JPH1084177A - Circuit board and its manufacturing method - Google Patents
Circuit board and its manufacturing methodInfo
- Publication number
- JPH1084177A JPH1084177A JP8237097A JP23709796A JPH1084177A JP H1084177 A JPH1084177 A JP H1084177A JP 8237097 A JP8237097 A JP 8237097A JP 23709796 A JP23709796 A JP 23709796A JP H1084177 A JPH1084177 A JP H1084177A
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- resin
- surface wiring
- semiconductor package
- soluble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子回路装置に備え
られる回路基板に関する。The present invention relates to a circuit board provided in an electronic circuit device.
【０００２】[0002]
【従来の技術】表層配線上への部品の実装は従来ほとん
ど半田が用いられてきた。半田は強固で電気的抵抗の小
さい接続を容易につくることができるため、用途に応じ
て様々な種類の半田が開発され、使用されてきた。2. Description of the Related Art Conventionally, soldering has been used for mounting components on surface wiring. Various types of solders have been developed and used depending on the application because solders can easily make strong and low electrical resistance connections.
【０００３】一方、特定の部品を導電性接着剤を用いて
実装する例が近年多く試みられるようになっている。な
ぜなら、導電性接着剤を用いた接続は半田を用いた接続
よりもフレキシブルであるために、ヒートショックやメ
カニカルショックによる接続部の抵抗の著しい増加を防
ぐことができる。特に、この導電性接着剤を用いた接続
は、部品材料と基板材料の熱膨張係数の差が著しく大き
いときに効果的である。On the other hand, in recent years, many examples of mounting a specific component using a conductive adhesive have been tried. Because the connection using the conductive adhesive is more flexible than the connection using the solder, it is possible to prevent a remarkable increase in the resistance of the connection portion due to heat shock or mechanical shock. In particular, connection using this conductive adhesive is effective when the difference between the thermal expansion coefficients of the component material and the substrate material is extremely large.
【０００４】また、近年、半田に多く使用されている鉛
（Ｐｂ）が地球環境や人の健康に大きな影響を与えるこ
とがわかってきてから、Ｐｂを含有する半田に対する規
制がアメリカなどで始まっており、Ｐｂを含有する半田
の代替材料の１つとしても導電性接着剤が考えられるよ
うになった。In recent years, it has been found that lead (Pb), which is widely used in solder, has a great effect on the global environment and human health, and regulations on solder containing Pb have begun in the United States and other countries. Thus, a conductive adhesive has come to be considered as one of the alternative materials to the solder containing Pb.
【０００５】Ｐｂを含有する半田の代替材料としては、
Ｐｂを含有しない半田も当然考えれれる。しかしなが
ら、Ｐｂを含有しない半田は、半田濡れ性に問題がある
他、対ヒートショック性などの信頼性に不安がある。ま
た、コストが従来のＰｂを含有する半田の数倍すること
も問題である。[0005] As an alternative material to the solder containing Pb,
Pb-free solder is of course also conceivable. However, the solder containing no Pb has a problem in solder wettability and has a problem in reliability such as heat shock resistance. Another problem is that the cost is several times that of the conventional solder containing Pb.
【０００６】一方、導電性接着剤は良好な耐ヒートショ
ック性を持ち、半田濡れ性の問題もない。On the other hand, conductive adhesives have good heat shock resistance and do not have the problem of solder wettability.
【０００７】[0007]
【発明が解決しようとする課題】導電性接着剤は良好な
耐ヒートショック性を持ち半田濡れ性の問題もないけれ
ども、以下に示すような問題がある。Although the conductive adhesive has good heat shock resistance and no problem of solder wettability, it has the following problems.
【０００８】問題の１つは、回路基板に現在使用されて
いる部品や、表層配線の処理方法が半田実装を前提とし
たものであるため、そのままでは接続材料として十分な
性能が引き出せないことである。One of the problems is that the components currently used for the circuit board and the method of treating the surface layer wiring are based on the premise that soldering is performed, so that sufficient performance as a connection material cannot be obtained as it is. is there.
【０００９】例えば、表層配線上には半田濡れ性の向上
と防錆のためにプリフラックス層が形成されている。こ
のプリフラックス層上に部品を導電性接着剤を用いて実
装すると、高温試験や高温高湿試験によって接続部の抵
抗が著しく増加してしまう。しかし、プリフラックス層
を取り除くと、防錆効果もなくなるために配線が銅の場
合は基板の保存が難しくなって製造段階で新たな施設を
つくる必要が生じ、コスト高につながる。For example, a pre-flux layer is formed on the surface wiring to improve solder wettability and prevent rust. When a component is mounted on the pre-flux layer using a conductive adhesive, the resistance of the connection part is significantly increased by a high-temperature test or a high-temperature and high-humidity test. However, if the pre-flux layer is removed, the rust-preventing effect is also lost, so that when the wiring is made of copper, it is difficult to store the substrate, and it is necessary to create a new facility at the manufacturing stage, leading to an increase in cost.
【００１０】また、実装する部品の多くは、半田濡れ性
の促進や、防錆のために配線上に半田メッキを施してい
る。半田メッキを施した配線と表層配線とを導電性接着
剤を用いて接続すると、接続部の抵抗が大きくなり信頼
性も悪い。これは、半田メッキ層の表面に発生する酸化
膜のために導通が妨害されるものと思われる。しかし、
半田メッキを取り除くと、配線が酸化するようなもので
あれば、表層配線と同様に部品の保存が難しくなるほか
実装も難しくなる。特に、半導体パッケージのリード線
の半田メッキを除去すると、半田メッキを除去して接続
動作を行った後、直ちに金などの貴金属でメッキする必
要があり、このこともコストを引き上げる要因となって
いる。Many of the components to be mounted are provided with solder plating on the wiring to promote solder wettability and prevent rust. If the solder-plated wiring and the surface wiring are connected by using a conductive adhesive, the resistance of the connecting portion is increased and the reliability is poor. This is presumably because conduction is hindered by an oxide film generated on the surface of the solder plating layer. But,
If the wiring is oxidized when the solder plating is removed, it becomes difficult to store the components as well as the mounting, as in the case of the surface wiring. In particular, when the solder plating of the lead wire of the semiconductor package is removed, it is necessary to immediately perform plating and remove the solder plating, and then immediately perform plating with a noble metal such as gold, which also raises the cost. .
