JPH06244093A - Substrate holding method, and method and device for manufacture of thin film multilayer substrate by using it - Google Patents

Abstract

PURPOSE:To provide a technique of manufacturing a thin film multilayer substrate which can reduce product defective by preventing contamination and damage of a product pattern part when vacuum-chucking a substrate in a substrate processing process of a thin film multilayer substrate wherein a product pattern by a thin film layer is formed in both front and rear surfaces. CONSTITUTION:The title device is a manufacturing device used for a process for processing a surface by rotating a substrate such as resist application, development, etching and insulation film application in a thin film manufacturing process of a substrate. It has a plurality of vacuum attraction pads 2 to 5 which attract a plurality of places in a periphery of the rear of a substrate 1, and is constituted of a spin chuck 6, etc., which has a function which enables independent operation of the plurality of vacuum attraction pads 2 to 5. After the vacuum attraction pad 2 having a clearance to the substrate 1 is moved up and down to entirely eliminate the clearance, the substrate 1 is attracted and held to the vacuum attraction pads 2 to 5 by a vacuum source 8 through a tube path 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding method and a thin film multilayer substrate manufacturing technique using the same, and particularly to a product pattern in a thin film multilayer substrate manufacturing process in which thin film layers are laminated on both front and back surfaces of a ceramic substrate or the like. TECHNICAL FIELD The present invention relates to a substrate holding method capable of reducing product defects by preventing contamination and damage of parts, and a technique effectively applied to a thin film multilayer substrate manufacturing method and apparatus using the same.

[0002]

2. Description of the Related Art For example, in the step of performing surface treatment by rotating a substrate such as resist coating, developing, etching, insulating film coating in a thin film manufacturing process for semiconductors, etc.
As in the etching device described in Japanese Patent Laid-Open No. 59-8340, a substrate holding method is used in which the vicinity of the center of the back surface of the substrate is sucked by a vacuum suction chuck.

This substrate holding method is an effective method for a substrate in which a product pattern is not formed on the back surface of the substrate, and is most widely used. However, for a substrate on which a product pattern is formed on the back surface of the substrate, the product pattern portion may be contaminated or damaged, resulting in a defective product.

As a first method to solve this, a protective film is formed by forming a resist film on the back surface of the substrate in advance to prevent contamination and damage of the product pattern portion at the time of adsorbing the back surface of the substrate to eliminate product defects and to protect the protective film. A method is conceivable in which the protective film is removed at the time when is unnecessary.

As a second method, a substrate holding method in which the vicinity of the center of the back surface of the substrate used as a product is not adsorbed and only the peripheral portion of the back surface of the substrate not used as a product is adsorbed can be considered.

[0006]

However, in the above-mentioned conventional technique, for example, the first protective film method, the number of manufacturing steps is increased, and both the protective property and the removability are compatible depending on the film structure of the product pattern portion. Therefore, it is difficult to completely prevent the contamination and damage of the product pattern portion and eliminate the product defect.

On the other hand, in the second substrate back surface peripheral suction method, the flatness of the substrate is generally poor around the substrate, and when the flatness of the substrate is poor, a gap is formed between the substrate and the suction pad. A vacuum leak occurs and the substrate cannot be held due to insufficient substrate adsorption.

Therefore, neither the conventional protective film method nor the substrate backside peripheral adsorption method can be applied well to the substrate processing in the manufacturing process of the substrate having the product patterns on both the front and back surfaces of the substrate like the thin film multilayer wiring substrate. There's a problem.

Therefore, an object of the present invention is to use a substrate holding method in which a surface opposite to a substrate processing surface is vacuum-adsorbed, particularly in a substrate processing step of a thin film multilayer substrate in which product patterns of thin film layers are formed on both front and back surfaces. Even in such a case, it is an object of the present invention to provide a substrate holding method capable of preventing the product pattern portion from being contaminated and damaged and reducing product defects, and a thin film multilayer substrate manufacturing method and apparatus using the same.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the substrate holding method of the present invention has a plurality of vacuum suction pads for sucking a plurality of portions around the back surface of the substrate, and a chuck having a function of independently operating the plurality of vacuum suction pads. The chuck holds the substrate.

In this case, three of the plurality of vacuum suction pads are fixed so that the remaining vacuum suction pads can be operated independently.

Further, each of the plurality of vacuum suction pads is vacuum-sucked by an independent vacuum source.

