TW449614B - Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device - Google Patents

Abstract

The invention provides resin-carrying metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a multilayered wiring board produced by using the resin-carrying metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.

Description

Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 44961 4 A7 B7 V. Description of the Invention (i) Technical Field The present invention relates to a resin film metal foil for a multilayer wiring board having a thermosetting resin film on one side, and a method for manufacturing the same. "Multilayer wiring board using the resin film metal foil for the multilayer wiring board, and electronic device connecting the multilayer wiring board and electronic components by wiring means" The multilayer wiring board of the present invention has its wiring located in the plane of the multilayer wiring board The distance between layers is considered practically constant, and the characteristic impedance deviation is small. Therefore, it has excellent characteristics as a wiring board for ultra-high-speed digital circuits. The electronic device of the present invention has excellent characteristic impedance stability, and the digital semiconductor can operate at high speed when the electronic component of the digital semiconductor is mounted. When an electronic component having a semiconductor having an analog portion is mounted, a semiconductor having an analog portion can reduce high-frequency signals because signal crosstalk is reduced. In addition, the glass transition temperature of the thermosetting resin is above 180 ° C. Therefore, the multilayer wiring board and the electronic device of the present invention have very high reliability. The specific permittivity of the thermosetting resin before thermosetting is as low as 3.3 or lower at a frequency of 1 MHz or more, and the specific permittivity is low. Therefore, the multilayer wiring board of the present invention is used after the thermosetting resin is cured. Its characteristics Impedance stability • High-speed signal transmission and excellent low crosstalk. In an electronic device using this multilayer wiring board, digital semiconductors can operate at the highest speed, and semiconductors that process analog signals can operate at the highest frequency. Background Art Conventionally, a metal foil having a thermosetting resin film is known as a copper foil containing an epoxy resin film. However, a multilayer wiring board characterized by repeatedly laminating a metal foil containing a resin film is a method of sequentially manufacturing a multilayer wiring board | the so-called laminated construction method The paper size is generally China National Standard (CNS) A4 (210X297 mm) ) — ^^ --- ^ --- installation -----; — order—leaf ---- line-- (please read the note on the back fs before filling out this page) -4-. Attachment〗 2 : Revised page of the Chinese specification for Patent Application No. 85 丨 15709 ^ 5. In the description of the invention (2), the film thickness of the thermosetting resin using the above-mentioned conventional body function of the resin film is the same as the film thickness and the characteristics of the wiring Impedance is also difficult in the dielectric properties and heat resistance of the resin because the speed circuit and high-frequency analog circuits are not considered | so for this * the use of conventional copper laminates made of epoxy trees, the dielectric constant of the resin is 3.6 ~ 3.9 The temperature is only 120 ~ 150 ° C. In fields such as the production of electrical wiring boards, a multilayer metal foil is a suitable multi-metal foil that is more important for circuits and high-frequency analog circuits than the electro-ammonium perforation process. The present invention uses a glass transition temperature foil with a specific dielectric constant | hardened | cured surface on one side to provide a high-speed digital circuit and a wiring board and an electronic device using the same.

When the metal foil was amended in February 1988, it was difficult to form the same certain range in the wires with electrical insulation. It is also considered that the thermosetting resin is used for higher applications in resin-containing metal foils whose performance is still insufficient. The glass transition of the hardened resin is how to form high-density wiring, but there is no application for high-speed multi-layer wiring boards. Multilayer configuration of gold high-frequency analog circuits of thermosetting resin films with a specific range of resin flow rate with resin films (please read back first and fill in the desired items before filling out this page to order the staff of the Central Bureau of Standards of the Ministry of Economic Affairs) Disclosure of the invention of the cooperative of India and Japan The present inventors and others have completed the invention of a metal foil containing a resin film through careful research. The present invention is composed of 13 inventions described below. The first invention of the present invention is a sequential multilayer wiring Plate-mounted resin film metal foil, which is characterized by a thermosetting resin film having a specific permittivity of 3.3 or lower in the frequency region above 1 MHz on one side of the metal foil, and a resin flow rate of 1% or more 5 0 % Or less. The second invention of the present invention is a resin film for successive multilayer wiring boards. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297 male bag wide 5 _ 4496 1 4

Interview 7 P V. Description of the invention (3) 'Metal foil, which is characterized in that the specific dielectric of the metal foil on a single side of the frequency range of 1 M Η Z or higher is a thermosetting resin film of 3.3 or less, resin flow It is 5% to 50%. {Please read the following precautions before filling in this page. The third invention of the present invention is the resin film metal foil for sequential multilayer wiring such as the scope of application for item 1 or item 2 of the patent application, where the thermosetting resin contains Made of inorganic filler. The fourth invention of the present invention is the resin film metal foil for successive multilayer wiring boards such as the first, second, or third patent application, wherein the glass transition temperature of the thermosetting resin is 180 ° C or higher when the thermosetting resin is cured. The fifth invention of the present invention is the resin film metal foil for successive multilayer wiring boards such as the first, second, and third items of the patent application scope, in which the thermosetting resin is a thermosetting polyphenylene ether resin. The sixth invention of the invention is the resin film metal foil for successive multilayer wiring boards such as the fifth item in the scope of application for patents, where the thermosetting resin is a thermosetting polyphenylene ether resin containing a polystyrene polymer. The seventh invention of the present invention is a manufacturing method of a resin film metal foil for successive multilayer wiring such as the scope of the patent application No. 5 or No. 6, which is characterized by a thermosetting polyphenylene ether resin and a solvent. The formed resin varnish was applied on a metal foil *, and then the coating film was dried under the condition that the evaporation rate of the solvent was 0.01 g / (cm2 · mi η) or less. The eighth invention of the present invention is a method for manufacturing a resin film metal foil for successive multi-layer wiring such as the scope of the patent application No. 5 or No. 6, which is characterized by coating a resin varnish composed of a thermosetting polyphenylene ether resin and a solvent. Placed on metal foil, and then the residual solvent concentration in the thermosetting resin film is reached. The paper Hit uses the Chinese National Standard (CNS) to show the standard (2Ι0 × 297 Public View Canton 6-~~ 一

