. A 7 B7 五、發明説明（1 ) 發明背景 發明領域 本發明與施加保護膜至半導體晶圓的方法及裝置有關 ，在保護膜施加於半導體表面後，並將保護膜切割成與晶 圓相匹配的形狀。 習知技術描述述 當製造半導體時，要在半導體晶圓（後文中簡稱為晶 圓）的底面進行研磨程序，以使它的厚度薄到符合半導體 晶片微型化的標準，在此過程中，上表面（即要製作電路 的表面）要施加可彎曲的保護膜加以保護，保護膜包括底 材，如黏著膜等。 施加此保護膜的方法已為吾人所熟知，其中一種方法 是先將保護膜切割成晶圓的形狀後再施加於晶圓，另一種 方法是先將保護膜施加於晶圓再按晶圓的形狀切割。 經濟部中央標隼局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 關於此點，本發明的方法將在下文中描述，沿著保護 膜饋入方向的相反方向施加一張力（反向張力），以使保護 膜處於拉緊的狀態，以防止施加時發生皺摺，保護膜在此 狀態下施加於晶圓。 不過，在以上所描述的習知技術中，反相張力的大小 無法調整。結果是，當反相張力過高時，收縮力會作用 於施加的保護膜，並將產生彎曲或斷裂的危險。 此外，如果背部張力太低，保護膜即可能產生皺摺， 氣泡即會進入保護膜與晶圓間，如此晶圓即無法進行研磨 -3- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 經濟部中央標準局負工消費合作社印製 五、發明説明（2 程序。 另一方面是有關於先將保護膜施加於晶圓再切割保護 膜以匹配晶圓的方法，習知技術的切割法是切割機沿著晶 圓四周進行切割，或是切割機固定’旋轉晶圓進行切割。 為將半導體晶圓定位’必須在晶圓上成形直線部分 也就是定位平直部分(orientation flat portion)，晶圓的定 位平直部分與圓周部分的交界處形成一轉角部分，以習知 技術的方法切割晶圓保護帶會在此轉角處留下殘留物. 在進行背部研磨時，這些殘留在轉角部分的切割殘留 物會被捲扯進研磨設備，如果發生這種情形，整個半導體 晶圓都會被毁壞。因此’一直到現在，對施加保護膜的筆 置都有一強烈期望，那就是不要留下這類切割殘餘物。此 外’如果保瘦膜與晶圓的結合力不夠’此部分也會被扯人 研磨裝置，產生如前所述的問題，因此，這些更導致對择 進的期望。 發明概述 本發明的第一目的是提供一種在半導體晶圓上施加保 護膜的方法與裝置，可防止晶圓被扭曲或損毁，也可避免 保護膜產生皺紋。 為獲致上述第一目的’當保護膜施加於半導體晶圓表 面時，本發明施加於保護膜的張力，在沿著保護膜饋人方 向的反方向可以調整。 本發明的第二目的是供一種在半導體晶圓上施加保護 -4- 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨〇><297公釐〉 (請先閱讀背面之注意事項再填寫本頁) 、17 . A 7 B7 五、發明説明（3 ) 膜的方法與裝置，它能精確地匹配晶圓的形狀將保護膜割 除。 為獲致上述第二目的，在本發明中，先將具有定位平 直部分與圓周部分的半導體晶圓放置於平台。之後，再將 保護膜切割成半導體晶圓的形狀。執行此動作的方法是移 動切割器或台面沿著定位平直部分切割保護膜，旋轉平台 同時移動切割器或平台，使切割器之切割刀的方向等於或 小於與半導體晶圓之圓周切綵方向有關的指定角度，接著 旋轉平台沿著半導體晶圓的圓周部分切割. 此外，在本發明中，在切割機前進方向的前方或/及 後方放置一導輥，以將保護膜壓在半導體晶圓上。 圖式簡述 圖1是按本發明之實施例在半導體晶圓上施加保護膜 之裝置的正視圖。 圖2是按本發明在半導體晶圓上施加保護膜之裝置的 平面圖。 經濟部中央標隼局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 圖3是按本發明在半導體晶圓上施加保護膜之裝置的 侧視圖。 圖4 A與4 B分別是按本發明之切割機的正視與側視放 大圖。 圖5的方塊圖顯示按本發明在半導體晶圓上施加保護 膜之裝置的控制系統。 圖6 A - 6 E顯示按本發明在半導體晶圓上施加保護膜之 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 A7 經濟部中央標率局員工消費合作社印製 -^ ___B7 五、發明説明（4 ) —' "~—~~~ 裝置的應用動作說明圖。 圖7是圖6B的平面圖。 圖8A-8D顯示按核明在晶圓周界切割操作的說明圖 〇 圖9顯示按本發明之另一種在晶圓周界切割操作的說 明圖。 較佳會.施例詳述 現將參閱所附圖式詳細描述本發明。 本發明之較佳實施例的正視圖、平面圖與側視圖分別 見圖1、圖2與圖3。如圖1所示，根據本發明將保護膜施加 於半導體晶圓1的裝置包括供應保護膜的保護膜供應部分 100，運送晶圓的晶圓運送機部分2〇〇 ,以及切割保護膜的 膜切割部分300。每一個部分將按順序說明如下。 在膜供應部分100’以壓合黏著膜為基材的保護膜1〇9 ，與可撕離的底襯111 一同繞在給料卷軸1〇1上，經由導輥 1〇3與張力輥1〇5延伸到壓輥1〇7。給料轴1〇1的轉軸有一彈 黃1〇2(見圖2) ’推擠固定於轉軸頂端的摩擦片1〇2_1〇2b ，施予轉軸一摩擦力。壓輥113將底襯1U剝離保護膜1〇9 ，接著經由驅動輥115、壓輥117與導輥119捲繞於捲軸121 。驅動輥115與捲軸121是由導引馬達123驅動。張力輥1〇5 由張力馬達125驅動，旋轉的方向與保護膜1〇9進料的方向 相反，施加保護膜109所t的張力（反向張力）。此反向張 力的量可以調整，如下所述。 -6 - 本紙張尺度· ^_ fl衣！ (諳先閱讀背面之注意事項再填寫本頁) 訂 經濟部中央樣準局員工消費合作社印製 • A7 __ B7 五、發明说明（5 ) ' ~~~ 如圖3所示，壓輥107固定於托架127上，垂直方向由 轴襯129導引，由氣缸131在垂直方向驅動。在壓輥1〇7附 近有兩個L形片所構成的夾頭135，配置於壓輥1〇7的兩端 。此兩個L形片可開或閤以夾住位於它們之間的保護膜 109。L形片的開閤由氣缸137控制。氣缸137固定於氣缸139 ’它負貝夾頭135垂直方向的移動。氣缸139固定於氣缸 141(見圖1)，它負責夾頭135相對於保護臈1〇9的橫向移動 (如圖3的左右方向）。氣缸141固定於壓輥1〇7的托架127， 藉以使夾頭135隨著壓輥1〇7上升或下降。 在晶圓輸送部分200 ’旋轉台2〇1固定於支撐座2〇3， 可自由旋轉並托住晶圓W。旋轉台2〇1由馬達帶動旋轉。 支撐座203架於軌道205上，並可在其上自由移動，皮帶2〇7 伸張於兩皮帶輪209、210之間因此與執2〇5平行，皮帶2〇7 經由連接片211與支撐座203連接。皮帶輪21〇由馬達213驅 動，按此方法，馬達213可帶動旋轉台2〇1沿著軌道2〇5往 復移動。 如圖2所示，在旋轉台201的表面有許多與晶圓外形與 大小相同的溝槽201a，對應於各種不同尺寸的晶圓。此外 ，旋轉台201台面上有許多小孔（圖中未顯示）經由真空管 路215(見圖1)連接到真空邦浦（圖中未顯示），藉吸力將晶 圓W穩固地固定在旋轉台201上。 如圖1及4所示，在膜切割部分3〇〇，超音波切割器3〇1 被傾斜安排於晶圓W側。按此方法，進行切割作業時切割 刀301a是斜向晶圓W側，因此保護膜1〇9不會突出超過晶 -7- 本紙張尺度適用中國國家標準（CNS ) A4规格（210X297公釐） (讀先間讀背面之註意事項再填寫本頁)A 7 B7 V. Description of the invention (1) Background of the invention The present invention relates to a method and a device for applying a protective film to a semiconductor wafer. After the protective film is applied to the surface of the semiconductor, the protective film is cut into a phase similar to the wafer. Matching shapes. The conventional technology description states that when manufacturing a semiconductor, a grinding process is performed on the bottom surface of a semiconductor wafer (hereinafter simply referred to as a wafer) so that its thickness is thin enough to meet the standards for miniaturization of semiconductor wafers. In the process, the above The surface (that is, the surface on which the circuit is to be made) should be protected by a flexible protective film, which includes a substrate, such as an adhesive film. The method of applying this protective film is well known to me. One method is to cut the protective film into the shape of a wafer before applying it to the wafer. The other method is to apply the protective film to the wafer and then press the wafer. Shape cutting. