JPH1044138A - Method and apparatus for dividing board - Google Patents

Method and apparatus for dividing board

Info

Publication number
JPH1044138A
JPH1044138A JP20608596A JP20608596A JPH1044138A JP H1044138 A JPH1044138 A JP H1044138A JP 20608596 A JP20608596 A JP 20608596A JP 20608596 A JP20608596 A JP 20608596A JP H1044138 A JPH1044138 A JP H1044138A
Authority
JP
Japan
Prior art keywords
substrate
dividing
board
pressure
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20608596A
Other languages
Japanese (ja)
Other versions
JP3796828B2 (en
Inventor
Norio Moriwaki
功雄 森脇
Tetsuo Tatsumi
哲夫 巽
Tadanori Higaki
忠則 檜垣
Kiyoshi Kurihara
潔 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP20608596A priority Critical patent/JP3796828B2/en
Publication of JPH1044138A publication Critical patent/JPH1044138A/en
Application granted granted Critical
Publication of JP3796828B2 publication Critical patent/JP3796828B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide method and apparatus for dividing a rectangular board constituted by continuously connecting small boards in one row into the small boards, without applying a pressure to component parts placed on the board. SOLUTION: A rectangular board 4 is clamped by feed rollers 2a, 2b from a side, fed forward, and simultaneously fixed. And, the board 4 is clamped at its forward end by oblique rollers 3a, 3b from the side, applied by a downward force, and divided into small boards. The board is clamped from the side, no pressure is hence applied onto the board, and a situation that a mounting component part is damaged can be avoided. An irregularity of the pressure due to an irregularity of heights of the parts is eliminated as compared with a method for applying the pressure to a board surface. And, a crack of an unnecessary portion of the board due to the irregularity of the pressure or a burr of the divided portion can be suppressed to a minimum limit.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品の実装な
どに使用する基板の分割、特に短冊状になった基板を最
終的な小基板に分割する、基板分割方法および基板分割
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for dividing a substrate used for mounting electronic components, and more particularly to a substrate dividing method for dividing a strip-shaped substrate into final small substrates.

【0002】[0002]

【従来の技術】プリント基板やセラミック基板などで
は、矩形状の1枚の基板に、分割溝で分けられて、多数
の小基板が縦・横連続して設けられ、個々の小基板上に
回路パターンが構成され、その上にICやトランジスタ
等の部品が搭載される。その後、矩形状の基板を、まず
スクライブ溝を用いて小基板が一列に連なった短冊状の
基板に分割し、さらに短冊状の基板から小基板へと最終
的に分割する。この短冊状の基板から小基板へと分割す
る方法として、従来から以下のような方法が用いられて
きた。
2. Description of the Related Art In a printed circuit board, a ceramic substrate, and the like, a large number of small boards are provided vertically and horizontally continuously on a single rectangular board by dividing grooves. A pattern is formed, and components such as an IC and a transistor are mounted thereon. After that, the rectangular substrate is first divided into strip-shaped substrates in which small substrates are arranged in a row using scribe grooves, and finally, the rectangular substrates are divided into small substrates. As a method of dividing the strip-shaped substrate into small substrates, the following method has been conventionally used.

【0003】図3に従来の基板分割装置の一例を示す。
図3は基板分割装置を横方向から見た図である。図3に
おいて基板分割装置は、ベルトコンベア7、送りローラ
ー8、加圧ローラー9で構成される。送りローラー8と
加圧ローラー9は同じ直径で、その回転軸は基板の進行
方向に直交して水平に配置され、加圧ローラー9の回転
軸は送りローラー8の回転軸よりわずかに低く配置され
ている。また、10は短冊状の基板、11は基板10に
搭載された搭載部品、12は基板10に設けられた分割
溝を示している。基板10は、複数の小基板が互いに分
割溝12を介して一列に連なっている。
FIG. 3 shows an example of a conventional substrate dividing apparatus.
FIG. 3 is a diagram of the substrate dividing apparatus viewed from the lateral direction. In FIG. 3, the substrate dividing device includes a belt conveyor 7, a feed roller 8, and a pressure roller 9. The feed roller 8 and the pressure roller 9 have the same diameter, and their rotation axes are horizontally arranged perpendicular to the direction of travel of the substrate, and the rotation axis of the pressure roller 9 is slightly lower than the rotation axis of the feed roller 8. ing. Further, reference numeral 10 denotes a strip-shaped substrate, 11 denotes a mounted component mounted on the substrate 10, and 12 denotes a dividing groove provided on the substrate 10. In the substrate 10, a plurality of small substrates are arranged in a line with each other via a dividing groove 12.