Further, the method and apparatus for manufacturing a thin film multilayer substrate of the present invention uses the substrate holding method described above, such as a resist coating apparatus, a developing apparatus, an etching apparatus and an insulating film coating apparatus used for manufacturing a thin film on a substrate. Resist coating, development,
In surface treatment processes such as etching and insulating film coating,
The surface treatment is performed by rotating the substrate by rotating the chuck.

In this case, a thick film wiring board having thick film patterns on both front and back surfaces is used as the substrate, and dummy patterns are formed at a plurality of locations around the front and back surfaces of the thick film wiring board, or thick film patterns are formed. Is not formed.

As the substrate, a thin film multilayer substrate having a conductor film pattern or a thin film layer composed of a conductor film pattern and an insulating film on both sides of a base substrate having thick film patterns on both sides is used as the substrate. A dummy pattern is formed at a plurality of locations on both sides, or a thin film layer is not formed.

[0018]

According to the above-mentioned substrate holding method and the method and apparatus for manufacturing a thin film multilayer substrate using the same, the chuck is provided with a plurality of independently operable vacuum suction pads, so that the flatness due to the warp of the substrate is caused. Is bad,
It is possible to eliminate the gap between the holding surface of the substrate and the vacuum suction pad, and prevent the suction failure of the substrate.

In this case, since only the remaining vacuum suction pads except the three locations can be operated independently, the operation of the vacuum suction pad is minimized and the suction of the substrate is suppressed even when the flatness of the substrate is poor. It is possible to eliminate defects and surely suck and hold the substrate.

Further, by connecting a vacuum source capable of independently performing vacuum suction to each of the plurality of vacuum suction pads, even if a vacuum leak occurs due to a gap between a certain vacuum suction pad and the holding surface of the substrate, the remaining Since no vacuum leakage occurs in the vacuum suction pad, it is possible to prevent a suction failure of the substrate and securely hold the substrate.

Thus, particularly in the surface treatment process such as resist coating, development, etching, and insulating film coating in the substrate thin film manufacturing process, the influence of the flatness of the substrate is reduced to suppress the occurrence of substrate adsorption failure. Moreover, by adsorbing the predetermined holding portion, it is possible to prevent the product area from being contaminated and damaged, and to improve the product quality.

[0022]

Embodiment 1 FIG. 1 is a side view showing an essential part of a thin film multilayer substrate manufacturing apparatus using a substrate holding method according to an embodiment of the present invention, and FIG. 2 is a thin film multilayer substrate manufacturing apparatus of this embodiment. It is a top view which shows the thick film wiring board used.

First, the main structure of the thin-film multilayer substrate manufacturing apparatus of this embodiment will be described with reference to FIG.

The thin-film multi-layer substrate manufacturing apparatus of this embodiment is used in a step of performing a surface treatment by rotating the substrate, such as resist coating, development, etching and insulating film coating in the thin-film manufacturing process of the substrate. And a plurality of vacuum suction pads 2 for sucking a plurality of places around the back surface of the substrate 1
5, the plurality of vacuum suction pads 2 to 5 are composed of a spin chuck 6 having a function of independently operating.

The substrate 1 is composed of vacuum suction pads 2-5 (however,
(5 is not visible due to the shadow of 3) 4 vacuum suction pads 2 to 5 that can operate in the vertical direction and can detect the contact with the substrate 1.
Is mounted on a spin chuck 6 which can rotate freely, and these vacuum suction pads 2 to 5 and the spin chuck 6 are connected to a vacuum source 8 via a tube passage 7. A nozzle 10 for supplying 9 is arranged.

Further, as the substrate 1 in this case, a thick film wiring substrate such as a ceramic substrate having thick film patterns on both front and back surfaces is used. For example, as shown in FIG. 2, the surface of the substrate 1 has a thick film product pattern. It is composed of a portion 11, four thick film dummy pattern portions 12 and a vacuum suction pad contact portion 13. The back surface of the substrate 1 has the same structure.

Next, the operation of this embodiment will be described.

First, the substrate 1 is transported by a transport arm (not shown), and the thick film product pattern portion 11 on the back surface of the substrate 1 is transported.
It is mounted on the spin chuck 6 through the vacuum suction pads 2 to 5 in accordance with the vacuum suction pad contact portion 13 of the thick film dummy pattern portion 12 without contacting with.