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the notes on the back before filling this page). In this regard, the method of the present invention will be described below, applying a force in the opposite direction of the protective film feed direction (Reverse tension), so that the protective film is in a tensioned state to prevent wrinkles during application, and the protective film is applied to the wafer in this state. However, in the conventional technique described above, the magnitude of the reverse tension cannot be adjusted. As a result, when the reverse tension is too high, the contraction force acts on the applied protective film and there is a danger of bending or breaking. In addition, if the back tension is too low, the protective film may wrinkle, and bubbles will enter between the protective film and the wafer, so that the wafer cannot be ground. -3- This paper size applies the Chinese National Standard (CNS) A4 specification ( 210X297 mm) A7 B7 Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (2 procedures. On the other hand, there is a method of applying a protective film to the wafer and then cutting the protective film to match the wafer. The cutting method of the conventional technology is that the dicing machine performs cutting along the periphery of the wafer, or the dicing machine fixes the 'rotating wafer for cutting. In order to position the semiconductor wafer', a straight portion, that is, a straight portion, must be formed on the wafer. (orientation flat portion), the corner of the wafer's positioning flat portion and the circumferential portion form a corner portion, cutting the wafer protection tape by conventional techniques will leave residues at this corner. During back grinding These cutting residues that remain at the corners will be pulled into the grinding equipment, and if this happens, the entire semiconductor wafer will be destroyed. Therefore Until now, there has been a strong expectation for pens with a protective film, that is, do not leave such cutting residues. In addition, 'if the thin film is not sufficiently bonded to the wafer', this part will also be pulled by the grinding device As mentioned above, the problems mentioned above are caused. Therefore, these lead to the expectation of selective advancement. SUMMARY OF THE INVENTION The first object of the present invention is to provide a method and device for applying a protective film on a semiconductor wafer, which can prevent the wafer from being twisted. It can also prevent the protective film from wrinkling. In order to achieve the above-mentioned first objective, when the protective film is applied to the surface of the semiconductor wafer, the tension applied to the protective film by the present invention can be in the opposite direction along the feeding direction of the protective film. The second object of the present invention is to provide protection on a semiconductor wafer. -4- The paper size applies the Chinese National Standard (CNS) A4 specification (2 丨 〇 > < 297 mm) (Please read the back first (Notes on this page, please fill in this page), 17. A 7 B7 V. Description of the invention (3) Film method and device, which can accurately match the shape of the wafer and cut off the protective film. In order to obtain the above For two purposes, in the present invention, a semiconductor wafer having a positioning straight portion and a circumferential portion is first placed on a platform. After that, the protective film is cut into the shape of the semiconductor wafer. The method for performing this action is to move the cutter or The mesa cuts the protective film along the straight part of the positioning. Rotate the platform to move the cutter or platform at the same time, so that the direction of the cutter of the cutter is equal to or less than the specified angle related to the circumferential color cutting direction of the semiconductor wafer. The peripheral portion of the semiconductor wafer is cut. In addition, in the present invention, a guide roller is placed in front or / and rear of the cutting machine to advance the protective film on the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. A front view of an apparatus for applying a protective film on a semiconductor wafer according to an embodiment of the present invention. Fig. 2 is a plan view of an apparatus for applying a protective film on a semiconductor wafer according to the present invention. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Figure 3 is a side view of a device for applying a protective film on a semiconductor wafer according to the present invention. Figures 4A and 4B are enlarged front and side views of a cutting machine according to the present invention, respectively. Fig. 5 is a block diagram showing a control system of a device for applying a protective film on a semiconductor wafer according to the present invention. Figures 6 A-6 E show that the paper size of the protective film applied to the semiconductor wafer according to the present invention is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 A7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs -^ ___B7 V. Description of the invention (4) — '" ~ — ~~~ Illustration of the operation of the device. Fig. 7 is a plan view of Fig. 6B. 8A-8D are explanatory diagrams showing a cutting operation at the wafer perimeter according to the verification. FIG. 9 is an explanatory diagram showing another cutting operation at the wafer perimeter according to the present invention. Detailed description of the embodiments The present invention will now be described in detail with reference to the drawings. A front view, a plan view and a side view of a preferred embodiment of the present invention are shown in Figs. 1, 2 and 3, respectively. As shown in FIG. 1, a device for applying a protective film to a semiconductor wafer 1 according to the present invention includes a protective film supply section 100 that supplies the protective film, a wafer conveyor section 200 that transports the wafer, and a film that cuts the protective film. Cutting portion 300. Each section will be explained in order as follows. In the film supply part 100 ', a protective film 109 with a pressure-sensitive adhesive film as a base material is wound around a feeding reel 101 with a detachable backing 111, and is passed through a guide roller 103 and a tension roller 10. 5 extends to press roller 107. The rotating shaft of the feeding shaft 101 has a spring 1002 (see FIG. 2) ′, and the friction plate 102_12b fixed on the top of the rotating shaft is pushed to apply a friction force to the rotating shaft. The pressure roller 113 peels off the protective film 10U from the backing 1U, and is then wound around the reel 121 via the driving roller 115, the pressure roller 117, and the guide roller 119. The driving roller 115 and the reel 121 are driven by a guide motor 123. The tension roller 105 is driven by a tension motor 125, and the direction of rotation is opposite to the feeding direction of the protective film 109, and a tension (reverse tension) applied by the protective film 109 is applied. The amount of this reverse tension can be adjusted as described below. -6-This paper size · ^ _ fl clothes! (谙 Please read the precautions on the back before filling this page) Printed by the Consumer Cooperative of the Central Sample Bureau of the Ministry of Economic Affairs • A7 __ B7 V. Description of the Invention (5) '~~~ As shown in Figure 3, the press roller 107 is fixed On the bracket 127, the bushing 129 is guided in the vertical direction and is driven in the vertical direction by the air cylinder 131. A chuck 135 composed of two L-shaped pieces is arranged near the pressure roller 107, and is arranged at both ends of the pressure roller 107. The two L-shaped pieces can be opened or closed to sandwich the protective film 109 therebetween. The opening and closing of the L-shaped plate is controlled by the air cylinder 137. The air cylinder 137 is fixed to the air cylinder 139 'and its negative chuck 135 moves vertically. The air cylinder 139 is fixed to the air cylinder 141 (see FIG. 1), and it is responsible for the lateral movement of the collet 135 with respect to the protection 109 (see the left-right direction of FIG. 3). The air cylinder 141 is fixed to the bracket 127 of the pressure roller 107, so that the chuck 135 rises or falls with the pressure roller 107. In the wafer conveying section 200 ', the rotary table 201 is fixed to the support base 203, and can freely rotate and support the wafer W. The rotary table 201 is driven to rotate by a motor. The support base 203 is mounted on the rail 205 and can move freely thereon. The belt 207 stretches between the two pulleys 209 and 210 so it is parallel to the holder 205. The belt 207 is connected to the support base 203 through the connecting piece 211 connection. The pulley 21 is driven by a motor 213. According to this method, the motor 213 can drive the rotary table 201 to move back and forth along the track 205. As shown in FIG. 2, there are many grooves 201a on the surface of the turntable 201 which have the same shape and size as the wafer, corresponding to various wafers of different sizes. In addition, many small holes (not shown in the figure) on the turntable 201 are connected to the vacuum pump (not shown in the figure) through the vacuum line 215 (see Figure 1), and the wafer W is firmly fixed on the turntable by suction. 201 on. As shown in FIGS. 1 and 4, in the film cutting section 300, the ultrasonic cutter 301 is arranged obliquely on the wafer W side. According to this method, the cutting blade 301a is inclined to the W side of the wafer during the cutting operation, so the protective film 109 will not protrude beyond the crystal -7- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Read the notes on the back before you fill out this page)