【００１１】本発明は上記問題を解決するもので、半田
に代えて導電性接着剤を用いながら接続の信頼性が高
く、かつ、低コストである回路基板を提供することを目
的とするものである。An object of the present invention is to solve the above-mentioned problems and to provide a circuit board having high connection reliability and low cost while using a conductive adhesive instead of solder. is there.
【００１２】[0012]
【課題を解決するための手段】上記問題を解決するため
に、本発明の回路基板は、表層配線と、表層配線を含む
基板表面または表層配線上に形成され、水に不溶で溶媒
和パラメータ６．５〜１０．０の有機溶媒に可溶である
樹脂層と、この樹脂層を形成した上記表層配線に形成さ
れた導電性接着剤からなる接合層と、この接合層を形成
した表層配線に接続された部品とを有するものである。In order to solve the above-mentioned problems, a circuit board of the present invention is formed on a surface wiring and a surface of the substrate including the surface wiring or on the surface wiring, is insoluble in water and has a solvation parameter of 6 or less. 0.5 to 10.0, a resin layer soluble in an organic solvent, a bonding layer made of a conductive adhesive formed on the surface wiring having the resin layer formed thereon, and a surface wiring having the bonding layer formed thereon. And connected components.
【００１３】この発明によれば、半田に代えて導電性接
着剤を用いながら接続の信頼性が高く、かつ、低コスト
である回路基板を得ることができる。According to the present invention, it is possible to obtain a circuit board having high connection reliability and low cost while using a conductive adhesive instead of solder.
【００１４】[0014]
【発明の実施の形態】本発明の請求項１に記載の発明
は、表層配線と、表層配線を含む基板表面または表層配
線上に形成され、水に不溶で溶媒和パラメータ６．５〜
１０．０の有機溶媒に可溶である樹脂層と、この樹脂層
を形成した上記表層配線に形成された導電性接着剤から
なる接合層と、この接合層を形成した表層配線に接続さ
れた部品とを有するものであり、この構成により、表層
配線は樹脂層により覆われているので防錆が行われなが
ら、樹脂層を形成した上記表層配線に導電性接着剤から
なる接合層を介して部品を接合させると、導電性接着剤
を塗布した部分のみ被覆した樹脂層が導電性接着剤に含
まれている樹脂や溶媒によって溶解し、導電性接着剤中
の導電物質と表層配線とが直接接触して良好な接続が得
られる。DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a method for forming a surface wiring, a substrate formed on the surface including the surface wiring or on the surface wiring, which is insoluble in water and has a solvation parameter of 6.5 to 6.5.
A resin layer soluble in an organic solvent of 10.0, a bonding layer made of a conductive adhesive formed on the surface wiring having the resin layer formed thereon, and connected to the surface wiring having the bonding layer formed thereon With this configuration, the surface wiring is covered with the resin layer, so that rust prevention is performed, while the surface wiring on which the resin layer is formed is connected to the surface wiring via a bonding layer made of a conductive adhesive. When the components are joined, the resin layer that covers only the part where the conductive adhesive is applied is dissolved by the resin or solvent contained in the conductive adhesive, and the conductive material in the conductive adhesive and the surface wiring are directly Good contact is obtained by contact.
【００１５】本発明の請求項２に記載の発明は、表層配
線と、導電性接着剤からなる接合層と、この接合層を介
して実装された部品とを有し、部品表面の少なくとも一
部が、水に不溶で溶媒和パラメータ６．５〜１０．０の
有機溶媒に可溶である樹脂で被覆されているものであ
り、この構成により、部品は樹脂層により覆われている
ので防錆が行われながら、樹脂層を形成した部品を、導
電性接着剤からなる接合層を介して基板側に接合させる
と、導電性接着剤を塗布した部分のみ被覆した樹脂層が
導電性接着剤に含まれている樹脂や溶媒によって溶解
し、導電性接着剤中の導電物質と部品とが直接接触して
良好な接続が得られる。According to a second aspect of the present invention, at least a part of the surface of a component has a surface wiring, a bonding layer made of a conductive adhesive, and a component mounted via the bonding layer. Is coated with a resin that is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0. With this configuration, the parts are covered with a resin layer, so that rust prevention is achieved. Is performed, when the component on which the resin layer is formed is bonded to the substrate side via a bonding layer made of a conductive adhesive, the resin layer coated only on the portion to which the conductive adhesive is applied becomes the conductive adhesive. It is dissolved by the contained resin and solvent, and the conductive material in the conductive adhesive and the component come into direct contact with each other to obtain a good connection.
【００１６】本発明の請求項３に記載の発明は、樹脂層
の樹脂として、ニトロセルロース、ロジン変性フェノー
ル樹脂、および変性アルキッド樹脂の内、１種類また
は、２種類以上のこれらの混合物、あるいは、これらの
樹脂の共重合体を使用するものであり、これにより、接
合性能および防錆性能に優れた回路基板を得ることがで
きる。According to a third aspect of the present invention, as the resin of the resin layer, one or more of nitrocellulose, rosin-modified phenolic resin and modified alkyd resin, or a mixture thereof, or A copolymer of these resins is used, whereby a circuit board excellent in bonding performance and rust prevention performance can be obtained.
【００１７】本発明の請求項４に記載の発明は、請求項
１または３に記載の発明において、部品表面の少なくと
も一部が、水に不溶で溶媒和パラメータ６．５〜１０．
０の有機溶媒に可溶である樹脂で被覆されているもので
あり、この構成により、表層配線および部品は樹脂層に
より覆われているので防錆が行われながら、樹脂層を形
成した上記表層配線および部品に導電性接着剤からなる
接合層を介して部品を接合させると、導電性接着剤を塗
布した部分のみ被覆した樹脂層が導電性接着剤に含まれ
ている樹脂や溶媒によって溶解し、導電性接着剤中の導
電物質と表層配線および部品とが直接接触して良好な接
続が得られる。According to a fourth aspect of the present invention, in the first or the third aspect, at least a part of the surface of the component is insoluble in water and has a solvation parameter of 6.5 to 10.
