JPH11150176A - Method and equipment for substrate holding, and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holding method which is capable of holding a substrate without leaving a transferring stain of a sucking means on the back of the substrate. SOLUTION: The back of an LCD(liquid crystal display) substrate is sucked with sucking members 35a-35h arranged on the upper surface of a mounting table 34, and the LCD substrate G is held with the mounting table 34. Sucking operations of the sucking means 35a-35h face opposite to each other interposing the center of the LCD substrate. The operation and the stoppage of sucking are performed every pairs of the sucking members 35a, 35e, the sucking members 35b, 35f, the sucking members 35c, 35g, and the sucking members 35d, 35h, and the sucking members are moved clockwise along the peripheral part of the LCD substrate in order. Sucking time of the sucking members 35a-35h is set shorter than the time of processing to the LCD substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding method for holding a substrate such as a semiconductor wafer or an LCD substrate in a processing apparatus, a substrate holding apparatus, and a substrate processing method for processing a substrate while holding the substrate. .

[0002]

2. Description of the Related Art Generally, in the manufacture of a liquid crystal display (LCD) device or a semiconductor device, a so-called lithography process is performed to form a resist film pattern on an upper surface of an LCD substrate or a semiconductor wafer. This lithography processing includes various processing steps such as cleaning of the LCD substrate, drying of the LCD substrate, application of a resist solution to the surface of the LCD substrate, exposure and development of a photosensitive film. For example, after the LCD substrate is washed, it is subjected to a hydrophobic treatment, and further cooled, and then a resist solution as a photoresist is applied to form a photosensitive film on the surface of the LCD substrate. After heating and baking, a predetermined pattern is exposed on the photosensitive film in an exposure device. After developing and applying a developing solution to the surface of the LCD substrate after exposure, the developing solution is washed away with a rinsing solution to complete the developing process.

In the above lithography process,
Usually, a method of performing processing while holding the LCD substrate on a horizontal mounting table and fixing the LCD substrate, and a method of holding the LCD substrate on a rotatable spin chuck and performing processing while rotating the LCD substrate are used. ing. In particular, the conventional mounting table is configured such that a suction member is provided on the upper surface of the mounting table, and a predetermined process is performed while the LCD substrate is held on the mounting table by sucking the back surface of the LCD substrate with the suction member. ing.

As a process in which the mounting table is used as described above, for example, after a step of applying a resist solution,
There is a periphery removal process for removing an unnecessary resist film formed on the periphery and the back surface of the CD substrate. In this method, while moving a nozzle along the periphery of an LCD substrate held on a mounting table, a solvent (eg, thinner) is supplied from the nozzle, and at the same time, a resist solution dissolved by the supply of the solvent is suctioned and removed. During this process, the suction member of the mounting table always sucks the back surface of the LCD substrate.

[0005]

By the way, in the conventional mounting table, all of the plurality of suction members arranged at predetermined positions on the upper surface of the mounting table suck the back surface of the LCD substrate and the LCD is mounted until the processing is completed. A predetermined portion on the back surface of the substrate has been continuously sucked. Therefore, if the processing is performed for a certain period of time or more, after the processing is completed, a trace of the adsorption member adsorbed, that is, a so-called transfer trace remains at a predetermined position on the back surface of the LCD substrate. This transfer mark may adversely affect the resist and reduce the yield in manufacturing a liquid crystal display (LCD) device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a substrate holding method capable of holding a substrate without leaving a transfer mark of a suction means on the back surface of the substrate, and a substrate holding device capable of suitably performing the substrate holding method. It is intended to solve the above problem by providing.

It is another object of the present invention to provide a processing method capable of simultaneously processing a substrate while holding the substrate.

[0008]

According to a first aspect of the present invention, there is provided a method of sucking and holding a substrate by a plurality of sucking means provided on an upper surface of a substrate mounting portion. Provided is a substrate holding method, wherein suction means for performing a suction operation is sequentially shifted during holding. According to this method, since the suction means for performing the suction operation is sequentially shifted, all the suction members provided on the upper surface of the substrate mounting portion do not continuously perform the suction operation from the start to the end of the processing at the same time. . Further, during processing, one of the suction members provided on the upper surface of the substrate mounting portion performs a suction operation appropriately, stops the suction operation before a transfer mark remains, and shifts to another suction member. This can be sequentially repeated until the processing is completed. That is, the suction location on the back surface of the substrate is not fixed. Therefore, even if the substrate mounting portion suctions and holds the substrate from the beginning to the end of the processing, it is possible to prevent the transfer trace of the suction means from remaining on the back surface of the substrate. In this case, the meaning of the sequential shift is not limited to the case where the suction means that performs the suction operation in accordance with a certain order is shifted regularly, and
This also includes the case of so-called irregular transition.