ΑΊ B7 經濟部中央標準局員工消費合作社印製 五、發明説明（6 圓W的周界。超音波切割器3G1具有配備超音波振動刀片 3〇la的尖端部分，固定於切割器支架3〇3上。刀片川“位 於導輥305間，導輥3〇5固定於支樓片3〇7,沿著切割器前 進方向位於刀片301a的前、後(在圖4B中是位於刀片3〇1& 的左右）。支撐片307經由一滑塊3〇9藉由夹具3〇8固定於切 割器支架303，以便能在垂直方向自由移動，張力簧3ΐι懸 吊於超音波切割器301上的銷如比與支撐片3〇7上的銷3〇7& 之間。此簧311的力量在垂直方向將導輥3〇5推向旋轉台2〇ι 的表面。 切割器支架303連接到氣缸313的活塞313a，氣叙313 固定於斜板315上。此外，滑台316也固定於 切割器支架303經由固定板314固定於滑台316。氣缸313帶 著超音波切割器301沿者斜板315的斜面上下移動。切割器 支架303以此種方法較於固^板314的好處是可以隨時更 換，因此可以從固定板314上取下切割器支架3〇3，將超音 波切割器更換成普通的切割器。 如圖4A所示，板318經由滑台319固定於活動板317， 板320固定於板318，斜板315經由兩個栓321與323緊定於 板320,因此改變栓323鎖緊的位置即可調整斜板315傾斜 的角度。板318被簧325拉向晶圓臂的中心（朝向圖4八的左 邊），並由設定螺326限位。藉調整設定螺326，它可以偏 動切割刀片301a朝向晶圓W的側邊切割保護臈。此外，备 外界有不正常的負荷施加於切割器上，板318會被朝外: 離晶圓W的外周界（即朝圖4A的右方）。按此方法，即可防 本紙張尺度適用中國國家標準(CNS ) A4規格（ (讀先閲讀背面之注意事項再填寫本頁) 訂 ί®. A7五、 發明説明（ 7 經濟部中央標準局員工消費合作社印製 止施加於晶圓W或切割器的負荷過量。 如圖1所示，支撐壓輥327的托架329固定於活動板317 上’托架329藉氣缸331上下移動。活動板317經由板330與 332固定於導板333 ’因此能由馬達335帶動在γ方向移動 。換言之，切割器301與壓輥327被固定於活動板317，並 由馬達335在Y方向驅動。 圖5顯示上述裝置之控制系統的方塊圖。控制裝置的 作用如同定序器之類的裝置，包括CPU與記憶體之類的單 元。在控制裝置400中，如晶圓大小以及每一個馬達移動 角度之類的資料利用資料輸入部分401預先輸入。也提供 一真空開關403將吸力施加於晶圓，以及一啟動開關4〇5輸 出一信號指示裝置開始作業。此外，也提供氣缸開關4〇7 、409、411、413，用以輸入每一個氣缸的上死點與下死 點三反向張力調整純5設定扭力馬達125的扭力，原點感 測器417、419偵測平台201、切割器3〇1與旋轉旋轉台的馬 達微的原點位置。圖5中接下來參考職與前所 件的編號相同^ 接下來，將描述以上所描述之裝置的操作。 首先，利用資料輸人部分4G1將作業裝置所需的 貢料（晶圓尺寸、每-個馬達移動的角度)輪人，並藉反向 張力調整器415將反向張力值輸入。 接下來，將備製完成的晶圓％置於平台2〇1。此 可以人工或藉自動供料裝置執行。特別是，晶圓w需放置 在對應於該晶BJW尺寸之溝槽2〇1内側。之後，打開真空 -9- 表纸張尺度適用中國國家榡準（CNS ) A4規格（210X297公釐 (請先閱讀背面之注意事項再填寫本頁}ΑΊ B7 Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (6 perimeters of W. The ultrasonic cutter 3G1 has a tip portion equipped with an ultrasonic vibration blade 30a and is fixed to the cutter holder 303 The blade blade "is located between the guide rollers 305, and the guide roller 305 is fixed to the branch piece 307, and is located in front of and behind the blade 301a along the cutting direction of the cutter (in Fig. 4B, it is located at the blade 301 & Left and right). The support piece 307 is fixed to the cutter holder 303 through a slider 309 by a clamp 308 so that it can move freely in the vertical direction. The tension spring 3ΐ is suspended on the pin of the ultrasonic cutter 301 such as Than the pin 3007 & on the support piece 3007. The force of this spring 311 pushes the guide roller 305 to the surface of the rotary table 2m in the vertical direction. The cutter holder 303 is connected to the cylinder 313 The piston 313a and the gas 313 are fixed to the swash plate 315. In addition, the slide table 316 is also fixed to the cutter bracket 303 and fixed to the slide table 316 via the fixing plate 314. The cylinder 313 carries the ultrasonic cutter 301 along the swash plate 315. Move up and down on the inclined surface. The cutter holder 303 is compared with the solid plate 314 in this way. The advantage is that it can be replaced at any time, so the cutter holder 3O3 can be removed from the fixed plate 314, and the ultrasonic cutter can be replaced with an ordinary cutter. As shown in FIG. 4A, the plate 318 is fixed to the movable plate via a slide table 319 317, the plate 320 is fixed to the plate 318, and the inclined plate 315 is fastened to the plate 320 via the two bolts 321 and 323, so the angle of the inclined plate 315 can be adjusted by changing the locking position of the bolt 323. The plate 318 is pulled toward by the spring 325 The center of the wafer arm (toward the left side of Figure 4-8) is limited by the setting screw 326. By adjusting the setting screw 326, it can bias the cutting blade 301a toward the side of the wafer W to protect it. In addition, prepare the outside If an abnormal load is applied to the cutter, the plate 318 will face outward: away from the outer perimeter of the wafer W (that is, to the right of FIG. 4A). In this way, the paper size can be prevented from applying Chinese national standards ( CNS) A4 specification ((Read the precautions on the back before filling this page) Order A. A7 