JP3590250B2

JP3590250B2 - Substrate processing method and substrate processing apparatus

Info

Publication number: JP3590250B2
Application number: JP33228897A
Authority: JP
Inventors: 伝大森
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 1997-11-18
Filing date: 1997-11-18
Publication date: 2004-11-17
Anticipated expiration: 2017-11-18
Also published as: JPH11150176A

Description

【０００１】
【発明の属する技術分野】
本発明は，例えば半導体ウェハやＬＣＤ基板などといった基板を処理する基板処理方法及び基板処理装置に関する。
【０００２】
【従来の技術】
一般に，液晶ディスプレイ（ＬＣＤ）装置や半導体デバイスなどの製造においては，ＬＣＤ基板や半導体ウェハの上面にレジスト膜パターンを形成させるために，いわゆるリソグラフィ処理が行われる。このリソグラフィ処理は，ＬＣＤ基板の洗浄，ＬＣＤ基板の乾燥，ＬＣＤ基板の表面へのレジスト液の塗布，感光膜の露光，現像など，種々の処理工程を含んでいる。例えば，ＬＣＤ基板を洗浄した後，疎水化処理を施し，更に冷却した後，フォトレジストとしてのレジスト液を塗布してＬＣＤ基板の表面に感光膜を塗布形成する。加熱してべーキング処理を施した後，露光装置において感光膜に所定のパターンを露光する。露光後のＬＣＤ基板の表面に現像液を塗布して現像した後にリンス液により現像液を洗い流し，現像処理を完了する。
【０００３】
以上のようなリソグラフィ処理において，通常，ＬＣＤ基板を水平な載置台に保持しＬＣＤ基板を固定した状態で処理を施す方法や，回転自在なスピンチャックにＬＣＤ基板を保持させＬＣＤ基板を回転させながら処理を施す方法などが採用されている。特に従来の載置台は，載置台の上面に吸着部材を設け，この吸着部材でＬＣＤ基板の裏面を吸着することによりＬＣＤ基板を載置台に保持させた状態で所定の処理を施すように構成されている。
【０００４】
以上のような載置台が使用されてる処理としては，例えば，レジスト液を塗布する工程した後にＬＣＤ基板の周縁部や裏面に形成された不要なレジスト膜を除去する周縁除去処理がある。これは，載置台に保持されたＬＣＤ基板の周縁部に沿ってノズルを移動させつつ，そのノズルから溶剤（例えばシンナ）を供給すると同時に，この溶剤の供給によって溶解したレジスト液を吸引除去するものであり，この処理中は常に載置台の吸着部材は，ＬＣＤ基板の裏面を吸着し続けている。
【０００５】
【発明が解決しようとする課題】
ところで，従来の載置台では，載置台の上面の所定の箇所に配置された複数の吸着部材の全てが，ＬＣＤ基板の裏面を吸着し処理が終了するまでＬＣＤ基板の裏面の所定の箇所を継続的に吸着し続けていた。このため，ある時間以上処理が行われた場合には，処理の終了後にＬＣＤ基板の裏面の所定の箇所では吸着部材が吸着した跡，いわゆる転写跡が残ってしまう。この転写跡は，レジストに悪影響を及ぼし液晶ディスプレー（ＬＣＤ）装置の製造における歩留まりを低下させる恐れがある。
【０００６】
本発明はかかる点に鑑みてなされてものであり，基板の裏面に吸着手段の転写跡を残さず基板を保持しながら，同時に基板の処理が好適に行える基板処理方法，及び基板処理方法を好適に実施できる基板処理装置を提供して上記問題の解決を図ることを目的とする。
【０００８】
【課題を解決するための手段】
前記目的を達成するために，本発明によれば，基板載置部の上面に設けた複数の吸着手段によって基板を吸着して保持し，処理液供給ノズルを当該基板の周縁部に沿って移動させつつこの処理液供給ノズルから処理液を供給して基板を処理する方法において，前記処理液供給ノズルの移動に伴って，前記吸着手段の吸着動作を基板の周縁部に沿って順次移行させることを特徴とする，基板処理方法が提供される。かかる方法によれば，吸着動作を行う吸着手段を順次移行させるため，基板載置部の上面に設けた全ての吸着部材が一斉に処理の開始から終了まで継続的に吸着動作を行うことがない。さらに処理中は，基板載置部の上面に設けた何れかの吸着部材が適宜吸着動作を行い転写跡が残る前に吸着動作を停止し，別の吸着部材に吸着動作が移行していき，これを処理が終了するまで順次繰り返すことができる。即ち，基板の裏面における吸着箇所は固定されない。従って，処理の最初から終わりまで基板を基板載置部が吸着・保持しても，基板の裏面に吸着手段の転写跡が残ることを防止できる。なおこの場合，順次移行の意味は，ある順番に従って吸着動作を行う吸着手段を規則正しく移行させる場合に限定されず，いわゆる不規則に移行させる場合も含んでいる。また，本発明によれば，基板載置部の上面に設けた複数の吸着手段によって基板を吸着して保持し，処理液供給ノズルを当該基板の周縁部に沿って移動させつつこの処理液供給ノズルから処理液を供給して基板を処理する方法において，前記処理液供給ノズルの移動に伴って，前記吸着手段の吸着動作を基板の各辺において順次移行させることを特徴とする，基板処理方法が提供される。
【０００９】
前記処理液供給ノズルの移動と同じ方向に，前記吸着手段の吸着動作を移行させることとしても良い。また，前記処理液供給ノズルの移動と逆の方向に，前記吸着手段の吸着動作を移行させることとしても良い。さらに，基板の中心を挟んで対向する前記吸着手段同士を同時に吸引動作させることとしても良い。かかる方法によれば，基板の中心を挟んで対向する，少なくとも２つの吸着手段同士が適宜吸着動作をするので，基板の裏面における吸着箇所が少なくとも基板の中心を挟んだ対向する位置の２箇所に適宜設定されていく。従って，このような基板の中心を挟んで対向した２箇所で裏面を吸着されている基板は，処理中常に安定して基板載置部に保持される。一方，基板の裏面における吸着箇所を規則正しく移行させていく。従って，これらの発明を組み合わせれば，より安定した基板の保持が行える。
【００１０】
また，本発明によれば，上面に複数の吸着手段を備えた基板載置部と，基板の周縁部に沿って移動しつつ基板の周縁部に処理液を供給する処理液供給ノズルを備えた基板処理装置であって，前記処理液供給ノズルの移動に伴って，前記吸着手段の吸着動作を基板の周縁部に沿って順次移行させる制御手段を備えたことを特徴とする，基板処理装置が提供される。
【００１１】
さらに，本発明によれば，上面に複数の吸着手段を備えた基板載置部と，基板の周縁部に沿って移動しつつ基板の周縁部に処理液を供給する処理液供給ノズルを備えた基板処理装置であって，前記処理液供給ノズルの移動に伴って，前記吸着手段の吸着動作を基板の各辺において順次移行させる制御手段を備えたことを特徴とする，基板処理装置が提供される。
【００１２】
前記制御手段は，前記処理液供給ノズルの移動と同じ方向に，前記吸着手段の吸着動作を移行させることとしても良い。また，前記制御手段は，前記処理液供給ノズルの移動と逆の方向に，前記吸着手段の吸着動作を移行させることとしても良い。前記各吸着手段は，真空吸引手段によって基板を吸着する構成を有し，前記真空吸引手段と各吸着手段とを結ぶ吸引路と，各吸引路の途中に介装された吸引路の開閉手段とを備え，前記制御手段によって前記開閉手段の開閉を制御することが好ましい。
【００１３】
また，基板載置部の中心を挟んで対向位置にある吸着手段の吸引路は少なくとも一部が共有されていることが好ましい。前記吸着手段は，少なくとも基板載置部の周縁部に沿って配置されることが好ましい。基板の中心を挟んで対向する前記吸着手段同士を同時に吸引動作させることとしても良い。
【００１４】
【発明の実施の形態】
以下，本発明の好ましい実施の形態を添付図面に基いて説明する。図１は，ＬＣＤ基板Ｇをフォトリソグラフィ技術を用いて処理する塗布現像処理システム１の斜視図であり，この塗布現像処理システムは本発明の実施の形態にかかる塗布・周縁部除去装置２４を備えている。
【００１５】
この塗布現像処理システム１は，例えば矩形状のＬＣＤ基板Ｇを搬入・搬出するローダ部２と，ＬＣＤ基板Ｇを処理する第１の処理部３と，この第１の処理部３とインターフェイス部４を介して連設された第２の処理部５と，この第２の処理部５と例えば露光装置６等との間でＬＣＤ基板Ｇを授受するためのインターフェイス部７から構成されている。
【００１６】
ローダ部２には，カセットステーション１０が設けられており，このカセットステーション１０には未処理のＬＣＤ基板Ｇを収納するカセット１１と，処理済みのＬＣＤ基板Ｇを収納するカセット１２とがそれぞれ複数個載置自在である。またローダ部２には，未処理のＬＣＤ基板Ｇを搬入または搬出するためのサブ搬送アーム１３が備えられている。なお，サブ搬送アーム１３はＹ，Ｚ方向への移動とθ方向に回転可能に構成されている。
【００１７】
第１の処理部３には，ＬＣＤ基板Ｇに対して所定の処理を施す各種の処理装置がメイン搬送アーム１５の搬送路１６を挟んで両側に配置されている。搬送路１６の一方の側に，カセット１１から取り出されたＬＣＤ基板Ｇを洗浄するためのブラシ洗浄装置１７，現像装置１８が並んで配置され，搬送路１６を挟んで反対側に，ＬＣＤ基板Ｇに疎水化処理を施すアドヒージョン装置１９，加熱装置２０，ＬＣＤ基板Ｇを所定の温度に冷却する冷却装置２１が適宜多段に配置されている。
【００１８】
第２の処理部５には，メイン搬送アーム２２の搬送路２３の一方の側に，本実施の形態にかかる塗布・周縁部除去装置２４が配置され，搬送路２２を挟んで反対側には，加熱装置２０，冷却装置２１が適宜多段に配置されている。
【００１９】
インターフェイス部７には，ＬＣＤ基板Ｇを一時待機させるためのカセット２５と，このカセット２５との間でＬＣＤ基板Ｇの出入れを行うサブ搬送アーム２６と，ＬＣＤ基板Ｇの受渡し台２７が設けられている。なお，これら第１の処理部３及び第２の処理部５の構成，各種装置の配列等は適宜変更することが可能である。
【００２０】
次に，上記のように構成される塗布現像処理システム１に組み込まれた塗布・周縁部除去装置２４の構成について説明する。
【００２１】
図２に示すように，塗布・周縁部除去装置２４内には，ＬＣＤ基板Ｇの表面にレジスト液を塗布する塗布系３０と，ＬＣＤ基板Ｇの周縁部に塗布形成された不要なレジスト膜を除去する周縁部除去系３１とを隣接させ，塗布系３０によってレジスト液が塗布されたＬＣＤ基板Ｇを周縁部除去系３１に搬送する搬送機構３２とを備えている。
【００２２】
図３は周縁部除去系３１の断面図であり，図４はその平面図である。図３に示すように，周縁部除去系３１の中央には，支柱３３の上端において支持された基板載置部としての載置台３４が配置されている。載置台３４の上面には，後に詳述する吸着部材３５ａ〜３５ｈが装着されており，これら吸着部材３５ａ〜３５ｈでＬＣＤ基板Ｇの裏面を吸着することによって，ＬＣＤ基板Ｇを載置台３４の上面に保持している。
【００２３】
支柱３３の下端は，装置フレーム３６に固定された軸受３７を貫通しており，この軸受３７内を支柱３３が摺動することにより，載置台３４は支柱３３と共に昇降する。但し，支柱３３は装置フレーム３６に固定されたシリンダ３８のピストンロッド３９に接続部材４０によって結合されており，また，軸受３７およびシリンダ３８を覆うカバー４１がピストンロッド３９に結合されている。従って，シリンダ３８が伸縮することによってカバー４１と共に載置台３４が昇降動作する。これにより，周縁部除去系３１へのＬＣＤ基板Ｇの搬入出が行われる構成になっている。
【００２４】
載置台３４に保持されたＬＣＤ基板Ｇの下方には，ＬＣＤ基板Ｇの周縁レジスト膜を除去する際に使用した溶剤やレジスト液などが落下したときにそれら溶剤やレジスト液を受け取るためのドレインパン４５が配置され，このドレインパン４５内の雰囲気が外部に漏れないようドレインパン４５を囲むように側壁部材４６が設けられている。図示のドレインパン４５は，先に説明した軸受３７やシリンダ３８などといった載置台３４の駆動部分の周囲を囲むように配置されている。このドレインパン４５の底面４７には，ドレインパン４５に溜まった溶剤を排液するためのドレイン管４８が接続され，このドレイン管４８には図示していない排気系統が接続されている。周縁部除去系３１内の雰囲気は，図示しない排気手段によって排気される。さらに，別設のファインフィルタユニット（図示せず）からの給気によりＬＣＤ基板Ｇの周囲にダウンフローを形成させる。
【００２５】
図３及び図４に示すように，載置台３４に保持されたＬＣＤ基板Ｇの周囲には，長方形をなすＬＣＤ基板Ｇの四辺のそれぞれに沿って移動するノズル５５，５６，５７，５８が配置されている。本実施の形態では，ノズル５５，５７をＬＣＤ基板Ｇの短辺Ｌ１，Ｌ３に沿ってそれぞれ移動するように対向して配置し，ノズル５６，５８をＬＣＤ基板Ｇの長辺Ｌ２，Ｌ４に沿ってそれぞれ移動するように対向して配置している。これらノズル５５，５６，５７，５８は，Ｌ字型をなす移動部材６０，６１，６２，６３の先端にそれぞれ取り付けられている。また，ＬＣＤ基板Ｇの周囲を囲むようにしてガイドレール６５，６６，６７，６８が配置されており，これらガイドレール６５，６６，６７，６８は，装置フレーム３６に固定されている。そして，これら移動部材６０，６１，６２，６３をガイドレール６５，６６，６７，６８のそれぞれに摺動自在に装着することにより，ノズル５５，５６，５７，５８がＬＣＤ基板Ｇの四辺Ｌ１，Ｌ２，Ｌ３，Ｌ４のそれぞれに沿って移動できるように構成されている。
【００２６】
何れも同様な構成を有したノズル５５，５６，５７，５８において，例えばノズル５５を代表として説明する。ノズル５５は，図５に示すように，ＬＣＤ基板Ｇの周縁部の上面を覆う上部水平片７０と，上部水平片７０より外方に突出する下部水平片７１とからなる断面略コ字状の噴頭７２を備えている。上部水平片７０には，上部水平片７０内部を通るシンナ供給路７３と，このシンナ供給路７３を介してＬＣＤ基板Ｇの周縁部上面に向かってレジスト膜除去用の溶剤としてシンナが供給される上吹き出し孔７４とを設けている。下部水平片７１には，下部水平片７１内部を通るシンナ供給路７５と，このシンナ供給路７５を介してＬＣＤ基板Ｇの周縁部下面に向かってレジスト膜除去用の溶剤としてシンナが供給される下吹き出し孔７６とを設けている。更に，噴頭７２にはＬＣＤ基板Ｇの周縁部近傍を覆うように形成された隙間７７が設けられ，内部中央にはＬＣＤ基板Ｇの周縁近傍の雰囲気を外側に吸引排気するための吸引孔７８が設けられている。なお，他のノズル５６，５７，５８も，ノズル５５と全く同様の構成を備えているので詳細な説明を省略する。
【００２７】
ここで，ＬＣＤ基板Ｇを吸着する上記吸着部材３５ａ〜３５ｈについて詳しく説明する。図６に示すように，載置台３４の四隅に吸着部材３５ａ，３５ｃ，３５ｅ，３５ｇをそれぞれ配置すると共に，吸着部材３５ａと３５ｃとの間の中心に吸着部材３５ｂを配置し，吸着部材３５ｃと３５ｅとの間の中心に吸着部材３５ｄを配置し，吸着部材３５ｅと３５ｇとの間の中心に吸着部材３５ｆを配置し，吸着部材３５ｇと３５ａとの間の中心に吸着部材３５ｈを配置している。図示の例では，吸着部材３５ａ〜３５ｃをＬＣＤ基板Ｇの短辺Ｌ３側に並べ，吸着部材３５ｃ〜３５ｅをＬＣＤ基板Ｇの長辺Ｌ２側に並べ，吸着部材３５ｅ〜３５ｇをＬＣＤ基板Ｇの長辺Ｌ１側に並べ，吸着部材３５ｇ〜３５ａをＬＣＤ基板Ｇの長辺Ｌ４側に並べている。
【００２８】
吸着部材３５ａ〜３５ｈは何れも同様の構成を有しており，例えば吸着部材３５ａは，図７に示すように載置台３４に設けられたバキューム孔８０と，このバキューム孔８０の外周の段付凹部８１内においてパッキン８２を介し押えリングネジ８３によって固定されるオイルシール８４を有しており，このオイルシール８４の上面には上方に向かってラッパ状に広がっていくシール部８５が備えられている。さらに吸着部材３５ａは，オイルシール８４のシール部８５に移動可能に嵌合され中心部に吸引孔８６を有するトップパッド８７を有している。なお，他の吸着部材３５ｂ〜３５ｈも，吸着部材３５ａと全く同様の構成を備えているので詳細な説明を省略する。
【００２９】
さらに，図８に示すように，各吸着部材３５ａ〜３５ｈは，真空吸引手段９０によってＬＣＤ基板Ｇを吸着する構成を有しており，載置台３４は，真空吸引手段９０と各吸着部材３５ａ〜３５ｈとを結ぶ各吸引路９１ａ〜９１ｈと，各吸引路９１ａ〜９１ｈの途中に介装された開閉弁９２ａ〜９２ｈと，開閉弁９２ａ〜９２ｈの開閉を制御する制御部９３とを備えている。そして，各吸着部材３５ａ〜３５ｈが吸着動作する際には，制御部９３から出力された制御信号により開閉弁９２ａ〜９２ｈを開かせる。これにより常時作動している真空吸引手段９０の機能が初めて作用し，トップバッド８７が吸引しＬＣＤ基板Ｇの傾斜や変形に追従して密着し，ＬＣＤ基板Ｇを確実に吸着できる構成になっている。
【００３０】
制御部９３は，全ての吸着部材３５ａ〜３５ｈが同時に作動するように一斉に制御信号を全ての開閉弁９２ａ〜９２ｈに出力するようには設定されておらず，開閉弁９２ａ〜９２ｈの何れかに制御信号を出力し，８個の吸着部材３５ａ〜３５ｈのうち８個の吸着部材をそれぞれ個々に又は吸着手段３５ａ〜３５ｈのうち２個以上の吸着手段を組合わせたグループ毎に吸着動作を行うか否かを制御するように構成されている。本実施の形態では，載置台３４の中心を挟んで対向する２つの吸着部材３５ａ，３５ｅと，吸着部材３５ｂ，３５ｅと，吸着部材３５ｃ，３５ｇと，吸着部材３５ｄ，３５ｈとを組合わせ，吸着動作を行うこれら各吸着部材３５ａ〜３５ｈの各グループを，所定の時間ごとに順次移行させる構成になっている。
【００３１】
以上，本実施の形態にかかる塗布・周縁部除去装置２４および載置台３４は以上のように構成されており，次に上記処理システム１に備えられた塗布・周縁部除去装置２４におけるＬＣＤ基板Ｇの保持動作について説明する。
【００３２】
まず，カセット１１内に収容された未処理のＬＣＤ基板Ｇはローダ部２のサブ搬送アーム１３によって取出された後，第１の処理部３のメイン搬送アーム１５に受け渡され，そして，ブラシ洗浄装置１７内に搬送される。このブラシ洗浄装置１７内にてブラシ洗浄されたＬＣＤ基板Ｇは，この後，アドヒージョン装置１９にて疎水化処理が施され，冷却装置２１にて冷却される。その後，塗布・周縁部除去装置２４の塗布系３０に搬入され，レジスト液がＬＣＤ基板Ｇの表面に塗布され，引き続きＬＣＤ基板Ｇは隣接する周縁部除去系３１に搬送機構３２によって搬入され周縁部に付着した不要なレジスト膜を除去する工程に移行する。
【００３３】
周縁部除去系３１では，搬送機構３２によって内部に搬入したＬＣＤ基板Ｇをシリンダ３８の伸張稼働によって上昇した載置台３４の上面で突き上げ，吸着部材３４でＬＣＤ基板Ｇの裏面を吸着することにより，ＬＣＤ基板Ｇを載置台３４の上面に保持する。この保持後，搬送機構３２が周縁部除去系３１から退避すると，シリンダ３８の短縮稼働によって載置台３４が下降し，図３に示したように，周縁部除去系３１内にＬＣＤ基板Ｇが搬入される。