Preferably, at the time of performing the suction operation, at least two suction means opposed to each other with the center of the substrate mounting portion interposed therebetween are simultaneously operated. As described above, the suction means may be arranged at least along the peripheral edge of the back surface of the substrate mounting portion, and the suction operation may be shifted clockwise or counterclockwise. According to this method, the basic operation is similar to that of claim 1 in both claim 2 and claim 3. However, in claim 2, at least two suction means opposed to each other with the center of the substrate interposed therebetween perform suction operation appropriately. Therefore, attraction points on the back surface of the substrate are appropriately set at least at two opposing positions across the center of the substrate. Therefore, such a substrate whose back surface is sucked at two positions opposed to each other with the center of the substrate therebetween is always stably held on the substrate mounting portion during processing. On the other hand, according to the third aspect, the suction locations on the back surface of the substrate are regularly shifted. Therefore, by combining the second aspect with the third aspect, the substrate can be held more stably.

According to a fourth aspect of the present invention, there is provided an apparatus for holding a substrate having a substrate mounting section provided with a plurality of suction means on an upper surface, wherein the suction operation of each suction means is performed for each suction means individually or individually. Provided is a substrate holding device, which is provided with control means for starting and stopping for each means group. According to this configuration, the method for holding a substrate according to the first to third aspects can be suitably performed. That is, since the control means accurately distinguishes the individual suction means or the group of suction means for performing the suction operation from the other individual suction means or the group of suction means, the transfer process of the suction means for performing the suction operation is initially performed. It is possible to proceed as planned.

According to a fifth aspect of the present invention, there is provided an apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein each suction means sucks the substrate by vacuum suction means. A suction path connecting the vacuum suction means and each suction means, a suction path opening / closing means interposed in each suction path, and a control means for controlling the opening / closing of the opening / closing means. A substrate holding device is provided. According to this configuration, when the opening / closing means is opened, the inside of the suction path is communicated, and the function of the vacuum suction means acts, so that the suction means performs a suction operation. On the other hand, when the on-off valve is closed, the inside of the suction path is shut off, the function of the vacuum suction means does not work, and the suction means does not perform the suction operation. Since the on-off valve is interposed in the middle of each suction path according to each suction means, the control means controls the suction operation accurately for each suction means or each suction means group. The same effect as that of No. 5 can be obtained.

In this case, it is preferable that at least a part of the suction path of the suction means located at a position opposed to the center of the substrate mounting portion is shared.
According to this configuration, the substrate mounting method according to the second aspect can be suitably performed. In addition, when the suction path is shared and the vacuum suction means is connected to each suction means, the number of on-off valves is reduced, and the labor for connecting each suction path to the vacuum suction means can be omitted. Therefore, it is possible to reduce the control load of the control means and simplify the substrate holding device.

According to a seventh aspect of the present invention, the substrate is sucked and held by a plurality of suction means provided on the upper surface of the substrate mounting portion, and the processing liquid supply nozzle is moved along the peripheral edge of the substrate to perform the processing. In a method of processing a substrate by supplying a processing liquid from a liquid supply nozzle, a substrate processing method is provided, in which suction means for performing a suction operation is sequentially shifted with movement of the processing liquid supply nozzle. According to this processing method, the suction location on the back surface of the substrate is sequentially shifted with the movement of the processing liquid supply nozzle. In this case, the back surface facing the periphery of the substrate being processed by the processing liquid supply nozzle is attracted to a stable state, so that the processing can be suitably performed. Further, the suction means for performing the suction operation may be sequentially shifted from the direction opposite to the movement of the processing liquid supply nozzle.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows an LCD substrate G
FIG. 1 is a perspective view of a coating and developing system 1 that processes a coating by using a photolithography technique. The coating and developing system includes a coating / periphery removing device 24 according to an embodiment of the present invention.

The coating and developing system 1 includes a loader unit 2 for loading / unloading a rectangular LCD substrate G, for example,
A first processing unit 3 for processing the CD substrate G, and a second processing unit 3 connected to the first processing unit 3 via the interface unit 4
Processing unit 5, the second processing unit 5, and the exposure device 6
And an interface unit 7 for exchanging the LCD substrate G with the other devices.

The loader unit 2 has a cassette station 1
The cassette station 10 has a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. The loader unit 2 is provided with a sub-transport arm 13 for loading or unloading an unprocessed LCD substrate G. The sub-transfer arm 1
Reference numeral 3 is configured to be movable in the Y and Z directions and rotatable in the θ direction.

