JPH11154764A - Manufacture of infrared data communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to radiate heat from a light emitting element and take measures against outer noises effectively. SOLUTION: In a module body, electronic parts like a LED element and a photo-diode are mounted on the surface of a circuit board 2. An upper face of the LED element and the photo-diode is covered by heme-spherical lens parts 7a and 7b. The upper surface of the module body is sealed with a sealing resin (epoxy resin). An Ni plating layer is formed on all faces of the sealing resin 7 except for the semi-spherical lens parts 7a and 7b. In the grounding of the Ni plating layer 21, part of the NI plating layer 21 is soldered by solder 10 with a GND electrode 9 on the mounting board side. After resist film is formed on the hemi-spherical lens parts 7a and 7b, a dicing tape is stuck on the rear face of the board, and in this assembled state, dicing, Ni plating, resist film flaking steps are carried out. In this way, a shielding case is not necessary, and the cost of the product in assembling steps is reduced, and effective shielding measures by the Ni plating layer are realized. At the same time, good reliability by using effective heat radiation, and small thin body are realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an infrared data communication module used in consumer equipment such as a personal computer, a printer, a PDA, a facsimile, a pager, and a mobile phone.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for miniaturization of infrared data communication modules in portable devices such as notebook computers, PDAs, and mobile phones equipped with an optical communication function. L
An infrared light emitting element composed of an ED, a light receiving element composed of a photodiode, an amplifier, a drive circuit and the like are incorporated.
An infrared data communication module has been developed in which a circuit portion made of C is directly die-bonded and wire-bonded to a circuit board, and a transmission unit and a reception unit are integrally packaged with a resin-integrated resin mold made of an epoxy resin containing a visible light cut agent. . The structure of a conventional general infrared data communication module will be outlined with reference to FIG. FIG.
FIG. 2 is a perspective view showing an appearance of the infrared data communication module.

In FIG. 15, reference numeral 1 denotes an infrared data communication module. Reference numeral 2 denotes a circuit board having heat resistance and insulating properties, such as glass epoxy or BT resin, on which an electrode pattern (not shown) is formed.

A not-shown infrared LED element as a light emitting element and a photodiode as a light receiving element are die-bonded and wire-bonded to an electrode pattern formed on the upper surface of the circuit board 2. The infrared LED element and the photodiode are electrically connected on the electrode pattern by a die bond paste such as a silver paste as a conductive adhesive. On the circuit board 2, electronic components such as an integrated circuit (not shown) are mounted in addition to the infrared LED element and the photodiode.

Reference numeral 7 denotes a light-transmitting sealing resin such as an epoxy resin containing a visible light-cutting agent for resin-sealing the infrared LED element and the photodiode. The hemisphere is provided on the upper surface of the infrared LED element and the photodiode. The mold lenses 7a and 7b are formed to provide a function of irradiating and condensing infrared light and at the same time protect both elements.

Reference numeral 8 denotes a substantially box-shaped thin plate, for example, a shield case made of metal such as stainless steel, aluminum, copper, or iron having a thickness of about 0.15 mm. The shield case 8
Transparent windows 8a are provided at positions corresponding to the hemispherical lens portions 7a and 7b formed on the upper surfaces of the infrared LED element and the photodiode, respectively, and cover the module body. Since the shield case 8 surrounds the circuit section, it is possible to take measures against electromagnetic shielding, which is extremely effective in preventing the influence of external noise and the like. Therefore,
The surfaces other than those mounted on the motherboard, such as the hemispherical lens portions 7a and 7b and the printed wiring board, are covered with the shield case 8. 9 is GND of motherboard
Electrodes, and the infrared data communication module 1
It is soldered to the D electrode with solder 10.

An outline of a method for manufacturing the infrared data communication module 1 will be described. 9 to 15 show a method of manufacturing a conventional infrared data communication module. FIG.
Is a through-hole processing step and an electrode pattern forming step in the collective circuit board, FIG. 10 is a die bonding step of an infrared LED element, a photodiode and an integrated circuit, FIG. 11 is a wire bonding step, and FIG. 13, FIG. 13 is a perspective view showing a dicing step, FIG. 14 is a perspective view showing a chip balancing step for making a semi-finished infrared data communication module alone, and FIG.

In FIG. 9, a through-hole processing step includes
A plurality of through-holes 11 for connecting the upper and lower conductive patterns are formed in each row of the collective circuit board 2A made of glass epoxy resin by a processing means such as NC cutting.