Printed by the Consumers' Cooperatives of the Bureau of Loss and Standards of the Ministry of Economic Affairs. 5. Description of the invention (4) ~ _ — 2 0 0 0 0 0 p pm The evaporation rate of the solvent is 0 · ◦ under 1 (cm2, mi η) The coating film was dried. The ninth invention of the present invention is a method for manufacturing a resin film-coated metal foil for a successive multilayer wiring board such as the scope of application for a patent item 5 or 6, which is applied under the condition that the thermosetting polyphenylene ether resin does not substantially decompose. Melt and relieve pressure. The tenth invention of the present invention is a resin film-coated metal foil for a successive multilayer wiring board according to any one of claims 1 to 6 of the scope of patent application. The resin foil has a resin surface protective sheet that can be easily peeled off. 1 1 The invention is a sequential multilayer wiring board. Its characteristics are as follows: the scope of application for patents is 1, 2, 3, 4, or 5 in order. They are laminated to form a wiring layer. The twelfth invention of the present invention is an electronic device, which is characterized in that the electronic component is connected to the successive multilayer wiring board of the above-mentioned eleventh invention using wiring means. The electronic device is composed of the sequential multilayer wiring board of the above-mentioned 11th invention of the above-mentioned 11th invention, and the electronic component having a transmission speed of an electrical signal of 16.5m / ns or more and a heat-resistant temperature of 180 ° C or more. Brief description of the figure. The first diagram is a cross-sectional view showing the structure of the metal foil to which the thermosetting resin of the present invention is attached. The second diagram is a successive multilayer wiring board junction of the first 11th invention. I t line (please read the precautions on the back before filling in this page) The paper size of this paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 449614 ^ > Is -Round-I — \ 1-ΙΜ- 丨 JI .. -ί _-1 Sequential multilayer wiring of the invention-i H '; V. Sectional view of the structure of the invention (5). Fig. 3 is a sectional view showing an example of a manufacturing process of the first plate. 4 to 6 are cross-sectional views showing a configuration example of an electronic device according to a twelfth invention. (谇 1 Read the notes on the back of the page and then fill in the best form of implementing the invention on this page. The present invention will be described in detail below. The metal foil in the present invention can use various metal foils, such as copper foil * aluminum foil, tin foil, gold foil, etc. Copper foil and aluminum foil are ideal because they are easy to obtain and easy to etch, and copper foil is the most preferred. There is no particular limitation on the thickness of metal foil. However, when ease of use is considered, it is preferably less than 500 mm and less than 200 / m. More preferably, it is less than 1.05 / m. The surface of the metal foil on which the thermosetting resin film is formed may be roughened and / or coupled in order to improve the adhesion with the resin. It is used for the manufacture of wiring boards The roughened electrolytic copper foil on sale can be directly used for manufacturing the resin-containing copper foil for the multilayer wiring board of the present invention. The metal foil is mainly used as a conductor of the multilayer wiring board of the present invention, and may also be used as a heat sink. The foil can be selected according to these purposes. Figure 1 shows the structure of a metal foil containing the thermosetting resin of the present invention in a sectional view. The figure 1 shows the structure of a metal foil. Foil, 2 is a thermosetting resin film. The thermosetting resin of the present invention can obtain the desired significant effect as long as the resin flow rate is from 1% to 50%. The resin flow rate is more preferably from 5% to 50%. Above 7% and below 45% are the most ideal. Resin flow less than 1% will cause defective inner layer circuits. This paper size applies to China National Standard (CNS) A4 specifications (2 丨 0X297 K Γ 8-449614 A7 B7 Printed by the Consumer Cooperatives of the Central Bureau of Economic Affairs of the Ministry of Economic Affairs. 5. Description of the invention (6) It is not easy to form multilayer wiring boards. Those with a large β resin flow are more likely to be buried in the inner circuit. Unable to maintain a certain thickness of the insulating layer and the characteristic impedance of the wiring. * The resin flow rate is measured by the following method: (1) The weight of a metal foil of 10 cm x 10 cm is measured as the weight a. ( 2) Measure the weight of the resin-containing metal foil at 10 cmx 10 cm as the weight b · (3) Place the above-mentioned resin metal foil at 1 70 eC, pressure 22 kg / cm2 * after pressing for 10 minutes • Remove the oozing out of metal foil The weight of the resin-containing gold foil containing resin is b > (4) Calculate the resin flow rate according to the following formula "b "-a resin content (%) two (1--) X 1 0 0 b — a The thermosetting resin used in the present invention, for example, a thermosetting polyphenylene ether resin * phenol resin, a low-dielectric-constant epoxy resin, a diallylphthalic acid resin, a divinylbenzene resin, a polyfunctional acrylic resin, Functional methyl acrylate paper size applies to China National Standards (CNS) A4 format (210 X 29? Mm) (Please read the cautions on the back before filling in > page)