In this configuration, the surface layer wiring and the components are covered with the resin layer, so that the resin layer is formed while the rust prevention is being performed. When the components are joined to the wiring and components via the joining layer made of the conductive adhesive, the resin layer that covers only the portion where the conductive adhesive is applied is dissolved by the resin or solvent contained in the conductive adhesive. In addition, the conductive material in the conductive adhesive is brought into direct contact with the surface wirings and components, and good connection is obtained.
【００１８】本発明の請求項５に記載の発明は、請求項
１〜４の何れかに記載の発明において、部品はリード線
を有する半導体パッケージであり、水に不溶で溶媒和パ
ラメータ６．５〜１０．０の有機溶媒に可溶である樹脂
によって少なくとも半導体パッケージのリード線が被覆
されているものであり、この構成により、半導体パッケ
ージのリード線は樹脂層により覆われているので防錆が
行われながら、樹脂層を形成した上記半導体パッケージ
のリード線を導電性接着剤からなる接合層を介して基板
に接合させると、導電性接着剤を塗布した部分のみ被覆
した樹脂層が導電性接着剤に含まれている樹脂や溶媒に
よって溶解し、導電性接着剤中の導電物質と半導体パッ
ケージのリード線とが直接接触して良好な接続が得られ
る。According to a fifth aspect of the present invention, in the first aspect, the component is a semiconductor package having a lead wire, which is insoluble in water and has a solvation parameter of 6.5. At least the lead wire of the semiconductor package is covered with a resin soluble in an organic solvent of up to 10.0. With this configuration, the lead wire of the semiconductor package is covered with the resin layer, so that rust prevention is achieved. When the lead wire of the semiconductor package having the resin layer formed thereon is bonded to the substrate via a bonding layer made of a conductive adhesive, the resin layer covering only the portion to which the conductive adhesive is applied is electrically conductively bonded. The resin is dissolved by the resin or the solvent contained in the agent, and the conductive material in the conductive adhesive and the lead wire of the semiconductor package come into direct contact to obtain a good connection.
【００１９】本発明の請求項６に記載の発明は、請求項
１または３に記載の発明において、表層配線と、上記表
層配線上に導電性接着剤を介して実装された半導体パッ
ケージとを有し、導電性接着剤によって半導体パッケー
ジのリード線が被覆されているものであり、この構成に
より、半導体パッケージのリード線は導電性接着剤によ
り覆われているので防錆が行われながら、この半導体パ
ッケージを基板に載置することにより導電性接着剤を介
して半導体パッケージと基板とが接触して良好な接続が
得られる。According to a sixth aspect of the present invention, in the first or third aspect of the present invention, there is provided a semiconductor device having a surface wiring and a semiconductor package mounted on the surface wiring via a conductive adhesive. In addition, the lead wire of the semiconductor package is covered with the conductive adhesive. With this configuration, the lead wire of the semiconductor package is covered with the conductive adhesive, so that rust prevention is performed. By mounting the package on the substrate, the semiconductor package and the substrate are brought into contact with each other via the conductive adhesive, whereby good connection is obtained.
【００２０】本発明の請求項７に記載の発明は、表層配
線を含む基板表面または表層配線上を、水に不溶で溶媒
和パラメータ６．５〜１０．０の有機溶媒に可溶な樹脂
で被覆する工程と、上記樹脂で被覆された表層配線に導
電性接着剤を介して部品を実装する工程とを有するもの
であり、この製造方法により、貴金属メッキなどのコス
トを引き上げる工程を要することなく、表層配線は樹脂
層により覆われているので防錆が行われながら、表層配
線に導電性接着剤からなる接合層を介して部品を接合さ
せた際には、導電性接着剤を塗布した部分のみ被覆した
樹脂層が導電性接着剤に含まれている樹脂や溶媒によっ
て溶解し、導電性接着剤中の導電物質と表層配線とが直
接接触して良好な接続が得られる。According to a seventh aspect of the present invention, a resin insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0 is used on the surface of the substrate including the surface wiring or on the surface wiring. It has a step of coating and a step of mounting components via a conductive adhesive on the surface wiring covered with the resin, and by this manufacturing method, it is not necessary to raise a cost such as precious metal plating. Since the surface wiring is covered with a resin layer so that the parts are bonded to the surface wiring via a bonding layer made of a conductive adhesive while rust prevention is being performed, a portion where the conductive adhesive is applied The resin layer covered only by the dissolution is dissolved by the resin or the solvent contained in the conductive adhesive, and the conductive substance in the conductive adhesive and the surface wiring are directly in contact with each other to obtain a good connection.
【００２１】本発明の請求項８に記載の発明は、表層配
線に実装される部品表面の少なくとも一部を、水に不溶
で溶媒和パラメータ６．５〜１０．０の有機溶媒に可溶
である樹脂で被覆する工程と、上記部品を表層配線に導
電性接着剤を用いて実装する工程とを有するものであ
り、この製造方法により、貴金属メッキなどのコストを
引き上げる工程を要することなく、部品は樹脂層により
覆われているので防錆が行われながら、基板に導電性接
着剤からなる接合層を介して部品を接合させた際には、
導電性接着剤を塗布した部分のみ被覆した樹脂層が導電
性接着剤に含まれている樹脂や溶媒によって溶解し、導
電性接着剤中の導電物質と部品とが直接接触して良好な
接続が得られる。According to an eighth aspect of the present invention, at least a part of the surface of a component mounted on a surface wiring is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0. A step of coating with a certain resin, and a step of mounting the above-mentioned component on the surface wiring using a conductive adhesive, and by this manufacturing method, the process of raising the cost of precious metal plating and the like is not required, and the component is not required. Is covered with a resin layer so that when parts are bonded to the board via a bonding layer made of conductive adhesive while rust prevention is performed,
The resin layer, which covers only the part where the conductive adhesive is applied, is dissolved by the resin or solvent contained in the conductive adhesive, and the conductive material in the conductive adhesive directly contacts the component, resulting in good connection. can get.