【００３４】
次いで，各ノズル５５，５６，５７，５８がＬＣＤ基板Ｇの四辺Ｌ１，Ｌ２，Ｌ３，Ｌ４のそれぞれに沿って移動を開始する。この移動により，図５に示したように，ＬＣＤ基板Ｇの周縁部が非接触の状態で各ノズル５５，５６，５７，５８の隙間７７に嵌入され，上吹き出し孔７４および下吹き出し孔７６からの溶剤としてのシンナの吹き出しを開始する。そして，吸引孔７８からの吸引排気も開始され，ＬＣＤ基板Ｇの周縁部に付着している不要なレジスト膜がシンナによって溶解され，その溶解したレジスト液を吸引孔７８から吸引排気することによって，ＬＣＤ基板Ｇの周縁部の不要なレジスト膜が除去される。
【００３５】
こうしてＬＣＤ基板Ｇの周縁部に付着している不要なレジスト膜が除去された後，載置台３４が上昇され，塗布現像処理システム１のメイン搬送アーム２２が塗布・周縁部除去装置２４内に進入しＬＣＤ基板Ｇを受け取る。これにより，塗布・周縁部除去装置２４からＬＣＤ基板Ｇが搬出される。次いで，加熱装置２０内に搬入されレジスト膜に対してべーキング処理が施された後，露光装置６にて所定のパターンが露光される。そして，露光後のＬＣＤ基板Ｇは現像装置１８内へ搬送され，現像液により現像された後にリンス液により現像液を洗い流し，現像処理を完了する。現像処理された処理済みのＬＣＤ基板Ｇは，ローダ部２のカセット１２内に収納された後に搬出され，次の処理工程に向けて移送される。
【００３６】
以上のような周縁レジスト膜除去工程において，ＬＣＤ基板Ｇの裏面に転写跡を残さないようにするための重要な役割を担うのは載置台３４に設けられた吸着部材３５ａ〜ｈであり，全ての吸着部材３５ａ〜３５ｈが処理中終始一貫して吸着動作を行うのではなく，これら吸着部材３５ａ〜３５ｈの中から順次選ばれたものが適宜吸着動作を行い，転写後が残る前に吸着動作を停止させて，ＬＣＤ基板Ｇの裏面における吸着箇所をその都度移行させることによりＬＣＤ基板Ｇを載置台３４に保持するものである。例えば以下のような吸着動作が行われている。
【００３７】
まず，吸着部材３５ａ〜３５ｈにおいて，基板の中心を挟んで対向するもの同士が同時に動作が行えるように，吸着部材３５ａ，３５ｅと，吸着部材３５ｂ，３５ｆと，吸着部材３５ｃ，３５ｇと，吸着部材３５ｄ，３５ｈとがグループとして設定され，吸着部材３５ａ，３５ｅが吸着動作する場合には開閉弁９２ａ，９２ｅに，吸着部材３５ｂ，３５ｆが吸着動作する場合には開閉弁９２ｂ，９２ｆに，吸着部材３５ｃ，３５ｇが吸着動作する場合には開閉弁９２ｃ，９２ｇに，吸着部材３５ｄ，３５ｈが吸着動作する場合には開閉弁９２ｄ，９２ｈに制御部９３がそれぞれ制御信号を出力する。このようなＬＣＤ基板Ｇの中心を挟んで対向した２箇所で裏面を吸着されているＬＣＤ基板Ｇは，処理中常に安定して基板載置台３４に保持されることになる。
【００３８】
吸着部材３５ａ，３５ｅと，吸着部材３５ｂ，３５ｆと，吸着部材３５ｃ，３５ｇと，吸着部材３５ｄ，３５ｈとは何れも同様に吸着動作するので，代表して吸着部材３５ａ，３５ｅの吸着動作について述べると以下のようになる。制御部９３から制御信号が開閉弁９２ａ，９２ｅに出力された場合には，開閉弁９２ａ，９２ｅが共に開き吸引路９１ａ，９１ｅ内が連通され真空吸引手段９０の機能が作用し吸着部材３５ａ，３５ｅは吸着動作する。一方，制御部９３から制御信号が開閉弁９２ａ，９２ｅに出力されない場合には，開閉弁９２ａ，９２ｅが閉じ吸引路９１ａ，９１ｅ内が遮断され，真空吸引手段９０の機能が作用せず吸着手段３５ａ，３５ｅは吸着動作しない。このように吸着部材３５ａ，３５ｅは制御部９３によって吸着動作を正確に制御される。なお，吸着部材３５ｂ，３５ｆと，吸着部材３５ｃ，３５ｇと，吸着部材３５ｄ，３５ｈも吸着部材３５ａ，３５ｅと同様に制御部９３によって吸着動作を正確に制御される。
【００３９】
さらに吸着部材３５ａ〜３５ｈの吸着時間は，ＬＣＤ基板Ｇに対する処理を施す時間より短くなるように所定時間以下に設定されており，所定時間を越えてもなお吸着部材３５ａ〜３５ｈが吸着動作を行いＬＣＤ基板Ｇの裏面に転写跡が残るのを未然に防止している。この場合，制御部９３は所定の時間ごとに，開閉弁９２ａ〜９２ｈ内のあるグループに出力しそれ以外のグループには制御信号を出力せず，吸着部材３５ａ〜３５ｈ内では所定の時間ごとに，吸着動作を行うグループとそれ以外のグループとに選別される。そして，吸着部材３５ａ〜３５ｈ内から適宜選別されたグループが所定の時間吸着動作を行い，このグループの吸着動作が終了すると共に吸着部材３５ａ〜３５ｈ内の別のグループに吸着動作が移行していき，同様に所定の時間吸着動作を行い，以後処理が終了するまでこれを順次繰り返すので，ＬＣＤ基板Ｇの裏面における吸着箇所は固定されない。こうしてＬＣＤ基板Ｇの裏面に吸着部材３５ａ〜３５ｈの転写跡を残さずともＬＣＤ基板Ｇを処理中常に載置台３４に保持させることができる。なお，一度所定の時間動作した吸着部材３５ａ〜３５ｈ内のグループは二度と動作を行えないわけではなく，吸着動作が完了した後にある程度休止すれば再び吸着動作を行うことが可能である。
【００４０】
ここで本実施の形態では，吸着部材３５ａ〜ｈの吸着動作の移行は，時計回りに基板の周縁部に沿って順次切り換えられていくプロセスが採用されている。図９（ａ）〜（ｄ）に示したように，一方は吸着部材３５ａから吸着動作の移行プロセスが開始し，他方では吸着部材３５ｅから吸着動作の移行プロセスが開始する。この場合，吸着部材３５ａ及び吸着部材３５ｅは同時に吸着動作の開始→所定の時間が経過して吸着部材３５ａ及び吸着部材３５ｅは同時に吸着動作を停止（図９（ａ））→吸着部材３５ｂ及び吸着部材３５ｆは同時に吸着動作の開始→所定の時間が経過して吸着部材３５ｂ及び吸着部材３５ｆは同時に吸着動作を停止（図９（ｂ））→吸着部材３５ｃ及び吸着部材３５ｇは同時に吸着動作の開始→所定の時間が経過して吸着部材３５ｃ及び吸着部材３５ｇは同時に吸着動作を停止（図９（ｃ））→吸着部材３５ｄ及び吸着部材３５ｈは同時に吸着動作の開始→所定の時間が経過して吸着部材３５ｄ及び吸着部材３５ｈは同時に吸着動作を停止（図９（ｄ））という，移行プロセスを経て最初の状態に戻る。そして，再び同じ移行プロセスを開始する。このプロセスは，ＬＣＤ基板Ｇの周縁部除去系３１内の搬入，周縁レジスト膜の除去，周縁部除去系３１内からの搬入という一連の工程において，繰り返されることになる。このようにＬＣＤ基板Ｇの中心を挟んで対向した２箇所でＬＣＤ基板Ｇの裏面を吸着し，しかもこれら吸着部材３５ａ〜３５ｈを規則正しく移行させていくので，より安定したＬＣＤ基板Ｇの保持が行われる。
【００４１】
この移行プロセスにおいて，先に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループと次に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループとの移行のタイミングは，先に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループが吸着動作を停止すると同時に次に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループが吸着動作を開始するようにしてもよいし，先に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループが吸着動作を停止する直前から次に吸着動作を行っている吸着部材３５ａ〜３５ｈ内のグループが吸着動作を開始するようにしてよい。いずれにしても，処理の種類に応じて自由に設定できる。
【００４２】
かくして，本実施の形態によれば，吸着動作を行う吸着部材３５ａ〜３５ｈを順次移行させ，ＬＣＤ基板Ｇの裏面における吸着箇所を所定時間以上に渡り固定させない。従って，処理の最初から終わりまでＬＣＤ基板Ｇを載置台３４が吸着・保持してもＬＣＤ基板Ｇの裏面に吸着部材３５ａ〜３５ｈの転写跡が残ることを防止できる。その結果，ＬＣＤ基板Ｇの製品不良を解決することができ，歩留まりを向上させることが可能となる。なお，吸着部材３５ａ〜３５ｈ内のグループ分けは，２個の吸着部材の組合わせに限らず，３個，４個及びそれ以上を組合わせてグループを形成してもよい。極端な例として，吸着部材３５ａ〜３５ｈうち単に１個の吸着部材を停止させ，この停止している吸着部材を順次移行させるといったものが考えられる。
【００４３】
なお，本発明の実施の形態の一例について説明したが，本発明はこの例に限定されるものでなく，種々の様態を採りうるものである。例えば，図１０に示すように，載置台１００において，載置台１００の中心を挟んで対向位置にある吸引部材３５ａの吸引路９１ａと吸引部材３５ｅの吸引路９１ｅの一部が共通接続され，同様に吸引部材３５ｂの吸引路９１ｂと吸引部材３５ｆの吸引路９１ｆの一部が共通接続され，同様に吸引部材３５ｃの吸引路９１ｃと吸引部材３５ｇの吸引路９１ｇの一部が共通接続され，同様に吸引部材３５ｄの吸引路９１ｄと吸引部材３５ｈの吸引路９１ｈの一部が共通接続されるようにしてもよい。この場合，吸引路９１ａと吸引路９１ｅとを接続点Ｎ１で共通接続させ，接続点Ｎ１と真空吸引手段９０との間を接続している吸引路１０１ａの途中に開閉弁１０２ａを介装する。同様に，吸引路９１ｂと吸引路９１ｆを接続点Ｎ２で共通接続させ，接続点Ｎ２と真空吸引手段９０との間を接続している吸引路１０１ｂの途中に開閉弁１０２ｂを介装する。
【００４４】
同様に，吸引路９１ｃと吸引路９１ｇを接続点Ｎ３で共通接続させ，接続点Ｎ３と真空吸引手段９０との間を接続している吸引路１０１ｃの途中に開閉弁１０２ｃを介装する。同様に，吸引路９１ｄと吸引路９１ｈを接続点Ｎ４で共通接続させ，接続点Ｎ４と真空吸引手段９０との間を接続している吸引路１０１ｄの途中に開閉弁１０２ｄを介装する。
かかる構成によれば，開閉弁１０２ａ〜１０２ｄの中から一つの開閉弁を開閉切換えするだけで吸着部材３５ａ〜３５ｈの中の二つ吸着部材の吸着動作を同時に制御できる。例えば，開閉弁１０２ａを開閉切換すると，吸引路９０ａ，９０ｅが真空吸引手段９０から連通，遮断されて吸着部材３５ａ，３５ｅの吸着動作が制御される。従って，載置台１００における吸着手段３５ａ〜３５ｈの制御動作を通常どおりに行いながらも開閉弁の個数が減るので，これら開閉弁１０２ａ〜１０２ｄを制御する制御部９３の負担が軽くなると共に，載置台１００にかかる構成要素の簡素化も図ることができる。
【００４５】
また，図１１に示すように，吸引路９１ａ〜９１ｈの全てを接続点Ｎ５で共通接続させ，これら吸引路９１ａ〜９１ｈを接続点Ｎ５と真空吸引手段９０との間を接続している吸引路１０４を介して真空吸引手段９０に接続させるようにしてもよい。かかる構成によれば，吸引路９１ａ〜９１ｈを真空吸引手段９０にそれぞれ接続する手間が省ける。
【００４６】
上記移行プロセスにおいても種々の様態を採りうることが可能である。例えば，移行プロセスにおいて，吸着動作の切り換えの順番を反時計回りになるようにしてもよい。また，時計回り又は反時計回りといった規則正しい吸着部材３５ａ〜３５ｈの移行プロセスに限らず，いわゆる不規則な移行プロセスを採用することも可能である。
【００４７】
さらに，図１２〜図１６に示すように，ノズル５５，５７，５７，５８をＬＣＤ基板Ｇの周縁部に沿って移動させつつにＬＣＤ基板Ｇにレジスト液を供給する際に，これらノズル５５，５７，５７，５８の移動に伴って，吸着動作を行う吸着部材１０５ａ〜１００ｐを順次移行させるようにしてもよい。この場合，載置台３４の四隅に吸着部材１０５ａ，１０５ｅ，１０５ｉ，１０５ｍをそれぞれ配置し，吸着部材１０５ａと１０５ｅとの間に吸着部材１０５ｂ，１０５ｃ，１０５ｄを適宜間隔を置いて配置し，同様に吸着部材１０５ｅと１０５ｉとの間に吸着部材１０５ｆ，１０５ｇ，１０５ｈを適宜間隔を置いて配置し，同様に吸着部材１０５ｉと１０５ｍとの間に吸着部材１０５ｊ，１０５ｋ，１０５ｌを適宜間隔を置いて配置し，同様に吸着部材１０５ｍと１０５ａとの間に吸着部材１０５ｎ，１０５ｏ，１０５ｐを適宜間隔を置いて配置している。図示の例では，吸着部材１０５ａ〜１０５ｅはＬＣＤ基板Ｇの短辺Ｌ３側に並べられ，吸着部材１０５ｅ〜１０５ｉはＬＣＤ基板Ｇの長辺Ｌ２側に並べられ，吸着部材１０５ｉ〜１０５ｍはＬＣＤ基板Ｇの長辺Ｌ１側に並べられ，吸着部材１０５ｍ〜１０５ａはＬＣＤ基板Ｇの長辺Ｌ４側に並べられている。
【００４８】
以上のような構成において，図１２〜図１６に示すように，短辺Ｌ１側ではノズル５５がＬＣＤ基板Ｇの短辺Ｌ１に沿って移動するのに伴い，吸着部材１０５ｉ→吸着部材１０５ｊ→吸着部材１０５ｋ→吸着部材１０５ｌ→吸着部材１０５ｍといった順番で移行プロセスが行われる。短辺Ｌ２側ではノズル５６がＬＣＤ基板Ｇの短辺Ｌ２に沿って移動するのに伴い，吸着部材１０５ｅ→吸着部材１０５ｆ→吸着部材１０５ｇ→吸着部材１０５ｈ→吸着部材１０５ｉといった順番で移行プロセスが行われる。短辺Ｌ３側ではノズル５７がＬＣＤ基板Ｇの短辺Ｌ３に沿って移動するのに伴い，吸着部材１０５ａ→吸着部材１０５ｂ→吸着部材１０５ｃ→吸着部材１０５ｄ→吸着部材１０５ｅといった順番で移行プロセスが行われる。短辺Ｌ４側ではノズル５８がＬＣＤ基板Ｇの短辺Ｌ４に沿って移動するのに伴い，吸着部材１０５ｍ→吸着部材１０５ｎ→吸着部材１０５ｏ→吸着部材１０５ｐ→吸着部材１０５ａといった順番で移行プロセスが行われる。
かかる移行プロセスによれば，ノズル５５，５６，５７，５８によってレジスト膜が除去されているＬＣＤ基板Ｇの周縁部近傍に対向した裏面が吸着され安定した状態となるので，周縁レジスト膜の除去を円滑に行うことができる。また，吸着動作を行う吸着手段１０５ａ〜１０５ｐを，ノズルの移動とは逆方向から順次移行させるようにしてもよい。
【００４９】
なお，基板は上記した本実施の形態のようにＬＣＤ基板Ｇに限るものでなく，半導体ウェハ，ガラス基板，ＣＤ基板，フォトマスク，プリント基板，セラミック基板等でもあってもよい。
【００５０】
【発明の効果】
本発明によれば，基板の裏面における吸着箇所を順次移行させることができるので，処理の最初から終わりまで基板を載置台が吸着し保持しても，基板の裏面に吸着手段の転写跡が残ることを防止できる。従って，基板の保持を好適に実施して基板の製品不良を解決でき，歩留まりの向上を図ることが可能である。さらに，安定して基板を載置台に保持することができる。
【００５２】
また，制御手段は吸着動作をさせる吸着手段とそれ以外の吸着手段との選別を的確に行えるので，吸着動作を行う吸着手段の移行プロセスを当初の計画通りに進行させることが可能となる。
【００５３】
さらに，基板載置部の中心を挟んで対向位置にある吸着手段の吸引路は少なくとも一部が共有されている構成としたことにより，開閉弁の個数が減るので制御手段における制御機能の負担が軽減し，吸引手段によって基板を吸引する構成を簡素化することができる。
【００５４】
また，処理液供給ノズルによって処理されている基板の周縁部近傍に対向した裏面が吸着され安定した状態となり，好適に処理を行うことができる。
【図面の簡単な説明】
【図１】本発明の実施の形態にかかる載置台及び塗布・周縁部除去装置を備えた塗布現像処理システムの斜視図である。
【図２】本発明の実施の形態にかかる塗布・周縁部除去装置の平面図である。
【図３】本発明の実施の形態にかかる塗布・周縁部除去装置の縁部除去系側の断面図である。
【図４】周縁部除去系の平面図である。
【図５】ノズルの断面図である。
【図６】載置台の斜視図である。
【図７】吸着部材の斜視図である。
【図８】載置台に接続される吸引系統の回路を示す説明図である。
【図９】吸着動作を行う吸着部材の移行プロセスを示す工程図である。
【図１０】載置台に接続される吸引系統の回路の他の例を示す説明図である。
【図１１】載置台に接続される吸引系統の回路の他の例の要部を示す説明図である。
【図１２】ノズルの移動に伴いを吸着動作を行う吸着部材を順次移行させた場合の様子を示す説明図である。
【図１３】ノズルの移動に伴いを吸着動作を行う吸着部材を順次移行させた場合の様子を示す説明図である。
【図１４】ノズルの移動に伴いを吸着動作を行う吸着部材を順次移行させた場合の様子を示す説明図である。
【図１５】ノズルの移動に伴いを吸着動作を行う吸着部材を順次移行させた場合の様子を示す説明図である。
【図１６】ノズルの移動に伴いを吸着動作を行う吸着部材を順次移行させた場合の様子を示す説明図である。
【符号の説明】
１処理システム
２４塗布・周縁部除去装置
３１周縁部除去系
３４載置台
３５ａ〜３５ｈ吸着部材
５５，５６，５７，５８ノズル
９０真空吸引手段
９１ａ〜９１ｈ吸引路
９２ａ〜９２ｈ開閉弁
９３制御部
ＧＬＣＤ基板[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention uses a substrate such as a semiconductor wafer or an LCD substrate.ProcessThe present invention relates to a substrate processing method and a substrate processing apparatus.
[0002]
[Prior art]
Generally, in the manufacture of a liquid crystal display (LCD) device or a semiconductor device, a so-called lithography process is performed in order to form a resist film pattern on an upper surface of an LCD substrate or a semiconductor wafer. This lithography processing includes various processing steps such as cleaning of the LCD substrate, drying of the LCD substrate, application of a resist solution to the surface of the LCD substrate, exposure and development of a photosensitive film. For example, after cleaning the LCD substrate, performing a hydrophobic treatment, and further cooling, a resist solution as a photoresist is applied to form a photosensitive film on the surface of the LCD substrate. After heating and baking, the photosensitive film is exposed to a predetermined pattern in an exposure device. After developing and applying a developing solution to the surface of the LCD substrate after exposure, the developing solution is washed away with a rinsing solution to complete the developing process.
