 第３の曲率半径の大きさと第４の曲率半
径の大きさが略等しい請求項１記載の発光ダイオード。2. The light emitting diode according to claim 1, wherein the magnitude of the third radius of curvature is substantially equal to the magnitude of the fourth radius of curvature. 【請求項３】 光軸上の発光観測面側から見て第３及び
第４の曲率半径を構成する断面と、前記リード端子間(1
03)、(104)の配置方向とが略平行である請求項１記載の
発光ダイオード。3. A cross section forming third and fourth radii of curvature as viewed from a light emission observation surface side on an optical axis, and a section between the lead terminals (1).
3. The light emitting diode according to claim 1, wherein the arrangement directions of (03) and (104) are substantially parallel. 【請求項４】 前記リード端子(103)は発光素子(102)か
らの光を反射するカップ(410)を有すると共に該カップ
(401)内に光軸上の発光観測面側から見て、透光性モー
ルド部材(101)の第２の曲率半径、第３の曲率半径及び
第４の曲率半径側よりも第１の曲率半径側の発光出力が
高く配置させた発光素子(102)を有する請求項１記載の
発光ダイオード。4. The lead terminal (103) has a cup (410) for reflecting light from the light emitting element (102) and the cup (410).
In the (401), the first radius of curvature of the second, third, and fourth curvature radii of the translucent mold member (101) as viewed from the light emission observation surface side on the optical axis. The light-emitting diode according to claim 1, further comprising a light-emitting element (102) arranged to have a high light-emission output on a radial side. 【請求項５】 少なくとも２つのリード端子と電気的に
接続された発光素子と、該発光素子を封止し先端が凸状
の光学レンズとなる透光性モールド部材とを有する発光
ダイオードを複数配置させた信号機であって、 前記発光ダイオードは先端を通る光軸を含む透光性モー
ルド部材の断面を構成する先端から端部までの第１の曲
率半径及び先端から他方の端部までの第２の曲率半径
と、光軸を含む前記断面と垂直をなす断面を構成する先
端から端部までの第３の曲率半径及び先端から他方の端
部までの第４の曲率半径がそれぞれ第１の曲率半径の大
きさ＜第３の曲率半径の大きさ、第４の曲率半径の大き
さ≦第２の曲率半径の大きさの関係を満たすと共に各発
光ダイオードを同一方向に配置したことを特徴とする信
号機。5. A plurality of light emitting diodes each having a light emitting element electrically connected to at least two lead terminals and a light transmissive molding member that seals the light emitting element and forms an optical lens having a convex end. Wherein the light emitting diode has a first radius of curvature from a tip to an end and a second radius of curvature from the tip to the other end that constitutes a cross section of the translucent mold member including an optical axis passing through the tip. And the third radius of curvature from the tip to the end and the fourth radius of curvature from the tip to the other end that constitute a section perpendicular to the section including the optical axis are the first curvature, respectively. The size of the radius is smaller than the size of the third radius of curvature, the size of the fourth radius of curvature is smaller than the size of the second radius of curvature, and the light emitting diodes are arranged in the same direction. traffic light.
JP26702798A 1997-09-22 1998-09-21 Light emitting diode for signal and traffic light using the same Expired - Fee Related JP2980121B2 (en)

Priority Applications (1)

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JP26702798A JP2980121B2 (en) 1997-09-22 1998-09-21 Light emitting diode for signal and traffic light using the same

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Application Number Priority Date Filing Date Title
JP25738297 1997-09-22
JP9-257382 1997-09-22
JP26702798A JP2980121B2 (en) 1997-09-22 1998-09-21 Light emitting diode for signal and traffic light using the same

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JPH11154766A true JPH11154766A (en) 1999-06-08
JP2980121B2 JP2980121B2 (en) 1999-11-22

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