Then, the substrate 1 and the vacuum suction pads 2-5 are contacted by contact sensors (not shown) of the vacuum suction pads 2-5.
Check the presence or absence of a gap between the vacuum suction pad 2 and the vacuum suction pad 2 which has a gap to operate upward so as to eliminate all the gaps between the four vacuum suction pads 2 to 5, and then open / close valve (not shown) of the pipe passage 7 ) Is opened, and the substrate 1 is suction-held on the vacuum suction pads 2-5 by the vacuum source 8.

Further, a chemical liquid 9 such as a resist is supplied onto the substrate 1 from a nozzle 10, and the spin chuck 6 is rotated under a preset rotation condition to apply the chemical liquid 9 on the substrate 1 to a desired thickness. Thereby, a resist film can be formed on both front and back surfaces of the substrate 1.

Therefore, according to the thin-film multilayer substrate manufacturing apparatus of this embodiment, the plurality of vacuum suction pads 2 to 5 are provided on the spin chuck 6 so that they can be independently operated, so that the warp of the substrate 1 is large. Even in this case, the vacuum suction pads 2 to 5 at the four positions can surely suck and hold the substrate 1,
The substrate 1 is not detached from the spin chuck 6 and is not blown during the rotation, and there is no risk of damaging the substrate 1.

In addition, since the substrate 1 can be sucked and held by the vacuum suction pad contact portion 13 of the thick film dummy pattern portion 12 without contacting the thick film product pattern portion 11 on the holding surface of the substrate 1, the quality is good. A thin film multilayer substrate can be obtained.

[0033]

[Embodiment 2] FIG. 3 is a side view showing an essential part of a thin film multilayer substrate manufacturing apparatus using a substrate holding method according to another embodiment of the present invention, and FIG. 4 is a thin film multilayer substrate manufacturing apparatus of this embodiment. FIG. 3 is a plan view showing a thin-film multilayer substrate used in the above.

In the thin-film multilayer substrate manufacturing apparatus of this embodiment, similar to the first embodiment, the steps of performing the surface treatment by rotating the substrate such as resist coating, development, etching and insulating film coating in the substrate thin-film manufacturing process. A plurality of vacuum suction pads 2, 3a for sucking a plurality of places around the back surface of the substrate 1a.
It is composed of a spin chuck 6a having 5a, etc., and is different from the first embodiment in that a plurality of vacuum suction pads 2, 3a.
The point is that the three vacuum suction pads 3a to 5a of 5a are fixed, and only the remaining vacuum suction pads 2 can be operated independently.

That is, as shown in FIG. 3, the substrate 1a includes a vacuum suction pad 2 which can be operated in the vertical direction and vacuum suction pads 3a to 5a whose operation is fixed (however, 5a cannot be seen because of the shadow of 3a). It is mounted on a rotatable spin chuck 6a having vacuum suction pads 2, 3a to 5a capable of sensing contact with a total of four substrates 1a.

Further, as the substrate 1a in this case, a thin film multilayer substrate having a conductor film pattern or a thin film layer composed of a conductor film pattern and an insulating film on both surfaces of a base substrate having thick film patterns on both front and back surfaces is used. For example, as shown in FIG. 4, the surface of the substrate 1a has a thin film product pattern portion 14 formed on the thick film product pattern portion 11 and a thin film dummy pattern formed on four sets of thick film dummy pattern portions 12. It is composed of a portion 15 and a vacuum suction pad contact portion 13. The back surface of the substrate 1a has the same structure.

When the substrate 1a is mounted on the spin chuck 6a, it is aligned with the vacuum suction pad contact portion 13 of the thin film dummy pattern portion 15 without contacting the thin film product pattern portion 14 on the back surface of the substrate 1a. And is mounted on the spin chuck 6a via the vacuum suction pads 2, 3a to 5a.

After that, the presence or absence of a gap between the substrate 1a and the vacuum suction pads 2, 3a to 5a is checked by a contact sensor (not shown) on the vacuum suction pads 2, 3a to 5a, and only the vacuum suction pad 2 is moved up and down. By operating, the substrate 1a can be suction-held on the vacuum suction pads 2, 3a-5a by eliminating all the gaps between the four vacuum suction pads 2, 3a-5a.

Therefore, according to the thin-film multi-layer substrate manufacturing apparatus of this embodiment, the spin chuck 6a is provided with the vacuum suction pad 2 operable in the vertical direction and the vacuum suction pads 3a to 5a whose operation is fixed. The vacuum suction pad 2 is operated to the minimum, and even when the flatness of the substrate 1a is poor, the substrate 1a can be surely sucked and held to prevent damage, and the thin film product of the substrate 1a can be prevented. Since there is no contact with the pattern portion 14, it is possible to obtain a thin film multi-layer substrate of good quality.