【0004】次に基板10の分割方法について説明す
る。基板10はベルトコンベア7で運ばれて送りローラ
ー8の方に送られる。送りローラー8は送られてきた基
板10を、ベルトコンベア7との間で押さえて上下に動
かないように固定すると共に、加圧ローラー9の方に送
り出す。加圧ローラー9の回転軸は送りローラー8の回
転軸より低く配置されているため、加圧ローラー9によ
って基板10の先頭の小基板、あるいはそこに搭載され
た搭載部品11の上から下向きに圧力が加えられる。こ
のとき、基板10の2番目の小基板はベルトコンベア7
と送りローラー8で固定されている。この結果、基板1
0の先頭の小基板は、2番目の小基板との間の分割溝1
2で分割される。
Next, a method of dividing the substrate 10 will be described. The substrate 10 is carried by the belt conveyor 7 and is sent to the feed roller 8. The feed roller 8 holds the sent substrate 10 between the belt conveyor 7 so as not to move up and down, and sends the substrate 10 toward the pressure roller 9. Since the rotation axis of the pressure roller 9 is disposed lower than the rotation axis of the feed roller 8, the pressure roller 9 applies pressure downward from the top of the small substrate of the substrate 10 or the mounting component 11 mounted thereon. Is added. At this time, the second small substrate of the substrate 10 is the belt conveyor 7
And the feed roller 8. As a result, the substrate 1
0 is the first small substrate and the dividing groove 1 between the second small substrate
Divided by two.

【0005】[0005]

【発明が解決しようとする課題】上記の基板分割方法で
は、送りローラー及び加圧ローラーが基板の部品搭載面
に対して圧力を加えるため、部品搭載の条件によっては
基板面に搭載された部品に対して上から圧力を加える可
能性がある。そのため、この方法では搭載部品にダメー
ジを与える可能性が強く、特にベアチップ搭載されてい
るような部品の場合には致命的になる。
In the above-described substrate dividing method, the feed roller and the pressure roller apply pressure to the component mounting surface of the substrate. On the other hand, pressure may be applied from above. Therefore, in this method, there is a strong possibility that the mounted component is damaged, and it is particularly fatal in the case of a component on which a bare chip is mounted.

【0006】また搭載部品は品種によってその形状が異
なる。加圧ローラーの位置を固定化してあると、特に搭
載部品の高さが異なる場合には、基板の種類によって加
圧ローラーによる圧力が変化する。そして、圧力条件が
安定しないため、基板が分割溝以外で割れたり分割部分
にバリ等が発生したりする可能性がある。
[0006] The shape of the mounted component differs depending on the type. When the position of the pressure roller is fixed, the pressure by the pressure roller changes depending on the type of the substrate, particularly when the height of the mounted components is different. Since the pressure condition is not stable, there is a possibility that the substrate is cracked at a portion other than the dividing groove or burrs are generated at the divided portion.

【0007】そこで本発明では、搭載部品に圧力を加え
ることなく、また搭載部品の形状によらずに一定の力で
基板を分割できる基板分割方法と基板分割装置を提供す
ることを目的とする。
Accordingly, an object of the present invention is to provide a substrate dividing method and a substrate dividing apparatus which can divide a substrate with a constant force without applying pressure to a mounted component and irrespective of the shape of the mounted component.