【００２２】本発明の請求項９に記載の発明は、請求項
７に記載の発明において、表層配線上に実装される部品
表面の少なくとも一部を、水に不溶で溶媒和パラメータ
６．５〜１０．０の有機溶媒に可溶である樹脂で被覆す
る工程を有するものであり、この製造方法により、貴金
属メッキなどのコストを引き上げる工程を要することな
く、表層配線および部品は樹脂層により覆われているの
で防錆が行われながら、基板に導電性接着剤からなる接
合層を介して部品を接合させた際には、導電性接着剤を
塗布した部分のみ被覆した樹脂層が導電性接着剤に含ま
れている樹脂や溶媒によって溶解し、導電性接着剤中の
導電物質と表層配線および部品とが直接接触して良好な
接続が得られる。According to a ninth aspect of the present invention, in accordance with the seventh aspect of the present invention, at least a part of the surface of the component mounted on the surface wiring is insoluble in water and has a solvation parameter of 6.5 to 6.5. The method includes a step of coating with a resin soluble in an organic solvent of 10.0. With this manufacturing method, the surface wiring and the components are covered with the resin layer without a step of raising costs such as precious metal plating. When parts are bonded to the board via a bonding layer made of conductive adhesive while the rust is being performed, the resin layer that covers only the part where the conductive adhesive is applied is covered with the conductive adhesive. And a conductive material in the conductive adhesive is directly contacted with the surface wirings and components, thereby obtaining a good connection.
【００２３】本発明の請求項１０に記載の発明は、請求
項７〜９のいずれかに記載の発明において、水に不溶で
溶媒和パラメータ６．５〜１０．０の有機溶媒に可溶で
ある樹脂によって少なくとも半導体パッケージのリード
線が被覆されている工程と、上記半導体パッケージを表
層配線上に導電性接着剤を介して実装する工程とを有す
るものであり、この製造方法により、貴金属メッキなど
のコストを引き上げる工程を要することなく、半導体パ
ッケージのリード線は樹脂層により覆われているので防
錆が行われながら、基板に導電性接着剤からなる接合層
を介して半導体パッケージを接合させた際には、導電性
接着剤を塗布した部分のみ被覆した樹脂層が導電性接着
剤に含まれている樹脂や溶媒によって溶解し、導電性接
着剤中の導電物質と半導体パッケージのリード線とが直
接接触して良好な接続が得られる。The invention according to claim 10 of the present invention is the invention according to any one of claims 7 to 9, which is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0. A step of covering at least a lead wire of the semiconductor package with a certain resin, and a step of mounting the semiconductor package on a surface wiring via a conductive adhesive. The semiconductor package was bonded to the substrate via a bonding layer made of a conductive adhesive while preventing rust because the lead wires of the semiconductor package were covered with a resin layer without requiring a step of raising the cost of the semiconductor package. In this case, the resin layer coated only on the portion where the conductive adhesive is applied is dissolved by the resin or solvent contained in the conductive adhesive, and the conductive material in the conductive adhesive is dissolved. Good connection to the leads of the semiconductor package is in direct contact can be obtained.
【００２４】本発明の請求項１１に記載の発明は、請求
項７に記載の発明において、導電性接着剤によって半導
体パッケージのリード線が被覆される工程と、上記半導
体パッケージを表層配線上に導電性接着剤を介して実装
する工程とを有するものであり、この製造方法により、
貴金属メッキなどのコストを引き上げる工程を要するこ
となく、半導体パッケージのリード線は導電性接着剤に
より覆われているので防錆が行われながら、この半導体
パッケージを基板に載置することにより導電性接着剤を
介して半導体パッケージと基板とが接触して良好な接続
が得られる。According to an eleventh aspect of the present invention, in the seventh aspect of the present invention, the step of covering the lead wire of the semiconductor package with the conductive adhesive and the step of disposing the semiconductor package on the surface wiring And a step of mounting via a conductive adhesive, and by this manufacturing method,
The lead wire of the semiconductor package is covered with a conductive adhesive without the need to raise the cost such as precious metal plating, so rust prevention is performed and the semiconductor package is placed on the substrate by conductive bonding. The semiconductor package and the substrate come into contact with each other via the agent, and good connection is obtained.
【００２５】本発明の請求項１２に記載の発明は、請求
項７〜１１のいずれかに記載の発明において、導電性接
着剤を介した部品実装の工程時に１ｋｇ／ｃｍ2 以上の
圧力を加える工程を含むものであり、この製造方法によ
り、一層良好な接続が得られる。According to a twelfth aspect of the present invention, in the invention of any of the seventh to eleventh aspects, a pressure of 1 kg / cm 2 or more is applied during the step of mounting components via the conductive adhesive. In this method, a better connection can be obtained.
【００２６】以下、本発明の実施の形態にかかる回路基
板について図面を参照しながら説明する。図１は本発明
の第１の実施の形態にかかる回路基板を示す断面図であ
る。図１に示すように、回路基板は、絶縁層１上に表層
配線２を形成し、この表層配線２上に、部品配線部３を
有するチップ部品４を導電性接着剤からなる接続層５を
介して搭載して構成されている。ここで、絶縁層１およ
び表層配線２と、部品配線部３を含むチップ部品４と
は、接続する前に、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層６，７がそれぞれ
予め形成されており、絶縁層１および表層配線２と部品
配線部３を含むチップ部品４とがそれぞれ樹脂層６，７
により被覆されている。そして、樹脂層６が形成された
表層配線２と、樹脂層７が形成されたチップ部品４の部
品配線部３とが接続層５を介して接続されている。な
お、図１においては、樹脂層６，７を点線部にて概略的
に図示している。Hereinafter, a circuit board according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a circuit board according to the first embodiment of the present invention. As shown in FIG. 1, in the circuit board, a surface wiring 2 is formed on an insulating layer 1, and a chip component 4 having a component wiring portion 3 is connected to a connection layer 5 made of a conductive adhesive on the surface wiring 2. It is configured to be mounted via. Here, the chip component 4 including the component layer portion 3 and the insulating layer 1 and the surface wiring 2 are insoluble in water and have a solvation parameter of 6.5 before connection.
