JPH10329087A5 - - Google Patents

Info

Publication number
JPH10329087A5
JPH10329087A5 JP1997157831A JP15783197A JPH10329087A5 JP H10329087 A5 JPH10329087 A5 JP H10329087A5 JP 1997157831 A JP1997157831 A JP 1997157831A JP 15783197 A JP15783197 A JP 15783197A JP H10329087 A5 JPH10329087 A5 JP H10329087A5
Authority
JP
Japan
Prior art keywords
semiconductor wafer
protective film
cutter
cutting
circumferential portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997157831A
Other languages
English (en)
Japanese (ja)
Other versions
JP3919292B2 (ja
JPH10329087A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP15783197A external-priority patent/JP3919292B2/ja
Priority to JP15783197A priority Critical patent/JP3919292B2/ja
Priority to US09/073,156 priority patent/US6080263A/en
Priority to EP98108540A priority patent/EP0881663A3/en
Priority to SG1998001040A priority patent/SG72813A1/en
Priority to SG200000160A priority patent/SG102564A1/en
Priority to TW087107433A priority patent/TW385296B/zh
Priority to MYPI98002256A priority patent/MY123396A/en
Priority to KR1019980019729A priority patent/KR100500066B1/ko
Priority to CNB03107748XA priority patent/CN1254847C/zh
Priority to CNA2005100844650A priority patent/CN1734709A/zh
Priority to CNA2005100525725A priority patent/CN1652298A/zh
Priority to CNB981093620A priority patent/CN1146016C/zh
Publication of JPH10329087A publication Critical patent/JPH10329087A/ja
Priority to US09/481,998 priority patent/US6258198B1/en
Publication of JPH10329087A5 publication Critical patent/JPH10329087A5/ja
Priority to KR1020050018483A priority patent/KR100500626B1/ko
Publication of JP3919292B2 publication Critical patent/JP3919292B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP15783197A 1997-05-30 1997-05-30 半導体ウェハ保護フィルムの切断方法および装置 Expired - Lifetime JP3919292B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP15783197A JP3919292B2 (ja) 1997-05-30 1997-05-30 半導体ウェハ保護フィルムの切断方法および装置
US09/073,156 US6080263A (en) 1997-05-30 1998-05-05 Method and apparatus for applying a protecting film to a semiconductor wafer
EP98108540A EP0881663A3 (en) 1997-05-30 1998-05-11 Method and apparatus for applying a protecting film to a semiconductor wafer
SG1998001040A SG72813A1 (en) 1997-05-30 1998-05-14 Method and apparatus for applying a protecting film to a semiconductor wafer
SG200000160A SG102564A1 (en) 1997-05-30 1998-05-14 Method and apparatus for applying a protecting film to a semiconductor wafer
TW087107433A TW385296B (en) 1997-05-30 1998-05-14 Method and apparatus for applying a protecting film to a semiconductor wafer
MYPI98002256A MY123396A (en) 1997-05-30 1998-05-21 Method and apparatus for applying a protecting film to a semiconductor wafer
CNB03107748XA CN1254847C (zh) 1997-05-30 1998-05-29 用于将保护膜贴敷在半导体晶片上的方法和装置
KR1019980019729A KR100500066B1 (ko) 1997-05-30 1998-05-29 반도체웨이퍼보호필름부착방법및그장치
CNA2005100844650A CN1734709A (zh) 1997-05-30 1998-05-29 用于将保护膜贴敷在半导体晶片上的方法和装置
CNA2005100525725A CN1652298A (zh) 1997-05-30 1998-05-29 切割半导体晶片保护膜的方法和装置
CNB981093620A CN1146016C (zh) 1997-05-30 1998-05-29 用于将一种保护膜贴敷在一半导体晶片上的方法和装置
US09/481,998 US6258198B1 (en) 1997-05-30 2000-01-11 Method and apparatus for applying a protecting film to a semiconductor wafer
KR1020050018483A KR100500626B1 (ko) 1997-05-30 2005-03-07 반도체 웨이퍼 보호 필름 절단 방법 및 그 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15783197A JP3919292B2 (ja) 1997-05-30 1997-05-30 半導体ウェハ保護フィルムの切断方法および装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003171801A Division JP3545758B2 (ja) 2003-06-17 2003-06-17 半導体ウェハ保護フィルムの切断方法および装置

Publications (3)

Publication Number Publication Date
JPH10329087A JPH10329087A (ja) 1998-12-15
JPH10329087A5 true JPH10329087A5 (cs) 2004-07-08
JP3919292B2 JP3919292B2 (ja) 2007-05-23

Family

ID=15658291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15783197A Expired - Lifetime JP3919292B2 (ja) 1997-05-30 1997-05-30 半導体ウェハ保護フィルムの切断方法および装置

Country Status (2)

Country Link
JP (1) JP3919292B2 (cs)
CN (1) CN1734709A (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
JP4642002B2 (ja) * 2006-11-14 2011-03-02 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
CN109534078B (zh) * 2018-11-27 2020-12-01 北京金风科创风电设备有限公司 自动粘贴及自动裁剪装置
JP7351090B2 (ja) * 2019-03-19 2023-09-27 東洋製罐株式会社 レーザー刻印装置
US20220143754A1 (en) * 2019-03-19 2022-05-12 Toyo Seikan Co., Ltd. Laser engraving device, laser engraving method, and device and method for manufacturing can lid having tab
JP7360812B2 (ja) * 2019-05-17 2023-10-13 リンテック株式会社 シート支持装置およびシート支持方法
CN114872103B (zh) * 2022-06-06 2024-09-17 无锡沃格自动化科技股份有限公司 一种胶条吸板、胶条分切机构及贴胶方法

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