iT -9-I 449614 Printed by the Consumers' Cooperative of the Central Government Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (7) Ethylene resin, polyfunctional maleimide resin, polyfunctional cyanate ester, Polyfunctional isobaric acid esters, unsaturated polyester resins, polybutadiene resins, crosslinked polymers such as styrene-butadiene · styrene_butadiene-styrene, etc. β These resins are used in industrial technology It is not limited to a single compound. In order to obtain desired characteristics, various other materials can be added or denatured. Thermosetting resins can be mixed with thermoplastic resins. In the present invention, the specific permittivity of the thermosetting resin must be 3.3 or less, and when the resin film metal foil for a multilayer wiring board is used, the resin flow rate must be within the scope of the patent application. In the above example of the thermosetting resin, the content of the present invention The ideal thermosetting resin used for the metal foil of the resin is a thermosetting polyphenylene ether resin, a thermosetting polyphenylene ether resin containing a polystyrene polymer, a resin composition containing polydivinylbenzene, and a resin containing polybutadiene. The resin composition is a resin composition containing a triallyl isocyanurate and / or a triallyl isocyanurate polymer and / or copolymer. These thermosetting resins are described below. Generally, the hardened product has a high glass transition temperature, and the specific permittivity is below 3.0 before and after hardening, and a thermosetting polyphenylene ether resin with adjustable flow characteristics is a particularly desirable resin. For the thermosetting polyphenylene ether resin, there is a composition of JP 6-1 6 5846, a composition of JP 7-7 66049, a composition of JP 7-7 3 7 5 6 7, a composition of JP 7-7 26 0 1 Composition of 3, etc. With respect to 100 parts by weight of the entire resin composition, the addition of 1 to 20 parts by weight of a polystyrene polymer has characteristics of excellent smoothness and toughness of the resin film. This paper music scale is applicable to China National Standard (CNS) Α4 specification (2ίΟ × 297 mm)-^ ------- · --- 奘 ----- ^-^ Order I ---- line- (Please Read the notes on the back before filling out this page) • 4 496 14 A7 B7 Printed by the Consumers' Cooperative of the Central Government Bureau of the Ministry of Economic Affairs 5. Description of the invention (8) The polystyrene polymer here refers to the average of styrene Polymer or styrene knot unit number is any thermoplastic copolymer with 80% or more of the total number of units. P Weight average molecular weight is more than 10,000. Ideal Q The polydivinylbenzene of the present invention refers to divinyl and / In a polymer obtained by polymerization or copolymerization of a dienylbenzene derivative in which a hydrogen atom is substituted with an arbitrary atomic group> Divinylbenzene and / or two unsaturated benzene derivatives of divinylbenzene One of the double bonds is polymerized, and one unsaturated double bond remains. This polymer has, for example, Flat 4 — 1 9 0 2 polymer 0 In the total number of repeating units, the repeating unit of divinyl or divinylbenzene derivative occupies more than 5%, more preferably 10% or more is more desirable. The weight average molecular weight is' — More than 10,000 is ideal. The following describes the polyfunctional cyanate resin of the present invention. The polyfunctional cyanate is a triazine ring formed by the thermal tri-quantitative reaction of carbon 1 to carbon two bonds. The ester is used as a multifunctional cyanate resin in the form of a monomer or a partially prequantified prepolymer. In the present invention, a prepolymer that is semi-solid at room temperature is used because it is a thin film. Ideally, the polybutadiene of the present invention refers to a well-known poly (1 »3-butadiene) 6 with a number average molecular weight of 5,000 or more and 50,000 or less. Ideally, 5,000 or more and 10,000 or less is more reasonable. ♦ 5 0 0 or more and 5 0 0 or less is ideal. 0 g g viscosity is too low when the average molecular weight is less than 5 0 > viscosity is too high when it exceeds 50,000 β triallyl cyanurate and / or triene Polymers and / or copolymers of propyl isourethane are also suitable as the thermosetting -1T line of the resin-containing gold tin foil of the present invention. The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm). Please read the note on the back-Xiang then i -11-4 49 6 1 4 Printed by the staff of the Central Government Bureau of the Ministry of Economic Affairs, printed by the cooperative A7 Β7 V. Description of the invention (9) Use of sex resin. The polymer or copolymer is heated in the presence of a triallyl isocyanurate and / or triallyl isocyanurate in a solvent such as toluene, such as a polymerization initiator of an organic peroxide. , Part of allyl is polymerized to obtain. The molecular structure can be linear or branched. Weight The average molecular weight is preferably from 1,000 to 100,000, and more preferably from 2,000 to 100,000. In the present invention, when used in combination and in order to impart desired properties, a filler or an additive may be added to the thermosetting resin within a range that does not affect the original characteristics. The filler can be fibrous or powdery, for example, there are dioxide chopping, alumina 'titanium oxide, barium titanate' talc, mica, glass beads, glass hollow balls, polyamide fibers, etc. In order to reduce thermal expansion in the present invention Additives such as flame retardant, anti-oxidant, heat stabilizer, antistatic agent, plasticizer, pigment, dye, colorant, etc. can be used as filler additives. There are significant effects in terms of electrical and electrical properties. For example, silicon dioxide and glass hollow spheres are the most ideal inorganic fillers. The thickness of the thermosetting resin film is not particularly limited, but it is more preferably 10 jum or more, more preferably 20 / zm or more, and most preferably 30 / zm or more. Laminate construction is difficult when the film thickness is extremely thin. Various methods can be used to form the thermosetting resin film. Ideal methods include, for example, a method in which a resin varnish in which the resin is dissolved or dispersed is applied and dried. The solvent can be selected to suit the resin. Yet another desirable method is, for example, a method of forming a film by solvent-free melting. The size of this paper applies to China National Standard (CNS) Α4 specification (210X297 mm) II- — I--: --- ^ ----- ^^ IV ----- line- (Please read the Note ^ Please fill in the wood page) -12-449614 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (10) There is no limitation on the method for attaching the gold foil to the thermosetting resin film. The resin film may be formed directly on the metal foil, or a person who has previously formed a film may be adhered to the metal foil by means such as heat and pressure. A step of forming a metal film on a film-forming resin by a known method such as vapor deposition, thermal spraying, or chemical plating may also be adopted. * The thermosetting resin is a thermosetting polymer containing a thermosetting polyphenylene ether resin or a polystyrene polymer. When the phenylene ether resin is produced by a method of forming a film from a resin varnish of a thermosetting resin, the resin film can be produced with high productivity by using the special production method of the seventh invention and the eighth invention, without powder falling off, and Resin-containing gold foil with good quality without drying cracks on the surface of the resin film. Solvents used in the preparation of polyphenylene ether resin varnishes such as aromatic hydrocarbons such as benzene, toluene, xylene, methylene chloride, chloroform, and trichloroethylene. And other halogen solvents such as THF. These can be used alone or in combination. A method for applying a varnish composed of a thermosetting polyphenylene ether resin and a solvent, for example, using an air pressure coater | blade coater, bar coater, knife coater, gravure coater, reverse roll coater | cast film Coating method for equipment such as a machine. Methods for drying the coating film include, for example, hot air drying, roller heating drying, infrared drying, and far-infrared drying. * These resins can be used alone or in combination of two or more. Next, the evaporation rate when a resin varnish * composed of a thermosetting polyphenylene ether resin and a solvent is applied and then the coating film is dried will be described. In the present invention, a specific method for controlling the evaporation rate when the coating film is dried, for example, adjusting the temperature of hot air required for drying, the amount of air *, and in order to control the temperature of evaporation, high boiling IL ^ can be added to the varnish. ^ ± ----- ^ -; Order ----- line (please read the notes on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 449614 A7 B7 V. Description of the invention ( u) Point solvent. Examples of such high-boiling solvents are chlorobenzene, sulphur, anisole and the like. In the present invention, the evaporation rate of the solvent must be below 0.10g / (cm2, mi η), and the ideal evaporation rate is above 0.001g and below 0.10g (cm m). When it exceeds 0.1g (cm m, the sheet surface will be printed by the Shell Standard Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs to produce dry cracks. When the coating film is dried, the evaporation rate is less than 0.001 g / (cm2 · mi η), The productivity of the resin-containing gold box will decrease. The thermosetting resin is a thermosetting polyphenylene ether resin or a polystyrene polymer-containing thermosetting polyphenylene ether resin. When a resin melting film-forming manufacturing method is used, the first The special manufacturing method of the ninth invention is capable of manufacturing a resin film metal foil with good quality that does not contain powder falling off and has no dry cracks on the surface of the resin film. The manufacturing method of the ninth invention of the present invention is characterized by high productivity. In order to select a resin melting temperature that does not substantially decompose the thermosetting polyphenylene ether resin. In order to melt and decompose the thermosetting polyphenylene ether-based resin without substantially decomposing and decomposing it, a melt extruder device and a melt extruder are selected. Melt extrusion temperature. In order not to melt and extrude the thermosetting polyphenylene ether resin in a substantially decomposed state, a melt extrusion temperature of 5 CTC or more and 300 ° C or less is selected. Melt extrusion methods include, for example, a uniaxial or multiaxial spiral type melt extruder with a die at the front end of the extrusion section, or a uniaxial or multi-axis die with a die at the front end of the extrusion section with a drilled area. Method of shaft spiral type melt extruder and other devices *