Resin layers 6 and 7 that are soluble in an organic solvent of up to 10.0 are respectively formed in advance, and the insulating layer 1, the surface wiring 2 and the chip component 4 including the component wiring portion 3 are formed in the resin layers 6 and 7, respectively.
Coated with The surface wiring 2 on which the resin layer 6 is formed and the component wiring portion 3 of the chip component 4 on which the resin layer 7 is formed are connected via the connection layer 5. In FIG. 1, the resin layers 6 and 7 are schematically illustrated by dotted lines.
【００２７】この回路基板は以下のようにして作製され
る。まず、一般の基板材料で形成した絶縁層１に、表層
配線２として銅配線を形成し、この表層配線２を形成し
た絶縁層１を、ニトロセルロースを含んだブチルカルビ
トールアセテート（ＢＣＡと略す）溶液（ここで、ＢＣ
Ａに対してニトロセルロースは１ｗｔ％）に浸し、その
後ＢＣＡを除去することによって、水に不溶で溶媒和パ
ラメータ６．５〜１０．０の有機溶媒に可溶な樹脂層６
を、表層配線２を形成した絶縁層１の周囲に形成する。
一方、チップ部品４も同様にニトロセルロースを含んだ
ＢＣＡ溶液（ニトロセルロースは１ｗｔ％）に浸し、水
に不溶で溶媒和パラメータ６．５〜１０．０の有機溶媒
に可溶な樹脂層７をチップ部品４の周囲に形成した。そ
して、樹脂層６を形成した表層配線２上に導電性接着剤
を用いて樹脂層７を形成したチップ部品４を接続して接
続層５を形成した。This circuit board is manufactured as follows. First, a copper wiring is formed as a surface wiring 2 on an insulating layer 1 formed of a general substrate material. Solution (where BC
Nitrocellulose with respect to A) and then BCA is removed to form a resin layer 6 insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0.
Is formed around the insulating layer 1 on which the surface wiring 2 is formed.
On the other hand, the chip part 4 is similarly immersed in a BCA solution containing nitrocellulose (nitrocellulose is 1 wt%) to form a resin layer 7 insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0. It was formed around the chip component 4. Then, the chip component 4 having the resin layer 7 formed thereon was connected to the surface wiring 2 having the resin layer 6 formed thereon using a conductive adhesive to form the connection layer 5.
【００２８】ここで、水に不溶で溶媒和パラメータ６．
５〜１０．０の有機溶媒に可溶な樹脂としては、ニトロ
セルロースを用いる代わりに、ロジン変性フェノール樹
脂、および変性アルキッド樹脂、ないしは、これらの樹
脂を含む共重合体なども用いることができる。上記樹脂
以外でも水に不溶で溶媒和パラメータ６．５〜１０．０
の有機溶媒に可溶な樹脂としては上記樹脂の他部品実装
や回路基板の信頼性に影響を与えるものでなかったらど
のような樹脂でも良い。Here, it is insoluble in water and has a solvation parameter of 6.
As the resin soluble in the organic solvent of 5 to 10.0, a rosin-modified phenol resin and a modified alkyd resin, or a copolymer containing these resins can be used instead of nitrocellulose. Other than the above resins, they are insoluble in water and have a solvation parameter of 6.5 to 10.0.
The resin soluble in the organic solvent may be any resin as long as it does not affect the component mounting and the reliability of the circuit board in addition to the above resin.
【００２９】接続層５としては一般の導電性接着剤を用
いる代わりに、異方性の導電性接着剤を用いることもで
きる。また、導電性接着剤において水に不溶で溶媒和パ
ラメータ６．５〜１０．０の有機溶媒に可溶な樹脂層
６，７をよく溶解する溶剤、例えば、水に不溶で溶媒和
パラメータ６．５〜１０．０の有機溶媒に可溶な樹脂層
６，７としてニトロセルロースを用いた場合はＢＣＡを
導電性接着剤に含有させることによって、チップ部品４
の実装を一層容易に行うことができる。Instead of using a general conductive adhesive as the connection layer 5, an anisotropic conductive adhesive can be used. Further, a solvent that is insoluble in water in the conductive adhesive and well dissolves the resin layers 6 and 7 that are soluble in an organic solvent having a solvation parameter of 6.5 to 10.0, for example, a solvent insoluble in water and having a solvation parameter of 6. When nitrocellulose is used as the resin layers 6 and 7 that are soluble in the organic solvent of 5 to 10.0, the chip component 4 is formed by adding BCA to the conductive adhesive.
Can be more easily implemented.
【００３０】また、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層７を形成したチッ
プ部品４を、水に不溶で溶媒和パラメータ６．５〜１
０．０の有機溶媒に可溶な樹脂層６を形成した表層配線
２に実装するときに、１ｋｇ／ｃｍ2 以上の力を加える
と、接続層５による接続箇所の信頼性をより一層高める
ことができる。It is insoluble in water and has a solvation parameter of 6.5.
The chip component 4 on which the resin layer 7 soluble in an organic solvent having a solvation parameter of 6.5 to 1 is formed.
Applying a force of 1 kg / cm 2 or more when mounting on the surface wiring 2 having the resin layer 6 soluble in an organic solvent of 0.0 further improves the reliability of the connection portion by the connection layer 5. Can be.
【００３１】なお、樹脂層６，７として、溶媒和パラメ
ータ６．５より小さいもの、または溶媒和パラメータ１
０．０より大きいものを用いると、接続層５と表層配線
２との間や接続層５とチップ部品４の部品配線部３との
間に樹脂層６，７が残留して良好な接続状態を得られな
いことがあるため、溶媒和パラメータが６．５〜１０．
０である樹脂層６，７を用いることが望ましい。The resin layers 6 and 7 have a solvation parameter smaller than 6.5 or a solvation parameter 1
If a material larger than 0.0 is used, the resin layers 6 and 7 remain between the connection layer 5 and the surface wiring 2 or between the connection layer 5 and the component wiring portion 3 of the chip component 4 to provide a good connection state. May not be obtained, so that the solvation parameter is 6.5-10.