[0003]
In the lithography process as described above, usually, the LCD substrate is held on a horizontal mounting table and the LCD substrate is fixed, and the process is performed while the LCD substrate is held by a rotatable spin chuck and the LCD substrate is rotated. A method of performing processing is employed. In particular, the conventional mounting table is configured such that a suction member is provided on the upper surface of the mounting table, and a predetermined process is performed while the LCD substrate is held on the mounting table by suctioning the back surface of the LCD substrate with the suction member. ing.
[0004]
As a process in which the mounting table as described above is used, for example, there is a peripheral edge removing process of removing an unnecessary resist film formed on the peripheral portion or the rear surface of the LCD substrate after a step of applying a resist liquid. In this method, a solvent (eg, thinner) is supplied from the nozzle while moving the nozzle along the periphery of the LCD substrate held on the mounting table, and at the same time, the resist solution dissolved by the supply of the solvent is suctioned and removed. During this process, the suction member of the mounting table constantly sucks the back surface of the LCD substrate.
[0005]
[Problems to be solved by the invention]
By the way, in the conventional mounting table, all of the plurality of suction members arranged at predetermined positions on the upper surface of the mounting table suck the rear surface of the LCD substrate and continue the predetermined position on the rear surface of the LCD substrate until the processing is completed. Adsorbed continuously. For this reason, if the processing is performed for a certain period of time or more, after the processing is completed, a mark where the suction member is sucked, a so-called transfer mark, remains at a predetermined location on the back surface of the LCD substrate. This transfer mark may adversely affect the resist and reduce the yield in manufacturing a liquid crystal display (LCD) device.
[0006]
The present invention has been made in view of such a point, and a method of removing a substrate without leaving a transfer mark of a suction unit on the back surface of the substrate.Substrate processing can be carried out simultaneously while holding the substrate.substrateprocessingMethod and substrateprocessingSubstrate that can suitably carry out the methodprocessingIt is an object of the present invention to provide an apparatus to solve the above problem.
[0008]
[Means for Solving the Problems]
To achieve the above object, according to the present invention, a substrate is suctioned and held by a plurality of suction means provided on an upper surface of a substrate mounting portion, and a processing liquid supply nozzle is moved along a peripheral portion of the substrate. In the method for processing a substrate by supplying a processing liquid from the processing liquid supply nozzle while moving the processing liquid supply nozzle, the suction operation of the suction means is sequentially shifted along the peripheral edge of the substrate as the processing liquid supply nozzle moves. A substrate processing method is provided. According to this method, since the suction means for performing the suction operation is sequentially shifted, all the suction members provided on the upper surface of the substrate mounting portion do not continuously perform the suction operation from the start to the end of the processing at the same time. . Further, during processing, one of the suction members provided on the upper surface of the substrate mounting portion performs a suction operation as appropriate, stops the suction operation before the transfer mark remains, and shifts the suction operation to another suction member. This can be sequentially repeated until the processing is completed. That is, the suction location on the back surface of the substrate is not fixed. Therefore, even if the substrate mounting portion sucks and holds the substrate from the beginning to the end of the processing, it is possible to prevent the transfer trace of the suction means from remaining on the back surface of the substrate. In this case, the meaning of the sequential shift is not limited to the case where the suction means that performs the suction operation according to a certain order is shifted regularly, but also includes the case where the so-called irregular shift is performed. Further, according to the present invention, the substrate is suctioned and held by a plurality of suction means provided on the upper surface of the substrate mounting portion, and the processing liquid supply nozzle is moved while moving the processing liquid supply nozzle along the peripheral edge of the substrate. In a method of processing a substrate by supplying a processing liquid from a nozzle, the suction operation of the suction means is performed on each side of the substrate as the processing liquid supply nozzle moves.Transition sequentially atA method of processing a substrate is provided.
[0009]
The suction operation of the suction means may be shifted in the same direction as the movement of the processing liquid supply nozzle. Further, the suction operation of the suction means may be shifted in a direction opposite to the movement of the processing liquid supply nozzle. Further, the suction means opposed to each other with the center of the substrate interposed therebetween may be simultaneously suction-operated.According to such a method,Since at least two suction units opposing each other with the center of the substrate interposed therebetween perform an appropriate suction operation, the suction points on the back surface of the substrate are appropriately set to at least two opposing positions across the center of the substrate. Therefore, the substrate whose rear surface is sucked at two locations facing each other across the center of the substrate is stably held at all times during the processing.on the other hand,The suction locations on the back surface of the substrate are regularly shifted. Therefore,theseBy combining the inventions, more stable holding of the substrate can be performed.
[0010]
Further, according to the present invention, there is provided a substrate mounting portion provided with a plurality of suction means on the upper surface, and a processing liquid supply nozzle for supplying a processing liquid to the peripheral portion of the substrate while moving along the peripheral portion of the substrate. A substrate processing apparatus, comprising: control means for sequentially shifting the suction operation of the suction means along a peripheral portion of a substrate with movement of the processing liquid supply nozzle. Provided.
[0011]
Further, according to the present invention, a substrate mounting portion having a plurality of suction means on an upper surface, and a processing liquid supply nozzle for supplying a processing liquid to the peripheral portion of the substrate while moving along the peripheral portion of the substrate are provided. A substrate processing apparatus, wherein the suction operation of the suction means is performed on each side of the substrate with the movement of the processing liquid supply nozzle.Transition sequentially atA substrate processing apparatus is provided, comprising a control means for causing the substrate to be processed.
[0012]
The control means may shift the suction operation of the suction means in the same direction as the movement of the processing liquid supply nozzle. Further, the control means may shift the suction operation of the suction means in a direction opposite to the movement of the processing liquid supply nozzle. Each of the suction means has a structure for sucking the substrate by a vacuum suction means, a suction path connecting the vacuum suction means and each suction means, and a suction path opening / closing means interposed in each suction path. Preferably, the control means controls opening and closing of the opening and closing means.
[0013]