V. Invention description (7 Employees' Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs prints the load applied to the wafer W or cutter As shown in FIG. 1, a bracket 329 supporting the pressure roller 327 Fixed on the movable plate 317 'the bracket 329 moves up and down by the air cylinder 331. The movable plate 317 is fixed to the guide plate 333 via the plates 330 and 332', so it can be moved in the γ direction by the motor 335. In other words, the cutter 301 and the pressure roller 327 It is fixed to the movable board 317 and driven by the motor 335 in the Y direction. Figure 5 shows a block diagram of the control system of the above device. The control device functions like a sequencer, including units such as a CPU and memory In the control device 400, data such as the size of the wafer and the moving angle of each motor are input in advance using the data input section 401. A vacuum switch 403 is also provided to apply suction to the wafer, and a start switch 405 outputs a signal to instruct the device to start operation. In addition, cylinder switches 407, 409, 411, and 413 are also provided to input the top dead center and bottom dead point of each cylinder. Three reverse tension adjustments. Pure 5 set torque motor 125 torque. Origin sensor 417. , 419 detects the origin position of the platform 201, the cutter 301, and the motor of the rotary table. The next reference position in FIG. 5 is the same as the previous one. Next, the operation of the device described above will be described. First, use the data input part 4G1 to turn the tributary materials (wafer size, angle of each motor movement) required by the operating device, and input the reverse tension value through the reverse tension adjuster 415. Next, the prepared wafer% is placed on the platform 201. This can be performed manually or by an automatic feeder. In particular, the wafer w needs to be placed inside the groove 201 corresponding to the size of the crystal BJW. After that, turn on the vacuum. -9- The paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm (please read the precautions on the back before filling this page)}
A7 B7 五、發明説明（8 ) 開關403施予晶圓吸力，接著打開啟動開關405操作平台201 移動事先輸入的量，之後，平台201停止移動，如圖6A與 6B所示。在此時’夾頭135與壓輥107在上升位置，夾頭135 夾住保護膜109的兩側。 接下來，壓輥107與夾頭135開始下降（圖6B)，同時夾 頭135更向下移動並向圖7之箭頭方向移動以横向張開保護 膜109。此時反向張力設定在足以將保護膜1〇9拉直的高點 (見圖6B)。之後’壓輥.107到達晶圓外周界位置且保護膜1〇9 壓到平台201。在此時，夾頭135張開，扭力馬達125的扭 力降低’橫過保護膜109的反向張力儘可能低，低到保護 膜109尚未施加到晶圓上的部分1 〇9a不會接觸到晶圓w的 表面（見圖6C)。此值已事先由反向張力調整器415所設定 ’列入考慮的因素.包括從張力輥105到壓輥1 〇7間保護膜 109的重量’以及平台201移動的速度。當然，所設定的值 可由反向張力調整器415改變。在上述的狀態，在壓輕1〇7 將保護膜109壓於晶圓W的同時，平台201向後移動（見圖 6D)先前向前移動的量（向圖6的左側）。 經濟部中央標準局員Η消費合作杜印製 ---------取— (.請先閲讀背面之注意事項再填寫本頁) 根據削所.¾ ’當保護膜109施加於晶圓w時由於沒有 在保護膜109上施加任何張力’因此沒有任何皺縮的力作 用於保護膜109 ’此可避免晶圓W有任何與其相關的彎曲 或損壞。 此外，由於保護膜109的邊緣部分被夾頭135在橫方向 拉扯’因此在保護膜109的橫方向施加了 一張力，當壓輥1〇7 接觸a日圓表面時，此可防止發生級敌。接著，告施加保含蔓 -10- 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0X297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（9 ) 膜109時釋放縱向與橫向的張力，儘可能防止皺摺力發生 之後，夾頭135閉，再抓住保護膜109的邊緣部分（見 圖6E)，切割器301沿著Y轴移動（在圖2中的方向是從上到 下），保護膜109被割開。在此時，氣缸331同時驅動侧壓 親327降下，與切割器301 —同沿著Y方向移動，在切割的 同時，側壓輥327也壓過晶圓W表面、亦即，保護膜1〇9被 壓輥107、327雙重壓緊，保護膜109可穩固地附著於晶圓 w表面。在切割後，壓輥107與夾頭135上升到升起待命的 位置，直到下一片晶圓進入。此外，側壓輥327也升起。 接下來，請參閱圖8說明切割周界部分的動作。在完 成上述切割保護膜109的程序後切割刀3〇la在圖8中的位 置C0 ’之後，切割器310上升與移動（在γ方向）到原點位置 ’同時，平台2〇1也在X方向軸，藉以將切割刀咖置 於圖8Β中解位於定位平直部分_側的轉角部分^。切 割刀3〇la在㈣部代降下以便切人健賴9，接著切 割刀30U沿著晶圓，定位平直部分走到位歧位平直部 分另-側的轉角部分c2，藉以切割出定位平直部分(圖8b) 。在此時刻，不會發生任何損壞，因為切割刀她的尖端 在槽201a的内侧。 接下來，切割刀3〇la在低的位置，平台2〇1在又方向 移動（在圖8B中從右到左）-段距叫(見圖8b)，同時，切 割刀3〇la在Y方向移動(在圖SB中從下到上）一段距離心。 此外，在上述移動的同時，平台2〇Ux〇為㈣中心逆時 -11- 本紙張尺度適用中國國家標準（CNS ) A4規格（210χ~ϋ公釐）--- (請先閲讀背面之注意事項再填寫本頁) ' -C 农--- I I、?τ— 經濟部中央標準局員工消費合作社印製 . B7 — I ---- ' _ .... _____ 五、發明説明（ίο ) 針方向旋轉一角度Θ。現在’如果從平台201的中心〇劃— 條垂於定位平直部分的直線，此直線將可截交到晶圓W圓 周的C3，C3與C2在X方向的距離為dx，C3與(：2在丫方向的 距離為dY。 如圖8C所示，執行上述的作業，切割刀301a與晶圓w 轉角部分C2間的位置關係使切割刀301a的切割方向（刀片 方向）與晶圓W之圓周部分的切線方向相合。在此點，如 果平台201繞中心Ο旋轉，保護膜1〇9即被沿著晶圓W的圓 周切割，如圖8D所示。執行此切割後，切割器301與平台 201各自朝原點位置移動’ 一旦原點位置偵測器417與419 分別偵測到切割器301與平台201已到達各自的原點位置， 即令其停止。 現在，即使圖8所述的範例是令切割刀301a的切割方 向與晶圓W的切線方向相合，不過也可如圖9所示，將切 割刀301a的方向安排成與圓周部分的切線方向t不相合， 例如兩個方向偏位一等於或低於指定角度（例如，α=0〜15 度）。進一步如圖9所示，將切割刀301a的切割方向安排在 晶圓W之圓周部分切線方向的内側，如此，即使晶圓W稍 許偏心，還是可以沿著晶圓W的周界切割保護膜109。現 在’如果切割刀301a移的太内侧，切割刀301a可向外侧移 動抵抗彈簧325的偏動力。 以上所執行的作業，由於切割保護膜1〇9的方向與晶 圓圓周部分的切線方向相合，或小於晶圓圓周部分切線方 向一指定角度’因此它可按晶圓的大小切割保護膜，即使 -12- 本紙張尺度通用中國國家：ϋ ( CNS ) A4規格^77^:297公^5 ' (請先閲讀背面之注意事項再填寫本頁) 訂 殘餘 發明说明（11 ) 是在定位平直部分的制部分，如此可避免產生 物。 2外’在以上的實施例中，切難是以 向切割保護膜。換t之，切宝，丨”认一 1 刀』方 户齡所-… 的方向不會改變(例如， 在圖8所不的_中，切割糊a的方向固定面 此丄本發明可做到精確的切割。