JP2003037276A - Remote control sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of the circuit part in a sealed resin being oppressed due to clipping with a hook or the sealing resin deteriorates under high temperature when soldering, related to a surface-mounting type package of a remote control sensor for detecting the infrared rays from a remote controller, where the side surface of sealing resin of the circuit part is clipped by the hook part of a shielding case and further it is fixed by soldering. SOLUTION: An arm part 3d is provided on both sides of a shield case 3, and the profile of a circuit board 1 is provided with a recessed part 1a. The circuit board filled with a sealing resin 2 is capped by a shield case, and the tip of the arm part is bent toward the inside of the recessed part. The sealing resin covers the recessed part as a ceiling, and since the tip of arm part engages with the lower surface of the sealing resin, the shield case is held at the upper part so as not to come off. The engagement in terms of figure will not oppress the sealing resin under elastic force, and soldering is not required, so the number of processes is decreased, and neither will it be subjected to high temperatures. A solder-free effect on the environment is provided as well.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a remote control sensor for detecting infrared rays emitted by a remote control device (hereinafter abbreviated as a remote control) for remotely controlling a television or other electric appliances.

[0002]

2. Description of the Related Art As a remote control sensor, there is a remote control sensor in which circuit components such as a photoelectric element such as a photodiode are mounted on a circuit board and packaged. FIG. 5 shows an example of such a remote control sensor of the surface mount type, which is used for a still camera, a video camera, etc., (A) is a plan view, (B) is a right side view, and (C) is (A). ) Is a C-C sectional view, and (D) is a front view. In this remote control sensor, a circuit component is mounted on a circuit board 1, a sealing resin 2 is filled on the circuit component to encapsulate the circuit component into a circuit block, and a metal shield case 3 is placed on and fixed to the circuit block. . The circuit board 1 has a shape in which four corners are dented in an arc shape, and the side surfaces of the dents are coated with a conductive material. It is connected to a terminal electrode (not shown).

Circuit parts mounted on the circuit board 1 are drawn by broken lines in FIG. 5 (A). Reference numeral 4 indicates an integrated circuit (I
C) 5 is a resistor and 6 is a capacitor. The photodiode of the photoelectric element is embedded in the region of the window 3a provided on the upper surface of the shield case 3. The structure for attaching the shield case 3 to the circuit block is shown in FIG.
As shown in (D), the hooks 3b pulled out toward the inside are provided at four convex edges on both side surfaces of the shield case 3,
The side surface of the sealing resin 2 is bitten and sandwiched, and the hanging portion 3c at another location of the shield case 3 is soldered and fixed to the metal pattern on the upper surface of the substrate 1 with solder 7.

[0004]

The above remote control sensor has the following problems. 1) Since the sealing resin on the circuit board is sandwiched by the hooks of the shield case, the circuit components in the resin are pressed to generate stress, which causes a problem. 2) The fixing force is not sufficient just by sandwiching the sealing resin between the hooks of the shield case, and the hanging part of the shield case is soldered to the circuit board. However, the heat during soldering may deteriorate the sealing resin. In addition, dehumidification work and inspection are required to ensure soldering, which increases cost. The present invention solves these problems and realizes a highly reliable and inexpensive remote control sensor.

[0005]

In the remote control sensor of the present invention, as a structure for fixing a metal shield case to a circuit block, arm portions are provided on two parallel side surfaces of the shield case, and at positions facing the arm portions. Providing a recess in the contour of the circuit board. Then, after covering the circuit block with the shield case, the tip of the arm portion is bent inward to be inserted into the concave portion of the circuit board. On the other hand, since the contour of the sealing resin is straight without any recess like the circuit board, the tip of the bent arm of the shield case engages with the lower surface of the sealing resin, and the shield case is removed from the circuit block. It is held so that it does not fall out.

[0006]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings. 1A and 1B show an embodiment of a remote control sensor of the present invention. FIG. 1A is a plan view, FIG. 1B is a right side view, and FIG. 1C is a front view.
(D) is a bottom view. As in the conventional case, the circuit board 1 on which the circuit components are mounted is filled with the sealing resin 2 to form a circuit block, and the metal shield case 3 is placed on the circuit block.
The shield case 3 has a window 3a, and a photodiode is mounted on the circuit board 1 corresponding to the window position. As shown in FIGS. (B), (C), (D), etc., an arm portion 3d is provided on the side surface of the shield case 3, while the arm portion 3d is provided.
A semicircular recess 1a is provided in the contour of the circuit board 1 facing d, and the tip of the arm 3d is bent toward the recess 1a. The hanging portion 3c will be described later.

Next, the component parts of the above embodiment will be shown and described. Figure 2 shows the shield case 3 before installation,
As described above, the window 3a is provided on the upper surface, and the arms 3d are provided on both side surfaces.
Is provided. The arm 3d has a substantially short L-shape. Separately, a hanging portion 3c is provided. FIG. 3 shows a circuit block in which the sealing resin 2 is laminated on the circuit board 1. Although not shown, the sealing resin 2 encloses circuit components such as ICs and photodiodes. The contour of the circuit board 1 is provided with recesses 1a on two parallel sides. The contour of the sealing resin 2 is linear without such a recess, and as shown in FIG.
From the lower surface, the lower surface of the sealing resin 2 can be seen in the recess 1 a of the circuit board 1.

As shown by the arrow in FIG. 4A, the shield case 3 is attached to the circuit block in which the circuit board 1 is filled with the sealing resin 2.
When it is covered with, it becomes the same figure (B). The same figure (C) is (B)
In the bottom view of FIG. 1, the arm portion 3d of the shield case 3 is pushed as indicated by the small arrow in the figure, and the tip of the arm portion 3d is pushed into the recess 1 of the side of the circuit board 1.
Bend toward the inside of a. Then, as shown in the bottom view (D) of FIG. 1, the tip of the arm portion 3d engages with the bottom surface of the sealing resin 2 that covers the recess 1a like a ceiling, so that the shield case 3 is connected to the circuit. Will not fall out of the block.

