JPH11131283A - Infrared ray remote control light receiving unit, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems caused by a shield case which lowers heat radiation efficiency and makes cost expensive. SOLUTION: In a module body in which electronic parts including a photodiode, an integrated circuit, a capacitor, and a resistor are mounted on the surface of a circuit substrate 2 and an upper surface of the electronic parts is sealed with a translucent sealing resin 7 (an epoxy resin), an Ni-plated layer 21 is formed on the whole surface of the sealing resin 7 except a light-receiving window 23a of a light-receiving unit and except through hole electrodes other than the through hole for grounding of the circuit substrate 2. The grounding of the Ni-plated layer 21 formed on the epoxy resin surface to the GND is achieved by soldering a part of the through hole electrode for grounding which is Ni-plated by a GND electrode 9 of a fitting substrate side (mother board) using a solder 10. Because no shield case is used, the material cost of a product is reduced, the cost of the product in terms of the assembly man hour and the inspection man-hour is reduced, the reliability in the shield countermeasures and the increase in the heat radiation by the Ni-plated layer 21 is improved, the unit is miniaturized, and of low-profile.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared remote control light receiving unit used for consumer equipment such as TVs, VTRs, audio equipment, air conditioners, car stereos, cameras and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, TVs and VTs equipped with an optical communication function have been developed.
R, audio equipment, air conditioners, car stereos, cameras, and other consumer equipment, such as infrared remote control light receiving units, are increasingly required to be smaller, thinner, more reliable, and more cost-effective. The structure of a conventional general infrared remote control light receiving unit will be outlined with reference to FIG. FIG.
FIG. 2 is a perspective view showing the appearance of an infrared remote control light receiving unit.

[0005] In FIG. 15, reference numeral 1 denotes an infrared remote control light receiving unit. 2 is glass ethoxy,
This is a circuit board having heat resistance and insulation properties, such as BT resin, on which an electrode pattern (not shown) is formed.

A photodiode, which is a light receiving element (not shown), is mounted on an electrode pattern formed on the upper surface of the circuit board 2 by die bonding and wire bonding. The photodiode is electrically connected to the electrode pattern with a die bond paste such as a silver paste as a conductive adhesive. On the circuit board 2, electronic components such as an integrated circuit, a capacitor, and a resistor (not shown) are mounted in addition to the photodiode.

In FIG. 15, reference numeral 7 denotes a light-transmitting sealing resin such as an epoxy resin containing a visible light-cutting agent, which covers an electronic component such as a photodiode.

Reference numeral 8 denotes a substantially box-shaped thin plate, for example, a shield case made of metal such as stainless steel, aluminum, copper, or iron having a thickness of about 0.15 mm. The shield case 8
The infrared remote control light receiving unit 1 has a light receiving window 8a at the position of the light receiving portion 1a, and covers the module main body. Since the shield case 8 surrounds the circuit section, it is possible to take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like. Therefore, surfaces other than those mounted on the motherboard such as the light receiving portion 1a and the printed wiring board are covered with the shield case 8. 9 is the motherboard GN
This is a D electrode, and the infrared remote control light receiving unit 1 is soldered to this GND electrode with solder 10.

An outline of a method of manufacturing the infrared remote control light receiving unit 1 will be described. 8 to 1
5 shows a method for manufacturing a conventional infrared remote control light receiving unit. 8 is a through-hole processing step and an electrode pattern forming step on the collective circuit board. FIG. 9 is a silver paste printing, mounting and reflow step on the electrode pattern for mounting the capacitor and the resistor. FIG. 10 is a photodiode and an integrated circuit. Silver paste printing, die bonding, curing process, FIG. 11 is a wire bonding process, FIG. 12 is a resin sealing process, FIG. 13 is a dicing process, and FIG. Chip balancing process to make a semi-finished product alone,
FIGS. 15A and 15B are perspective views showing a shield case assembling process for assembling the semi-finished product of FIG. 14 into a shield case to obtain a completed infrared remote control light receiving unit.

[0008] In FIG. 8, a through-hole processing step is as follows.
A plurality of through-holes 11 for connecting the upper and lower conductive patterns are formed in each row of the collective circuit board 2A made of glass epoxy resin by a processing means such as NC cutting.

Next, in a plating step, after cleaning the entire surface of the collective circuit board 2A including the wall surfaces of the through holes 11, a copper plating layer is formed on the entire surface of the collective circuit board 2A by electroless plating. A nickel plating layer is formed thereon by electrolytic plating, and a gold plating layer is further formed thereon by electrolytic plating.