關於此，在習知技術的方 法7割刀的方向會改變’沿著晶圓圓周之切線方向移 動^刀’當此情況，糊刀的尖端很料料切割位置 ，¥致產生蝴殘留物。相對於此，本發明所描述的上 實施例中，切割刀的切割方向保持不變，使得切割刀的刀 尖不會：過切割位置，因此切割刀可精確地沿著晶圓的圓 周部分前進。此外，此類控制可以很容易執行。 此外，虽執行上述切割作業時，位於切割刀301a前、 後方的導輥305同時也壓住保護膜。因此，在保護膜1〇9與 平台201間沒有間隙’可以使得切割更穩定。此外，由於 保護膜109可以报緊密地與晶圓w結合，不容易產生切割 殘留物’因此’在研磨期間’不會有切割殘留物捲入，也 可避免水滲入保護膜與晶圓間。至於導輥3〇5，切割器的 前後不一定都需要導輥’只需前或後擇一而置即可。 在保護膜109從晶圓W的圓周部分切割除後，保護膜 109未與晶圓w結合的剩下部分被剝去，取下晶圓w，再 將新的晶圓W放在平台201上。此動作可以人工或自動給 剩·袭置完成。在新的晶圓就定位後重複上述動作。 在以上的描述中，在平台201移動施加保護膜109的同 13 本纸張尺度適用中國國家標準（CNS ) a4規格（210X 297公釐） (請先聞讀背面之注意事項再填寫本頁) 鯉濟部中央標準局員工消費合作社印製 ------ΐτ---；----ΙΦ-------- 經濟部中央標隼局員工消費合作社印製 . A7 B7 五、發明説明（12 ) 時，壓輥107保持不動。不過，本發明並不限於此種安排 ，也可以是壓輥107移動而平台201保持不動。 在上述裝置中，切割刀從圖8B移至8C的同時，可令 切割器與保護膜間的位置關係保持不變，即，切割器循著 定位平直部分的轉角部分移動。按此方法，可以保持保護 膜之切割點的連續，並可保證在晶圓的角位置處不會產切 割殘留物或粗糙的邊緣。在上述範例中，適當設定平台在 X方向移動的速度以及平台旋轉的速度，且設定切割器301 的移動速度與轉角部分C2在Y方向移動的速度相匹配，晶 圓的轉角部分C2即循著圖8B中所示的定位平直部分的Z線 執跡移動。 此外，雖然按上述方法切割刀從圖8B移動到圖8C是 切割器與平台同時移動，但也可以只移動平台或只移動切 割器。在圖8B的描述中，在定位平直部分被切除後，切 割器從圖8B的<：2位置移到C3位置，此項移動可以只是切 割器在XY方向移動，或僅平台在XY方向移動。 如前所述，由於本發明可在施加保護膜時調整反向張 力，因此在將保護膜施加於半導體晶圓時不會導致半導體 晶圓彎曲或損壞。 此外，本發明可以按晶圓的外形切割保護膜，即使是 在定位平直部分的轉角部分，藉以避免產生切割殘留物。 此外，藉著安排於切割刀前與後方之導輥的壓著，保護膜 可以很穩固地與晶圓結合，如此也可防止切割殘留物產生 〇 -14- (請先閱讀背面之注意事項再填寫本頁) ΙΛ ^ 水 、訂 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X297公釐）A7 B7 V. Description of the invention (8) Switch 403 applies wafer suction, and then turns on the start switch 405 to operate the platform 201 to move the previously input amount. After that, the platform 201 stops moving, as shown in FIGS. 6A and 6B. At this time, the chuck 135 and the pressure roller 107 are in the raised position, and the chuck 135 sandwiches both sides of the protective film 109. Next, the pressure roller 107 and the chuck 135 begin to descend (Fig. 6B), and at the same time, the chuck 135 moves further downward and moves in the direction of the arrow in Fig. 7 to open the protective film 109 laterally. At this time, the reverse tension is set at a high point sufficient to straighten the protective film 10 (see Fig. 6B). After that, the 'press roller. 107' reaches the position of the outer periphery of the wafer and the protective film 109 is pressed to the platform 201. At this time, the chuck 135 is opened, the torque of the torque motor 125 is reduced, and the reverse tension across the protective film 109 is as low as possible, so low that the portion of the protective film 109 that has not been applied to the wafer 109a will not touch. The surface of the wafer w (see FIG. 6C). This value has been set in advance by the reverse tension adjuster 415 ′ taking into account factors including the weight of the protective film 109 from the tension roller 105 to the pressure roller 107 and the speed at which the platform 201 moves. Of course, the set value can be changed by the reverse tension adjuster 415. In the above state, while the protective film 109 is pressed against the wafer W by the light pressure 107, the stage 201 moves backward (see FIG. 6D) by the amount previously moved forward (to the left of FIG. 6). Member of the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperation Du printed --------- Take— (. Please read the precautions on the back before filling this page) According to the parcel. ¾ 'When the protective film 109 is applied to the wafer Since no tension is applied to the protective film 109 at the time of 'w', there is no any shrinking force acting on the protective film 109 ', which can prevent the wafer W from any bending or damage associated with it. In addition, since the edge portion of the protective film 109 is pulled in the lateral direction by the chuck 135, a tension is applied in the lateral direction of the protective film 109. This prevents the occurrence of a major enemy when the press roller 107 contacts the surface of a Japanese yen. Next, the application of containment -10- This paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0X297 mm) A7 B7 printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) Film 109 After releasing the vertical and horizontal tension to prevent the occurrence of wrinkling force as much as possible, the chuck 135 is closed, and then the edge portion of the protective film 109 is grasped (see FIG. 6E). Direction is from top to bottom), the protective film 109 is cut. At this time, the air cylinder 331 simultaneously drives the side pressure 327 to move down and moves in the same Y direction as the cutter 301. At the same time as the cutting, the side pressure roller 327 also presses the surface of the wafer W, that is, the protective film 1. 