JPH10335831A - 多層プリント配線板及び該製造方法 - Google Patents

多層プリント配線板及び該製造方法

Info

Publication number
JPH10335831A
JPH10335831A JP10138327A JP13832798A JPH10335831A JP H10335831 A JPH10335831 A JP H10335831A JP 10138327 A JP10138327 A JP 10138327A JP 13832798 A JP13832798 A JP 13832798A JP H10335831 A JPH10335831 A JP H10335831A
Authority
JP
Japan
Prior art keywords
wiring pattern
layer
pattern
material substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10138327A
Other languages
English (en)
Japanese (ja)
Inventor
Jae-Chul Ryu
在▲てつ▼ 柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Samsung Aerospace Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Aerospace Industries Ltd filed Critical Samsung Aerospace Industries Ltd
Publication of JPH10335831A publication Critical patent/JPH10335831A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10138327A 1997-05-23 1998-05-20 多層プリント配線板及び該製造方法 Pending JPH10335831A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1997-20403 1997-05-23
KR1019970020403A KR19980084566A (ko) 1997-05-23 1997-05-23 다층 인쇄회로기판 및 그 제조방법

Publications (1)

Publication Number Publication Date
JPH10335831A true JPH10335831A (ja) 1998-12-18

Family

ID=19506946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10138327A Pending JPH10335831A (ja) 1997-05-23 1998-05-20 多層プリント配線板及び該製造方法

Country Status (3)

Country Link
JP (1) JPH10335831A (zh)
KR (1) KR19980084566A (zh)
CN (1) CN1201367A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102366A (ja) * 2010-11-10 2012-05-31 Koichi Kugimiya 機能性紋様形成方法及び機能性素子
JP2012102365A (ja) * 2010-11-10 2012-05-31 Koichi Kugimiya 機能性紋様形成方法及び機能性デバイス
CN106937488A (zh) * 2017-05-03 2017-07-07 奥士康精密电路（惠州）有限公司 一种耐电解液的防焊覆铜板印刷方法
CN106982517A (zh) * 2017-05-26 2017-07-25 东莞翔国光电科技有限公司 一种用热固油墨印刷pcb防焊层的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100350820C (zh) * 2000-06-30 2007-11-21 E·I·内穆尔杜邦公司 厚膜电路形成图形的方法
KR100396866B1 (ko) * 2001-02-26 2003-09-03 산양전기주식회사 감광성 절연물을 이용한 연성인쇄회로기판의 제조방법
TW200405786A (en) * 2002-08-06 2004-04-01 Taiyo Ink Mfg Co Ltd Manufacturing method of multi-layer printed circuit board and multi-layer printed circuit board
KR100797716B1 (ko) * 2006-03-21 2008-01-23 삼성전기주식회사 회로기판이 없는 ｌｅｄ-백라이트유닛 및 그 제조방법
CN101959374B (zh) * 2009-07-15 2013-03-20 三星电子株式会社 一种多层印制电路板的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012102366A (ja) * 2010-11-10 2012-05-31 Koichi Kugimiya 機能性紋様形成方法及び機能性素子
JP2012102365A (ja) * 2010-11-10 2012-05-31 Koichi Kugimiya 機能性紋様形成方法及び機能性デバイス
CN106937488A (zh) * 2017-05-03 2017-07-07 奥士康精密电路（惠州）有限公司 一种耐电解液的防焊覆铜板印刷方法
CN106982517A (zh) * 2017-05-26 2017-07-25 东莞翔国光电科技有限公司 一种用热固油墨印刷pcb防焊层的方法

Also Published As

Publication number Publication date
KR19980084566A (ko) 1998-12-05
CN1201367A (zh) 1998-12-09

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