In addition, it is preferable that at least a part of the suction path of the suction unit that is located opposite to the center of the substrate mounting unit is shared. It is preferable that the suction means is arranged at least along a peripheral edge of the substrate mounting portion. The suction means opposed to each other with the center of the substrate interposed therebetween may be simultaneously operated.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a coating and developing processing system 1 for processing an LCD substrate G by using photolithography technology. The coating and developing processing system includes a coating and peripheral edge removing device 24 according to an embodiment of the present invention. ing.
[0015]
The coating and developing system 1 includes, for example, a loader unit 2 for loading / unloading a rectangular LCD substrate G, a first processing unit 3 for processing the LCD substrate G, and a first processing unit 3 and an interface unit 4. And an interface unit 7 for exchanging the LCD substrate G between the second processing unit 5 and, for example, the exposure device 6 or the like.
[0016]
The loader unit 2 is provided with a cassette station 10, and the cassette station 10 includes a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. It can be placed freely. The loader unit 2 is provided with a sub-transport arm 13 for loading or unloading an unprocessed LCD substrate G. The sub-transport arm 13 is configured to be movable in the Y and Z directions and rotatable in the θ direction.
[0017]
In the first processing unit 3, various processing devices that perform predetermined processing on the LCD substrate G are arranged on both sides of the transport path 16 of the main transport arm 15. On one side of the transport path 16, a brush cleaning device 17 and a developing device 18 for cleaning the LCD substrate G taken out of the cassette 11 are arranged side by side. Device 19, a heating device 20, and a cooling device 21 for cooling the LCD substrate G to a predetermined temperature are appropriately arranged in multiple stages.
[0018]
In the second processing unit 5, the coating / periphery removing device 24 according to the present embodiment is arranged on one side of the transfer path 23 of the main transfer arm 22, and on the opposite side of the transfer path 22. , A heating device 20 and a cooling device 21 are appropriately arranged in multiple stages.
[0019]
The interface section 7 is provided with a cassette 25 for temporarily holding the LCD substrate G, a sub-transport arm 26 for taking the LCD substrate G in and out of the cassette 25, and a transfer stand 27 for the LCD substrate G. ing. The configurations of the first processing unit 3 and the second processing unit 5, the arrangement of various devices, and the like can be appropriately changed.
[0020]
Next, the configuration of the coating / periphery removing device 24 incorporated in the coating and developing system 1 configured as described above will be described.
[0021]
As shown in FIG. 2, a coating system 30 for coating a resist solution on the surface of the LCD substrate G and an unnecessary resist film applied and formed on the peripheral portion of the LCD substrate G are provided in the coating / periphery removing device 24. A transport mechanism 32 is provided adjacent to the peripheral edge removing system 31 to be removed, and transports the LCD substrate G coated with the resist liquid by the coating system 30 to the peripheral edge removing system 31.
[0022]
FIG. 3 is a sectional view of the peripheral edge removing system 31, and FIG. 4 is a plan view thereof. As shown in FIG. 3, a mounting table 34 serving as a substrate mounting section supported at the upper end of the column 33 is disposed in the center of the peripheral edge removing system 31. Suction members 35a to 35h, which will be described in detail later, are mounted on the upper surface of the mounting table 34. The suction members 35a to 35h suction the back surface of the LCD substrate G, so that the LCD substrate G is placed on the upper surface of the mounting table 34. Holding.
[0023]
The lower end of the column 33 penetrates a bearing 37 fixed to the device frame 36, and the column 33 slides in the bearing 37 so that the mounting table 34 moves up and down together with the column 33. However, the column 33 is connected to a piston rod 39 of a cylinder 38 fixed to the device frame 36 by a connecting member 40, and a cover 41 that covers the bearing 37 and the cylinder 38 is connected to the piston rod 39. Therefore, the mounting table 34 moves up and down together with the cover 41 as the cylinder 38 expands and contracts. Thus, the configuration is such that the LCD substrate G is carried in and out of the peripheral edge removal system 31.
[0024]
Below the LCD substrate G held by the mounting table 34, a drain pan for receiving the solvent and the resist liquid when the solvent or the resist liquid used for removing the peripheral resist film of the LCD substrate G falls. A side wall member 46 is provided so as to surround the drain pan 45 so that the atmosphere in the drain pan 45 does not leak outside. The illustrated drain pan 45 is arranged so as to surround the driving portion of the mounting table 34 such as the bearing 37 and the cylinder 38 described above. A drain pipe 48 for draining the solvent accumulated in the drain pan 45 is connected to a bottom surface 47 of the drain pan 45, and an exhaust system (not shown) is connected to the drain pipe 48. The atmosphere in the peripheral edge removing system 31 is exhausted by exhaust means (not shown). Further, a downflow is formed around the LCD substrate G by air supply from a separately provided fine filter unit (not shown).
[0025]
As shown in FIGS. 3 and 4, nozzles 55, 56, 57, and 58 that move along each of the four sides of the LCD substrate G forming a rectangle are arranged around the LCD substrate G held on the mounting table 34. Have been. In the present embodiment, the nozzles 55 and 57 are arranged facing each other so as to move along the short sides L1 and L3 of the LCD substrate G, and the nozzles 56 and 58 are arranged along the long sides L2 and L4 of the LCD substrate G. Are arranged so as to move each other. These nozzles 55, 56, 57, 58 are respectively attached to the tips of L-shaped moving members 60, 61, 62, 63. Further, guide rails 65, 66, 67, 68 are arranged so as to surround the periphery of the LCD substrate G, and these guide rails 65, 66, 67, 68 are fixed to the device frame 36. The nozzles 55, 56, 57, and 58 are slidably mounted on the guide rails 65, 66, 67, and 68, respectively. It is configured to be able to move along each of L2, L3, and L4.
[0026]
The nozzles 55, 56, 57, and 58 having the same configuration will be described with the nozzle 55 as a representative, for example. As shown in FIG. 5, the nozzle 55 has a substantially U-shaped cross section including an upper horizontal piece 70 that covers the upper surface of the peripheral portion of the LCD substrate G and a lower horizontal piece 71 that projects outward from the upper horizontal piece 70. A spout 72 is provided. Thinner is supplied to the upper horizontal piece 70 as a solvent for removing a resist film toward the upper surface of the peripheral portion of the LCD substrate G through the thinner supply path 73 passing through the inside of the upper horizontal piece 70. An upper outlet 74 is provided. The lower horizontal piece 71 is supplied with thinner as a solvent for removing a resist film toward the lower surface of the periphery of the LCD substrate G through the thinner supply path 75 passing through the lower horizontal piece 71 and the thinner supply path 75. A lower outlet hole 76 is provided. Further, the jetting head 72 is provided with a gap 77 formed so as to cover the vicinity of the periphery of the LCD substrate G, and a suction hole 78 for suctioning and exhausting the atmosphere near the periphery of the LCD substrate G to the outside at the center of the inside. Is provided. The other nozzles 56, 57, and 58 have exactly the same configuration as the nozzle 55, and a detailed description thereof will be omitted.
[0027]