It is desirable to use the resin layers 6 and 7 which are 0.
【００３２】この構成により、表層配線２やチップ部品
４の部品配線部３は樹脂層６，７により被覆されるため
に防錆が行われながら、表層配線２に導電性接着剤から
なる接合層５を介してチップ部品４を接合させた際に
は、導電性接着剤からなる接合層５を塗布した部分のみ
被覆した樹脂層６，７が接合層５の導電性接着剤に含ま
れている樹脂や溶媒によって溶解し、接合層５中の導電
物質と表層配線２とチップ部品４の部品配線部３とが直
接接触して良好な接続が得られる。また、貴金属メッキ
などのコストを引き上げる工程を要しないため、大幅な
コストアップを生じることもない。With this configuration, since the surface wiring 2 and the component wiring portion 3 of the chip component 4 are covered with the resin layers 6 and 7, rust is prevented, and the surface wiring 2 is bonded to the bonding layer made of a conductive adhesive. When the chip components 4 are bonded via the bonding layer 5, the resin layers 6 and 7 covering only the portion where the bonding layer 5 made of the conductive adhesive is applied are included in the conductive adhesive of the bonding layer 5. It is dissolved by a resin or a solvent, and the conductive substance in the bonding layer 5 and the surface wiring 2 and the component wiring portion 3 of the chip component 4 are in direct contact with each other, so that good connection is obtained. In addition, since a step of increasing the cost of precious metal plating or the like is not required, a significant increase in cost does not occur.
【００３３】次に、本発明の第２の実施の形態にかかる
回路基板について図２を参照しながら説明する。図２に
示すように、回路基板は、絶縁層１上に表層配線２を形
成し、この表層配線２上に、リード線８を有する半導体
パッケージ９を導電性接着剤からなる接続層５を介して
搭載して構成されている。ここで、絶縁層１および表層
配線２と、リード線８を有する半導体パッケージ９と
は、接続する前に、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層６，７がそれぞれ
予め形成されており、絶縁層１および表層配線２とリー
ド線８を有する半導体パッケージ９とがそれぞれ樹脂層
６，７により覆われている。そして、樹脂層６が形成さ
れた表層配線２と、樹脂層７が形成された半導体パッケ
ージ９のリード線８とが接続層５を介して実装されてい
る。なお、図２においては、樹脂層６，７を点線部にて
概略的に図示している。Next, a circuit board according to a second embodiment of the present invention will be described with reference to FIG. As shown in FIG. 2, in the circuit board, a surface wiring 2 is formed on an insulating layer 1, and a semiconductor package 9 having a lead 8 is formed on the surface wiring 2 via a connection layer 5 made of a conductive adhesive. It is configured to be mounted. Here, the insulating layer 1 and the surface wiring 2 and the semiconductor package 9 having the lead wires 8 are insoluble in water and have a solvation parameter of 6.5 before connection.
Resin layers 6 and 7 which are soluble in an organic solvent of up to 10.0 are respectively formed beforehand, and the insulating layer 1, the surface wiring 2 and the semiconductor package 9 having the lead wires 8 are covered with the resin layers 6 and 7, respectively. Have been done. The surface wiring 2 on which the resin layer 6 is formed and the lead wire 8 of the semiconductor package 9 on which the resin layer 7 is formed are mounted via the connection layer 5. In FIG. 2, the resin layers 6 and 7 are schematically illustrated by dotted lines.
【００３４】この回路基板は以下のようにして作製され
る。まず、一般の基板材料で形成した絶縁層１に、表層
配線２として銅配線を形成し、この表層配線２と絶縁層
１の周囲に、水に不溶で溶媒和パラメータ６．５〜１
０．０の有機溶媒に可溶な樹脂層６を形成する。一方、
半導体パッケージ９の周囲にも、水に不溶で溶媒和パラ
メータ６．５〜１０．０の有機溶媒に可溶な樹脂層７を
形成した。そして、樹脂層６を形成した表層配線２上
に、導電性接着剤からなる接続層５を介して、樹脂層７
を形成した半導体パッケージ９のリード線８を載せて、
半導体パッケージ９を実装して接続層５を形成した。This circuit board is manufactured as follows. First, a copper wiring is formed as a surface wiring 2 on an insulating layer 1 formed of a general substrate material, and a water-insoluble and solvation parameter of 6.5 to 1 is formed around the surface wiring 2 and the insulating layer 1.
A resin layer 6 soluble in an organic solvent of 0.0 is formed. on the other hand,
A resin layer 7 insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0 was also formed around the semiconductor package 9. Then, the resin layer 7 is formed on the surface wiring 2 on which the resin layer 6 is formed via the connection layer 5 made of a conductive adhesive.
The lead wire 8 of the semiconductor package 9 on which
The connection layer 5 was formed by mounting the semiconductor package 9.
【００３５】なお、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層６，７に用いる樹
脂の種類は上記第１の実施の形態と同様なものを用い
る。接続層５としては一般の導電性接着剤を用いる代わ
りに、異方性の導電性接着剤を用いることもできる。ま
た、導電性接着剤において水に不溶で溶媒和パラメータ
６．５〜１０．０の有機溶媒に可溶な樹脂層６，７をよ
く溶解する溶剤、例えば、水に不溶で溶媒和パラメータ
６．５〜１０．０の有機溶媒に可溶な樹脂層６，７とし
てニトロセルロースを用いた場合はＢＣＡを導電性接着
剤に含有させることによって、半導体パッケージ９の実
装を一層容易に行うことができる。The solvent is insoluble in water and has a solvation parameter of 6.5.