【0008】[0008]

【課題を解決するための手段】上記問題を解決するため
に、本発明の基板分割方法は、複数の小基板を一列に配
列してなる短冊状の基板を用意し、回転軸が垂直で、互
いに対向して逆方向に回転する一対の送りローラーを用
いて、前記基板を側面からクランプして前方に送り出す
工程と、回転軸が垂直方向に対して前記基板の進行方向
に傾斜し、互いに対向して逆方向に回転する一対の傾斜
ローラーを用いて、前記基板の先端を側面からクランプ
して前方下方に送り出すことにより先頭の小基板を前記
基板から分離・分割する工程を有することを特徴とす
る。
In order to solve the above-mentioned problems, a substrate dividing method according to the present invention provides a strip-shaped substrate in which a plurality of small substrates are arranged in a line, and the rotation axis is vertical. Using a pair of feed rollers rotating in opposite directions opposite to each other, clamping the substrate from the side surface and sending it forward, and a rotation axis is inclined in the direction of travel of the substrate with respect to the vertical direction, and faces each other. Using a pair of inclined rollers that rotate in the opposite direction, and separating and dividing the leading small substrate from the substrate by clamping the front end of the substrate from the side and sending it forward and downward. I do.

【0009】また、本発明の基板分割装置は、複数の小
基板を一列に配列してなる短冊状の基板を、小基板ごと
に分割する基板分割装置であって、回転軸が垂直で、互
いに対向して逆方向に回転する一対の送りローラーと、
前記送りローラーに対して前記基板の進行方向に位置
し、回転軸が垂直方向に対して前記基板の進行方向に傾
斜し、互いに対向して逆方向に回転する一対の傾斜ロー
ラーを有することを特徴とする。
Further, the substrate dividing apparatus of the present invention is a substrate dividing apparatus for dividing a strip-shaped substrate formed by arranging a plurality of small substrates in a line into small substrates. A pair of feed rollers opposing and rotating in the opposite direction,
It is characterized by having a pair of inclined rollers that are positioned in the traveling direction of the substrate with respect to the feed roller, the rotation axis is inclined in the traveling direction of the substrate with respect to the vertical direction, and rotates in opposite directions opposite to each other. And

【0010】[0010]

【発明の実施の形態】本発明の基板分割装置の一実施例
を図1に示す。図1(a)は基板分割装置の上面図、図
1(b)は側面図である。図1において、基板分割装置
は、分割ガイド1、送りローラー2、傾斜ローラー3で
構成される。また、4は短冊状の基板、5は基板4上に
搭載された搭載部品、6は基板4の分割溝を示してい
る。基板4は、複数の小基板が互いに分割溝6を介して
一列に連なっている。
FIG. 1 shows an embodiment of a substrate dividing apparatus according to the present invention. FIG. 1A is a top view of the substrate dividing apparatus, and FIG. 1B is a side view. In FIG. 1, the substrate dividing device includes a dividing guide 1, a feed roller 2, and an inclined roller 3. Reference numeral 4 denotes a strip-shaped substrate, 5 denotes a mounted component mounted on the substrate 4, and 6 denotes a dividing groove of the substrate 4. In the substrate 4, a plurality of small substrates are connected to each other in a line via a dividing groove 6.

【0011】送りローラー2は、2本のローラー2a、
2bで構成され、その回転軸は垂直に対向して配置さ
れ、互いに逆方向に同期して回転する。分割ガイド1は
送りローラー2の2本のローラーの間に水平に配置され
る。一方、傾斜ローラー3は、2本のローラー3a、3
bで構成され、その回転軸は垂直に対して基板4の進行
方向に一定角度傾斜して対向して配置され、互いに逆方
向に同期して回転する。
The feed roller 2 has two rollers 2a,
2b, the rotation axes of which are vertically opposed to each other, and rotate synchronously in opposite directions. The division guide 1 is arranged horizontally between two rollers of the feed roller 2. On the other hand, the inclined roller 3 has two rollers 3a, 3
The rotation axis is arranged so as to be opposed to the vertical at a predetermined angle in the traveling direction of the substrate 4 with respect to the vertical direction, and rotate synchronously in opposite directions.

【0012】次に基板4の分割方法について説明する。
図2に、動作の流れを4つの部分に分けて斜視図で示
す。
Next, a method of dividing the substrate 4 will be described.
FIG. 2 is a perspective view showing the flow of the operation divided into four parts.

【0013】図2において、基板4は、分割ガイド1に
セットされた状態で送りローラー2の方に送り出される
(図2(a))。送りローラー2は基板4をその長手方
向側面からクランプし、上下や斜めに動かないように分
割ガイド1とともに固定したまま、2a、2bが互いに
逆方向に回転することで傾斜ローラー3の方に送り出す
(図2(b))。
In FIG. 2, the substrate 4 is sent out toward the feed roller 2 while being set on the division guide 1 (FIG. 2A). The feed roller 2 clamps the substrate 4 from its side in the longitudinal direction and sends it to the inclined roller 3 by rotating the substrates 2a and 2b in opposite directions while fixing the substrate 4 together with the division guide 1 so as not to move vertically or diagonally. (FIG. 2 (b)).