Here, the suction members 35a to 35h for sucking the LCD substrate G will be described in detail. As shown in FIG. 6, suction members 35a, 35c, 35e, and 35g are arranged at the four corners of the mounting table 34, and an adsorption member 35b is arranged at the center between the adsorption members 35a and 35c. The suction member 35d is disposed at the center between the suction members 35e and 35e, the suction member 35f is disposed at the center between the suction members 35e and 35g, and the suction member 35h is disposed at the center between the suction members 35g and 35a. I have. In the illustrated example, the suction members 35a to 35c are arranged on the short side L3 side of the LCD substrate G, the suction members 35c to 35e are arranged on the long side L2 side of the LCD substrate G, and the suction members 35e to 35g are arranged on the long side of the LCD substrate G. The suction members 35g to 35a are arranged on the long side L4 side of the LCD substrate G.
[0028]
Each of the suction members 35a to 35h has the same configuration. For example, the suction member 35a includes a vacuum hole 80 provided in the mounting table 34 and a stepped outer periphery of the vacuum hole 80 as shown in FIG. An oil seal 84 is fixed in the recess 81 by a press ring screw 83 via a packing 82. A seal portion 85 is provided on the upper surface of the oil seal 84 so as to spread upward in a trumpet shape. . Further, the suction member 35a has a top pad 87 movably fitted to the seal portion 85 of the oil seal 84 and having a suction hole 86 at the center. Note that the other suction members 35b to 35h have exactly the same configuration as the suction member 35a, and a detailed description thereof will be omitted.
[0029]
Further, as shown in FIG. 8, each of the suction members 35a to 35h has a configuration in which the LCD substrate G is sucked by the vacuum suction means 90, and the mounting table 34 includes the vacuum suction means 90 and the suction members 35a to 35h. Each of the suction passages 91a to 91h is connected to a corresponding one of the suction passages 91a to 91h. . Then, when the suction members 35a to 35h perform the suction operation, the on / off valves 92a to 92h are opened by the control signal output from the control unit 93. As a result, the function of the vacuum suction means 90, which is always operating, operates for the first time, and the top pad 87 sucks and adheres to the LCD substrate G following the inclination and deformation thereof, so that the LCD substrate G can be reliably sucked. I have.
[0030]
The control unit 93 is not set to output a control signal to all of the on-off valves 92a to 92h at the same time so that all the adsorption members 35a to 35h operate simultaneously, and any one of the on-off valves 92a to 92h is not set. And outputs a control signal to each of the eight suction members 35a to 35h to perform the suction operation individually or in a group in which two or more of the suction members 35a to 35h are combined. It is configured to control whether or not to perform. In the present embodiment, two suction members 35a, 35e, suction members 35b, 35e, suction members 35c, 35g, and suction members 35d, 35h, which are opposed to each other with the center of the mounting table 34 interposed therebetween, are combined. Each group of the suction members 35a to 35h performing the operation is sequentially shifted at predetermined time intervals.
[0031]
As described above, the coating / peripheral portion removing device 24 and the mounting table 34 according to the present embodiment are configured as described above. Next, the LCD substrate G in the coating / peripheral portion removing device 24 provided in the processing system 1 will be described. Will be described.
[0032]
First, the unprocessed LCD substrate G accommodated in the cassette 11 is taken out by the sub-transport arm 13 of the loader unit 2 and then transferred to the main transport arm 15 of the first processing unit 3, and then brush-cleaned. It is transported into the device 17. The LCD substrate G that has been brush-cleaned in the brush cleaning device 17 is thereafter subjected to a hydrophobic treatment by an adhesion device 19 and cooled by a cooling device 21. Thereafter, the resist solution is carried into the coating system 30 of the coating / periphery removing device 24, the resist solution is applied to the surface of the LCD substrate G, and the LCD substrate G is subsequently carried into the adjacent peripheral removing device 31 by the transport mechanism 32 and is transported. The process proceeds to a step of removing an unnecessary resist film adhered to the substrate.
[0033]
In the peripheral edge removal system 31, the LCD substrate G carried into the interior by the transport mechanism 32 is pushed up on the upper surface of the mounting table 34 which has been raised by the extension operation of the cylinder 38, and the back surface of the LCD substrate G is sucked by the suction member 34. The LCD substrate G is held on the upper surface of the mounting table 34. After the holding, when the transport mechanism 32 retreats from the peripheral edge removing system 31, the mounting table 34 is lowered by the shortening operation of the cylinder 38, and the LCD substrate G is carried into the peripheral edge removing system 31, as shown in FIG. Is done.
[0034]
Next, each of the nozzles 55, 56, 57, 58 starts moving along each of the four sides L1, L2, L3, L4 of the LCD substrate G. By this movement, as shown in FIG. 5, the periphery of the LCD substrate G is fitted into the gap 77 between the nozzles 55, 56, 57, and 58 in a non-contact state, and from the upper outlet hole 74 and the lower outlet hole 76. Of the thinner as a solvent is started. Then, the suction / exhaust from the suction hole 78 is also started, and the unnecessary resist film attached to the peripheral portion of the LCD substrate G is dissolved by the thinner. Unnecessary resist films on the periphery of the LCD substrate G are removed.
[0035]
After the unnecessary resist film adhering to the peripheral portion of the LCD substrate G is thus removed, the mounting table 34 is raised, and the main transport arm 22 of the coating and developing system 1 enters the coating / peripheral portion removing device 24. Then, the LCD substrate G is received. As a result, the LCD substrate G is carried out from the coating / peripheral part removing device 24. Next, after being carried into the heating device 20 and subjected to a baking process on the resist film, a predetermined pattern is exposed by the exposure device 6. Then, the exposed LCD substrate G is conveyed into the developing device 18, and after being developed with the developing solution, the developing solution is washed away with the rinsing solution to complete the developing process. The processed LCD substrate G that has been subjected to the development processing is stored in the cassette 12 of the loader unit 2 and then unloaded and transported to the next processing step.
[0036]
In the above-described peripheral edge resist film removing process, the suction members 35a to 35h provided on the mounting table 34 play an important role to prevent transfer marks from remaining on the back surface of the LCD substrate G. The suction members 35a to 35h do not perform the suction operation all the time during the processing, but those sequentially selected from these suction members 35a to 35h perform the suction operation appropriately, and perform the suction operation before the transfer remains. Is stopped, and the suction position on the rear surface of the LCD substrate G is shifted each time, so that the LCD substrate G is held on the mounting table 34. For example, the following suction operation is performed.
[0037]
First, in the suction members 35a to 35h, the suction members 35a and 35e, the suction members 35b and 35f, the suction members 35c and 35g, and the suction members 35d and 35h are set as a group, and when the suction members 35a and 35e perform the suction operation, the opening and closing valves 92a and 92e. When the suction members 35b and 35f perform the suction operation, the opening and closing valves 92b and 92f. The control unit 93 outputs control signals to the open / close valves 92c and 92g when the suction operation is performed on the suction members 35c and 35g, and to the open / close valves 92d and 92h when the suction members 35d and 35h perform the suction operation when the suction members 35d and 35h perform the suction operation. The LCD substrate G whose rear surface is sucked at two places opposed to each other with the center of the LCD substrate G interposed therebetween is always stably held on the substrate mounting table 34 during processing.