Please read the notices on the back before filling in. Fun · This page I-line paper size is applicable to Chinese National Standard (CNS) A4 (210X297 mm) -14-Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 4 49614 a? B7 V. Description of the invention (12) The method of adjusting the resin flow rate to be 1% to 50%, ideally 5% to 50%, and more preferably 7% to 45% is not limited. For example, there are methods by adjusting the chemical structure or composition of the resin. It is also an effective method to adjust the resin flow rate by partially curing the thermosetting resin with a resin flow rate that is too high by a method suitable for various resins such as heat treatment or photochemical treatment. The resin-coated gold foil for multilayer wiring boards of the present invention is formed of a protective sheet that can be easily peeled from the surface of a thermosetting resin film. It is practically easy to use and becomes a useful material for multilayer wiring boards. The thermosetting resin film and the protective sheet from which the resin film is peeled are composite sheets formed by adhering in this order. In other words, the tenth invention of the present invention. Regarding the manufacturing method, the protective sheet is pressed and attached to the resin The step of filming a metal foil, and conversely, the step of adhering a gold foil to a step of forming a thermosetting resin film on a protective sheet first. An easily peelable sheet such as a desirable resin film. When considering heat resistance, ideally, polyethylene, polypropylene, polyethylene phthalate, etc. The surface of the film can be demolded with silicone or fluororesin. The use of the resin film metal foil for multilayer wiring boards of the first to sixth inventions of this case is very industrially useful * because this metal foil can be used to obtain the insulation of multilayer wiring boards. A practical multilayer wiring board with a fixed layer thickness and a constant characteristic impedance, and can significantly improve the electrical characteristics of electronic equipment using the multilayer wiring board, especially electronic devices. When the thickness of the insulation layer and the characteristic impedance deviation are within ± 10%, it is considered to be a certain value in practice. Such deviation does not adversely affect the electrical characteristics of the multilayer wiring board or semiconductor device. The thermosetting paper size is applicable to the national standard (CNS) A4 specification (210X 297 mm) l ·-^-^ --- 臾 ----- ^ --- --r ----- line -(Please read the precautions on the back before filling in this page) -15-449614 Gong, Λ? Person '* Π V, hair] y] Explanation (ΐ3) The specific dielectric ratio of the following resins is above 1 MUΗ Z frequency The ideal area is 3.0 or less, and the specific permittivity of the resin after heat curing is also lower < " · Read the precautions before you write " When the specific dielectric ratio of the insulating layer is low, the width of the wiring can be increased. Therefore, even if the wiring is formed in the same processing step, the deviation of the characteristic impedance is reduced, and crosstalk is reduced. These multiplying effects make the multilayer wiring board and electronic device of the present invention have extremely excellent electrical characteristics. In the 3rd to 6th inventions, the glass transition temperature of the cured thermosetting resin is above 180 ° C, which can obtain extremely excellent Reliable multilayer wiring board. When the glass transition temperature of the thermosetting resin is lower than 180 ° C, the insulation resistance may be reduced due to the movement of the conductor during long-term use of the device, which may cause the device to malfunction. Glass transition temperatures above 200 ° C are more desirable. The glass transition temperature was measured using a Reovibron (Dynamic Viscoelasticity Measurement Apparatus) manufactured by Orientec Corporation at a temperature rise rate of 2 ° C / m η, 3 5 Η Z. In the 11th invention and the 12th invention, the specific permittivity of the resin after thermal curing is 1 MHz or more and the frequency is 3.3 or less. These multilayer wiring boards and semiconductor devices can obtain excellent electrical characteristics. The dielectric constant is more preferably below 3.0. When the specific permittivity exceeds 3.3, the delay time per unit length of the wiring increases, and the timing margin is reduced in high-speed digital circuits, and the cycle frequency cannot be increased. Moreover, the conductor loss at the square ratio of the specific permittivity increases, Therefore, in high-frequency circuits, the signal level tolerance is reduced, narrowing the available frequency band. In addition, the characteristic impedance deviation and the increase of crosstalk affect the operation of the circuit. The structure of a multilayer wiring board according to the 11th invention is shown in Fig. 2 and Fig. 2. 3 is a cured thermosetting resin wax. 4 is the task of electrical insulation, the paper scale is suitable / 彳: China and Fujian National Standard Soap < CNS) Λ4 Specification (210 X Male 1)-16-

No. 85115709 Patent Application A7 Revised Chinese Manual May 7th of the Republic of China, V. Description of the Invention (14) The intended board material, 5 is a via connection hole and 6 is a plated through hole. An example of a method for manufacturing a sequential multilayer wiring board according to the eleventh invention is shown in Fig. 3 ', and examples of the manufacturing method will be described in order. (Please read the back of the book first; fill in this page before filling in this page.) (1) For example, a laminated board with copper foil on both sides * First, conductors 7 are formed in advance on both sides of the electrically insulating plate-like object 8, and then manufacturing begins. (2) For example, the conductor 7 is formed into a circuit circular shape by a known method such as engraving. (3) The thermosetting resin film-attached metal foil of the present invention is laminated by a known means such as heat and pressure to form a conductor layer 9 and a thermosetting resin layer 10 after thermosetting. (4) Forming the perforations 1 1. (5) After electroless plating, electroforming of copper by a known method is performed to form the conductive film 12 | After the connection hole is obtained, a circuit type is formed in the same manner as in (2). (6) The same method as (3) uses the thermosetting resin metal foil of the present invention to form a new conductor layer 13 and a new thermosetting thermosetting resin layer 1 4 * Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs ) When necessary, the through-holes can be formed through the entire multilayer wiring board manufacturing method. (8) The method of (5) is the same as that of (5). After electroless plating, copper is electroplated by a known method to form a conductor layer 1 Θ ′ to obtain connection holes and connection through holes, and then form a circuit pattern. The silver scale of this paper applies the Chinese National Standard (CNS) A4 specification (210 * 297 public love) 449614

欠 消 f ;， 合 ft ί [. \ ..Ri- '·; | ζ ________ πϊ "乂 Bu V. Description of the invention (15) ---- Figure 3 illustrates a 6-layer substrate using the sticker of the present invention In the case of a thermosetting resin film metal foil, a multi-layer wiring board with various layers can be sequentially manufactured by repeatedly forming perforations, connecting holes and circuits. The structure of the electronic device of the 12th invention is shown in FIGS. 4 to 6. The first invention of the present invention is characterized in that the electronic device has an arbitrary structure. For the multilayer wiring board used, the excellent electrical characteristics of the electronic device can be obtained by using the multilayer wiring board of the present invention. Wiring means for connecting electronic components to the multilayer wiring board Suitable items can be selected according to the structure. For example, connecting wires, contact pieces, etc. Figures 4 to 6 | 17 is the multilayer wiring board of the present invention, 18 is a conductor, 19 is a semiconductor chip, and 20 is a dielectric body , Capacitor * inductor, and / or individual electronic components such as impedance body, 21 is a sealing means, 22 is a solder ball > 23 is a heat sink, 24 is a connecting wire, 25 is a metal pin, and 26 is a silicon chip. In the electronic device of the 12th invention, particularly, The transmission speed of the air signal is designed to be more than 16.5cm / ns, and the comprehensive heat resistance temperature of the multilayer wiring board is selected to be 180 ° C or more. This is the thirteenth invention of this case. Although the electronic device has various structures, the invention It is a semiconductor wafer related to silicon, gallium arsenic, etc., or a semiconductor cut from an alloy block, or the semiconductor is mounted on a carrier, etc., making it easy to use, dielectrics, capacitors, inductors, and / or resistors. And other electronic components, and the multilayer wiring boards on which these are mounted are necessary components. Use of the wiring formed inside and on the surface of the multilayer wiring board 1 has a signal transmission speed of 16. 5 cm / ns This paper thick scale is suitable for China Garden House Winter (CNS) Λ-ί;. · ITToTTg '-", · 18 ~: 449614 jf: K; and hf: 乂, i'i Announcement 5 and f — capture charge ”16 wood paper 烺The scale is applicable to the Chinese family ’s mouth (CNS) in order to use (210 V. When the invention is described above. Not only reduces the delay time of electronic devices, but also reduces the chaotic phenomenon of rising and falling digital signals of high-speed signals. Excellent electronic device. This is the present One of the obvious effects of the Ming. In an actual multilayer wiring board, the electrical signal is transmitted by the electric field vibration between the signal line and the corresponding ground potential surface | Therefore, the mutual position of the signal line and the ground potential conductor must be considered when designing And the dielectric characteristics of the insulating material occupying the space. On the contrary, the mutual positional relationship between the ground potential conductor and the power source potential conductor, and the dielectric characteristics of the insulating material between them are not very important. The heat-resistant temperature of the multilayer wiring board An effect can be obtained above 180 ° C. Electronic devices require extremely stable operating characteristics in high-speed digital circuits and high-speed digital / analog mixed-load circuits. By setting the heat-resistant temperature of the multilayer wiring board to 180 ° C or more, the characteristics of the electronic device of the present invention are difficult to change with respect to temperature and temperature changes. The multiplying effect of these two items makes the electronic device of the thirteenth invention of the present case applicable as a component for a high-speed digital circuit and a high-speed digital / analog mixed circuit. The heat-resistant temperature referred to in the thirteenth invention refers to the temperature closest to room temperature among several temperatures above room temperature, such as the temperature at which thermal decomposition is started, and the phase transition point. The multilayer wiring board of the present invention is a composite of various materials that are practical, but in the present invention, the temperature closest to room temperature among the individual heat-resistant temperatures of these various materials is the heat-resistant temperature of the multilayer wiring board. Practically, mixed materials such as resins and ceramics can also be used as components of composites. In the sequential multilayer wiring board of the present invention, conventional plating vias can be formed.

