JPH1060371A - Resin-coated substrate and production of resin sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin-coated substrate in improved productivity without dusting and without causing the surface of the sheet to be cracked when dried by applying a thermosetting polyphenylene resin varnish to a substrate and drying the varnish under specified conditions. SOLUTION: A thermoplastic polyphenylene ether resin is applied to a substrate (e.g. metallic foil such as a copper foil, an aluminum foil or a tin foil or plastic substrate such as a polyethylene terephthalate film, a polyimide film or a fluororesin film). When used as especially a resin-coated substrate for a wiring board, the substrate used is desirably a copper or aluminum foil having a thickness of 500μm or below and provided with a surface being roughened and/or treated with a coupling agent to improve its adhesion to the resin. The thermosetting polyphenylene ether resin may be used alone or together with a polyfunctional compound and may further contain a filler and additives. This is mixed with a solvent to form a resin varnish. This varnish is applied to a substrate in a coating thickness of 10μm or above and dried at a rate of solvent vaporization of 0.10gr.cm<2> /min or below to obtain a resin-coated substrate. The substrate is removed therefrom to obtain a resin sheet.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin-coated substrate having a thermosetting polyphenylene ether-based resin film and a method for producing a resin sheet.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and the like, and accordingly, materials have become more excellent. Heat resistance and electrical characteristics in a high frequency range are being demanded. In the electric wiring board industry, it is urgent to establish a laminated build-up method that can form higher-density wiring than the plated through-hole method, but it can be used for high-speed digital circuits and high-frequency analog circuits. There was no resinous base material and resin sheet. For example, as a resin-attached base material and a resin sheet having a thermosetting resin film, there are those using a conventional epoxy resin, but the epoxy resin has poor electric characteristics, particularly in a high-frequency region, and is difficult to handle. In this case, there is a drawback that resin powder easily falls off.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above circumstances, and does not cause powder to fall off.
Another object of the present invention is to provide a method for producing a resin-coated base material and a resin sheet having a thermosetting polyphenylene ether-based resin film which does not cause drying cracks on the sheet surface and has high productivity.

[0004]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, when drying the coating film, the conditions of the evaporation rate of the solvent and the specific residual solvent By specifying the conditions of the evaporation rate of the solvent until the amount is reached, a production method meeting the purpose of the present invention has been found, and the present invention has been completed. That is, the present invention is as follows.

(1) In a method for producing a resin-coated substrate having a thermosetting polyphenylene ether resin film on the substrate,
When a resin varnish comprising a thermosetting polyphenylene ether-based resin and a solvent is applied to a substrate and the obtained coating film is dried, the solvent evaporation rate is 0.10 gr · cm 2 /
A method for producing a substrate with resin, comprising drying under a condition of not more than one minute.

(2) In a method for producing a resin substrate having a film of a thermosetting polyphenylene ether resin, a resin varnish comprising a thermosetting polyphenylene ether resin and a solvent is applied to the substrate, and the resulting coating film is obtained. A method for producing a resin sheet, comprising drying the solvent under conditions where the evaporation rate of the solvent is 0.10 gr · cm 2 / min or less, and then removing the base material.

(3) The residual solvent concentration of the coating film is 20,000
The evaporation rate of the solvent until it reaches 0 ppm is 0.10 gr
-The method for producing a substrate with a resin according to the above (1), wherein the substrate is dried under a condition of not more than cm2 / min. (4) The method for producing a resin sheet according to the above (2), wherein the drying is performed under the condition that the evaporation rate of the solvent until the residual solvent concentration of the coating film reaches 200000 ppm is 0.10 gr · cm 2 / min or less. .

Hereinafter, the present invention will be described in detail. As the substrate used in the present invention, for example, copper foil, aluminum foil,
Examples include, but are not particularly limited to, metal foils such as tin foil and gold foil, and plastic films such as polyethylene terephthalate film, polybutylene terephthalate film, polyimide film, polyethylene sulfide film, and fluororesin film.

When the substrate with resin of the present invention is used for a wiring board, the substrate to be used for the substrate with resin is preferably a conductive metal foil. Considering that such a metal foil is easily available and can be easily etched, a copper foil and an aluminum foil are preferable, and among them, a copper foil is most preferable. The thickness of the metal foil is not particularly limited, but is preferably 500 μm or less, more preferably 200 μm or less, and most preferably 105 μm or less from the viewpoint of ease of handling. The surface of the metal foil on which the thermosetting resin film is formed may be roughened and / or subjected to a coupling treatment in order to enhance the adhesion to the resin. The roughened electrolytic copper foil manufactured and sold for manufacturing a wiring board can be used as it is in the manufacture of the resin-coated base material of the present invention.

In addition, the resin sheet from which the base material has been removed is supported,
As the support used for protection, a support that is easy to release, such as the above-mentioned plastic film or a glossy surface of a copper foil, is preferable so that a resin sheet can be quickly formed before use. Such a resin sheet can be used as, for example, an adhesive sheet, a sheet for controlling thickness, a via hole for a multilayer wiring board, a sheet for filling in through holes, and a sheet for sequential lamination.