[0038]
Since the suction members 35a and 35e, the suction members 35b and 35f, the suction members 35c and 35g, and the suction members 35d and 35h all perform suction operations in the same manner, the suction operation of the suction members 35a and 35e will be described as a representative. Is as follows. When a control signal is output from the control unit 93 to the on-off valves 92a and 92e, the on-off valves 92a and 92e are both opened to communicate with the insides of the suction passages 91a and 91e, and the function of the vacuum suction means 90 is operated to operate the suction members 35a and 92e. 35e performs a suction operation. On the other hand, when the control signal is not output from the control unit 93 to the on-off valves 92a and 92e, the on-off valves 92a and 92e are closed and the insides of the suction passages 91a and 91e are shut off. 35a and 35e do not perform the suction operation. As described above, the suction operation of the suction members 35a and 35e is accurately controlled by the control unit 93. The suction operation of the suction members 35b and 35f, the suction members 35c and 35g, and the suction members 35d and 35h is accurately controlled by the control unit 93 similarly to the suction members 35a and 35e.
[0039]
Further, the suction time of the suction members 35a to 35h is set to be equal to or shorter than a predetermined time so as to be shorter than the time for performing the processing on the LCD substrate G. Even if the suction time exceeds the predetermined time, the suction members 35a to 35h perform the suction operation. Transfer marks are prevented from remaining on the back surface of the LCD substrate G. In this case, the control unit 93 outputs a signal to a certain group in the on-off valves 92a to 92h at predetermined time intervals and does not output a control signal to the other groups. , The group that performs the suction operation and the other groups. Then, a group appropriately selected from among the suction members 35a to 35h performs the suction operation for a predetermined time, and the suction operation of this group ends, and the suction operation shifts to another group in the suction members 35a to 35h. Similarly, the suction operation is performed for a predetermined period of time, and this operation is sequentially repeated until the processing is completed. Therefore, the suction position on the rear surface of the LCD substrate G is not fixed. In this way, the LCD substrate G can be always held on the mounting table 34 during processing without leaving transfer marks of the suction members 35a to 35h on the back surface of the LCD substrate G. It is to be noted that the group in the suction members 35a to 35h that have operated once for a predetermined time cannot be operated again, and the suction operation can be performed again if the operation is stopped to some extent after the suction operation is completed.
[0040]
Here, in the present embodiment, the process of sequentially shifting the suction operation of the suction members 35a to 35h along the peripheral edge of the substrate is adopted. As shown in FIGS. 9A to 9D, on one side, the transition process of the suction operation starts from the suction member 35 a, and on the other side, the transition process of the suction operation starts from the suction member 35 e. In this case, the suction members 35a and 35e start the suction operation at the same time → the predetermined time has elapsed and the suction members 35a and 35e simultaneously stop the suction operation (FIG. 9A) → the suction member 35b and the suction member The member 35f starts the suction operation at the same time → After a predetermined time elapses, the suction members 35b and 35f simultaneously stop the suction operation (FIG. 9B) → The suction members 35c and the suction member 35g start the suction operation at the same time. → After a predetermined time elapses, the suction members 35c and 35g simultaneously stop the suction operation (FIG. 9C) → The suction members 35d and the suction member 35h simultaneously start the suction operation → After a predetermined time elapses The suction member 35d and the suction member 35h return to the initial state through a transition process of simultaneously stopping the suction operation (FIG. 9D). Then, the same transition process is started again. This process is repeated in a series of steps of loading the LCD substrate G into the peripheral edge removing system 31, removing the peripheral resist film, and loading the LCD substrate G from the peripheral edge removing system 31. In this manner, the back surface of the LCD substrate G is sucked at two locations opposed to each other with the center of the LCD substrate G interposed therebetween, and the suction members 35a to 35h are regularly shifted, so that the LCD substrate G can be held more stably. Is
[0041]
In this transition process, the timing of transition between the group in the suction members 35a to 35h performing the suction operation first and the group in the suction members 35a to 35h performing the next suction operation is determined by the timing of the suction operation. The group in the suction members 35a to 35h performing the suction operation may stop the suction operation at the same time as the group in the suction members 35a to 35h performing the suction operation. Immediately before the group in the suction members 35a to 35h performing the operation stops the suction operation, the group in the suction members 35a to 35h performing the next suction operation may start the suction operation. In any case, it can be set freely according to the type of processing.
[0042]
Thus, according to the present embodiment, the suction members 35a to 35h performing the suction operation are sequentially shifted, and the suction portion on the back surface of the LCD substrate G is not fixed for a predetermined time or more. Therefore, even if the mounting table 34 sucks and holds the LCD substrate G from the beginning to the end of the processing, it is possible to prevent the transfer traces of the sucking members 35a to 35h from remaining on the back surface of the LCD substrate G. As a result, product defects of the LCD substrate G can be solved, and the yield can be improved. Note that the grouping of the suction members 35a to 35h is not limited to the combination of two suction members, and a group may be formed by combining three, four or more members. As an extreme example, it is conceivable that only one of the suction members 35a to 35h is stopped and the stopped suction members are sequentially shifted.
[0043]
Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example, and can take various forms. For example, as shown in FIG. 10, in the mounting table 100, a part of the suction path 91 a of the suction member 35 a and a part of the suction path 91 e of the suction member 35 e which are opposed to each other across the center of the mounting table 100 are connected in common. The suction path 91b of the suction member 35b and a part of the suction path 91f of the suction member 35f are commonly connected, and similarly, the suction path 91c of the suction member 35c and a part of the suction path 91g of the suction member 35g are commonly connected. The suction path 91d of the suction member 35d and a part of the suction path 91h of the suction member 35h may be commonly connected. In this case, the suction path 91a and the suction path 91e are commonly connected at the connection point N1, and an on-off valve 102a is interposed in the suction path 101a connecting the connection point N1 and the vacuum suction means 90. Similarly, the suction path 91b and the suction path 91f are commonly connected at a connection point N2, and an on-off valve 102b is interposed in the suction path 101b connecting the connection point N2 and the vacuum suction means 90.
[0044]