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4496 1 4 Consumption cooperation by employees of the Central Bureau of Standards of the Ministry of Economic Affairs, Du printed Α7 Β7 V. Description of the invention (17) The wiring layers are formed in sequence, but for high-density wiring, it is ideal to connect the layers by forming via connection holes. It may also include a through hole of a via connection hole. Any method can be used for punching and electrical connection between layers. It is not necessary to limit, the following describes the steps of forming the via connection hole. Via connection hole formation is performed on the surface metal foil by processing such as etching to expose only the portion where the via connection hole is to be formed, and the thermosetting resin layer is exposed. Then, the laser is excited by laser, carbon dioxide laser, YAG laser, etc. Removal of the resin part by spray processing, dry etching such as ions or plasma, or wet etching of corrosive chemicals, exposing the underlying gold foil layer, and then plating or spraying on the inner wall of the resin hole Form a gold tincture film for interlayer connection, or plug a conductive slurry into the resin pores to connect. The opening method of the metal foil and the resin layer has been described separately. Of course, an electric drill can also be used to open the non-through holes. The multilayer wiring board of the present invention is formed by a lamination method, but a part of the layers may be formed by other layer forming methods, such as a laser processing of a photosensitive insulating resin or a thermosetting resin, and a conductor forming method of non-electrolytic plating. In the electronic device of the present invention, for example, when the electronic component is mounted on the multilayer wiring board of the present invention, and when it is mounted on other plates, such as a gold plate or a ceramic plate that also radiates heat, the present invention The multilayer wiring board is processed into a groove shape, and then adhered to the plate shape. The multi-layer wiring board of the present invention is formed by a lamination construction method, so that a multilayer wiring can be formed on an arbitrary plate. The plate itself is a metal plate, a metal wiring board, a ceramic plate, a ceramic multilayer wiring board, etc., which have heat dissipation, wiring functions, or functions with special electrical characteristics. The following examples illustrate the present invention more clearly, but the present invention is not subject to this practical standard (CNS 丨 Λ4 gauge; 2 丨 GX297 mm) ~ ^ '-20-! L · ---- -: --- 奘 ----- ^-^ tr—r ---- line --- (Please read the notes on the back before filling out this page) 4496 1 4 A7 B7 Employees of the Central Prospective Bureau, Ministry of Economic Affairs Printed by a consumer cooperative V. Description of the invention (18) Limited by the example β (Example 1) The thermosetting resin uses a thermosetting polyphenylene ether resin with a specific permittivity of 2.7 and a metal foil using a 12em thick printed circuit board A resin film-coated metal foil for a multilayer wiring board was produced using an electrolytic ketone foil. The thickness of the resin film was 60. The resin flow was 3%. The thermosetting polyphenylene ether resin was thermally cured, and the glass transition temperature was measured. The temperature was measured at 220 ° C. The specific permittivity of 1MH z is 2.8. 0.3mm thick 18 / zm copper foil on both sides. The thermosetting polyphenylene ether is laminated on both sides of the copper laminate to form the inner layer circuit. The two sides are laminated on the metal foil of the thermosetting polyphenylene ether film. Then form the outer layer circuit to make a 4 layer wiring board of 3 3 0mmx4 00mm. The characteristic impedance of the wiring of the 4-layer wiring board was measured to be within ± 10%. A part of this 4-layer wiring board was buried in epoxy resin, and the cross-section was ground and observed with an optical microscope. It was found that the inner layer circuit was completely buried in the thermosetting polyphenylene ether resin, and there were no air bubbles. (Example 2) A thermosetting resin using a thermosetting polyphenylene ether resin with a specific permittivity of 2.8 at 1 MHz, and a gold foil using an electrolytic ketone foil for a printed circuit board with a thickness of 1 2 / zm were used to produce a resin for multilayer wiring boards. Film copper foil. The thickness of the resin film is 60 μm »The resin flow rate is 39%. The thermosetting polyphenylene ether resin was thermally cured, and the glass transition temperature was measured. The specific permittivity of 2 10 ° C »1 M Η ζ was 9. The thickness of the copper foil on both sides is 0.3mm. This paper is compliant with the Chinese National Standard (CNS) A4 (210X297mm). Please read the notice on the back of it, and fill in this page. Μ