【0014】傾斜ローラー3は送りローラー2から送り
出された基板4の先端をその長手方向側面からクランプ
し、3a、3bが互いに逆方向に回転することでさらに
先へ送り出そうとする。この時、傾斜ローラー3の回転
軸は、送りローラー2の回転軸に対して基板4の進行方
向に対して一定角度傾斜しているため、傾斜ローラー3
でクランプされた基板4の先頭の小基板には進行方向下
向きの力が加わる(図2(c))。この時、基板4の2
番目の小基板は送りローラー2と分割ガイド1の間で固
定されたままであるため、基板4の先頭の小基板は分割
溝6に従って分割される(図2(d))。
The inclined roller 3 clamps the front end of the substrate 4 sent from the feed roller 2 from the side in the longitudinal direction, and tries to send it further by rotating 3a and 3b in opposite directions. At this time, the rotation axis of the inclined roller 3 is inclined at a certain angle with respect to the rotation axis of the feed roller 2 with respect to the traveling direction of the substrate 4.
A downward force in the traveling direction is applied to the leading small substrate of the substrate 4 clamped by (FIG. 2C). At this time, 2
Since the second small substrate remains fixed between the feed roller 2 and the division guide 1, the first small substrate of the substrate 4 is divided according to the division groove 6 (FIG. 2D).

【0015】このとき、送りローラー2と傾斜ローラー
3は共に、基板4に側面から圧力を加えるため、基板4
上の搭載部品5には圧力は加わらない。
At this time, both the feed roller 2 and the inclined roller 3 apply pressure to the substrate 4 from the side.
No pressure is applied to the upper mounted component 5.

【0016】[0016]

【発明の効果】本発明の基板分割方法によれば、短冊状
の基板の側面をクランプした状態で、傾斜ローラーによ
る斜め方向の力で基板を分割するもので、基板表面に搭
載された部品に圧力を与えることなく、また搭載部品の
高さのバラツキ等によらず安定した条件で基板を分割す
ることができ、基板の不必要な部分での割れや、分割部
分のバリ等を最小限におさえることができる。また、本
発明の基板分割装置によれば、比較的簡単な構成で基板
分割ができ、また、基板上の搭載部品に圧力が加わるこ
とはないため部品に損傷を与えることがなく、信頼性の
高い、高品質の基板分割が可能になる。
According to the substrate dividing method of the present invention, the substrate is divided by oblique force by the inclined roller while clamping the side surface of the strip-shaped substrate. The board can be split under stable conditions without applying pressure and regardless of variations in the height of mounted components, etc., minimizing cracks at unnecessary parts of the board and burrs at split parts. Can be suppressed. Further, according to the substrate dividing apparatus of the present invention, the substrate can be divided with a relatively simple configuration, and since no pressure is applied to the mounted components on the substrate, the components are not damaged, and the reliability is improved. High and high quality substrate division becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の基板分割装置の一実施例の構成を示す
図で、(a)は上面図、(b)は側面図である。
FIG. 1 is a view showing a configuration of an embodiment of a substrate dividing apparatus according to the present invention, wherein (a) is a top view and (b) is a side view.

【図2】図1の基板分割装置を用いて基板を分割する工
程を示す図で、(a)は基板分割装置に基板をセットし
た状態を示す図、(b)は基板送りの状態を示す図、
(c)は基板先端に下向きの力を加えている状態を示す
図、(d)は基板を分割している状態を示す図である。
2A and 2B are diagrams illustrating a process of dividing a substrate using the substrate dividing device of FIG. 1, wherein FIG. 2A illustrates a state in which the substrate is set in the substrate dividing device, and FIG. Figure,
(C) is a diagram showing a state in which a downward force is applied to the front end of the substrate, and (d) is a diagram showing a state in which the substrate is divided.

【図3】従来の基板分割装置の構成を示す図である。FIG. 3 is a diagram showing a configuration of a conventional substrate dividing apparatus.