Similarly, the suction path 91c and the suction path 91g are commonly connected at the connection point N3, and an on-off valve 102c is interposed in the suction path 101c connecting the connection point N3 and the vacuum suction means 90. Similarly, the suction path 91d and the suction path 91h are commonly connected at a connection point N4, and an on-off valve 102d is interposed in the suction path 101d connecting the connection point N4 and the vacuum suction means 90.
According to such a configuration, the suction operation of the two suction members among the suction members 35a to 35h can be simultaneously controlled only by switching the opening and closing of one of the open / close valves 102a to 102d. For example, when the open / close valve 102a is switched between open and closed, the suction paths 90a and 90e are communicated and blocked from the vacuum suction means 90, and the suction operation of the suction members 35a and 35e is controlled. Therefore, the number of on-off valves is reduced while the operation of controlling the suction means 35a to 35h in the mounting table 100 is performed as usual, so that the load on the control unit 93 for controlling the on-off valves 102a to 102d is reduced, and the mounting table is reduced. 100 can be simplified.
[0045]
As shown in FIG. 11, all of the suction paths 91a to 91h are commonly connected at a connection point N5, and the suction paths 91a to 91h are connected between the connection point N5 and the vacuum suction means 90. You may make it connect to the vacuum suction means 90 via 104. According to such a configuration, the labor for connecting the suction paths 91a to 91h to the vacuum suction means 90 can be omitted.
[0046]
Various aspects can also be taken in the above transition process. For example, in the transition process, the order of switching the suction operation may be set to be counterclockwise. In addition, not only the transfer process of the regular suction members 35a to 35h such as clockwise or counterclockwise, but also a so-called irregular transfer process can be adopted.
[0047]
Further, as shown in FIGS. 12 to 16, when supplying the resist liquid to the LCD substrate G while moving the nozzles 55, 57, 57, 58 along the periphery of the LCD substrate G, these nozzles 55, 57, 57, 58 are used. With the movement of 57, 57, 58, the suction members 105a to 100p performing the suction operation may be sequentially shifted. In this case, the suction members 105a, 105e, 105i, and 105m are arranged at the four corners of the mounting table 34, and the suction members 105b, 105c, and 105d are arranged at appropriate intervals between the suction members 105a and 105e. Adsorbing members 105f, 105g, and 105h are disposed at appropriate intervals between the adsorbing members 105e and 105i, and similarly, adsorbing members 105j, 105k, and 105l are disposed at appropriate intervals between the adsorbing members 105i and 105m. Similarly, the suction members 105n, 105o, and 105p are arranged at appropriate intervals between the suction members 105m and 105a. In the illustrated example, the suction members 105a to 105e are arranged on the short side L3 side of the LCD substrate G, the suction members 105e to 105i are arranged on the long side L2 side of the LCD substrate G, and the suction members 105i to 105m are arranged on the LCD substrate G. Are arranged on the long side L1 side, and the suction members 105m to 105a are arranged on the long side L4 side of the LCD substrate G.
[0048]
In the above configuration, as shown in FIGS. 12 to 16, on the short side L1 side, as the nozzle 55 moves along the short side L1 of the LCD substrate G, the suction member 105i → the suction member 105j → the suction. The transition process is performed in the order of the member 105k, the suction member 105l, and the suction member 105m. On the short side L2 side, as the nozzle 56 moves along the short side L2 of the LCD substrate G, a transition process is performed in the order of the suction member 105e → the suction member 105f → the suction member 105g → the suction member 105h → the suction member 105i. Is On the short side L3 side, as the nozzle 57 moves along the short side L3 of the LCD substrate G, a transition process is performed in the order of the suction member 105a → the suction member 105b → the suction member 105c → the suction member 105d → the suction member 105e. Is On the short side L4 side, as the nozzle 58 moves along the short side L4 of the LCD substrate G, a transition process is performed in the order of the suction member 105m → the suction member 105n → the suction member 105o → the suction member 105p → the suction member 105a. Is
According to such a transition process, the back surface opposed to the vicinity of the periphery of the LCD substrate G from which the resist film has been removed by the nozzles 55, 56, 57, 58 is attracted and brought into a stable state. It can be done smoothly. Further, the suction means 105a to 105p for performing the suction operation may be sequentially shifted from the direction opposite to the movement of the nozzle.
[0049]
The substrate is not limited to the LCD substrate G as in the present embodiment described above, but may be a semiconductor wafer, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.
[0050]
【The invention's effect】
The present inventionAccording to the method, since the suction position on the back surface of the substrate can be sequentially shifted, even if the mounting table suctions and holds the substrate from the beginning to the end of the processing, the transfer mark of the suction means remains on the back surface of the substrate. Can be prevented. Therefore, it is possible to preferably carry out the holding of the substrate, to solve the product defect of the substrate, and to improve the yield.Further, the substrate can be stably held on the mounting table.
[0052]
Also,Since the control means can accurately select the suction means for performing the suction operation and the other suction means, it is possible to progress the transfer process of the suction means for performing the suction operation as originally planned.
[0053]
furtherThe suction path of the suction means, which is located at a position opposite to the center of the substrate mounting portion, is at least partially shared.Since the number of on-off valves is reduced, the load on the control function of the control means is reduced, and the structure for sucking the substrate by the suction means can be simplified.
[0054]
AlsoIn addition, the back surface opposed to the vicinity of the peripheral edge of the substrate being processed by the processing liquid supply nozzle is attracted to a stable state, so that the processing can be suitably performed.
[Brief description of the drawings]
FIG. 1 is a perspective view of a coating and developing system including a mounting table and a coating / periphery removing unit according to an embodiment of the present invention.
FIG. 2 is a plan view of the coating / periphery removing device according to the embodiment of the present invention.
FIG. 3 is a cross-sectional view of the coating / periphery removing apparatus according to the embodiment of the present invention, on an edge removing system side.
FIG. 4 is a plan view of a peripheral edge removing system.
FIG. 5 is a sectional view of a nozzle.
FIG. 6 is a perspective view of a mounting table.
FIG. 7 is a perspective view of a suction member.
FIG. 8 is an explanatory diagram showing a circuit of a suction system connected to the mounting table.
FIG. 9 is a process diagram showing a transfer process of a suction member performing a suction operation.
FIG. 10 is an explanatory diagram showing another example of a suction system circuit connected to the mounting table.
FIG. 11 is an explanatory diagram showing a main part of another example of a suction system circuit connected to the mounting table.
FIG. 12 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
FIG. 13 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted with movement of a nozzle.
FIG. 14 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
FIG. 15 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted with movement of a nozzle.
FIG. 16 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
[Explanation of symbols]
1 Processing system
24 Coating and peripheral edge removing device
31 Peripheral edge removal system
34 Mounting table
35a-35h Suction member
55, 56, 57, 58 nozzles
90 Vacuum suction means
91a-91h Suction path
92a-92h On-off valve
93 Control unit
G LCD board