The thermosetting polyphenylene ether resin used in the present invention may be a single resin and / or a mixture of a thermosetting resin and a polyfunctional compound. Also, a mixture of a polyphenylene ether resin and a thermosetting resin and / or a polyfunctional compound may be used, and the type of the resin is not particularly limited. In the present invention, the thermosetting resin may be blended with a filler or an additive in an amount that does not impair the original properties for the purpose of imparting desired performance according to the use. The filler may be fibrous or powdery, and may be silica, alumina, talc, mica, glass beads,
Glass hollow spheres and the like can be given. In addition, as additives, flame retardants, antioxidants, heat stabilizers, antistatic agents,
Plasticizers, pigments, dyes, coloring agents, and the like are included.

The thickness of the thermosetting polyphenylene ether-based resin film is preferably 10 μm or more, more preferably 20 μm or more, and most preferably 30 μm or more from the viewpoint of easy handling. Examples of the solvent used for producing the varnish include aromatic hydrocarbons such as benzene, toluene, and xylene; halogen solvents such as dichloromethane, chloroform, and trichloroethylene;
F and the like, which can be used alone or as a mixture. As a method of applying a varnish comprising a thermosetting polyphenylene ether resin and a solvent, an aired coater, a blade coater, a rod coater, a knife coater,
A method using a device such as a gravure coater, a reverse coater, or a cast coater may be used. Hot air drying, roll heating drying, infrared drying,
A method using a device such as far-infrared drying may be mentioned, and in practice, these devices may be used alone or in combination of two or more.

Next, the evaporation rate when a resin varnish comprising a thermosetting polyphenylene ether-based resin and a solvent is applied and the applied film is dried will be described. As a specific method for controlling the evaporation rate in drying the coating film in the present invention, for example, adjusting the temperature and the amount of hot air for drying may be mentioned. In order to control the evaporation temperature, a high boiling solvent may be added to the varnish. Examples of such high-boiling solvents include chlorobenzene, tetralin, anisole and the like.

In the present invention, the evaporation temperature is 0.10 g
r · cm 2 / min or less, but preferably, the evaporation rate is 0.0010 gr · cm 2 / min or more,
0.10 gr · cm 2 / min or less. 0.10 gr
If it exceeds cm2 / min, dry cracking will occur on the sheet surface. On the other hand, the evaporation rate for drying the coating film is 0.00
If it is less than 1 gr · cm 2 / min, the productivity of the sheet may decrease, which is not preferable.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION

[0016]

EXAMPLES Hereinafter, the present invention will be described with reference to examples to further clarify the present invention.

[0017]

Examples 1 to 3 A resin varnish comprising a thermosetting polyphenylene ether-based resin and a toluene solvent was applied to one side of a 12 μm-thick electrolytic copper foil for printed circuit boards so that the resin thickness after drying was 50 μm. . In drying the coating film, the evaporation rate of the solvent until the residual solvent concentration of the coating film reaches 200,000 ppm is 0.005 gr · cm 2 / min, 0.01 gr · cm 2 / using a hot air drier.
The temperature and air volume of the hot air were adjusted so as to be 0.05 gr · cm 2 / min. The obtained resin-attached sheet has no drying cracks on the coated surface, and does not fall off during handling such as cutting of the resin-attached sheet or when manufacturing a multilayer wiring board by successive lamination, and has a highly reliable multilayer wiring. A plate could be made.

[0018]

Comparative Example 1 In drying the coating film of Example 1,
A sheet with resin was produced in the same manner as in Examples 1 to 3, except that the temperature and the amount of hot air were adjusted so that the evaporation rate of the solvent was 0.2 gr · cm 2 / min. In the obtained sheet, dry cracks were observed on the coated surface, and powder dropping was observed at the time of processing such as cutting of a sheet with a resin and at the time of handling when manufacturing a multilayer wiring board by successive lamination. Observation of the cross section of the manufactured multilayer wiring board showed that resin embedding failure occurred in the circuit portion.

[0019]

The resin-coated base material and the resin sheet of the present invention have no drying cracks, do not fall off during processing and handling, and have high productivity. Therefore, the resin-coated substrate of the present invention is suitably used as a resin-coated substrate for a wiring board that can be used for high-speed digital circuits and high-frequency analog circuits, and a resin sheet is used not only for a wiring board but also for an adhesive sheet, It is suitably used as a thickness control sheet.

Claims (4)

[Claims] 1. A method for producing a resin-coated base material having a thermosetting polyphenylene ether-based resin film on the base material, the method comprising applying a resin varnish comprising a thermosetting polyphenylene ether-based resin and a solvent to the base material. A method for producing a substrate with resin, characterized in that when drying the applied film, the solvent is evaporated under conditions such that the evaporation rate of the solvent is 0.10 gr · cm 2 / min or less. 2. A method for producing a resin sheet having a film of a thermosetting polyphenylene ether resin, wherein a resin varnish comprising a thermosetting polyphenylene ether resin and a solvent is applied to a substrate, and the obtained coating film is dried. In doing so, a method for producing a resin sheet, characterized in that the solvent is evaporated under conditions where the evaporation rate of the solvent is 0.10 gr · cm 2 / min or less, and then the substrate is removed. 3. The method according to claim 1, wherein the residual solvent concentration of the coating film is 200,000 pp.
m until the solvent evaporation rate reaches 0.10 gr · cm
2. The method for producing a resin-coated substrate according to claim 1, wherein the substrate is dried under a condition of 2 / min or less. 4. A coating film having a residual solvent concentration of 200,000 pp.
m until the solvent evaporation rate reaches 0.10 gr · cm
The method for producing a resin sheet according to claim 2, wherein the drying is performed under a condition of 2 / min or less.