Further, by using this thin film multilayer substrate, it is possible to achieve high performance and space saving of a device such as a general-purpose large computer.

[0041]

[Embodiment 3] FIG. 5 is a side view showing an essential part of an apparatus for manufacturing a thin film multilayer substrate using a substrate holding method according to still another embodiment of the present invention, and FIG. 6 is a method for manufacturing the thin film multilayer substrate of this embodiment. It is a side view which shows the modification in an apparatus.

The thin-film multi-layer substrate manufacturing apparatus of this embodiment performs the surface treatment by rotating the substrate like resist coating, developing, etching and insulating film coating in the thin-film manufacturing process of the substrate as in the first and second embodiments. A plurality of vacuum suction pads 2 which are used in the steps to be performed and which suction a plurality of places around the back surface of the substrate 1a
5 to 5 and is different from the first and second embodiments in that each vacuum suction pad 2 to 5 is vacuum-sucked by an independent vacuum source 8a to 8d.

That is, as shown in FIG. 5, the substrate 1a has the vacuum suction pads 2 to 5 (however, 5
Is not visible in the shade of 3), and is mounted on a spin chuck 6b which is free to rotate and which has vacuum suction pads 2 to 5 capable of sensing contact with a total of four substrates 1a. Reference numeral 5 is connected to independent vacuum sources 8a to 8d via tube passages 7a to 7d, respectively.

When mounting the substrate 1a on the spin chuck 6b, first, the substrate 1a is carried by a carrying arm (not shown) and moved above the spin chuck 6b. After that, among the claws (not shown) of the transfer arm, only the one corresponding to the vacuum suction pad 2 is removed from the substrate 1a and moved away to move the vacuum suction pad 2 upward, and the substrate 1a is moved by the contact sensor (not shown). After checking that there is no gap between the vacuum suction pad 2 and the vacuum suction pad 2, the opening / closing valve (not shown) of the pipe passage 7a is opened and the substrate 1a is suction-held on the vacuum suction pad 2 by the vacuum source 8a.

Similarly, among the claws of the transfer arm, only those corresponding to the vacuum suction pads 3 to 5 are sequentially removed from the substrate 1a and moved away, and the vacuum suction pads 3 to 5 are moved upward.
After checking that there is no gap between the substrate 1a and the vacuum suction pads 3-5, the substrate 1a is suction-held on the vacuum suction pads 3-5 by the vacuum sources 8b-8d through the pipe passages 7b-7d.
As described above, the vacuum suction pads 2 to 5 can sequentially receive the substrates 1a from the corresponding claws of the transfer arm and suction-hold them.

Therefore, according to the thin-film multilayer substrate manufacturing apparatus of this embodiment, the vacuum suction pads 2 to 2 which can be operated in the vertical direction are used.
By connecting 5 to the independent vacuum sources 8a to 8d, respectively, like the first and second embodiments, even if the flatness of the substrate 1a is poor, the substrate 1a can be surely sucked and held to prevent damage. Since the substrate 1a can be sucked and held without coming into contact with the thin film product pattern portion 14 of the substrate 1a only by contacting the same thin film dummy pattern portion 15 of the substrate 1a during transportation and processing of the substrate 1a, It is possible to obtain a good quality thin film multilayer substrate having a wide effective product area.

Furthermore, for example, even if a vacuum leak occurs due to the gap between the vacuum suction pad 2 and the substrate 1a at one place, no vacuum leak occurs at the other vacuum suction pads 3 to 5, so that the remaining three places. The vacuum suction pads 3 to 5 can surely suction and prevent the suction failure of the substrate 1a.

In this case, for example, as shown in FIG.
All the vacuum suction pads 2a to 5a of the spin chuck 6c
Even when the operation is fixed, the flatness of the substrate 1a is poor,
Even if a vacuum leak occurs due to the gap between the vacuum suction pad 2a and the substrate 1a, the remaining vacuum suction pads 3a to 5a.
As a result, the substrate 1a can be reliably sucked and held.

Although the invention made by the present inventor has been specifically described based on the first to third embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, in the thin film multilayer substrate manufacturing apparatus of the above-described embodiment, the case where the substrates 1, 1a are rotated by the spin chucks 6, 6a to 6c to perform the surface treatment has been described. However, the present invention is not limited to the above, but can be widely applied to an apparatus including chucks 16 and 16a to 16c as shown in FIGS.