Next, in a plating step, after cleaning the entire surface of the collective circuit board 2A including the wall surfaces of the through holes 11, a copper plating layer is formed on the entire surface of the collective circuit board 2A by electroless plating. A nickel plating layer is formed thereon by electrolytic plating, and a gold plating layer is further formed thereon by electrolytic plating.

In the electrode pattern forming step, a plating resist is laminated in an etching step, and a pattern mask is formed by exposure and development, and the electronic component mounting electrode patterns 2a, 2b and 2c are formed on the upper surface of the collective circuit board 2A.
Then, a through-hole electrode 11a connected to the upper and lower conductive patterns is formed.

In FIG. 10, in a die bonding step of mounting an electronic component, a predetermined position on the upper surface side of the collective circuit board 2A, that is, the electronic component mounting electrode patterns 2a, 2b.
And 2c, a conductive adhesive 6 such as a silver paste is applied or printed, and the infrared LED element 3 and the electronic components such as the photodiode 4 and the integrated circuit 5 are pressed while being lightly pressed so as not to be damaged. The electronic component is mounted on the paste, then put into a curing furnace, and held at a predetermined temperature for a predetermined time to cure the silver paste.
It is fixed on and integrated.

In FIG. 11, the wire bonding step
Each electronic component fixed on the collective circuit board 2A is wire-bonded to a pattern on the collective circuit board 2A by a bonding wire 12 made of a gold wire or the like.

In FIG. 12, a resin sealing step is performed so that the upper surfaces of the infrared LED element 3 and the photodiode 4 are covered with hemispherical lens portions 7a and 7b.
A sealing resin 7 made of a translucent epoxy resin on the upper surface side of A
Fill, mold and cure. Thus, the infrared data communication module assembly 1A is formed.

In FIG. 13, in the dicing step, the infrared data communication module assembly 1A is
Cut along a cut line by a dicing or slicing machine or the like to divide it into a single infrared data communication module semi-finished product 1B. Of the cut lines,
An X-direction cut line 13 is a line passing through the center of a plurality of through holes (11) (not shown) formed between the rows, and a Y-direction cut line 14 orthogonal to this line is provided for the electronic component. This is a line including one set. A semicircular through-hole electrode (11a) (not shown) is formed on the row of the cut lines 13 in the X direction.

The chip dispersing step is divided in the dicing step and separated into individual pieces, and as shown in FIG. 14, an infrared data communication module semi-finished product 1B is obtained. As described above, FIG. 15 shows a semi-finished infrared data communication module 1B in a shield case assembling step, in which a substantially box-shaped shield case 8 made of metal such as stainless steel, aluminum, copper, or iron is used. Hemispherical lens portions 7a, 7 formed on the upper surfaces of the infrared LED element 3 and the photodiode 4.
The infrared data communication module 1 is completed by covering the module main body with the light transmitting windows 8a opened at the positions corresponding to b.

[0016]

However, the above-mentioned infrared data communication module and the method of manufacturing the same have the following problems. That is, in the infrared data communication module, since the radiation of heat generated from the infrared LED elements and other electronic components during use and the countermeasures against noise from the outside are performed using the shield case, first, the thin plate made of the metal is used. Requires a shield case (parts cost). In addition, a mold (mold cost) for making the shield case is required. Furthermore, the work (man-hours) of incorporating the product into the shield case and bending the two projecting pieces is required. In addition, a built-in height inspection (man-hour) after the built-in is required. In addition, since there is a gap (air layer) between the built-in product and the shield case (especially in the top direction), heat is trapped in the air layer and heat is not sufficiently released.
Promote life degradation of electronic components. There were fatal problems such as increased reliability and product cost.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to use a conventional metal shield case without using a conventional metal shield case, and instead use N.sub.
With a simple configuration in which an i-plated layer is formed, this Ni-plated layer improves shielding measures and heat radiation efficiency. That is, it is possible to dissipate the heat generated by the light emitting element and to cope with external noise. An object of the present invention is to provide a method of manufacturing an infrared data communication module which is inexpensive, ultra-small, thin and excellent in reliability.