In the first processing section 3, various processing devices for performing predetermined processing on the LCD substrate G are arranged on both sides of the transfer path 16 of the main transfer arm 15. On one side of the transport path 16, the L
A brush cleaning device 17 for cleaning the CD substrate G and a developing device 18 are arranged side by side, and an adhesion device 19 for performing hydrophobic treatment on the LCD substrate G, a heating device 20, and an LCD on the opposite side of the transport path 16 therebetween. Cooling devices 21 for cooling the substrate G to a predetermined temperature are appropriately arranged in multiple stages.

The second processing unit 5 includes a main transfer arm 2
The coating / periphery removing device 24 according to the present embodiment is disposed on one side of the second transport path 23, and the heating device 20 and the cooling device 21 are appropriately arranged in multiple stages on the opposite side across the transport path 22. Are located.

The interface unit 7 includes an LCD substrate G
, A sub-transfer arm 26 for moving the LCD substrate G in and out of the cassette 25, and a transfer stand 27 for the LCD substrate G. The configurations of the first processing unit 3 and the second processing unit 5, the arrangement of various devices, and the like can be appropriately changed.

Next, the coating / peripheral part removing device 24 incorporated in the coating / developing processing system 1 configured as described above.
Will be described.

As shown in FIG. 2, a coating system 30 for coating a resist solution on the surface of the LCD substrate G and an unnecessary coating formed on the peripheral portion of the LCD substrate G are provided in the coating / periphery removing device 24. The edge removing system 31 for removing the resist film is adjacent to the resist film, and the coating solution 30
A transport mechanism 32 for transporting the CD substrate G to the peripheral edge removing system 31
And

FIG. 3 is a sectional view of the peripheral edge removing system 31.
FIG. 4 is a plan view thereof. As shown in FIG. 3, a mounting table 34 as a substrate mounting portion supported at the upper end of the column 33 is disposed at the center of the peripheral edge removing system 31. On the upper surface of the mounting table 34, suction members 35a to 35
5h are attached, and these suction members 35a to 35h
By sucking the back surface of the LCD substrate G with the
The substrate G is held on the upper surface of the mounting table 34.

The lower end of the column 33 penetrates a bearing 37 fixed to the apparatus frame 36, and the column 33 slides in the bearing 37 so that the mounting table 34 moves up and down together with the column 33. However, the column 33 is connected to a piston rod 39 of a cylinder 38 fixed to the device frame 36 by a connecting member 40, and a cover 41 that covers the bearing 37 and the cylinder 38 is connected to the piston rod 39. Therefore, the mounting table 34 moves up and down together with the cover 41 as the cylinder 38 expands and contracts. Thus, the configuration is such that the LCD substrate G is carried in and out of the peripheral edge removing system 31.

Under the LCD substrate G held by the mounting table 34, the solvent and the resist liquid used for removing the peripheral resist film of the LCD substrate G are dropped to receive the solvent and the resist liquid when dropped. And a side wall member 46 surrounding the drain pan 45 so that the atmosphere in the drain pan 45 does not leak outside.
Is provided. The illustrated drain pan 45 is mounted on the mounting table 34 such as the bearing 37 or the cylinder 38 described above.
Are arranged so as to surround the periphery of the driving part. A drain pipe 48 for draining the solvent accumulated in the drain pan 45 is connected to a bottom surface 47 of the drain pan 45, and an exhaust system (not shown) is connected to the drain pipe 48. The atmosphere in the peripheral edge removing system 31 is exhausted by exhaust means (not shown). Further, a downflow is formed around the LCD substrate G by air supply from a separately provided fine filter unit (not shown).

As shown in FIGS. 3 and 4, around the LCD substrate G held by the mounting table 34, a rectangular LC
Nozzle 5 that moves along each of the four sides of D substrate G
5, 56, 57, 58 are arranged. In the present embodiment, the nozzles 55, 57 are connected to the short sides L1, L of the LCD substrate G.
The nozzles 56 and 58 are opposed to each other so as to move along the long sides L2 and L4 of the LCD substrate G, respectively. These nozzles 55, 56, 57, 58 are attached to the tips of L-shaped moving members 60, 61, 62, 63, respectively. Further, guide rails 65, 66, 67, 68 are arranged so as to surround the periphery of the LCD substrate G, and these guide rails 65, 66, 67, 68 are fixed to the device frame 36. Then, these moving members 60, 61, 62, 63 are connected to guide rails 65, 6.
6, 67, 68, the nozzles 55, 56, 57, 58 are configured to be able to move along each of the four sides L1, L2, L3, L4 of the LCD substrate G. I have.