ST line -21-4496 1 4 A7 B7 V. Description of the invention (19) Thermosetting polyphenylene ether on both sides with copper layer and pasting the above thermosetting polyphenyl to make 330mmx40 wiring board. The wiring characteristics of the same multilayer wiring board are 3 5mmx3. The semiconductor is mounted on a 5mm digital semiconductor test circuit and the semiconductor is mounted at 100MHz. Hygroscopic treatment in this pressure cooker was performed for 3, 000 hours, and the reciprocation between ec and 1 2 5 ° C was repeated for 1,000 times. No inner-layer electric ether resin film metal foil was formed on the laminate. The 4-layer wiring board with a resistance of 0mm is within ± 10%. The 4-layer device for semiconductor devices with copper foil and resin on both sides is equipped with a variable metronome device. It is found that the semiconductor device can be placed at 1 2 and the frequency is within 100MHz. No adverse effects were found in the hot and cold shock test, which had an impact on the work. Circuit, the outer layer circuit is formed on both sides. The stability characteristics of the four layers were measured. The copper-clad laminated board was used as the wiring board, and the trial frequency of the test device equipped with the generating device was found to be 1 ° C · 2 atmospheric operation. Please read the precautions before you fill in the 6.5, and then fill out the book, Bengo. 1 (Embodiment 3) The staff of the Central Standards Bureau of the Ministry of Economic Affairs printed the thermoset polymer of Embodiment 2 for the cooperative. 100 parts by weight of phenyl ether resin plus 4 parts by weight of polystyrene with an average molecular weight of 500,000. 8。 The thermosetting polyphenylene ether resin containing this polystyrene has a specific permittivity of 1 MHz of 2.8. A thermosetting polyphenylene ether resin containing this polystyrene and an electrolytic copper foil for a printed circuit board having a thickness of 12 µτη were used to form a resin film copper foil for a multilayer wiring board. It is easy to form a resin film with a smooth gloss and a thickness of 60 mm. The resin flow is 40%. 9。 The thermosetting polyphenylene ether resin was thermally cured to measure the glass transition temperature, and the specific permittivity of 210 ° C »lMHz was measured to be 2.9. Both sides are attached with 1 8 copper foil 0.3mm thick thermosetting polyphenylene ether. Both sides of the paper are applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) -22-449614 A7 B7 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs-Industrial and Consumer Cooperative V. Description of the invention (20) The inner layer circuit is formed on the copper-clad laminated board. The two sides are laminated with the above-mentioned thermosetting polyphenylene ether resin film metal foil. Then the outer layer circuit is formed to form a 4 layer wiring board of 3 3 Ommx 4 0 mm. The characteristic impedance of the wiring of this 4-layer wiring board was measured to be within ± 10%. The same multilayer wiring was used to form a 3 5mm x 3 5 mm 4 layer wiring board for semiconductor devices made of copper foil with resin film and copper clad laminates on both sides. It was equipped with digital semiconductors and was used as a semiconductor device. The semiconductor device was mounted on a test circuit equipped with a variable beat generating device, and the working frequency was measured to be within 100 MHz. The semiconductor device was placed in a pressure cooker at 2 1 ° C and 2 atmospheres to absorb moisture, and the operation of 100 MHZ was confirmed. It was found that there was no adverse effect on the work within the processing time of 3000 hours. During repeated cold and hot shock tests between 65 ° C and 125 ° C, no effect on work was found within 1,000 times of repeating. (Example 4) A thermosetting resin was prepared by mixing 90 parts by weight of poly (p-divinylbenzene) having a molecular weight of 50,000 and 10 parts by weight of bis (iminoimide) of the following structural formula 1. The specific permittivity of this thermosetting resin at 1 MHz is 2.7 »

Structural formula 1 A thermosetting resin containing this polydivinylbenzene and an electrolytic copper foil for a printed circuit wiring board having a thickness of 12 are used to make a resin film copper foil for a multilayer wiring board. The thickness of the resin film was 60 gm. Resin flow is 15%. Standards for clothing and paper are in accordance with Chinese Standards (CNS) A4 (210X297 mm) (Please read the cautions on the back before filling in this page) -23-449614 AT B7 Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Consumer Cooperatives V. Explanation of the invention (21) The thermosetting polydivinylbenzene resin was subjected to thermal curing to measure the glass transition temperature, and the specific permittivity of 460 ° CelMHz was measured to be 2.8. The inner layer circuit is formed on both sides of a copper laminate with a thickness of 1 .8 mm of a 0.3 mm thick thermosetting polyphenylene ether, and the above-mentioned polydivinylbenzene resin film metal foil is laminated on both sides. An outer layer circuit was formed to make a 4-layer wiring board of 3 3 mm x 400 mm. The characteristic impedance of the wiring of the 4-layer wiring board was measured to be a stable characteristic within 10% of soil. The same multilayer multilayer wiring board with resin film copper foil and double-sided foil-clad laminates was used to make a 3-layer wiring board for semiconductor devices of 3.5 mm x 3.5 mm. Digital semiconductors were used to mount the semiconductor devices. The semiconductor device is mounted on a test circuit equipped with a variable beat generation device. The measured working frequency is within 10 μMΗz. ≫ The semiconductor device is placed in a pressure cooker at 1 2 ° C and 2 atmospheres. Wet processing, confirming the work of 1 〇 Ο ΜΗ z, found no adverse effect on the work within the processing time of 3000 hours. During repeated cold and hot shock tests between _ 6 5 ° C and 1 2 5 aC, no effect on work was found until repeated 10,000 times. (Example 5) A bifunctional carboxylic acid ester preparation prepolymer of the following structural formula 2 was partially polymerized. The number average molecular weight of this prepolymer was 5 60, and the weight average molecular weight was 13,10. 100 parts by weight of the prepolymer, 1 part by weight of nonylphenol, and 0.25 parts by weight of cobalt octoate were mixed to prepare a polyfunctional cyanate resin. 9。 The dielectric rate of 1MHz of this thermosetting resin is 2.9. This paper size applies to Chinese standards (CNS > A4 size (210X297 mm) 丨 I τ .¾ -----; --- 3T ---; ----- line 丨 (Please read the back first Please note the ice sheet for the matters needing attention). -24-449614 A7 B7 V. Description of the invention (22) CH3