[0018]

In order to achieve the above object, a method of manufacturing an infrared data communication module according to the present invention comprises a method of manufacturing an infrared data communication module, comprising: A through-hole processing step of drilling a plurality of through-holes for pattern connection, and forming a plating layer on the entire surface of the collective circuit board including the inner surface of the through-hole by plating at a predetermined position between each row of the through-holes. A plating step, laminating a plating resist, forming a pattern mask after exposure and development, performing pattern etching, an electrode pattern for mounting electronic components on the upper surface of the collective circuit board, and an electrode pattern for forming a through-hole electrode in the through hole. Forming process, and conducting electronic parts such as light emitting element, light receiving element and IC chip on the upper surface of the collective circuit board. A mounting step of fixing with an adhesive and electrically connecting; a resin sealing step of sealing the upper surface of the light emitting element and the light receiving element with a translucent epoxy resin so as to be covered with a hemispherical lens portion; A masking step of masking with a mask member such as a mask that exposes only the hemispherical lens portion on the upper surface of the sealing resin, and applying or spraying and curing a resist liquid on the hemispherical lens portion exposed on the upper surface of the sealing resin. According to, a resist coating step of forming a resist film on the hemispherical lens portion, and after removing a mask member such as a mask type covering the upper surface of the sealing resin, a dicing tape is attached to the back surface of the collective circuit board, A dicing step of completely cutting the collective circuit board along an orthogonal cut line and cutting to the surface of the dicing tape; and Ni plating in a state of being adhered on a dicing tape, a Ni plating step of forming a Ni plating layer on the surface of a sealing resin made of an epoxy resin, a step of removing the resist film, and peeling off from the dicing tape, And a balancing step of separating the single infrared data communication module into a completed product.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing an infrared data communication module according to the present invention will be described below with reference to the drawings. 1 to 7 are perspective views illustrating a method for manufacturing an infrared data communication module according to an embodiment of the present invention. FIG. 8 is a perspective view of a completed infrared data communication module. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 8, reference numeral 20 denotes an infrared data communication module according to the manufacturing method of the present invention. Reference numeral 2 denotes a circuit board made of glass epoxy resin having a substantially rectangular flat surface as in the related art, and an electrode pattern and a through-hole electrode (not shown) are formed on the surface thereof. Electronic components such as an infrared LED element, a photodiode, and an integrated circuit are die-bonded to an electrode pattern formed on the surface side of the circuit board 2 with a conductive adhesive such as a silver paste, and wire-bonded with a bonding wire such as a gold wire. Have been.

In the same manner as in the prior art, the upper surfaces of the infrared LED element and the photodiode are covered with a translucent sealing resin 7 such as epoxy resin, and the upper surface of the infrared LED element and the photodiode are hemispherical lens portions. 7a and 7b are formed to have a function of irradiating and condensing infrared light and at the same time protect both elements.

Reference numeral 21 denotes a Ni plating layer formed on the surface of the sealing resin 7 except for the hemispherical lens portions 7a and 7b. The Ni plating layer 21 has the function of a conventional shield case, can take measures against electromagnetic shielding, and is extremely effective in preventing the influence of external noise and the like. Further, unlike the conventional shield case, the resin sealing portion including the circuit board 2 and the hemispherical lens portion is exposed to dissipate heat generated from the infrared LED element and other electronic components. The heat radiation efficiency is extremely good without any intervening layers. Reference numeral 9 denotes a GND electrode of the motherboard, and the infrared data communication module 20 is soldered to this GND electrode with solder 10.

A method of manufacturing the infrared data communication module 20 will be described. 1 to 7 show a method of manufacturing an infrared data communication module according to the present invention. 1 is a resin sealing step, FIG. 2 is a masking step, FIG. 3 is a resist coating step, FIG. 4 is a dicing step, FIG. 5 is a plating step, FIG. 6 is a resist peeling step, and FIG. It is a perspective view which shows the balancing process which isolate | separates into a single infrared data communication module finished product.

In the method of manufacturing an infrared data communication module according to the embodiment of the present invention, a plurality of through holes for connecting upper and lower conductive patterns are provided for each row of a collective circuit board made of glass epoxy resin. And a plating step of forming a plating layer on the entire surface of the integrated circuit board including the inner surface of the through hole by plating at a predetermined position between each row of the through holes, and laminating a plating resist. After exposure and development, form a pattern mask, perform pattern etching,
An electrode pattern for mounting electronic components on the upper surface of the collective circuit board,
An electrode pattern forming step of forming a through-hole electrode in the through-hole, and a mounting step of fixing electronic components such as a light-emitting element, a light-receiving element, and an IC chip on the upper surface of the integrated circuit board with a conductive adhesive, and performing wire-bond mounting. Is the same as the above-described prior art, and the description thereof is omitted.