The type of resin used for the resin layers 6 and 7 soluble in an organic solvent of up to 10.0 is the same as that used in the first embodiment. As the connection layer 5, instead of using a general conductive adhesive, an anisotropic conductive adhesive can be used. Further, a solvent that is insoluble in water in the conductive adhesive and well dissolves the resin layers 6 and 7 that are soluble in an organic solvent having a solvation parameter of 6.5 to 10.0, for example, a solvent insoluble in water and having a solvation parameter of 6. When nitrocellulose is used as the resin layers 6 and 7 soluble in the organic solvent of 5 to 10.0, the semiconductor package 9 can be mounted more easily by adding BCA to the conductive adhesive. .
【００３６】また、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層７を形成した半導
体パッケージ９のリード線８を、水に不溶で溶媒和パラ
メータ６．５〜１０．０の有機溶媒に可溶な樹脂層６を
形成した表層配線２に実装するときに、１ｋｇ／ｃｍ2
以上の力を加えると、接続層５による接続箇所の信頼性
をより一層高めることができる。It is insoluble in water and has a solvation parameter of 6.5.
The lead wire 8 of the semiconductor package 9 on which the resin layer 7 soluble in an organic solvent having a solvation parameter of 6.5 to 10.0 is formed. 1 kg / cm 2 when mounted on the surface wiring 2 on which
When the above-mentioned force is applied, the reliability of the connection portion by the connection layer 5 can be further improved.
【００３７】また、水に不溶で溶媒和パラメータ６．５
〜１０．０の有機溶媒に可溶な樹脂層７をリード線８に
形成したが、これに替えて、リード線８を一般の導電性
接着剤や異方性の導電性接着剤を用いて被覆しても良
い。異方性の導電性接着剤を用いるときは樹脂成分が水
に不溶で溶媒和パラメータ６．５〜１０．０の有機溶媒
に可溶な樹脂で構成されていることが望ましい。It is insoluble in water and has a solvation parameter of 6.5.
Although a resin layer 7 soluble in an organic solvent of about 10.0 was formed on the lead wire 8, the lead wire 8 was replaced with a general conductive adhesive or an anisotropic conductive adhesive. It may be coated. When an anisotropic conductive adhesive is used, it is desirable that the resin component be composed of a resin that is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0.
【００３８】この構成により、表層配線２や半導体パッ
ケージ９のリード線８は樹脂層６，７や導電性接着剤に
より被覆されるために防錆が行われながら、表層配線２
に導電性接着剤からなる接合層５を介して半導体パッケ
ージ９のリード線８を接合させた際には、導電性接着剤
からなる接合層５を塗布した部分のみ被覆した樹脂層
６，７が接合層５の導電性接着剤に含まれている樹脂や
溶媒によって溶解し、接合層５中の導電物質と表層配線
２と半導体パッケージ９のリード線８とが直接接触して
良好な接続が得られる。また、貴金属メッキなどのコス
トを引き上げる工程を要しないため、大幅なコストアッ
プを生じることもない。With this configuration, the surface wiring 2 and the lead wires 8 of the semiconductor package 9 are covered with the resin layers 6 and 7 and the conductive adhesive, so that the surface wiring 2 and the conductive adhesive are protected from rust.
When the lead wire 8 of the semiconductor package 9 is bonded to the semiconductor package 9 via the bonding layer 5 made of a conductive adhesive, the resin layers 6 and 7 covering only the portion where the bonding layer 5 made of the conductive adhesive is applied are formed. It is dissolved by a resin or a solvent contained in the conductive adhesive of the bonding layer 5, and the conductive material in the bonding layer 5 directly contacts the surface wiring 2 and the lead wire 8 of the semiconductor package 9 to obtain a good connection. Can be In addition, since a step of increasing the cost of precious metal plating or the like is not required, a significant increase in cost does not occur.
【００３９】なお、上記の実施の形態においては、表層
配線２だけでなく絶縁層１も樹脂層６にて被覆した場合
を説明したが、表層配線２だけを被覆してもよく、ま
た、部品配線部３やリード線８だけでなく、チップ部品
４や半導体パッケージ９も樹脂層６や導電性接着剤にて
被覆した場合を説明したが、部品配線部３やリード線８
だけを被覆してもよい。In the above embodiment, not only the surface wiring 2 but also the insulating layer 1 is covered with the resin layer 6, but only the surface wiring 2 may be covered. The case where not only the wiring part 3 and the lead wire 8 but also the chip component 4 and the semiconductor package 9 are covered with the resin layer 6 and the conductive adhesive has been described.
May be coated.
【００４０】[0040]
【発明の効果】以上のように本発明によれば、半田に替
えて導電性接着剤を用いた回路基板を、より信頼性を高
く、かつ、低コストで供給することができる。As described above, according to the present invention, a circuit board using a conductive adhesive instead of solder can be supplied with higher reliability and at lower cost.
【図１】本発明の第１の実施の形態にかかる回路基板の
断面図FIG. 1 is a sectional view of a circuit board according to a first embodiment of the present invention;
【図２】本発明の第２の実施の形態にかかる回路基板の
断面図FIG. 2 is a sectional view of a circuit board according to a second embodiment of the present invention;
１ 絶縁層 ２ 表層配線 ３ 部品配線部 ４ チップ部品 ５ 接続層 ６，７ 樹脂層 ８ リード線 ９ 半導体パッケージ DESCRIPTION OF SYMBOLS 1 Insulating layer 2 Surface wiring 3 Component wiring part 4 Chip component 5 Connection layer 6, 7 Resin layer 8 Lead wire 9 Semiconductor package
Claims (12)
たは表層配線上に形成され、水に不溶で溶媒和パラメー
タ６．５〜１０．０の有機溶媒に可溶である樹脂層と、
この樹脂層を形成した上記表層配線に形成された導電性
接着剤からなる接合層と、この接合層を形成した表層配
線に接続された部品とを有する回路基板。1. A surface wiring, and a resin layer formed on the surface of the substrate including the surface wiring or on the surface wiring and insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0.
A circuit board comprising: a bonding layer formed of a conductive adhesive formed on the surface wiring having the resin layer formed thereon; and components connected to the surface wiring having the bonding layer formed thereon.