A circuit block as shown in FIG.
It can be manufactured using a collective substrate in which a large number of regions to be arranged are arranged in a matrix. After mounting a photoelectric element or a circuit component on each remote control area and filling the entire surface of the collective substrate with the sealing resin 2, dicing is performed vertically and horizontally with a cutter along the boundary line between the areas. Then, each of the divided pieces becomes a circuit block, and several hundred parts can be obtained at one time, which is extremely efficient.

In this case, the concave portion 1a of the contour of the circuit board 1 is a through hole of a full circle in the collective substrate, and the cutter passes through the center of this hole during dicing, so that the concave portion 1a of a semicircle is formed in each circuit board 1. Become. Therefore, when filling the encapsulation resin 2 into the collective substrate on which the circuit components are mounted, it is necessary to prevent the resin from entering the holes. Therefore, in the collective substrate, this hole is closed by using a patch material called an adhesive tape or a hot film.

In the above-described embodiment, as shown in FIG. 2, the shield case 3 has a flat arm portion 3d before being attached to the circuit block, as shown in FIG. 4C. Although it is bent after being covered with the circuit block, it is also possible to bend the arms 3d at the stage of parts and spread them between the arms 3d when they are attached to the circuit block by elastic material. Further, since the above-described embodiment is very small, the arm portion 3d on the side surface of the shield case 3 is 1
One side is enough, but in the case of a large device, the number of arms 3d may be increased if necessary.

The concave portion 1a of the contour of the circuit board 1 is for inserting the tip of the arm portion 3d of the shield case 3. However, if the side surface of the concave portion 1a is also covered with a conductive material, the concave portion 1a of the circuit board 1 will be covered. It can be used for connecting electrodes provided on the upper surface and the lower surface.

When the completed remote controller as shown in FIG. 1 is mounted on the circuit board of the electronic device, the hanging portion 3c of the shield case 3 is soldered to the ground wire of the circuit board of the assembly destination device. As a result, the shield case 3 is grounded. Figure 5
In the conventional remote controller, the hanging part 3c of the shield case 3 is
Was grounded to the circuit board 1 of the remote controller. As a result, the shield case 3 is grounded,
The main purpose of soldering was to secure the shield case 3 with the hooks 3b because it is a weak force.

In the present invention, the shield case 3 is geometrically coupled to the arm portion 3d and the concave portion 1a of the circuit board 1. Therefore, it is not necessary to strengthen the fixing of the shield case 3 by soldering. As described above, when the remote controller is mounted on a device, the shield case 3 is soldered and grounded, so soldering is not completely abolished. However, when mounting a circuit component including the remote controller on the device originally. Since soldering is indispensable, there is no particular problem in including soldering for grounding in the soldering process at the time of mounting, and eliminating the need for soldering during remote control manufacturing is lead-free for the environment. It can be said that it will make a certain contribution.

[0015]

As described above, in the remote control sensor using the present invention, the arm portion of the shield case is engaged with the ceiling portion of the concave portion of the circuit board contour and does not come off, so that the shield case is securely fixed. Is. Further, since the shield case does not elastically sandwich the sealing resin, the circuit component in the sealing resin is not pressed to cause a trouble. Also,
Since the shield case is not soldered to the circuit board, the manufacturing process is simplified, and the sealing resin does not deteriorate at the high temperature during soldering. Since it does not use solder, it also has the effect of making lead free of the environment. This provides a remote control sensor with good performance and high reliability at a low price.

[Brief description of drawings]

FIG. 1 is an embodiment of a remote controller of the present invention, (A) is a plan view, (B) is a right side view, (C) is a front view, and (D) is a bottom view.

FIG. 2 is a shield case of the present invention, (A) is a front view,
(B) is a bottom view and (C) is a right side view.

FIG. 3 is a circuit block in which a circuit board is filled with a sealing resin according to the present invention, (A) is a front view, and (B) is a bottom view.

FIG. 4 is a side view of the circuit block and the shield case in a circuit block and a shield case in which a circuit board according to the present invention is filled with sealing resin, and FIG. 4B is a side view of the circuit block and the shield case. A side view and (C) are bottom views of (B).

FIG. 5 is a conventional remote controller, (A) is a plan view, (B) is a right side view, (C) is a sectional view taken along line CC of (A), and (D) is a front view.

[Explanation of symbols]

1 circuit board 1a recess 2 Sealing resin 3 shield case 3a window 3b hook 3c hanging part 3d arm 7 Solder

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5C056 AA05 BA01 CA06 DA06 DA13                       EA12                 5E321 AA01 AA02 CC06 CC12 GG05                 5F088 AA01 BB10 JA06 JA20                 5K048 AA11 BA02 DB02 DB04 HA07                       HA11

Claims (2)

[Claims] 1. A remote control sensor in which a circuit component including a photoelectric element is mounted on a circuit board, resin-sealed, and a shield case is attached to at least one of the two parallel side surfaces of the shield case.
The individual arm portions are provided, and a concave portion is provided in the contour of the circuit board at a position facing the arm portion, and the distal end of the arm portion is bent toward the inner side of the concave portion so that the distal end of the arm portion covers the concave portion. A remote control sensor, which is engaged with a lower surface of a sealing resin and is held without coming out upward. 2. The remote control sensor according to claim 1, wherein a side surface of the recess of the contour of the circuit board is coated with a conductive material and is used for connecting electrodes on the upper surface and the lower surface of the board.