Nozzles 55 and 5 having the same configuration
6, 57 and 58, for example, the nozzle 55 will be described as a representative. The nozzle 55 is, as shown in FIG.
An upper horizontal piece 70 covering the upper surface of the peripheral edge of the substrate G and a lower horizontal piece 71 projecting outward from the upper horizontal piece 70 are provided with a jet head 72 having a substantially U-shaped cross section. Upper horizontal piece 70
A thinner supply passage 73 passing through the upper horizontal piece 70;
An upper blowing hole 74 through which thinner is supplied as a solvent for removing a resist film is provided toward the upper surface of the peripheral portion of the LCD substrate G via the thinner supply path 73. The lower horizontal piece 71 has a thinner supply path 75 passing through the lower horizontal piece 71.
And a lower blowout hole 76 through which thinner is supplied as a solvent for removing a resist film toward the lower surface of the peripheral portion of the LCD substrate G via the thinner supply path 75. Furthermore,
A gap 77 formed to cover the vicinity of the periphery of the LCD substrate G is provided at the jetting head 72, and a suction hole 78 for sucking and exhausting the atmosphere near the periphery of the LCD substrate G to the outside is provided at the center of the inside. ing. The other nozzles 56 and 5
The nozzles 7 and 58 have exactly the same configuration as the nozzle 55, and a detailed description thereof will be omitted.

Here, the suction members 35a to 35h for sucking the LCD substrate G will be described in detail. As shown in FIG. 6, the suction members 35a, 35
c, 35e, and 35g, and a suction member 35b at the center between the suction members 35a and 35c, and the suction member 3 at the center between the suction members 35c and 35e.
5d, an adsorption member 35f is disposed at the center between the adsorption members 35e and 35g, and an adsorption member 35h is disposed at the center between the adsorption members 35g and 35a. In the illustrated example, the suction members 35a to 35c are connected to the short side L3 of the LCD substrate G.
The suction members 35c to 35e are arranged on the long side L2 side of the LCD substrate G, the suction members 35e to 35g are arranged on the long side L1 side of the LCD substrate G, and the suction members 35g to 35a are
The D substrates G are arranged on the long side L4 side.

Each of the suction members 35a to 35h has the same configuration. For example, the suction member 35a includes a vacuum hole 80 provided in the mounting table 34 as shown in FIG. Has an oil seal 84 fixed by a holding ring screw 83 via a packing 82 in a stepped concave portion 81 of the oil seal 8.
The upper surface of 4 is provided with a seal portion 85 that spreads upward like a trumpet. Further, the suction member 35a
Has a top pad 87 movably fitted to a seal portion 85 of an oil seal 84 and having a suction hole 86 at the center. Note that the other suction members 35b to 35h have exactly the same configuration as the suction member 35a, and a detailed description thereof will be omitted.

Further, as shown in FIG.
5a to 35h have a configuration in which the LCD substrate G is sucked by the vacuum suction means 90. The mounting table 34 includes suction paths 91a to 91h connecting the vacuum suction means 90 and the suction members 35a to 35h. Opening / closing valves 92a to 92h provided in the middle of each of the suction passages 91a to 91h, and opening / closing valves 92a to 92h
And a control unit 93 for controlling the opening and closing of 2h. When the suction members 35a to 35h perform the suction operation,
On-off valve 92a according to a control signal output from control unit 93
Open ~ 92h. As a result, the function of the vacuum suction means 90 which is always operating operates for the first time, and the top pad 87 operates.
Is sucked and adheres following the inclination and deformation of the LCD substrate G,
The configuration is such that the LCD substrate G can be reliably sucked.

The control unit 93 includes all the suction members 35a to 35a.
The control signal is not set to be output to all of the on-off valves 92a to 92h at the same time so that 5h operates simultaneously, but the control signal is output to any of the on-off valves 92a to 92h, and the eight suction valves are output. It is configured to control whether or not to perform the suction operation on each of the eight suction members among the members 35a to 35h individually or for each group in which two or more suction members among the suction members 35a to 35h are combined. ing. In the present embodiment, two suction members 35a, 35e opposed to each other with the center of the mounting table 34 interposed therebetween, and suction members 35b, 35e.
And the suction members 35c and 35g, and the suction members 35d and 35
h to perform the suction operation.
The groups a to 35h are sequentially shifted at predetermined time intervals.

As described above, the coating / peripheral portion removing device 24 and the mounting table 34 according to the present embodiment are configured as described above. Next, the coating / peripheral portion removing device 24 provided in the processing system 1 will be described. The holding operation of the LCD substrate G will be described.