【符号の説明】[Explanation of symbols]

1…分割ガイド 2…送りローラー 3…傾斜ローラー 4…短冊状の基板 5…搭載部品 6…分割溝 DESCRIPTION OF SYMBOLS 1 ... Dividing guide 2 ... Feeding roller 3 ... Inclined roller 4 ... Strip-shaped board 5 ... Mounting parts 6 ... Dividing groove

───────────────────────────────────────────────────── フロントページの続き (72)発明者 栗原 潔 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kiyoshi Kurihara 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto, Japan Murata Manufacturing Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 複数の小基板を一列に配列してなる短冊
状の基板を用意し、 回転軸が垂直で、互いに対向して逆方向に回転する一対
の送りローラーを用いて、前記基板を側面からクランプ
して前方に送り出す工程と、 回転軸が垂直方向に対して前記基板の進行方向に傾斜
し、互いに対向して逆方向に回転する一対の傾斜ローラ
ーを用いて、前記基板の先端を側面からクランプして前
方下方に送り出すことにより先頭の小基板を前記基板か
ら分離・分割する工程を有することを特徴とする基板分
割方法。
1. A strip-shaped substrate in which a plurality of small substrates are arranged in a line is prepared, and the substrate is rotated by using a pair of feed rollers having a vertical rotation axis and rotating in opposite directions to face each other. A step of clamping forward from the side and sending it forward, using a pair of inclined rollers whose rotation axis is inclined in the direction of travel of the substrate with respect to the vertical direction and opposed to each other and rotates in the opposite direction, the tip of the substrate is A substrate dividing method, comprising a step of separating / dividing a leading small substrate from the substrate by clamping the substrate from the side and sending it forward and downward.
【請求項2】 複数の小基板を一列に配列してなる短冊
状の基板を、小基板ごとに分割する基板分割装置であっ
て、 回転軸が垂直で、互いに対向して逆方向に回転する一対
の送りローラーと、 前記送りローラーに対して前記基板の進行方向に位置
し、回転軸が垂直方向に対して前記基板の進行方向に傾
斜し、互いに対向して逆方向に回転する一対の傾斜ロー
ラーを有することを特徴とする基板分割装置。
2. A substrate dividing apparatus for dividing a strip-shaped substrate, in which a plurality of small substrates are arranged in a line, into small substrates, wherein the rotation axes are perpendicular to each other and rotate in opposite directions opposite to each other. A pair of feed rollers, and a pair of tilts located in the direction of travel of the substrate with respect to the feed roller, the rotation axis of which is inclined in the direction of travel of the substrate with respect to the vertical direction, and rotates in opposite directions facing each other. A substrate dividing device having a roller.
JP20608596A 1996-08-05 1996-08-05 Substrate dividing method and substrate dividing apparatus Expired - Lifetime JP3796828B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20608596A JP3796828B2 (en) 1996-08-05 1996-08-05 Substrate dividing method and substrate dividing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20608596A JP3796828B2 (en) 1996-08-05 1996-08-05 Substrate dividing method and substrate dividing apparatus

Publications (2)

Publication Number Publication Date
JPH1044138A true JPH1044138A (en) 1998-02-17
JP3796828B2 JP3796828B2 (en) 2006-07-12

Family

ID=16517576

Family Applications (1)

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Country Status (1)

Country Link
JP (1) JP3796828B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852553B2 (en) 2000-02-15 2005-02-08 Renesas Technology Corp. Semiconductor device fabrication method and semiconductor device fabrication apparatus
KR100645160B1 (en) * 2005-09-22 2006-11-10 현대모비스 주식회사 Damper structure of a glove box
JP2011146424A (en) * 2010-01-12 2011-07-28 Canon Machinery Inc Method and apparatus for dividing semiconductor wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852553B2 (en) 2000-02-15 2005-02-08 Renesas Technology Corp. Semiconductor device fabrication method and semiconductor device fabrication apparatus
US6946306B2 (en) 2000-02-15 2005-09-20 Renesas Technology Corp. Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
KR100645160B1 (en) * 2005-09-22 2006-11-10 현대모비스 주식회사 Damper structure of a glove box
JP2011146424A (en) * 2010-01-12 2011-07-28 Canon Machinery Inc Method and apparatus for dividing semiconductor wafer

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