JP2002088226A5 - - Google Patents

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Publication number
JP2002088226A5
JP2002088226A5 JP2001204673A JP2001204673A JP2002088226A5 JP 2002088226 A5 JP2002088226 A5 JP 2002088226A5 JP 2001204673 A JP2001204673 A JP 2001204673A JP 2001204673 A JP2001204673 A JP 2001204673A JP 2002088226 A5 JP2002088226 A5 JP 2002088226A5
Authority
JP
Japan
Prior art keywords
encapsulant
potting composition
wollastonite
filler
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001204673A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002088226A (ja
Filing date
Publication date
Priority claimed from US09/620,170 external-priority patent/US6462108B1/en
Application filed filed Critical
Publication of JP2002088226A publication Critical patent/JP2002088226A/ja
Publication of JP2002088226A5 publication Critical patent/JP2002088226A5/ja
Pending legal-status Critical Current

Links

JP2001204673A 2000-07-20 2001-07-05 高ガラス転移温度の注封コンパウンド Pending JP2002088226A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/620170 2000-07-20
US09/620,170 US6462108B1 (en) 2000-07-20 2000-07-20 High Tg potting compound

Publications (2)

Publication Number Publication Date
JP2002088226A JP2002088226A (ja) 2002-03-27
JP2002088226A5 true JP2002088226A5 (enExample) 2008-08-21

Family

ID=24484872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001204673A Pending JP2002088226A (ja) 2000-07-20 2001-07-05 高ガラス転移温度の注封コンパウンド

Country Status (7)

Country Link
US (1) US6462108B1 (enExample)
EP (1) EP1174456B1 (enExample)
JP (1) JP2002088226A (enExample)
AT (1) ATE340207T1 (enExample)
DE (1) DE60123176T2 (enExample)
ES (1) ES2269256T3 (enExample)
PT (1) PT1174456E (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003002661A1 (fr) * 2001-06-28 2003-01-09 Toray Industries, Inc. Composition de resine epoxyde qui presente une excellente aux intemperies et materiaux composites renforces en fibres
US20050048291A1 (en) * 2003-08-14 2005-03-03 General Electric Company Nano-filled composite materials with exceptionally high glass transition temperature
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
CN100448909C (zh) * 2003-02-28 2009-01-07 长兴化学工业股份有限公司 感光元件封装材料组合物及其使用方法
US20050008865A1 (en) * 2003-07-07 2005-01-13 General Electric Company Curable epoxy compositions and articles made therefrom
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
US7439752B2 (en) * 2006-05-03 2008-10-21 Micron Technology, Inc. Methods of providing semiconductor components within sockets
US8742018B2 (en) * 2008-01-08 2014-06-03 Dow Global Technologies Llc High Tg epoxy systems for composite applications
JPWO2009088087A1 (ja) * 2008-01-10 2011-05-26 日本化薬株式会社 エポキシ化触媒、エポキシ化触媒の製造方法、エポキシ化合物の製造方法、硬化性樹脂組成物及びその硬化物
RU2474599C2 (ru) * 2011-03-09 2013-02-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Компаунд и способ его получения
US8815725B2 (en) 2013-01-18 2014-08-26 International Business Machines Corporation Low alpha particle emission electrically-conductive coating
JP6222428B2 (ja) * 2013-07-05 2017-11-01 ナガセケムテックス株式会社 エポキシ樹脂組成物
JP6747440B2 (ja) * 2015-06-16 2020-08-26 日立化成株式会社 フィルム形成用樹脂組成物及びこれを用いた封止フィルム、支持体付き封止フィルム、半導体装置
RU2628786C1 (ru) * 2016-11-10 2017-08-22 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Многослойный самоклеящийся материал
CN109021503A (zh) * 2018-07-26 2018-12-18 安徽同佳电子科技有限公司 一种绝缘、耐冲击电磁线圈封装材料的制备方法
ES3033654T3 (en) 2020-03-30 2025-08-06 Henkel Ag & Co Kgaa Curable potting composition free of substances of very high concern
TW202511401A (zh) * 2023-09-13 2025-03-16 達興材料股份有限公司 固化組成物、固化物及其應用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657992A (en) * 1986-02-18 1987-04-14 Coors Porcelain Company Paste anhydride curing system for cast epoxy resin bodies and method for making the same
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
US5045609A (en) 1989-07-07 1991-09-03 Hexcel Corporation Toughened, high temperature resin matrix system
US5276073A (en) * 1989-08-26 1994-01-04 Somar Corporation Thermosetting resin composition comprising maleimide, anhydride, epoxy resin and wollastonite
US4999699A (en) 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5155066A (en) 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5195299B1 (en) 1992-02-28 1996-02-13 Johnson Matthey Inc Method of reducing moisture content of hermetic packages containing semiconductor devices
JPH09286840A (ja) * 1996-04-19 1997-11-04 Toshiba Chem Corp エポキシ樹脂組成物
JP2000086869A (ja) * 1998-09-16 2000-03-28 Toshiba Chem Corp エポキシ樹脂組成物およびコイル

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