First, the unprocessed LCD substrate G accommodated in the cassette 11 is taken out by the sub-transport arm 13 of the loader unit 2 and then transferred to the main transport arm 15 of the first processing unit 3. , And is transported into the brush cleaning device 17. The LCD substrate G, which has been brush-cleaned in the brush cleaning device 17, is thereafter subjected to an adhesion device 19.
, And is cooled by the cooling device 21. Thereafter, the substrate is carried into the coating system 30 of the coating / periphery removing device 24, and the resist solution is applied to the surface of the LCD substrate G.
Then, the process proceeds to a step of removing an unnecessary resist film carried in by the transport mechanism 32 and adhered to the peripheral portion.

In the peripheral edge removing system 31, the LCD substrate G carried into the inside by the transport mechanism 32 is pushed up on the upper surface of the mounting table 34 which is raised by the extension operation of the cylinder 38, and the back surface of the LCD substrate G is sucked by the suction member 34. Thus, the LCD substrate G is held on the upper surface of the mounting table 34. After the holding, when the transport mechanism 32 retreats from the peripheral edge removing system 31, the mounting table 34 is lowered by the shortening operation of the cylinder 38, and as shown in FIG.
The substrate G is loaded.

Next, each of the nozzles 55, 56, 57, 58
Starts moving along each of the four sides L1, L2, L3, L4 of the LCD substrate G. By this movement, as shown in FIG. 5, the periphery of the LCD substrate G is fitted into the gap 77 between the nozzles 55, 56, 57, 58 in a non-contact state,
The blowing of thinner as a solvent from the upper blowing hole 74 and the lower blowing hole 76 is started. And the suction hole 7
8, the unnecessary resist film adhering to the peripheral portion of the LCD substrate G is dissolved by the thinner, and the dissolved resist solution is sucked and exhausted from the suction holes 78 to thereby discharge the LCD substrate G. Unnecessary resist film on the periphery is removed.

After the unnecessary resist film adhering to the peripheral portion of the LCD substrate G is removed in this way, the mounting table 34 is raised, and the main transfer arm 2 of the coating and developing system 1 is moved.
2 enters the coating / periphery removing device 24 and the LCD substrate G
Receive. As a result, the LCD substrate G is carried out from the coating / peripheral part removing device 24. Next, after being carried into the heating device 20 and subjected to a baking process on the resist film, a predetermined pattern is exposed by the exposure device 6. Then, the exposed LCD substrate G is transported into the developing device 18, and after being developed by the developing solution, the developing solution is washed away by the rinsing solution, and the developing process is completed. The processed LCD substrate G that has been subjected to the development processing is housed in the cassette 12 of the loader unit 2 and then carried out and transferred to the next processing step.

In the above-described peripheral resist film removing step, the suction members 35a to 35h provided on the mounting table 34 play an important role in preventing transfer marks from remaining on the back surface of the LCD substrate G. Yes, all suction members 35a-3
5h does not perform the suction operation consistently throughout the processing,
One of these suction members 35a to 35h sequentially performs an appropriate suction operation, stops the suction operation before the transfer is left, and shifts the suction portion on the back surface of the LCD substrate G in each case. Place the substrate G on the mounting table 34
Is to be held. For example, the following suction operation is performed.

First, in the suction members 35a to 35h,
The suction members 35a and 35e and the suction members 35
b, 35f, suction members 35c, 35g, and suction member 3
5d and 35h are set as a group, and the suction members 3
When the suction operation is performed on the valves 5a and 35e, the on-off valves 92a and 9
2e, when the suction members 35b and 35f perform the suction operation, the attraction members 35d and 35h perform the suction operation at the on-off valves 92b and 92f, and when the suction members 35c and 35g perform the suction operation, at the on-off valves 92c and 92g. In case of on-off valve 92
The control unit 93 outputs control signals to d and 92h, respectively. 2 facing each other across the center of such an LCD substrate G
The LCD substrate G whose back surface is sucked at the location is always stably held on the substrate mounting table 34 during processing.