Further, in the electrode pattern forming step, a plating resist is laminated in an etching step, and a pattern mask is formed by exposure and development, and the electronic component mounting electrode patterns 2a, 2b, 2c are formed on the upper surface of the collective circuit board 2A. And 2d, and a through-hole electrode 11a connected to the upper and lower conductive patterns.

In FIG. 9, a mounting and reflow step for fixing a capacitor and a resistor is performed by applying a silver paste 3 as a conductive adhesive by printing or the like on the electrode patterns 2c and 2d formed on the circuit board 2A. Then, the capacitor 4 and the resistor 5 are mounted on the silver paste 3 and reflowed.

In FIG. 10, a die bonding and curing step for fixing the photodiode 6 and the integrated circuit 12 is performed by the electrode pattern 2a formed on the circuit board 2A.
And 2b are coated with silver paste 3 as a conductive adhesive by printing or the like, and mounted on the silver paste 3 while lightly applying pressure so that the photodiode 6 and the integrated circuit 12 are not damaged. Is held at a predetermined temperature for a predetermined time, and the silver paste 3 is cured to be fixed and integrated on the collective circuit board 2A.

Referring to FIG. 11, the wire bonding step comprises:
The photodiode 6 and the integrated circuit 12 fixed on the collective circuit board 2A are wire-bonded to a pattern on the collective circuit board 2A by bonding wires 13 made of gold wire or the like.

In FIG. 12, in the resin sealing step, the upper surface side of the collective circuit board 2A is made of a transparent epoxy resin so as to cover the upper surfaces of the capacitor 4, the resistor 5, the photodiode 6, and the integrated circuit 12. Fill the sealing resin 7,
Mold and cure. Thus, the infrared remote control light receiving unit assembly 1A is formed.

In FIG. 13, the dicing step is performed by the infrared remote control light receiving unit assembly 1A.
Is cut by a dicing or slicing machine or the like along two orthogonal cut lines to be divided into a single infrared remote control light receiving unit semi-finished product 1B. Among the cut lines, a cut line 1 in the X direction
4 is a line passing through the center of a plurality of through holes (11) (not shown) formed between the respective rows, and a cut line 15 in the Y direction orthogonal to this line is a line including one set of the electronic component. It is. A semicircular through-hole electrode (11a) (not shown) is formed on the row of the cut lines 14 in the X direction.

In the chip balancing step, as shown in FIG. 14, the chip is divided in the dicing step and separated into individual parts.
Infrared remote control light receiving unit semi-finished product 1B
become. As described above, FIG. 15 shows that the infrared remote control light receiving unit semi-finished product 1B has a substantially box shape and has a light receiving window 8a at a position corresponding to the light receiving portion 1a of the light receiving unit in the shield case assembling step. The infrared remote control light-receiving unit 1 is completed by covering with a thin metal shield case 8 made of stainless steel, aluminum, copper, iron or the like.

[0017]

However, the infrared remote control light receiving unit and the method of manufacturing the same have the following problems. That is, in the infrared remote control light-receiving unit, since the radiation of heat generated from the electronic components during use and the countermeasures against external noise are performed using the shield case, first,
A thin metal shield case (parts cost) is required. Also, a mold for making the shield case (mold cost)
Is required. Furthermore, work (man-hours) for incorporating the product into the shield case is required. In addition, a height inspection (man-hour) after mounting is also required. In addition, since there is a gap (air layer) between the incorporated product and the shield case (particularly in the direction of the upper surface), heat is trapped in the air layer, heat is not sufficiently released, and the life of the electronic component is deteriorated. . For this reason, the use of the shield case has a fatal problem such as an increase in reliability and cost of the product and a disadvantage in thinning.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to eliminate the use of a conventional metal shield case, and instead use Ni plating on the surface of a sealing resin made of ethoxy resin. With a simple structure with layers formed, N
The shielding measures and heat radiation efficiency are improved by the i-plated layer. That is, it is possible to radiate the heat generated from the electronic components, and at the same time, it is possible to take measures against external noise. An object of the present invention is to provide an inexpensive, ultra-compact, thin, and highly reliable infrared remote control light receiving unit.