〇 ~ C = N Structural formula N = C-〇-^^ (Please read the notes on the back before filling in the flavor page) Use this multifunctional phthalate resin and electrolytic copper foil for printed circuit wiring boards with thickness of 12 A copper foil with resin film for multilayer wiring boards was produced. The thickness of the resin film was 60 jum. The resin flow was 41%. 0。 The multifunctional cyanate resin was thermally cured to determine the glass transition temperature, and the specific permittivity of 280 eC " lMHz was measured to be 3.0. 18-mm thick thermosetting polyphenylene ether printed on copper foil printed on both sides by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Foil and re-form the outer layer circuit to make a 4-layer wiring board of 3 3 0mmx4 00mm. Measured the characteristic impedance of the wiring of this 4-layer wiring board is within ± 10%. The stable characteristic is used to make a 3 5mm x 3 5mm semiconductor device for the same multilayer wiring board using copper foil with resin film and copper laminate on both sides. A multilayer wiring board is mounted on a digital semiconductor to produce a semiconductor device. The semiconductor device is mounted on a test circuit equipped with a variable beat generation device. The measured working frequency is within 100 MHz. The semiconductor device is placed in a pressure cooker at 1 2 ° C and 2 atmospheres to absorb moisture. ， Confirmed the work of 100 MHz, found no adverse effect on the work within the processing time of 3 000 hours ° and cold and hot shock test back and forth between _ 6 5 ° C and 1 2 5 ° C No effect on work was found until repeated 10,000 times. (Example 6) The paper scale is in accordance with the common Chinese National Standard (CNS) Λ4 specification (210X297 public holiday) -25-449614 A7 B7 Printed by the Consumers' Cooperative of the China Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (23) Average molecular weight of mixed numbers 1,000 parts by weight of polybutadiene of 3 1 0 • 2 parts by weight of dicumenyl peroxide to prepare a thermosetting resin. This thermosetting resin has a dielectric constant of 1 MHz of 2. 4 »Using this polybutadiene-based thermosetting resin and an electrolytic copper foil with a thickness of 12 for a printed circuit board to make a resin film for multilayer wiring boards. For 6 0. The resin flow rate is 43%. 5。 The polybutadiene-based thermosetting resin was thermally cured to determine the glass transition temperature, and measured the specific permittivity of 150 ° C »lMHz is 2.5. 0.3 mm thick thermosetting polyphenylene ether on both sides with a 0.3 mm thick thermosetting polyphenylene ether laminated on a copper laminate to form an inner layer circuit | These two sides are laminated with the polybutadiene-based thermosetting resin film metal foil laminated above. An outer layer circuit was formed to make a 4 layer wiring board of 3 3 mm x 400 mm. Measured the characteristic impedance of the wiring of this 4 麿 wiring board is within ± 10%. The stable characteristics are made using the same multilayer wiring board with resin film copper foil and copper foil laminated board on both sides to make a 3 5mm x 3 5mm semiconductor device. Multilayer wiring board | It mounts a digital semiconductor to make a semiconductor device. A semiconductor device is mounted on a test circuit provided with a variable beat generating device, and when the working frequency is measured, it is found that the device can operate within 100 MHz. (Example 7) A triallyl isocyanurate was placed in toluene and heated together with a peroxide to obtain a poly (triallyl isocyanurate) having a weight average molecular weight of 300. 90 parts by weight of this polytriallyl isouronic acid ester, 10 parts by weight of the triallyl isofluorourate monomer, and 2,5-dimethyl-1,2,5-di (third butyl) Base peroxy) hexyne-1 3 3 parts by weight for thermosetting This paper is sized for China National Standard (CNS) A4 (210X297 mm) — [L -------.--- Gas ----- ----- Order l · ------ Line · (Please read the notice on the back before filling this page) -26-Μ9614 Α7 Β7 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economy (24) A poly (triallyl isourethane) resin. The dielectric property of this thermosetting resin at 1 MHz is 3.1. The poly (triallyl isocyanurate) -containing thermosetting resin and an electrolytic copper foil for a printed circuit board having a thickness of 1 2 / zm were used to make a copper foil for a resin film for a multilayer wiring board. The thickness of this resin film is 60. The resin flow rate is 25%. The thermosetting poly (triallyl isocyanurate) resin was thermally cured, and the glass transition temperature was measured to determine a temperature of 350 ° C. The specific dielectric ratio of 1 MHz is 3.3. Both sides are pasted with 18 # m copper foil 0.3mm thick thermosetting polyphenylene ether. Both sides are pasted on a copper laminate to form an inner layer circuit. The two sides are laminated with the poly (triallyl isocyanurate) resin film gold foil. • Form the outer layer circuit to make a 4 layer wiring board of 3 3mm x 400mm. Measured the characteristic impedance of the wiring of this 4-layer wiring board is within ± 10%. The stable characteristic is used to make a 3 5mm x 3 5mm semiconductor device for the same multilayer wiring board using copper foil with resin film and copper laminate on both sides. A multilayer wiring board is mounted on a digital semiconductor to produce a semiconductor device. The semiconductor device was mounted on a test circuit equipped with a variable beat generating device, and the working frequency was measured to be 100 MHz. This semiconductor device was placed in a pressure cooker at 2 1 ° C and 2 atmospheres to absorb moisture, and the operation of 100 μΗ was confirmed. No adverse effect on the work was found within the processing time of 3 000 hours. During repeated cold and hot shock tests at a temperature between 65 ° C and 125 ° C, no effect on the work was found up to 100 times. (Comparative Example 1) A copper-clad laminate was used instead of the thermosetting polymer paper of Example 2 to apply the Chinese National Standard (CNS) A4 specification (2 丨 0 × 297 mm) '-27-. „Equipment ~ 1T— ------ m ~ I (Please read the notes on the back before filling in this page) a # 96l4 A7 B7 Printed by the Consumers' Cooperatives of the Ministry of Economic Affairs, China Bureau of Standards and Commerce 5. Inventive Notes (25) Phenyl ether resin 8。 同 实施 例 The same as the fat film copper foil, measured resin flow rate of 6 5%. The epoxy resin curing measured glass transition temperature of 150 ° C »specific permittivity at 1MHz frequency is 3.8. 同 实施 例The method of 1 makes a 4-layer wiring board with a measured characteristic impedance of ± 1 6%. The semiconductor device equipped with a digital semiconducting diode has an operational frequency of 80 MHz. It is a pressure cooker at 1 2 ° C and 2 atmospheres. A humidification test was performed within 80 hours at 80 MHz, and the semiconductor device was subjected to a cold and heat shock test of _ 65 eC and 125 ° C. It was found that it failed to work after repeated 300 times. Example 8 to 10) The coating on one side of electrolytic copper foil for a printed circuit board with a thickness of 12 was implemented by The resin varnish composed of the thermosetting polyphenylene ether resin and toluene solvent of 2 forms a dry resin film thickness of 50. When drying the coating film, a hot air dryer is used to adjust the temperature of the hot air, and the air volume makes the residual solvent concentration of the coating film reach 〇lg / (cm2-min), Example 10 is 0. 〇 The evaporation rate of 2 0 0 0 0 0 P pm solvent in Example 8 is 0.005 g / (cm2.min), Example 9 is 0. 5g / (cm2-mi η). There is no dry crack on the coated surface of the obtained resin-containing sheet, processing such as cutting of gold foil with resin film or sequential lamination when making multilayer wiring boards · Multi-layer wiring board with high reliability can be made. (Comparison 2) The paper scale is applicable to China National Standard (CNS) A4 specification (2 [〇 乂 297mm)! R —--: --- 奘 --- -^ ------ line— (Please read the notes on the back first. ¾ Then fill in the flavor page) -28 _ 4 4 9 6 1 4 a? Β7 Printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards, Ministry of Economic Affairs 51 V. Description of the invention (26) Except that the coating film of Example 2 is dried, the temperature of the hot air * air volume is adjusted so that the evaporation rate of the solvent becomes 0.2 g / (cm2 * mi η), the rest is the same as in Example 8. 10 Production of metal foil with resin film. The coated surface of the obtained sheet had dry cracks, powders came off during processing such as cutting of metal foil with resin film or sequential lamination to make multilayer wiring boards. When the cross section of the multilayer wiring board was found, the resin embedded in the circuit part was found to be defective β (Examples 1 to 1 3). The thermosetting polyphenylene ether resin of Example 2 was used to electrolyze a printed circuit board with a thickness of 1 2 // m. A resin thickness of 50 was formed on one side of the copper foil after drying, and the resin was melt-extruded to form a resin film on the copper foil. The melt extrusion device is a biaxial screw type melt extruder with a T die at the front end of the extrusion part. The melt extrusion temperature is adjusted by means of Example 1; 80 ° C, Example 12; 120 aC. Example 13; 250 ° C. The surface of the obtained gold foil with resin film is smooth, and there is no powder fall-off during processing such as cutting of the gold foil with resin film or sequential lamination to produce multilayer wiring boards, and high-reliability multilayer wiring boards can be produced. (Comparative Example 3) Except that when the melt-formed film of the thermosetting polyphenylene ether resin of Example 2 was produced, the temperature of the melt extrusion was 3 50 ° C, the rest of the method was the same as that of Example 1 to produce a metal film with a resin film. Foil. The surface of the prepared metal foil with resin film is not smooth. When cutting the resin film and gold foil, etc., or when the multilayer wiring board is laminated sequentially, no powder comes off. But observe the size of the multilayer paper. Applicable to China National Standard (CNS) Α4 rule (210 '< &297; «) (Please read the notice on the back before filling this page) -29-449614 A7 B7 Employee Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs Oxygen printing 5. Description of the invention (27) When the cross section of the wiring board is broken, the resin embedded in the circuit part may occur. (Example 1 4) A polyethylene film having a thickness of 10 μm was pressure-bonded to a resin surface of a metal foil with a thermosetting polyphenylene oxide film made in Example 2 by hot-rolling at 100 ° C. as the resin. The protective sheet β of the film metal foil contains the protective sheet and is directly wound on a cylinder with a diameter of 10 cm in the state, and stored at 2 3 ° C for 1 week. The surface of the metal foil is not contaminated by the thermosetting polyphenylene ether resin. The edges of the polyethylene film after being pressure-bonded are easily peeled off with a finger. (Example 15) A multilayer wiring board using a thermosetting polyphenylene ether resin having a heat-resistant temperature of 200 ° C as an insulating resin was produced. The wiring board had 6 layers in total. The heat-resistant temperature of this multilayer wiring board was 200 ° C. The electrical signal transmission speed of this multilayer wiring board was measured by TDR (Time Domain Reflection Method) to be 17.5cm / n s or more. This multi-layer wiring board is equipped with programmable detail information group gate array chip, damping resistor, and capacitor, and then sealed with resin to make an electronic device. This electronic device works normally when mounted on a digital circuit board with a reference cycle of 100 μΗ. This digital circuit board was placed at 60 ° C, and the relative humidity was 90%. * It can work normally after being humidified for 10,000 hours. 9 (Comparative Example 4) Using epoxy resin for general copper-clad laminates is Multi-layer insulation resin with this paper standard General Zhongguanjia standard (CNS) 8 4 specifications (210X297 mm) Please read the note on the back Φ, fill in the items, this purchase Chu-order _ 30-f449 6 1 4 A7 _ B7 5 Explanation of the invention (28) The wire board replaces the multilayer wiring board of Example 15 and the fastest transmission speed of electrical signals is found by TDR to be 15.0 cm / ns. The same components as those of Example 15 are used to make an electronic device. The operation test with a reference beat of 1 〇 OMH z found that it will not work properly. Reduce the reference beat to 7 OMH z can work. This digital circuit board is placed at 60 ° C and 90% relative humidity, and humidified. Cannot work normally after 1000 hours. Industrial Applicability The high-performance multilayer wiring board with stable characteristic impedance can be manufactured by the laminated construction method using the thermosetting resin film metal foil for multilayer wiring board of the present invention. According to the present invention The manufacturing method can Polyphenylene ether film metal foil with excellent quality "The resin film metal foil of the present invention can be pressure-bonded and inexpensive resin surface protective sheet, and can be used as a resin film metal foil with excellent storage and usability. Multilayer of the present invention The wiring board is stable in characteristic impedance and has excellent electrical characteristics, so it can manufacture high-performance high-speed digital circuits and high-frequency circuits that have not been available in the past. The electronic device of the present invention is capable of high-speed operation and excellent high-frequency operation that was not available in the past. Apparatus. This paper size is in accordance with national standards (CNS > A4 size (210 X 297 mm). Please read the back matter before filling in this page.)