The suction members 35a and 35e and the suction member 35
b, 35f, suction members 35c, 35g, and suction member 3
Since the suction operation is performed similarly for 5d and 35h, the suction operation of the suction members 35a and 35e will be described below as a representative. When a control signal is output from the control unit 93 to the on-off valves 92a and 92e, the on-off valves 92a and 92e
The suction passages 92e are both opened, and the insides of the suction passages 91a and 91e are communicated with each other, and the function of the vacuum suction means 90 is operated to operate the suction members 35a and 35e.
Performs the suction operation. On the other hand, when the control signal is not output from the control unit 93 to the on-off valves 92a and 92e,
a, 92e are closed and the inside of the suction passages 91a, 91e is shut off,
The function of the vacuum suction means 90 does not work and the suction means 35a, 3
5e does not perform the suction operation. Thus, the suction members 35a, 3
In step 5e, the suction operation is accurately controlled by the control unit 93. The suction members 35b and 35f and the suction members 35
c, 35g and the suction members 35d, 35h are also suction members 3.
As in 5a and 35e, the suction operation is accurately controlled by the control unit 93.

Further, the suction time of the suction members 35a to 35h is set to be equal to or shorter than a predetermined time so as to be shorter than the time for performing the processing on the LCD substrate G. Operate and LC
Transfer marks are prevented from remaining on the back surface of the D substrate G. In this case, the control unit 93 outputs the control signal to a certain group in the on-off valves 92a to 92h at predetermined time intervals and does not output a control signal to the other groups.
Within h, a group that performs the suction operation and another group are selected at predetermined time intervals. Then, a group appropriately selected from among the suction members 35a to 35h performs the suction operation for a predetermined time, and the suction operation of this group ends, and the suction operation shifts to another group in the suction members 35a to 35h. Similarly, the suction operation is performed for a predetermined period of time, and this operation is sequentially repeated until the processing is completed.
The suction location on the back surface of the LCD substrate G is not fixed.
Thus, the suction members 35a to 35h are provided on the rear surface of the LCD substrate G.
, The LCD substrate G can be always held on the mounting table 34 during processing without leaving a transfer mark. It is to be noted that the group in the suction members 35a to 35h that have operated once for a predetermined time cannot be operated again, and the suction operation can be performed again if the operation is stopped to some extent after the suction operation is completed.

Here, in the present embodiment, the suction member 35a
The process of sequentially shifting the suction operation of (h) to (h) is sequentially switched along the periphery of the substrate in the clockwise direction. As shown in FIGS. 9A to 9D, the transfer process of the suction operation starts from the suction member 35 a on one side, and the transfer process of the suction operation starts from the suction member 35 e on the other side. In this case, the suction members 35a and 35e start the suction operation at the same time.
9a and the suction member 35e simultaneously stop the suction operation (FIG. 9).
(A)) → Suction member 35b and suction member 35f start suction operation at the same time → Suction member 35b
The suction member 35f simultaneously stops the suction operation (FIG. 9).
(B)) → The suction member 35c and the suction member 35g start the suction operation at the same time → After a predetermined time elapses, the suction member 35c
And the suction member 35g simultaneously stops the suction operation (FIG. 9).
(C)) The suction member 35d and the suction member 35h start the suction operation at the same time → After a predetermined time elapses, the suction member 35d
And the suction member 35h simultaneously stops the suction operation (FIG. 9).
(D)), which returns to the initial state through the transition process. Then, the same transition process is started again. This process involves loading the LCD substrate G into the peripheral edge removing system 31,
The process is repeated in a series of steps of removing the peripheral resist film and carrying in from the peripheral portion removing system 31.
As described above, the back surface of the LCD substrate G is sucked at two places opposed to each other with the center of the LCD substrate G interposed therebetween, and the sucking members 35a to 35h are regularly shifted. Will be

In this transition process, the timing of transition between the group in the suction members 35a to 35h performing the suction operation first and the group in the suction members 35a to 35h performing the suction operation next is determined in advance. The group in the suction members 35a to 35h performing the suction operation stops the suction operation, and at the same time, the suction member 3 performing the next suction operation.
The group within 5a to 35h may start the suction operation, or the suction member 35 that has performed the suction operation first.
Immediately before the group in a to 35h stops the suction operation, the group in the suction members 35a to 35h performing the next suction operation may start the suction operation. In any case, it can be set freely according to the type of processing.

Thus, according to the present embodiment, the suction members 35a to 35h performing the suction operation are sequentially shifted, and
The suction location on the back surface of the D substrate G is not fixed for more than a predetermined time. Therefore, LC from the beginning to the end of the process
Even if the mounting table 34 sucks and holds the D substrate G, the LCD substrate G
The transfer marks of the suction members 35a to 35h can be prevented from remaining on the back surface of the recording medium. As a result, product defects of the LCD substrate G can be resolved, and the yield can be improved. Note that the grouping of the suction members 35a to 35h is not limited to the combination of two suction members, and a group may be formed by combining three, four or more members. As an extreme example, it is conceivable to simply stop one of the suction members 35a to 35h and sequentially shift the stopped suction members.

Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example.
It can take various aspects. For example, as shown in FIG. 10, in the mounting table 100, the suction path 91 a of the suction member 35 a at a position facing the center of the mounting table 100.
And a part of the suction passage 91e of the suction member 35e is commonly connected, and similarly, the suction passage 91b of the suction member 35b and the suction member 3 are connected.
A part of the suction path 91f of 5f is connected in common, and similarly, the suction path 91c of the suction member 35c and the suction path 9 of the suction member 35g are similarly connected.
A part of 1g may be commonly connected, and similarly, a part of the suction path 91d of the suction member 35d and a part of the suction path 91h of the suction member 35h may be commonly connected. In this case, the suction path 91
a and the suction passage 91e are commonly connected at a connection point N1, and an on-off valve 102a is interposed in the suction passage 101a connecting the connection point N1 and the vacuum suction means 90. Similarly,
The suction path 91b and the suction path 91f are commonly connected at a connection point N2, and an on-off valve 102b is interposed in the suction path 101b connecting the connection point N2 and the vacuum suction means 90.

Similarly, the suction path 91c and the suction path 91g are commonly connected at the connection point N3, and the connection point N3 and the vacuum suction means 9 are connected.
An on-off valve 102c is interposed in the middle of the suction path 101c connecting between the valve 102 and the zero. Similarly, the suction path 91d and the suction path 9
1h is commonly connected at a connection point N4, and an on-off valve 102d is interposed in the middle of a suction path 101d connecting the connection point N4 and the vacuum suction means 90. According to such a configuration, the suction operation of the two suction members among the suction members 35a to 35h can be simultaneously controlled only by switching the opening and closing of one of the open / close valves 102a to 102d. For example, on-off valve 1
02a, the suction passages 90a and 90e are communicated with and blocked by the vacuum suction means 90, and the suction members 35a and 3e are closed.
The suction operation of 5e is controlled. Accordingly, the number of on-off valves is reduced while the operation of controlling the suction means 35a to 35h in the mounting table 100 is performed as usual, so that the load on the control unit 93 for controlling these on-off valves 102a to 102d is reduced, and the mounting table is reduced. It is possible to simplify the components related to 100.

As shown in FIG. 11, the suction path 91a
To 91h are commonly connected at a connection point N5, and these suction paths 91a to 91h are connected to the vacuum suction means 90 via a suction path 104 connecting the connection point N5 and the vacuum suction means 90. It may be. According to such a configuration, the labor for connecting the suction paths 91a to 91h to the vacuum suction means 90 can be omitted.

Various aspects can be adopted in the above transition process. For example, in the transition process, the order of switching the suction operation may be set to be counterclockwise. In addition, not only the transfer process of the regular suction members 35a to 35h such as clockwise or counterclockwise, but also a so-called irregular transfer process can be adopted.

Further, as shown in FIGS. 12 to 16, when the resist liquid is supplied to the LCD substrate G while the nozzles 55, 57, 57, 58 are moved along the periphery of the LCD substrate G, Suction members 105a to 100p that perform a suction operation as the nozzles 55, 57, 57, 58 move.
May be sequentially shifted. In this case, the suction members 105a, 105e, 105i,
105m, and adsorbing members 105a and 105m
e, the suction members 105b, 105c, and 105d are disposed at appropriate intervals, and similarly, the suction members 105e and
5i, the suction members 105f, 105g, and 105h are disposed at appropriate intervals, and similarly,
05m and the adsorbing members 105j, 105k, 105l
Are arranged at appropriate intervals, and similarly, the adsorbing members 105n, 105o, and 105 are provided between the adsorbing members 105m and 105a.
p are arranged at appropriate intervals. In the illustrated example, the suction members 105a to 105e are arranged on the short side L3 side of the LCD substrate G, the suction members 105e to 105i are arranged on the long side L2 side of the LCD substrate G, and the suction members 105i to 105e are arranged.
m are arranged on the long side L1 side of the LCD substrate G,
05m to 105a are arranged on the long side L4 side of the LCD substrate G.

In the above configuration, FIGS.
As shown in FIG. 6, on the short side L1 side, as the nozzle 55 moves along the short side L1 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05i → adsorption member 105j → adsorption member 105k → adsorption member 105l → adsorption member 105m. On the short side L2 side, as the nozzle 56 moves along the short side L2 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05e → adsorption member 105f → adsorption member 105g → adsorption member 105h → adsorption member 105i. On the short side L3 side, as the nozzle 57 moves along the short side L3 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05a → adsorption member 105b → adsorption member 105c → adsorption member 105d → adsorption member 105e. On the short side L4 side, as the nozzle 58 moves along the short side L4 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05m → adsorption member 105n → adsorption member 105o → adsorption member 105p → adsorption member 105a. According to this transition process, the back surface facing the periphery of the LCD substrate G, from which the resist film has been removed by the nozzles 55, 56, 57, 58, is attracted and brought into a stable state. It can be done smoothly. Further, the suction means 105a to 105p performing the suction operation may be sequentially shifted from the direction opposite to the movement of the nozzle.