層と、この接合層を介して実装された部品とを有し、部
品表面の少なくとも一部が、水に不溶で溶媒和パラメー
タ６．５〜１０．０の有機溶媒に可溶である樹脂で被覆
されている回路基板。2. A semiconductor device comprising: a surface wiring, a bonding layer made of a conductive adhesive, and a component mounted via the bonding layer, wherein at least a part of the surface of the component is insoluble in water and has a solvation parameter of at least 6. A circuit board coated with a resin soluble in an organic solvent of 0.5 to 10.0.
ス、ロジン変性フェノール樹脂、および変性アルキッド
樹脂の内、１種類または、２種類以上のこれらの混合
物、あるいは、これらの樹脂の共重合体を使用する請求
項１または２に記載の回路基板。3. As the resin for the resin layer, one or more of nitrocellulose, rosin-modified phenolic resin, and modified alkyd resin, or a mixture of these resins, or a copolymer of these resins is used. The circuit board according to claim 1.
で溶媒和パラメータ６．５〜１０．０の有機溶媒に可溶
である樹脂で被覆されている請求項１または３に記載の
回路基板。4. The circuit according to claim 1, wherein at least a part of the surface of the component is coated with a resin that is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0. substrate.
ジであり、水に不溶で溶媒和パラメータ６．５〜１０．
０の有機溶媒に可溶である樹脂によって少なくとも半導
体パッケージのリード線が被覆されている請求項１〜４
の何れかに記載の回路基板。5. The component is a semiconductor package having lead wires, which is insoluble in water and has a solvation parameter of 6.5-10.
5. The semiconductor device according to claim 1, wherein at least the lead wire of the semiconductor package is covered with a resin soluble in an organic solvent.
The circuit board according to any one of the above.
着剤を介して実装された半導体パッケージとを有し、導
電性接着剤によって半導体パッケージのリード線が被覆
されている請求項１または３に記載の回路基板。6. A semiconductor package having a surface wiring and a semiconductor package mounted on the surface wiring via a conductive adhesive, wherein a lead wire of the semiconductor package is covered with the conductive adhesive. 4. The circuit board according to 3.
上を、水に不溶で溶媒和パラメータ６．５〜１０．０の
有機溶媒に可溶な樹脂で被覆する工程と、上記樹脂で被
覆された表層配線に導電性接着剤を介して部品を実装す
る工程とを有する回路基板の製造方法。7. A step of coating the surface of the substrate including the surface wiring or the surface wiring with a resin that is insoluble in water and soluble in an organic solvent having a solvation parameter of 6.5 to 10.0, and coated with the resin. Mounting a component on a surface wiring via a conductive adhesive.
とも一部を、水に不溶で溶媒和パラメータ６．５〜１
０．０の有機溶媒に可溶である樹脂で被覆する工程と、
上記部品を表層配線に導電性接着剤を用いて実装する工
程とを有する回路基板の製造方法。8. At least a part of the surface of the component mounted on the surface wiring is insoluble in water and has a solvation parameter of 6.5 to 1.
Coating with a resin that is soluble in an organic solvent of 0.0,
Mounting the component on a surface wiring using a conductive adhesive.
くとも一部を、水に不溶で溶媒和パラメータ６．５〜１
０．０の有機溶媒に可溶である樹脂で被覆する工程を有
する請求項７に記載の回路基板の製造方法。9. A method in which at least a part of the surface of a component mounted on a surface wiring is insoluble in water and has a solvation parameter of 6.5 to 1.
The method for producing a circuit board according to claim 7, further comprising a step of coating with a resin soluble in an organic solvent of 0.0.
１０．０の有機溶媒に可溶である樹脂によって少なくと
も半導体パッケージのリード線が被覆されている工程
と、上記半導体パッケージを表層配線上に導電性接着剤
を介して実装する工程とを有する請求項７〜９のいずれ
かに記載の回路基板の製造方法。10. A water-insoluble solvation parameter of 6.5 to 10.
10. A semiconductor device comprising: a step of coating at least a lead wire of a semiconductor package with a resin soluble in an organic solvent of 10.0; and a step of mounting the semiconductor package on a surface wiring via a conductive adhesive. 10. The method for manufacturing a circuit board according to any one of 7 to 9.
ジのリード線が被覆される工程と、上記半導体パッケー
ジを表層配線上に導電性接着剤を介して実装する工程と
を有する請求項７に記載の回路基板の製造方法。11. The circuit according to claim 7, further comprising: a step of covering a lead wire of the semiconductor package with a conductive adhesive; and a step of mounting the semiconductor package on a surface wiring via the conductive adhesive. Substrate manufacturing method.
時に１ｋｇ／ｃｍ2以上の圧力を加える工程を含む請求
項７〜１１のいずれかに記載の回路基板の製造方法。12. The method for producing a circuit board according to claim 7, further comprising a step of applying a pressure of 1 kg / cm 2 or more during a step of mounting components via a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8237097A JPH1084177A (en) | 1996-09-09 | 1996-09-09 | Circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8237097A JPH1084177A (en) | 1996-09-09 | 1996-09-09 | Circuit board and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1084177A true JPH1084177A (en) | 1998-03-31 |
Family
ID=17010376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8237097A Pending JPH1084177A (en) | 1996-09-09 | 1996-09-09 | Circuit board and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1084177A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129696A (en) * | 2009-12-17 | 2011-06-30 | Koa Corp | Mounting structure for electronic component |
| CN108366493A (en) * | 2017-01-26 | 2018-08-03 | 真空融化两合公司 | Be electrically insulated component and the method for making component be electrically insulated |
-
1996
- 1996-09-09 JP JP8237097A patent/JPH1084177A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011129696A (en) * | 2009-12-17 | 2011-06-30 | Koa Corp | Mounting structure for electronic component |
| CN108366493A (en) * | 2017-01-26 | 2018-08-03 | 真空融化两合公司 | Be electrically insulated component and the method for making component be electrically insulated |
| CN108366493B (en) * | 2017-01-26 | 2022-04-19 | 真空融化两合公司 | Electrically insulating assembly and method for electrically insulating an assembly |
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