In FIG. 1, in the resin sealing step, the through holes 11 are masked with a masking tape 22 such as a dry film in order to prevent resin from flowing into the through hole electrodes 11a formed on the collective circuit board 2A. Keep it. A sealing resin 7 made of a translucent epoxy resin is filled and cured so that the upper surfaces of the light emitting element and the light receiving element are covered with hemispherical lens portions 7a and 7b.

In FIG. 2, the masking step is performed by using the surface of the sealing resin 7 as a mask member so as to expose the hemispherical lens portions 7a and 7b formed by the sealing resin 7, for example,
Mask with a mask mold 23 or the like. As will be described later, since the Ni plating is performed after the full dicing, the Ni plating is applied to the inside of the through-hole electrode 11a. Therefore, it is not necessary to mask the through-hole electrode 11a on the back surface of the substrate with a masking tape or the like.

In FIG. 3, in the resist coating step, the masked infrared data communication module assembly 2 is used.
By coating or spraying a resist solution on 0A and curing, a resist film 24 is formed on the surfaces of the hemispherical lens portions 7a and 7b.

Referring to FIG. 4, the dicing step is such that, after removing the mask mold 23, a dicing tape 25 having a strong adhesive force is attached to the back surface of the collective circuit board 2A, and two orthogonal cut lines, that is, in the X direction. Cut line 1
3. Along the cut line 14 in the Y direction, the assembled circuit board 2A is completely cut, and further, full dicing is performed by a dicing or slicing machine or the like to cut a part of the surface of the dicing tape 25. The cut line 13 in the X direction is a line passing through the center of the plurality of through holes 11 formed between the rows, and a not-shown through hole electrode is formed in a semicircular shape.

In FIG. 5, in the Ni plating step, Ni plating is performed in a state where the products made into a single product by the full dicing are adhered by the dancing tape 25. N
The i-plated layer 21 is formed on the entire surface of the sealing resin 7 except for the hemispherical lens portions 7a and 7b masked by the resist film 24. Regarding the thickness of the Ni plating layer 21, since the purpose is a shield, if it is thin, the effect of the shield is not exhibited, and it is necessary to secure a thickness of, for example, 0.1 mm or more at least. Therefore, the Ni plating layer 21 for shielding becomes thick plating. In the case of the Ni plating,
Although the plating solution is also immersed in the surface of the circuit board 2, the material of the board is an epoxy resin containing glass.
No plating. However, the through-hole electrode 11
Ni plating on gold plating of a, solder wetting property,
Although it is somewhat disadvantageous in strength, there is no problem as a product. In the steps of Ni plating and resist removal, there is an extremely large merit that a single product can be processed in an assembled state without being separated from the dicing tape 25 and falling off.

In FIG. 6, in the resist peeling step, the resist film 24 on the hemispherical lens portions 7a and 7b is peeled off while being attached to the dicing tape 25 as described above.

In FIG. 7, in the balancing step, a single product is separated from the dicing tape 25 and separated into a single infrared data communication module completed product 20.

In the completed infrared data communication module 20 after completing all the steps, the Ni plating layer 21 formed on the surface of the sealing resin 7 is formed, so that it is possible to take measures against electromagnetic shielding and to be affected by external noise and the like. It is extremely effective in preventing Furthermore, the sealing resin 7 is used to radiate heat generated from the infrared LED element 3 and other electronic components.
Since heat can be radiated directly from the surface to the Ni plating layer 21 and directly from the circuit board 2, the heat radiation efficiency is extremely good.

[0033]

As described above, according to the method for manufacturing an infrared data communication module of the present invention, the Ni plating layer is formed on the surface of the sealing resin except for the hemispherical lens portion. It has the function of a conventional shield case, can take measures against electromagnetic shielding, and is extremely effective in preventing the effects of external noise and the like. Furthermore, an air layer was conventionally interposed between the substrate and the shield case to radiate heat generated from the infrared LED element and other electronic components. And radiate heat directly from the circuit board,
The heat radiation effect can be improved.

Further, the shield case conventionally used becomes unnecessary. This eliminates the need for a mold for forming the shield case, and eliminates the need to incorporate the product into the shield case and then bend the two projecting pieces for preventing the product from falling. Further, inspection after assembling becomes unnecessary.