The substrate is not limited to the LCD substrate G as in the above-described embodiment, but may be a semiconductor wafer, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.

[0050]

According to the first aspect of the present invention, since the suction position on the back surface of the substrate can be sequentially shifted, even if the mounting table sucks and holds the substrate from the beginning to the end of the processing, Transfer marks of the suction means can be prevented from remaining on the back surface of the substrate. Therefore, it is possible to solve the product defect of the substrate by suitably holding the substrate and improve the yield.

According to the second or third aspect of the present invention, the substrate can be more stably held on the mounting table.

According to the fourth and fifth aspects of the present invention, the substrate holding method according to the first to third aspects can be suitably implemented. In particular, according to the fifth aspect, the control means can accurately select the suction means for performing the suction operation and the other suction means, so that the transition process of the suction means for performing the suction operation proceeds as originally planned. Becomes possible.

Further, according to the invention described in claim 6,
Since the number of on-off valves is reduced, the load on the control function of the control means is reduced, and the structure for sucking the substrate by the suction means can be simplified.

According to the seventh aspect of the present invention, the back surface opposed to the vicinity of the periphery of the substrate being processed by the processing liquid supply nozzle is attracted to a stable state, so that the processing can be suitably performed.

[Brief description of the drawings]

FIG. 1 is a view showing a mounting table and a coating and coating apparatus according to an embodiment of the present invention.
1 is a perspective view of a coating and developing system including a peripheral edge removing device.

FIG. 2 is a plan view of a coating / periphery removing device according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of the coating / periphery removing apparatus according to the embodiment of the present invention, on an edge removing system side;

FIG. 4 is a plan view of a peripheral edge removing system.

FIG. 5 is a sectional view of a nozzle.

FIG. 6 is a perspective view of a mounting table.

FIG. 7 is a perspective view of a suction member.

FIG. 8 is an explanatory diagram showing a circuit of a suction system connected to a mounting table.

FIG. 9 is a process chart showing a transfer process of a suction member performing a suction operation.

FIG. 10 is an explanatory diagram showing another example of a suction system circuit connected to the mounting table.

FIG. 11 is an explanatory diagram showing a main part of another example of a suction system circuit connected to the mounting table.

FIG. 12 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.

FIG. 13 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.

FIG. 14 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted with movement of a nozzle.

FIG. 15 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.

FIG. 16 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Processing system 24 Coating / peripheral part removing device 31 Peripheral part removing system 34 Mounting table 35a-35h Suction member 55,56,57,58 Nozzle 90 Vacuum suction means 91a-91h Suction path 92a-92h On-off valve 93 Control part G LCD substrate

Claims (7)

[Claims] In a method of sucking and holding a substrate by a plurality of suction means provided on an upper surface of a substrate mounting portion, the suction means for performing a suction operation is sequentially shifted while holding the substrate. The substrate holding method. 2. The substrate holding method according to claim 1, wherein at least two suction means opposed to each other with the center of the substrate mounting portion interposed therebetween perform the suction operation at the same time. 3. The substrate according to claim 1, wherein the suction means is arranged at least along a peripheral edge of the substrate mounting portion, and the suction operation is shifted clockwise or counterclockwise. Retention method. 4. An apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein the suction operation of each suction means is performed for each suction means or each suction means group.
A substrate holding device comprising control means for starting and stopping. 5. An apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein each suction means has a structure for sucking the substrate by vacuum suction means,
A suction path connecting the vacuum suction means and the suction means; opening and closing means for a suction path interposed in each suction path; and control means for controlling opening and closing of the opening and closing means. Substrate holding device. 6. The substrate holding device according to claim 5, wherein at least a part of a suction path of the suction unit located at a position facing the center of the substrate mounting portion is shared. 7. A processing liquid supply nozzle which holds a substrate by sucking and holding the substrate by a plurality of suction means provided on an upper surface of the substrate mounting portion and moves the processing liquid supply nozzle along a peripheral portion of the substrate. In the method of processing a substrate by supplying a liquid, the suction means for performing the suction operation is sequentially shifted with the movement of the processing liquid supply nozzle.
Substrate processing method.