CN102194654B - Device and method for forming protective film on mini-camera chip - Google Patents
Device and method for forming protective film on mini-camera chip Download PDFInfo
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- CN102194654B CN102194654B CN2010101295276A CN201010129527A CN102194654B CN 102194654 B CN102194654 B CN 102194654B CN 2010101295276 A CN2010101295276 A CN 2010101295276A CN 201010129527 A CN201010129527 A CN 201010129527A CN 102194654 B CN102194654 B CN 102194654B
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Abstract
The invention provides a method for forming a protective film on a mini-camera chip. The method comprises the following steps of: providing a support plate for bearing a chip disk so as to fix the position of the chip disk on which a plurality of chips are arranged; fixing the support plate by using an outer cover; sticking a protection sheet onto the surface of the outer cover; and pressurizing a pressure plate so as to transfer the patterns of the protective film on the protection sheet onto the plurality of the chips.
Description
Technical field
The invention relates to a kind of miniature video camera chip, in more detail, relate to a kind of method of diaphragm on the miniature video camera chip that form.
Background technology
The semiconductor image sensor extensively is used as image sensor, and it has semiconductor photo diode and can be used as photoelectric conversion component.Comprise at present two based semiconductor image sensors, one be electric charge manifold type semiconductor image sensor have Charged Coupled Device (CCD) can be for detecting light transmission light electric charge, another for the transistor type image sensor has complementary metal oxide semiconductor (CMOS) field-effect transistor (CMOS) can be for detection light transmission light electric charge.Complementary metal oxide semiconductor (CMOS) field-effect transistor image sensor has been widely used in many applications, for example static number camera and camera cell phone.Above-mentioned application is mainly utilized active pixel array or the image sensing born of the same parents array of optical diode assembly, and the image transform light energy of incident is become to numerical data.
By improving the image sensing technology such as Charged Coupled Device, complementary metal oxide semiconductor (CMOS) field-effect transistor, can promote the pixel quality of image capture unit (as: digital camera, camera cell phone and digital camera etc.).Image sensing component is a kind of assembly that is used for detecting object information and is translated into the electron image signal.Image sensing component can comprise a pick-up tube and a solid-state image sensors.Pick-up tube is for example photoconductive tube, lead-oxide camera tube or saticon, and solid-state image sensors is for example CMOS (Complementary Metal Oxide Semiconductor) or Charged Coupled Device.
Charged Coupled Device and complementary metal oxide semiconductor (CMOS) field-effect transistor can be used as the miniature video camera chip.The miniature video camera chip has low-power consumption, volume is little, weight is little, the time shutter is short and without characteristics such as preheatings, it is widely applied in high-speed image input and portable image scanner.The miniature video camera chip can be incorporated in the multifunctional paper feeding machine of functions such as having scanning, fax and photocopy.
The miniature video camera chip easily causes the pollution of scratch, static or dust (Particles) in the process of transporting; scratch, static or dust pollution can affect its image acquisition quality and even electrically lose efficacy, thus at upper formation one diaphragm of miniature video camera chip to prevent the pollution of dust.Yet on traditional miniature video camera chip, the method for formation diaphragm, be that (piece by piece) is attached at diaphragm on chip manually singly.This kind method is not easy single diaphragm is aimed to chip exactly, easily produces the fraction defective of diaphragm, and attaches for the diaphragm of a large amount of miniature video camera chips the more time of cost that needs.
Therefore, the formation method in view of the traditional protection film on the miniature video camera chip has above-mentioned shortcoming, the invention provides a kind ofly to be better than known diaphragm and to be attached at method on the miniature video camera chip to overcome above-mentioned shortcoming.
Summary of the invention
The object of the present invention is to provide a kind of diaphragm device on the miniature video camera chip and forming method thereof that forms, its collocation that utilizes multiple tool is with the attaching efficiency of lifting diaphragm and the degree of accuracy of assembling.
Another object of the present invention is to provide the formation method of a kind of diaphragm on the miniature video camera chip, it can easily attach diaphragm on the miniature video camera chip, and diaphragm is attached on the miniature video camera chip equably.
A further object of the present invention is to provide the formation method of a kind of diaphragm on the miniature video camera chip, and it can allow diaphragm to put (joining) according to the mode of group to put.
Another purpose of the present invention is exactly in a kind of formation method that provides diaphragm on the miniature video camera chip, utilizes lower cost assembling diaphragm on the miniature video camera chip, to save the cost of product.
For achieving the above object, the present invention proposes the formation method of a kind of diaphragm on the miniature video camera chip, and comprise a back up pad is provided, be used to carrying a chip disk, with the position of fixed chip dish, a plurality of chips of configuration on chip disk; Utilize an outer cover with fixed support plate; Attach a screening glass on the surface of outer cover; And stress on a pressing plate so that the diaphragm on this screening glass is needed on a plurality of chips.