9 is double-pressed by the pressing rollers 107 and 327, and the protective film 109 can be firmly attached to the surface of the wafer w. After dicing, the pressure roller 107 and the chuck 135 are raised to the raised standby position until the next wafer enters. In addition, the side pressure roller 327 is also raised. Next, the operation of cutting the perimeter portion will be described with reference to FIG. 8. After completing the above procedure of cutting the protective film 109, after the cutting blade 30a is at the position C0 'in FIG. 8, the cutter 310 rises and moves (in the γ direction) to the origin position. At the same time, the platform 201 is also at X The direction axis is used to place the cutting knife in the corner portion ^ located on the side of the positioning straight portion in FIG. 8B. The cutting blade 30a is lowered in the crotch to cut people 9 and then the cutting blade 30U moves along the wafer, positioning the straight part into place, and the corner part c2 on the other side of the straight part, so as to cut the positioning flat. Straight section (Figure 8b). At this moment, no damage occurs because the cutting blade has her tip on the inside of the groove 201a. Next, the cutting blade 30a is at a low position, and the platform 201 is moved in another direction (from right to left in FIG. 8B)-the segment is called (see FIG. 8b), and at the same time, the cutting blade 30a is at Y Move in a direction (from bottom to top in Figure SB) a distance from the center. In addition, at the same time as the above movement, the platform 20Ux〇 is the center of the counterclockwise -11- This paper size applies the Chinese National Standard (CNS) A4 specification (210χ ~ ϋmm) --- (Please read the note on the back first Please fill in this page for further information) '-C Agriculture --- II,? Τ — Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. B7 — I ----' _ .... _____ 5. Description of the Invention (ίο) The needle direction is rotated by an angle Θ. Now 'if you draw from the center of the platform 201 — a straight line perpendicular to the positioning straight part, this straight line will be intercepted to the C3 of the wafer W circumference, the distance between C3 and C2 in the X direction is dx, C3 and (: 2 The distance in the Y direction is dY. As shown in FIG. 8C, the positional relationship between the cutting blade 301a and the corner portion C2 of the wafer w makes the cutting direction (blade direction) of the cutting blade 301a The tangent directions of the circumferential portions coincide. At this point, if the platform 201 rotates around the center 0, the protective film 109 is cut along the circumference of the wafer W, as shown in FIG. 8D. After performing this cutting, the cutter 301 and The platform 201 moves towards the origin position 'Once the origin position detectors 417 and 419 detect that the cutter 301 and the platform 201 have reached their respective origin positions, they are stopped. Now, even if the example described in FIG. 8 is Let the cutting direction of the dicing blade 301a coincide with the tangential direction of the wafer W, but as shown in FIG. 9, the direction of the dicing blade 301a may be arranged so as not to coincide with the tangential direction t of the circumferential portion, for example, the two directions are offset by one. At or below a specified angle (e.g. α = 0 ~ 15 degrees). Further, as shown in FIG. 9, the cutting direction of the dicing blade 301 a is arranged inside the tangential direction of the circumferential portion of the wafer W. Thus, even if the wafer W is slightly eccentric, it can still be along the wafer. The perimeter of W cuts the protective film 109. Now 'if the cutting blade 301a moves too far inside, the cutting blade 301a can move outward against the biasing force of the spring 325. The work performed above is due to the direction of the cutting protective film 1 09 and The tangent direction of the wafer's peripheral portion coincides, or it is smaller than the specified angle of the tangential direction of the wafer's peripheral portion, so it can cut the protective film according to the size of the wafer, even though the paper size is universal. China: ϋ (CNS) A4 specification ^ 77 ^: 297 Gong ^ 5 '(Please read the precautions on the back before filling this page) Residual invention description (11) is in the positioning part of the straight part, so as to avoid production. 