That is, in the case of FIG. 7, the chuck 16 for holding the substrate 1 is provided with a plurality of vacuum suction pads 2-5 for independently sucking a plurality of portions around the back surface of the substrate 1 so as to be independently operable. Therefore, the substrate 1 can be reliably held by vertically moving these vacuum suction pads 2 to 5 without contacting the product pattern portion of the substrate 1. Similarly, the structure of FIG. 8 is the case of the chuck 16a in which the three vacuum suction pads 3a to 5a are fixed and the remaining vacuum suction pads 2 can be independently operated.

Further, the chuck 16b of FIG. 9 is adapted to perform vacuum suction by the independent vacuum sources 8a to 8d for each of the vacuum suction pads 2 and 3a to 5a. Even if a vacuum leak occurs, the substrate 1 can be surely sucked and held by the other vacuum suction pads 3a to 5a. Further, a combination of these is used for all the vacuum suction pads 2a to 5a as shown in FIG.
Has a structure in which the chuck 16c is fixed.

In the first embodiment, the thick film wiring board is formed by forming the thick film dummy pattern portion 12 on the surface of the substrate 1. Further, in the substrate of the second embodiment, a thin film is formed on the thick film dummy pattern portion 12. Although the case of using the thin film multilayer substrate having the dummy pattern portion 15 formed thereon has been described, the present invention is also applicable to the case where the thick film layer and the thin film layer are not formed instead of forming the thick film and thin film dummy pattern portions 12 and 15. is there.

In the above description, the invention made by the present inventor is mainly applied to a manufacturing apparatus used for resist coating, developing, etching, insulating film coating, etc. in the thin film manufacturing process of substrates, which is the field of use of the invention. However, the present invention is not limited to this, and is widely applicable to other substrates having product patterns on the front and back sides, manufacturing equipment such as other surface treatment processes, and especially to both sides of a base substrate having a thick film pattern. It is a good technique for manufacturing a multilayer substrate having a conductor film pattern or a thin film layer composed of a conductor film pattern and an insulating film.

[0055]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). A plurality of vacuum suction pads for sucking a plurality of portions around the back surface of the substrate are provided, and a chuck having a function of independently operating the plurality of vacuum suction pads is provided. By holding, the gap between the holding surface of the substrate and the vacuum suction pad can be eliminated even if the flatness of the substrate is poor, so that it is possible to prevent the suction failure of the substrate.

(2). By fixing three of the plurality of vacuum suction pads and allowing the remaining vacuum suction pads to operate independently, the operation of the vacuum suction pads is minimized,
Even if the flatness of the substrate is poor, the suction failure can be eliminated, so that the substrate can be securely suction-held.

(3) By vacuum-sucking a plurality of vacuum suction pads by an independent vacuum source, even if a vacuum leak occurs due to a gap between any of the vacuum suction pads and the holding surface of the substrate, the remaining Since no vacuum leakage occurs in the vacuum suction pad, it is possible to prevent a suction failure of the substrate and securely hold the substrate.

(4) The influence of the flatness of the substrate can be reduced by using it in the step of performing the surface treatment by rotating the substrate such as resist coating, development, etching, and insulating film coating in the thin film manufacturing process of the substrate. A method and apparatus for manufacturing a thin-film multilayer substrate that suppresses the occurrence of defective adsorption of a substrate and does not suffer damage due to the substrate dropping during a processing step, thus improving the yield of the manufactured substrate. be able to.

(5) According to the above (4), since only a part other than the product pattern in the peripheral portion of the substrate can be securely adsorbed and held, the product pattern is not damaged even when the product pattern is formed on both front and back surfaces of the substrate. It is possible to obtain a method and an apparatus for manufacturing a thin-film multilayer substrate, which is free from contamination and enables the quality of the manufactured substrate to be improved.

(6) Due to the above (4), the total area of the suction-holding portion of the substrate becomes small, so that the thin film multilayer substrate manufacturing method and apparatus capable of expanding the product area can be obtained.

(7) According to the above (4), since it is not necessary to form a protective film on the adsorption holding surface of the substrate as in the conventional case, a manufacturing method and apparatus of a thin film multilayer substrate capable of reducing manufacturing man-hours. Can be obtained.