[0019]

In order to achieve the above object, an infrared remote control light receiving unit according to the present invention has a through-hole electrode and an electrode pattern formed on a circuit board surface made of glass epoxy resin having a substantially rectangular flat surface. A light receiving element and an integrated circuit on the electrode pattern;
Infrared remote control in which a module body in which electronic components such as a capacitor and a resistor are mounted and sealed with a sealing resin made of a translucent epoxy resin so as to cover the upper surface of the electronic component is shielded by a shield member having a light receiving window. In the light receiving unit, the surface of the sealing resin excluding the light receiving window is plated with Ni, and the shield member is formed of a Ni plating layer.

Further, the surface of the sealing resin excluding the through hole electrode other than the through hole electrode for ground of the light receiving window and the circuit board is plated with Ni, and a shield member is formed by a Ni plating layer. And a through-hole electrode for use is electrically connected by the Ni plating layer.

A through-hole processing step of forming a plurality of through-holes for connecting upper and lower conductive patterns for each row of the collective circuit board formed of a large number of glass epoxy resins; A plating step of forming a plating layer on the entire surface of the collective circuit board including the inner surface of the through hole by plating at predetermined positions between rows, laminating a plating resist, forming a pattern mask after exposure and development, performing pattern etching, An electrode pattern for mounting electronic components on an upper surface of the collective circuit board, an electrode pattern forming step of forming a through-hole electrode in the through hole, and an electronic component such as a light receiving element, an integrated circuit, a capacitor, and a resistor on the upper surface of the collective circuit board With a conductive adhesive,
A mounting step of mounting as an electrical connection, a resin sealing step of sealing with a sealing resin made of a translucent epoxy resin so as to cover the upper surface of the electronic component, and a half dicing for cutting along an orthogonal cut line And masking a mask member such as a mask that exposes only the light receiving window on the upper surface of the sealing resin and a through-hole electrode portion other than the ground through-hole electrode on the back surface of the integrated circuit board with a mask member such as a masking tape. A masking step, a resist coating step of applying or spraying a resist liquid on the surface of the light receiving window exposed by masking on the surface of the sealing resin, and curing to form a resist film on the opened light receiving window; After removing the mask member such as the mask type covering the top surface of the sealing resin, the surface of the sealing resin made of epoxy resin by Ni plating A Ni plating step of forming a Ni plating layer on the substrate, a step of removing a mask member such as the resist film and a masking tape, and a step of cutting the collective circuit board left by the half dicing to divide it into a single infrared remote control light receiving unit It is characterized by comprising a full dicing step.

In the half dicing step, only the sealing resin is cut along two orthogonal cut lines.

In the half dicing step, the cutting depth of the dicing along the other cut line is formed on the through-hole electrodes other than the ground through-hole electrode along one of the orthogonal cut lines. The half is dicing to cut only the sealing resin, the cutting depth to dice along the cut line on the ground through-hole electrode, the sealing resin,
Further, it reaches the inside of the through-hole electrode of the substrate.

In the half dicing step, the cutting depth of dicing on the one of the through-hole electrodes in an orthogonal cut line is determined by dicing the sealing resin alone and completely cutting the sealing resin. In addition, dicing reaching the through-hole electrode of the substrate is performed alternately.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an infrared remote control light receiving unit according to the present invention will be described with reference to the drawings. 1 to 7 are perspective views illustrating an infrared remote control light receiving unit and a method of manufacturing the same according to an embodiment of the present invention. In the figure,
The same members as those in the prior art are denoted by the same reference numerals.

In FIG. 1, reference numeral 20 denotes an infrared remote control light receiving unit. 2, as before,
A circuit board made of glass epoxy resin having a substantially rectangular flat surface has an electrode pattern (not shown) and a through-hole electrode formed on the surface. Electronic components such as a photodiode, an integrated circuit, a capacitor, and a resistor are fixed to an electrode pattern formed on the upper surface side of the circuit board 2 by a conductive adhesive such as a silver paste, and the photodiode and the integrated circuit are bonded by a gold wire or the like. Wire-bonded with wires.

Further, as in the conventional case, the electronic component mounted on the upper surface of the circuit board 2 has its upper surface sealed with a translucent sealing resin 7 such as epoxy resin.

Reference numeral 21 denotes Ni formed on the surface of the sealing resin 7 except for through-hole electrode portions other than the ground through-hole electrode for grounding to the light receiving portion 20a of the infrared remote control light receiving unit 20 and the motherboard.
It is a plating layer. The Ni plating layer 21 has the function of a conventional shield case, can take measures against electromagnetic shielding, and is extremely effective in preventing the influence of external noise and the like. Further, unlike the conventional shield case, since the circuit board 2 and the sealing resin 7 are exposed to dissipate heat generated from the electronic components, the heat radiation efficiency is extremely good without an air layer interposed therebetween. .
9 is a GND electrode of the motherboard, and the infrared remote control light receiving unit 20 is connected to the GND electrode by soldering 1
0 is soldered.

