WO2002054492A3 - Schaltungsanordnung - Google Patents

Schaltungsanordnung Download PDF

Info

Publication number
WO2002054492A3
WO2002054492A3 PCT/DE2001/004589 DE0104589W WO02054492A3 WO 2002054492 A3 WO2002054492 A3 WO 2002054492A3 DE 0104589 W DE0104589 W DE 0104589W WO 02054492 A3 WO02054492 A3 WO 02054492A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
circuit
divided
sensor
faces
Prior art date
Application number
PCT/DE2001/004589
Other languages
English (en)
French (fr)
Other versions
WO2002054492A2 (de
Inventor
Andreas Kux
Original Assignee
Infineon Technologies Ag
Andreas Kux
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Andreas Kux filed Critical Infineon Technologies Ag
Priority to EP01995582A priority Critical patent/EP1346413A2/de
Publication of WO2002054492A2 publication Critical patent/WO2002054492A2/de
Publication of WO2002054492A3 publication Critical patent/WO2002054492A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Pressure Sensors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Schaltungsanordnung mit einem ersten Substrat (1), dass in einer ersten Oberfläche (3) eine integrierte Schaltung (4) und gegenüberliegend eine zweite Oberfläche (2) aufweist und mt einem zweiten Substrat (9), dass an einer Oberfläche einen Sensor (7) aufweist, wobei das zweite Substrat (9) mit dem ersten Substrat (1) derart haftend verbunden ist, dass die Oberfläche des zweiten Substrats (9), das den Sensor (7) aufweist, einer der beiden Oberflächen (2, 3) des ersten Substrats (1) zugewandt ist. Damit wird feststellbar, ob die Anordnung aus ersten und zweiten Substrat aufgetrennt ist oder wurde.
PCT/DE2001/004589 2000-12-29 2001-12-06 Schaltungsanordnung WO2002054492A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01995582A EP1346413A2 (de) 2000-12-29 2001-12-06 Schaltungsanordnung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000165747 DE10065747A1 (de) 2000-12-29 2000-12-29 Schaltungsanordnung
DE10065747.8 2000-12-29

Publications (2)

Publication Number Publication Date
WO2002054492A2 WO2002054492A2 (de) 2002-07-11
WO2002054492A3 true WO2002054492A3 (de) 2003-02-13

Family

ID=7669438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004589 WO2002054492A2 (de) 2000-12-29 2001-12-06 Schaltungsanordnung

Country Status (4)

Country Link
EP (1) EP1346413A2 (de)
DE (1) DE10065747A1 (de)
TW (1) TW544897B (de)
WO (1) WO2002054492A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10238835A1 (de) * 2002-08-23 2004-03-11 Infineon Technologies Ag Halbleiterchip, Chipanordnung mit zumindest zwei Halbleiterchips und Verfahren zur Überprüfung der Ausrichtung zumindest zweier übereinander liegender Halbleiterchips in einer Chipanordnung
DE10309614A1 (de) * 2003-03-05 2004-09-23 Infineon Technologies Ag Halbleiterstruktur und Verfahren zur Herstellung derselben
US7758911B2 (en) 2003-05-08 2010-07-20 Honeywell International Inc. Microelectronic security coatings
US7429915B2 (en) 2005-04-20 2008-09-30 Honeywell International Inc. System and method for detecting unauthorized access to electronic equipment or components
US7719419B2 (en) 2005-11-02 2010-05-18 Honeywell International Inc. Intrusion detection using pseudo-random binary sequences
US7388486B2 (en) 2006-01-05 2008-06-17 Honeywell International Inc. Method and system to detect tampering using light detector
US7436316B2 (en) 2006-01-05 2008-10-14 Honeywell International Inc. Method and system to detect tampering using light detector
US7495554B2 (en) 2006-01-11 2009-02-24 Honeywell International Inc. Clamshell protective encasement
US7671324B2 (en) 2006-09-27 2010-03-02 Honeywell International Inc. Anti-tamper enclosure system comprising a photosensitive sensor and optical medium
US8279075B2 (en) 2006-11-30 2012-10-02 Honeywell International Inc. Card slot anti-tamper protection system
US7796036B2 (en) 2006-11-30 2010-09-14 Honeywell International Inc. Secure connector with integrated tamper sensors
US8284387B2 (en) 2007-02-08 2012-10-09 Honeywell International Inc. Methods and systems for recognizing tamper events
EP3156947B1 (de) 2015-10-12 2020-01-01 Nxp B.V. Elektronische vorrichtung
EP3193281B1 (de) 2016-01-15 2019-11-13 Nxp B.V. Elektronische vorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2727226A1 (fr) * 1994-11-17 1996-05-24 Schlumberger Ind Sa Dispositif de securite actif a memoire electronique
WO1999008192A1 (en) * 1997-08-07 1999-02-18 Hitachi, Ltd. Semiconductor device
US5881155A (en) * 1996-04-01 1999-03-09 Schlumberger Industries Security device for a semiconductor chip
US6072393A (en) * 1997-12-19 2000-06-06 Micro Snitch Corporation Anti-theft alarm for portable electrically operated devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2727226A1 (fr) * 1994-11-17 1996-05-24 Schlumberger Ind Sa Dispositif de securite actif a memoire electronique
US5881155A (en) * 1996-04-01 1999-03-09 Schlumberger Industries Security device for a semiconductor chip
WO1999008192A1 (en) * 1997-08-07 1999-02-18 Hitachi, Ltd. Semiconductor device
US6072393A (en) * 1997-12-19 2000-06-06 Micro Snitch Corporation Anti-theft alarm for portable electrically operated devices

Also Published As

Publication number Publication date
TW544897B (en) 2003-08-01
EP1346413A2 (de) 2003-09-24
WO2002054492A2 (de) 2002-07-11
DE10065747A1 (de) 2002-07-11

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