(8) According to the above (4), when used in, for example, an automation device, the automation device does not stop due to a defective adsorption of the substrate, etc., so that unattended operation and labor saving by the automation device are possible. It is possible to obtain a method and an apparatus for manufacturing a thin film multilayer substrate.

[Brief description of drawings]

FIG. 1 is a side view showing a main part of a thin-film multilayer substrate manufacturing apparatus using a substrate holding method according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a thick film wiring substrate used in the thin film multilayer substrate manufacturing apparatus in Example 1;

FIG. 3 is a side view showing a main part of a thin-film multilayer substrate manufacturing apparatus using a substrate holding method according to a second embodiment of the present invention.

FIG. 4 is a plan view showing a thin film multilayer substrate used in a thin film multilayer substrate manufacturing apparatus in Example 2;

FIG. 5 is a side view showing a main part of a thin-film multilayer substrate manufacturing apparatus using a substrate holding method according to a third embodiment of the present invention.

FIG. 6 is a side view showing a modified example of the thin-film multilayer substrate manufacturing apparatus of the third embodiment.

FIG. 7 is a side view showing the main part of the manufacturing apparatus in the substrate holding method in the present invention.

FIG. 8 is a side view showing a main part of another manufacturing apparatus in the substrate holding method in the present invention.

FIG. 9 is a side view showing a main part of still another manufacturing apparatus in the substrate holding method in the present invention.

FIG. 10 is a side view showing a main part of still another manufacturing apparatus in the substrate holding method in the present invention.

[Explanation of symbols]

 1, 1a Substrate 2, 2a Vacuum suction pad 3, 3a Vacuum suction pad 4, 4a Vacuum suction pad 5, 5a Vacuum suction pad 6, 6a-6c Spin chuck 7, 7a-7d Pipe passage 8, 8a-8d Vacuum source 9 Chemicals 10 Nozzle 11 Thick film product pattern part 12 Thick film dummy pattern part 13 Vacuum suction pad contact part 14 Thin film product pattern part 15 Thin film dummy pattern part 16, 16a-16c Chuck

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location H05K 3/46 Y 6921-4E // B23Q 3/08 A 8612-3C (72) Inventor Takashi Inoue 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd. Production Engineering Research Laboratory, Hitachi, Ltd. (72) Inventor Shinya Miura 1 Horiyamashita, Hadano-shi, Hadano, Kanagawa Pref., General Computer Division

Claims (7)

[Claims] 1. A chuck having a plurality of vacuum suction pads for sucking a plurality of portions around the back surface of a substrate, the plurality of vacuum suction pads having an independently operable function, and holding the substrate by the chuck. A method for holding a substrate, comprising: 2. The substrate holding method according to claim 1, wherein
A method for holding a substrate, characterized in that three of the plurality of vacuum suction pads are fixed, and the remaining vacuum suction pads can be operated independently. 3. The substrate holding method according to claim 1, wherein each of the plurality of vacuum suction pads is vacuum-sucked by an independent vacuum source. 4. A step of performing a surface treatment by rotating the substrate, such as resist coating, developing, etching and insulating film coating in the substrate thin film manufacturing step, using the substrate holding method according to claim 1, 2 or 3. 3. The method for manufacturing a thin film multilayer substrate according to, wherein the substrate is rotated by rotating the chuck to perform a surface treatment. 5. The substrate holding method according to claim 1, 2 or 3, wherein the substrate is rotated like a resist coating device, a developing device, an etching device, or an insulating film coating device used for manufacturing a thin film of the substrate. An apparatus for performing a surface treatment, wherein the substrate is rotated by rotating the chuck to perform the surface treatment. 6. The thin-film multilayer substrate manufacturing apparatus according to claim 5, wherein a thick film wiring board having thick film patterns on both front and back surfaces is used as the substrate, and the thick film wiring board is provided at a plurality of locations around both front and back surfaces of the thick film wiring board. An apparatus for manufacturing a thin-film multilayer substrate using a substrate holding method, wherein a dummy pattern is formed or the thick film pattern is not formed. 7. The thin-film multilayer substrate manufacturing apparatus according to claim 5, wherein a conductive film pattern or a thin film layer including a conductive film pattern and an insulating film is formed on both surfaces of a base substrate having thick film patterns on both front and back surfaces as the substrate. Using the thin-film multi-layer substrate having the above, a dummy pattern is formed at a plurality of positions on both sides of the front and back of the thin-film multi-layer substrate, or the thin-film multi-layer substrate is not formed. apparatus.