An outline of a method of manufacturing the infrared remote control light receiving unit 20 will be described. 2 to 7 show a method of manufacturing the infrared remote control light receiving unit of the present invention. 2A is a perspective view showing a half dicing step, FIG. 2B is a cross-sectional view showing a half dicing cut line in the X direction, and surrounded by a circle indicated by a two-dot chain line A in FIG. FIG. 2C is a cross-sectional view showing half dicing surrounded by a circle indicated by a two-dot chain line B in FIG. FIG.
Shows a masking step, FIG. 4 shows a resist coating step, and FIG.
Is a Ni plating step, FIG. 6 is a mask member peeling step,
FIG. 7 is a perspective view showing the infrared remote control light receiving units divided into single units in a full dicing step of cutting a circuit board.

In the method of manufacturing an infrared remote control light-receiving unit according to the embodiment of the present invention, a plurality of through holes for connecting upper and lower conductive patterns are provided for each row of a collective circuit board made of glass epoxy resin. A through-hole processing step of drilling holes, a plating step of forming a plating layer on the entire surface of the collective circuit board including the inner surface of the through-hole by plating at a predetermined position between each row of the through-holes, and laminating a plating resist Forming a pattern mask after exposure and development, performing pattern etching, an electrode pattern for mounting electronic components on the upper surface of the collective circuit board, and an electrode pattern forming step of forming a through-hole electrode in the through hole; Silver paste, a conductive adhesive, is printed on the electrode pattern formed on the upper surface of the A step of mounting and reflowing the capacitor and the resistor on the silver paste, and applying a silver paste, which is a conductive adhesive, on the electrode pattern formed on the collective circuit board by printing or the like; And mounting the integrated circuit on a silver paste, and then placing it in a curing furnace and holding it at a predetermined temperature for a predetermined time by a die bonding and wire bonding mounting process, and a translucent film so as to cover the upper surface of the electronic component. The resin encapsulation step of encapsulating with an encapsulation resin made of epoxy resin is the same as in the above-described prior art, and therefore the description thereof is omitted. By the resin sealing step, the infrared remote control light receiving unit assembly 20A is formed.

In FIG. 2, reference numeral 14 denotes a cut line in the X direction, which is a line passing through the centers of the plurality of through holes 11 formed between the rows. A cut line 15 in the Y direction orthogonal to the cut line in the X direction is a cut line including one set of the electronic component. The infrared remote control light receiving unit assembly 20A is diced by a dicing or slicing machine or the like along the two orthogonal cut lines 14 and 15,
As shown in FIG. 2B, when dicing the dicing depth on the through-hole electrode 11a other than the ground through-hole electrode and the Y-direction cut line 15 in the X-direction cut line 14, Without cutting the circuit board 2A, cut into the front of the collective circuit board 2A,
Half dicing for cutting the thickness of the sealing resin 7 is performed. When dicing is performed on the ground through-hole electrode 11a with the adjacent cut line 14 in the X direction, the dicing depth is as shown in FIG. As shown in FIG. 7, half dicing is performed in which not only the cutting of the sealing resin 7 but also a cut is made until the sealing resin 7 reaches the inside of the through-hole electrode 11a of the collective circuit board 2A.

In FIG. 3, in the masking step, the through-hole electrode portion 11a other than the ground through-hole electrode on the back surface of the collective circuit board 2A is masked with a masking tape 22 or the like, for example. Also, the light receiving section 20 of the infrared remote control light receiving unit 20
As a mask member having a light receiving window 23a formed at a position corresponding to a, the surface of the sealing resin is masked by a mask mold 23, for example.

In FIG. 4, in the resist coating step, a resist liquid is applied or sprayed onto the masked infrared remote control light receiving unit assembly 20A and cured to form a resist film 24 on the surface of the light receiving window 23a. It is formed.

In FIG. 5, in the Ni plating step, Ni plating is performed after removing the mask mold 23 which has masked the surface of the sealing resin 7. The Ni plating layer 21 is formed on the entire surface of the sealing resin 7 excluding the light receiving window 23a masked by the resist film 24 and the through-hole electrode 11a other than the ground through-hole electrode. Regarding the thickness of the Ni plating layer 21, the effect of the shield is not exhibited if the Ni plating layer 21 is thin because the purpose is a shield.
It is necessary to secure a thickness of 0.1 mm or more. Therefore,
The Ni plating layer 21 for shielding becomes thick plating. still,
At the time of the Ni plating, the plating solution is immersed also in the surface of the collective circuit board 2A. However, since the material of the substrate is an epoxy resin containing glass, the surface of the substrate is not plated with Ni.