-iT Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -31

Claims (1)

Annoying Committee I tKEJ ^, f Printed by the Consumer Cooperatives of the Central Sample Bureau of the Ministry of Economic Affairs 6. Application scope of patents-t- 1 | No. 8 5 1 1 5 7 0 9 Patent String Request 1 1 Chinese String Request Patent Scope amendment [1 February 1988, revision 1 I, please 1 1 1 A kind of resin-coated gold turbid foil for successive multilayer wiring boards. Its characteristics are read in advance. I is a metal foil with a frequency of 1 μΗ Ζ or more on one side. In the field i ratio dielectric read back 1 | Thermosetting resin film with a rate of 3.3 or less »Resin flow rate is 1% or more Note 1 1 I 50% or less. Item 1 1 2. A type of resin film metal foil for successive multilayer wiring boards, which is filled with features 1 This is a metal foil with a specific dielectric sheet «· 1 1 ratio of 3 in the frequency domain on one side of the metal foil. The flow rate of the thermosetting resin film of 3 or less is 5% or more and 1500% or less. 1 1 3 If the multi-layer wiring is successively applied to item 1 or item 2 of the scope of patent application 1 Order I resin metal foil for board I The thermosetting resin is formed by containing 1 / at inorganic filler 1 1 I. 1 Successive multi-layer wiring for item 1 or item 2 of the scope of patent application i 1 Resin film metal foil for boards in which the thermosetting resin is cured > Glass transition 4 The temperature is 18 0 ° C or more 9 J j 5. Successive multilayer wiring of item 1 or item 2 I 1 Resin film metal foil for board > where the thermosetting resin is a thermosetting polyphenylene ether tree 1 1 grease 1 1 6. Such as the sequential multilayer wiring board of item 5 of the scope of patent application 1 1 Lipstick film metal foil with a thermosetting resin in which the thermosetting resin is a polystyrene polymer-containing thermo 1 I curable polyphenylene ether resin 0 1 i [7. A sequential multilayer formulation Manufacturer of metal foil with resin film for plates 1 1 i through xl ruled paper label Guoguo Zhugong 4496 1 4 Β8 C8 D8 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economy A resin varnish composed of a thermosetting polyphenylene ether resin and a solvent is coated on the metal foil, and the obtained coating film is dried under the condition that the solvent evaporation rate is 0 to 10 g / (cm2.min) or less. On one side of the metal foil, there is a thermosetting resin film with a specific permittivity of 3.3 or less in the frequency range of 1 MHz or higher, and the resin flow rate is 1% or more and 50% or less. A method for producing a gold foil with a resin film for a multilayer wiring board is characterized in that a resin varnish composed of a thermosetting polyphenylene ether resin and a solvent is coated on the gold foil, and the obtained coating film is dried. Drying was performed under conditions where the residual solvent concentration of the coating film of the thermosetting resin reached 20000 ppm and the solvent evaporation rate was 0.10 g / (cm2 · mi η) or less. 9. The manufacturing method of resin film metal foil for successive multilayer wiring boards according to item 7 of the scope of patent application *, characterized in that the thermosetting polyphenylene ether resin is melted and extruded under conditions that do not substantially decompose. 10. The resin film metal foil for successive multilayer wiring boards such as item 1 or item 2 of the scope of patent application, which has a resin surface protective sheet that can be easily peeled off. 1 1. A sequential multilayer wiring board characterized in that the wiring layer is formed by sequentially laminating a resin film gold foil for a sequential multilayer wiring board such as the first or second item of the patent application. 1 2. An electronic device characterized in that the electronic components are connected using wiring means on a successive multilayer wiring board such as the item 11 in the scope of patent application. 1 3. If the electronic device in the scope of patent application No. 12 is made by (read the precautions on the back and then fill out this page) The paper size is applicable to the Chinese National Standard (CMS) A4 specification (210x297 mm) 449 6 1 4 b8 CS D8 VI. Patent application scope The electrical signal transmission speed is more than 16.5cm / ns, and the heat-resistant temperature is 180 ° C or more. Read the notes on the back, and then fill out this page.) Ordered by the Ministry of Economic Affairs, Central Standards Bureau, Off-line Consumer Cooperatives. 31 This paper is fully applicable to China National Standard (CNS) A4 (210X 297 mm) -3 ~