Claims

The substrate is suctioned and held by a plurality of suction means provided on the upper surface of the substrate mounting portion, and the processing liquid is supplied from the processing liquid supply nozzle while moving the processing liquid supply nozzle along the periphery of the substrate. In the method of processing a substrate,
A substrate processing method, wherein the suction operation of the suction unit is sequentially shifted along a peripheral portion of a substrate with movement of the processing liquid supply nozzle.

The substrate is suctioned and held by a plurality of suction means provided on the upper surface of the substrate mounting portion, and the processing liquid is supplied from the processing liquid supply nozzle while moving the processing liquid supply nozzle along the periphery of the substrate. In the method of processing a substrate,
A substrate processing method, wherein the suction operation of the suction unit is sequentially shifted on each side of a substrate as the processing liquid supply nozzle moves.

3. The substrate processing method according to claim 1, wherein the suction operation of the suction unit is shifted in the same direction as the movement of the processing liquid supply nozzle.

3. The substrate processing method according to claim 1, wherein the suction operation of the suction unit is shifted in a direction opposite to the movement of the processing liquid supply nozzle.

5. The substrate processing method according to claim 1, wherein the suction means facing each other across the center of the substrate are simultaneously suction-operated.

What is claimed is: 1. A substrate processing apparatus, comprising: a substrate mounting portion having a plurality of suction means on an upper surface;
A substrate processing apparatus, comprising: a control unit that sequentially shifts the suction operation of the suction unit along a peripheral edge of the substrate as the processing liquid supply nozzle moves.

What is claimed is: 1. A substrate processing apparatus, comprising: a substrate mounting portion having a plurality of suction means on an upper surface;
A substrate processing apparatus, further comprising control means for sequentially shifting the suction operation of the suction means on each side of the substrate as the processing liquid supply nozzle moves.

8. The substrate processing apparatus according to claim 6, wherein the control means shifts the suction operation of the suction means in the same direction as the movement of the processing liquid supply nozzle.

8. The substrate processing apparatus according to claim 6, wherein the control unit shifts the suction operation of the suction unit in a direction opposite to a movement of the processing liquid supply nozzle.

Each of the suction means has a configuration for suctioning the substrate by a vacuum suction means,
A suction path connecting the vacuum suction means and each suction means,
A suction path opening / closing means interposed in the middle of each suction path;
10. The substrate processing apparatus according to claim 6, wherein opening / closing of the opening / closing means is controlled by the control means.

The substrate processing apparatus according to claim 10, wherein at least a part of a suction path of the suction unit that is opposed to the center of the substrate mounting unit is shared.

The substrate processing apparatus according to claim 6, wherein the suction unit is disposed at least along a peripheral edge of the substrate mounting unit.

13. The substrate processing apparatus according to claim 6, wherein the suction units opposing each other across the center of the substrate are simultaneously suction-operated.