In FIG. 6, the peeling step is performed in the light receiving window 23a.
Then, the masking tape 22 that masks the through-hole electrodes 11a other than the ground through-hole electrodes on the back surface of the substrate is removed.

In FIG. 7, in the full dicing step, the integrated circuit board 2A left in the half dicing step is cut to complete a single infrared remote control light receiving unit 20. In the full dicing process, a semicircular through-hole electrode (11a) (not shown) is formed on the row of the cut lines 14 in the X direction.

FIG. 1 shows the infrared remote control light receiving unit 20 completed after all the steps. Since the Ni plating layer 21 formed on the surface of the sealing resin 7 is formed, it is possible to take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like.
Furthermore, since the heat generated from the mounted electronic components can be radiated, the heat can be radiated directly from the surface of the sealing resin 7 to the Ni plating layer 21 and directly from the circuit board 2, so that the radiation efficiency is extremely good. .

[0038]

As described above, in the infrared remote control light receiving unit of the present invention, the Ni plating layer is formed on the surface of the sealing resin except for the light receiving window and the through-hole electrode portion other than the ground through-hole electrode. Thus, the Ni plating layer has the function of a conventional shield case, and can take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like. Furthermore, in order to dissipate the heat generated from electronic components, an air layer has conventionally been interposed between the board and the shield case. However, heat is directly dissipated from the sealing resin surface to the Ni plating layer and directly from the circuit board. In addition, the heat radiation effect can be improved.

Further, the shield case conventionally used becomes unnecessary. This eliminates the need for a mold for making the shield case, and eliminates the need to incorporate the product into the shield case. Further, inspection after assembling becomes unnecessary.

As described above, cost reduction in material costs, product cost reduction in assembly man-hours, inspection man-hours, etc., increase in productivity due to multi-cavity production, and improvement in reliability due to increase in heat radiation effect. In addition, since the shield case is eliminated, it is possible to provide an infrared remote control light-receiving unit that exhibits various practical effects such as reduction in size and thickness, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is an external perspective view of an infrared remote control light receiving unit according to an embodiment of the present invention.

2 (a) is a perspective view showing a half dicing step in the method for manufacturing the infrared remote control light receiving unit of FIG. 1, and FIG. 2 (b) is a circle indicated by a two-dot chain line A in FIG. 2 (a). FIG. 2C is a cross-sectional view showing half dicing in which only the sealing resin is cut on the through-hole electrode surrounded by circles.
FIG. 3 is a cross-sectional view showing a sealing resin on a ground through-hole electrode surrounded by a two-dot chain line B circle in FIG. 2A and half dicing reaching further into the through-hole electrode of the substrate.

FIG. 3 is a perspective view showing a masking step of attaching a masking tape and a mask mold to FIG. 2;

FIG. 4 is a perspective view showing a resist liquid applying step of forming a resist film on a light receiving window of FIG. 3;

FIG. 5 is a perspective view showing a Ni plating step of forming a Ni plating layer on the surface of the sealing resin except for the through hole electrodes other than the light receiving window and the ground through hole electrode of FIG. 4;

6 is a perspective view showing a step of removing a masking tape and a step of removing a resist film in FIG. 5;

FIG. 7 is a perspective view showing a full dicing step of cutting the substrate of FIG. 6;

FIG. 8 is a perspective view showing a through-hole processing and an electrode pattern forming step on a collective circuit board common to the conventional and the present invention.

9 shows a mount for printing a silver paste on an electrode pattern of the collective circuit board of FIG. 8 to fix a capacitor and a resistor;
It is a perspective view which shows a reflow process.

FIG. 10 is a perspective view showing a die bonding and curing process in which a silver paste is printed on an electrode pattern of the collective circuit board of FIG. 9 to fix the photodiode and the integrated circuit.

FIG. 11 is a perspective view showing a wire bonding step of connecting the photodiode and the integrated circuit of FIG. 10 with bonding wires.

FIG. 12 is a perspective view illustrating a resin sealing step of sealing the electronic component of FIG. 11;

FIG. 13 is a perspective view showing a conventional dicing process.