As described above, cost reduction in material costs, product cost reduction in assembling man-hours, inspection man-hours, etc., productivity improvement by multi-cavity production, improvement of reliability by increasing heat radiation effect, Since there is no shield case, it is possible to provide a method of manufacturing an infrared data communication module that exhibits various practical effects such as reduction in size and thickness.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a resin sealing step in a method for manufacturing an infrared data communication module according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a masking step of attaching a mask mold to FIG.

FIG. 3 is a perspective view showing a resist liquid applying step of forming a resist film on the hemispherical lens portion of FIG. 2;

FIG. 4 is a perspective view showing a dicing step of removing the mask mold of FIG. 3, attaching a dicing tape to the back surface of the substrate, and performing full dicing.

FIG. 5 is a perspective view showing a Ni plating step of forming a Ni plating layer on the surface of the sealing resin except for the hemispherical lens part of FIG.

FIG. 6 is a perspective view showing a step of removing the resist film of FIG. 5;

FIG. 7 is a perspective view showing a balancing step of separating the single infrared data communication module into a completed product in FIG. 6;

8 is a perspective view showing a state where the infrared data communication module of FIG. 7 is soldered to a GND electrode of a motherboard.

FIG. 9 is a perspective view showing a through-hole processing and an electrode pattern forming process for a collective circuit board common to the conventional and the present invention.

FIG. 10 is a perspective view showing a die bonding step of fixing an electronic component to the electrode pattern of FIG. 9 with a conductive adhesive.

FIG. 11 is a perspective view showing a wire bonding step of connecting the electronic components of FIG. 10 with bonding wires.

FIG. 12 is a perspective view illustrating a resin sealing step of sealing the electronic component of FIG. 11;

FIG. 13 is a perspective view showing a conventional dicing process.

FIG. 14 is a perspective view showing a semi-finished product of the infrared data communication module divided in FIG. 13;

15 is a perspective view showing an appearance of the infrared data communication module in a state where the semi-finished product of FIG. 14 is incorporated in a shield case.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 2 Circuit board 2A Collective circuit board 2a, 2b, 2c Electrode pattern for mounting electronic components 3 Infrared LED element 4 Photodiode 5 Integrated circuit 6 Silver paste 7 Sealing resin 7a, 7b Hemispherical lens section 8 Shield case 9 Motherboard GND Electrode 10 Solder 11 Through hole 11a Through hole electrode 12 Bonding wire 13 X direction cut line 14 Y direction cut line 20 Infrared data communication module 20A Infrared data communication module assembly 21 Ni plating layer 22 Masking tape 23 Mask type 24 Resist film 25 Dicing tape

Claims (1)

[Claims] 1. A through-hole processing step of forming a plurality of through-holes for connecting upper and lower conductive patterns for each row of a plurality of collective circuit boards made of glass epoxy resin. A plating step of forming a plating layer on the entire surface of the collective circuit board including the inner surface of the through hole by plating at predetermined positions between rows, laminating a plating resist, forming a pattern mask after exposure and development, performing pattern etching, An electrode pattern for mounting electronic components on an upper surface of the integrated circuit board, an electrode pattern forming step of forming a through-hole electrode in the through hole, and an electronic component such as a light emitting element, a light receiving element, and an IC chip on the upper surface of the integrated circuit board. A mounting step of fixing with a conductive adhesive and electrically connecting the light emitting element and the light receiving element with a hemispherical lens unit. A resin sealing step of sealing with a translucent epoxy resin so as to cover; a masking step of masking with a mask member such as a mask type that exposes only a hemispherical lens portion on the upper surface of the sealing resin; A resist liquid is applied or sprayed onto the hemispherical lens portion exposed on the upper surface of the resin, and cured to form a resist film on the hemispherical lens portion, and a mask type or the like covering the upper surface of the sealing resin. After removing the mask member, a dicing tape is attached to the back surface of the collective circuit board, and the dicing step of completely cutting the collective circuit board along an orthogonal cut line and cutting to the surface of the dicing tape; and Ni plating is applied while the individual circuit boards are adhered to the dicing tape, and Ni plating is applied to the surface of the sealing resin made of epoxy resin. To form a N
A method for manufacturing an infrared data communication module, comprising: an i-plating step; a step of removing the resist film; and a balancing step of peeling off from the dicing tape and separating it into a single completed infrared data communication module.