2 Wai' above In the embodiment, cutting the protective film is to cut the protective film in the direction of direction. In other words, cutting Bao, 丨 "recognize a 1 knife" Fang Hulingsuo-the direction will not change (for example, in _ The direction of cutting the paste a fixed surface The invention can achieve accurate cutting. Regarding this, in the method 7 of the conventional technology, the direction of the cutting blade will be changed to 'move along the tangent of the wafer circumference ^ knife'. In this case, the tip of the paste knife is in a material cutting position. In contrast, in the previous embodiment described in the present invention, the cutting direction of the cutting blade remains unchanged, so that the cutting edge of the cutting blade does not pass through the cutting position, so the cutting blade can be accurately Along the peripheral portion of the wafer. In addition, such control can be easily performed. In addition, when the above-mentioned cutting operation is performed, the guide rollers 305 located in front of and behind the cutting blade 301a also press the protective film at the same time. There is no gap between the film 109 and the platform 201, which can make the cutting more stable. In addition, since the protective film 109 can be tightly combined with the wafer w, it is not easy to generate dicing residues. Therefore, no dicing residues are entangled during the polishing period, and water can be prevented from penetrating between the protective film and the wafer. As for the guide rollers 305, the guide rollers are not necessarily required at the front and back of the cutter. After the protective film 109 is cut from the peripheral portion of the wafer W, the remaining portion of the protective film 109 that is not bonded to the wafer w is peeled off, the wafer w is removed, and a new wafer W is placed on the platform 201 . This action can be done manually or automatically. This operation is repeated after a new wafer is positioned. In the above description, the same 13 paper sizes as the protective film 109 applied on the platform 201 are applicable to the Chinese National Standard (CNS) a4 specification (210X 297 mm) (please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China ------ ΐτ ---; ---- IΦ -------- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. A7 B7 5 In the description of the invention (12), the pressure roller 107 remains stationary. However, the present invention is not limited to such an arrangement, and the pressing roller 107 may be moved while the platform 201 remains stationary. In the above device, while the cutting blade is moved from FIG. 8B to 8C, the positional relationship between the cutter and the protective film can be maintained, that is, the cutter moves along the corner portion of the positioning straight portion. In this way, the cutting points of the protective film can be kept continuous, and it can be ensured that no cutting residue or rough edges will be produced at the corner positions of the wafer. In the above example, the speed at which the platform moves in the X direction and the speed at which the platform rotates are appropriately set, and the moving speed of the cutter 301 is set to match the speed at which the corner portion C2 moves in the Y direction, and the corner portion C2 of the wafer follows The Z-line positioning of the straight portion shown in FIG. 8B moves. In addition, although the cutter moves from FIG. 8B to FIG. 8C in the above-mentioned manner, the cutter and the platform move simultaneously, but only the platform or the cutter may be moved. In the description of FIG. 8B, after the positioning straight portion is cut off, the cutter is moved from the <: 2 position to the C3 position in FIG. 8B. mobile. As described above, since the present invention can adjust the reverse tension when a protective film is applied, the semiconductor film will not be warped or damaged when the protective film is applied to the semiconductor wafer. In addition, the present invention can cut the protective film according to the shape of the wafer, even in the corner portion where the straight portion is positioned, thereby avoiding cutting residue. In addition, by the pressure of the guide rollers arranged in front of and behind the cutting blade, the protective film can be firmly combined with the wafer, so that the cutting residue can be prevented. 0-14- (Please read the precautions on the back first. (Fill in this page) ΙΛ ^ Water and bound paper size are applicable to China National Standard (CNS) A4 (210X297 mm)