FIG. 14 is a perspective view showing a semi-finished product of the infrared remote control light receiving unit divided in FIG. 13;

15 is a perspective view showing the appearance of an infrared remote control light receiving unit in a state where the semi-finished product of FIG. 14 is assembled in a shield case and completed.

[Description of Signs] 2 Circuit board 2A Collective circuit board 2a, 2b, 2c, 2d Electrode pattern for mounting electronic components 3 Silver paste (conductive adhesive) 4 Capacitor 5 Resistance 6 Photodiode 7 Sealing resin 9 GND electrode on motherboard DESCRIPTION OF SYMBOLS 10 Solder 11 Through hole 11a Through hole electrode 12 Integrated circuit 13 Bonding wire 14 X direction cut line 15 Y direction cut line 20 Infrared remote control light receiving unit 20A Infrared remote control light receiving unit assembly 20a Light receiving part 21 Ni plating layer 22 Masking tape 23 Mask type 23a Light receiving window 24 Resist film

Claims (6)

[Claims] 1. A through hole electrode and an electrode pattern are formed on a circuit board surface made of a glass epoxy resin having a substantially rectangular shape on a plane, and electronic components such as a light receiving element, an integrated circuit, a capacitor, and a resistor are mounted on the electrode pattern. In an infrared remote control light-receiving unit in which a module main body sealed with a sealing resin made of a translucent epoxy resin so as to cover an upper surface of the electronic component is shielded with a shield member having a light-receiving window, a sealing except for the light-receiving window is provided. An infrared remote control light receiving unit, wherein a Ni plating is applied to a surface of a resin and a shielding member is formed by a Ni plating layer. 2. A surface of a sealing resin excluding a through-hole electrode other than the through-hole electrode for ground of the light receiving window and the circuit board is plated with Ni, and a shield member is formed by a Ni plating layer. 2. The infrared remote control light receiving unit according to claim 1, wherein the through-hole electrode is electrically connected to the through-hole electrode by the Ni plating layer. 3. A through-hole processing step of forming a plurality of through-holes for connecting upper and lower conductive patterns for each row of a collective circuit board made of a large number of glass epoxy resins. A plating step of forming a plating layer on the entire surface of the collective circuit board including the inner surface of the through hole by plating at predetermined positions between rows, laminating a plating resist, forming a pattern mask after exposure and development, performing pattern etching, An electrode pattern for mounting electronic components on an upper surface of the collective circuit board, an electrode pattern forming step of forming a through-hole electrode in the through hole, and an electronic component such as a light receiving element, an integrated circuit, a capacitor, and a resistor on the upper surface of the collective circuit board A mounting step of fixing the electronic component with a conductive adhesive and performing electrical connection, and a translucent air cover so as to cover an upper surface of the electronic component. A resin sealing step of sealing with a sealing resin made of xylene resin, a half dicing step of cutting along an orthogonal cut line, and a mask member such as a mask type that exposes only a light receiving window on an upper surface of the sealing resin; A masking step of masking a through-hole electrode portion other than the ground through-hole electrode on the back surface of the collective circuit board with a mask member such as a masking tape; and a resist solution on the surface of the light-receiving window exposed by masking on the surface of the sealing resin. After coating or spraying and curing, a resist coating step of forming a resist film in the opened light receiving window portion, and after removing a mask member such as a mask type covering the upper surface of the sealing resin, epoxy by Ni plating A Ni plating step of forming a Ni plating layer on the surface of a sealing resin made of a resin; A step of removing a mask member such as a mask and a full dicing step of cutting the collective circuit board left by the half dicing and dividing it into a single infrared remote control light receiving unit. Production method. 4. The method of manufacturing an infrared remote control light receiving unit according to claim 3, wherein in the half dicing step, only the sealing resin is cut along cut lines orthogonal to each other. 5. The half dicing step includes, on one of the orthogonal cut lines, on one of the cut-off lines and on a through-hole electrode other than the ground through-hole electrode;
The cutting depth for dicing along the other cut line is half dicing for cutting only the sealing resin,
4. The infrared remote control receiver according to claim 3, wherein a cutting depth of dicing along a cut line on the ground through-hole electrode reaches the sealing resin and further into the through-hole electrode of the substrate. Unit manufacturing method. 6. The half dicing step, wherein a cutting depth for dicing on the one of the through-hole electrodes in an orthogonal cut line includes a dicing of only the sealing resin and a full cutting of the sealing resin. 4. The method of manufacturing an infrared remote control light receiving unit according to claim 3, wherein dicing reaching the through-hole electrode of the substrate is alternately performed.