JPH11100274A5 - - Google Patents

Info

Publication number
JPH11100274A5
JPH11100274A5 JP1997261561A JP26156197A JPH11100274A5 JP H11100274 A5 JPH11100274 A5 JP H11100274A5 JP 1997261561 A JP1997261561 A JP 1997261561A JP 26156197 A JP26156197 A JP 26156197A JP H11100274 A5 JPH11100274 A5 JP H11100274A5
Authority
JP
Japan
Prior art keywords
valves
reliability
heat dissipation
silicon nitride
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997261561A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11100274A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9261561A priority Critical patent/JPH11100274A/ja
Priority claimed from JP9261561A external-priority patent/JPH11100274A/ja
Publication of JPH11100274A publication Critical patent/JPH11100274A/ja
Publication of JPH11100274A5 publication Critical patent/JPH11100274A5/ja
Pending legal-status Critical Current

Links

JP9261561A 1997-09-26 1997-09-26 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板 Pending JPH11100274A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9261561A JPH11100274A (ja) 1997-09-26 1997-09-26 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9261561A JPH11100274A (ja) 1997-09-26 1997-09-26 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板

Publications (2)

Publication Number Publication Date
JPH11100274A JPH11100274A (ja) 1999-04-13
JPH11100274A5 true JPH11100274A5 (enExample) 2004-11-11

Family

ID=17363620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9261561A Pending JPH11100274A (ja) 1997-09-26 1997-09-26 窒化珪素質焼結体、その製造方法及びそれを用いた回路基板

Country Status (1)

Country Link
JP (1) JPH11100274A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4571728B2 (ja) * 1999-06-23 2010-10-27 日本碍子株式会社 窒化珪素焼結体及びその製造方法
JP2002029851A (ja) * 2000-07-17 2002-01-29 Denki Kagaku Kogyo Kk 窒化珪素質組成物、それを用いた窒化珪素質焼結体の製造方法と窒化珪素質焼結体
JP5094259B2 (ja) * 2007-07-27 2012-12-12 京セラ株式会社 回路基板
JP6245602B2 (ja) * 2013-10-21 2017-12-13 国立研究開発法人産業技術総合研究所 窒化ケイ素フィラー、樹脂複合物、絶縁基板、半導体封止材、窒化ケイ素フィラーの製造方法
CN113614910A (zh) * 2019-03-29 2021-11-05 电化株式会社 氮化硅烧结体及其制造方法、以及层叠体及电力模组
JP7313105B2 (ja) 2019-09-17 2023-07-24 株式会社東芝 構造体及び接合体
JP2021147272A (ja) 2020-03-19 2021-09-27 株式会社東芝 構造体及び接合体
WO2025127130A1 (ja) * 2023-12-14 2025-06-19 株式会社 東芝 窒化珪素焼結体及び窒化珪素回路基板

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