Back up pad comprises an accommodation space, a plurality of the first tenon, the first mortise and the second mortise, and accommodation space is in order to the carries chips dish.Outer cover comprises a plurality of the second tenons, the 3rd mortise and pothole, and the second tenon is in order to engage the second mortise, and a plurality of potholes are in order to hold a plurality of chips.Upper cover comprises the 4th mortise and a secure component, and the 4th mortise is in order to engage the first tenon, and secure component is in order to fix the 3rd mortise.Screening glass also comprises that a pad attaches diaphragm.Pressing plate is to be fixed in a upper cover.
Again in another embodiment, the formation method of diaphragm of the present invention on the miniature video camera chip also comprises lifts upper cover and outer cover with separating chips dish and back up pad.
In one embodiment, method of the present invention also comprises that attaching one pressing object is on the surface of outer cover, and this pressing plate that then pressurizes makes diaphragm attach more tightly chip on the pressing object.Afterwards, remove upper cover and pressing object.Finally, utilize the upper cover stationary housings, the upper cover that lifts together combination with outer cover with chip disk and back up pad, to separate.
According to another viewpoint of the present invention, the formation method of a kind of diaphragm on the miniature video camera chip proposed, it comprises provides a back up pad, be used to carrying a chip disk, with the position of fixed chip dish, a plurality of chips of configuration on chip disk; Utilize an outer cover with fixed support plate; Attach a screening glass on the surface of outer cover; Attach a transfer belt on outer cover, its region of diaphragm across screening glass; Pressurize a press strip on transfer belt, make diaphragm be transferred on transfer belt; Remove the screening glass on outer cover, adhere to afterwards have diaphragm transfer belt to outer cover, make diaphragm be attached on the surface of a plurality of chips; And remove transfer belt.
In one embodiment, method of the present invention also comprises utilizes a upper cover stationary housings, the upper cover that lifts together afterwards combination with outer cover with chip disk and back up pad, to separate.
According to another viewpoint of the present invention, the formation method of a kind of diaphragm on the miniature video camera chip proposed, comprise: a back up pad is provided, be used to carrying a chip disk, with the position of fixed chip dish, a plurality of chips of configuration on chip disk; Utilize an outer cover with fixed support plate; Attach a screening glass on the surface of outer cover; And the diaphragm pattern on the pressurization screening glass, make the diaphragm pattern be attached to the upper surface of a plurality of chips, then remove screening glass, with by the diaphragm pattern transfer to the upper surface of a plurality of chips.
A kind of device of diaphragm on chip that form of the present invention comprises: a back up pad, and be used to carrying a chip disk, with the position of fixed chip dish, a plurality of chips of configuration on chip disk; One outer cover, in order to fixed support plate; One screening glass, be used to attaching the surface of outer cover; And a pressing plate, in order to pressurization, the diaphragm on screening glass is needed on a plurality of chips, pressing plate is to be fixed on a upper cover.
The formation method and apparatus of diaphragm of the present invention on the miniature video camera chip not only overcomes the shortcoming of prior art, and can effectively increase efficiency and the fiduciary level of the formation method of diaphragm on the miniature video camera chip, and can significantly reduce costs.
The accompanying drawing explanation
Said modules, and further feature of the present invention and advantage, by the content of reading embodiment and graphic after, will be more obvious:
Fig. 1 is the schematic diagram according to the back up pad of the first embodiment of the present invention.
Fig. 2 is the schematic diagram according to chip disk contraposition back up pad cavity of the present invention.
Fig. 3 is that chip disk according to the present invention is placed in the schematic diagram in the back up pad cavity.
Fig. 4 is the schematic diagram according to outer cover contraposition back up pad of the present invention and chip disk.
Fig. 5 is that outer cover according to the present invention is fixed in the schematic diagram on back up pad and chip disk.
Fig. 6 is the schematic diagram according to screening glass contraposition outer cover of the present invention.
Fig. 7 is the schematic diagram that screening glass according to the present invention fits in outer cover.
Fig. 8 is the schematic diagram according to upper cover contraposition outer cover of the present invention, and wherein Fig. 8 A is the schematic bottom view of upper cover.
Fig. 9 is the schematic diagram according to upper cover stationary housings of the present invention and back up pad.
Figure 10 A and Figure 10 B be according to the down application of force of the present invention with the application of force up to lift the schematic diagram of outer cover.
Figure 11 is the schematic diagram that lifts together upper cover and outer cover according to of the present invention.
Figure 12 is the schematic diagram according to separation upper cover of the present invention and outer cover.
Figure 13 is the schematic diagram that removes the screening glass on outer cover according to of the present invention.
Figure 14 is that the schematic diagram on back up pad is put and be incorporated into to outer cover according to the present invention.
Figure 15 is that attaching pressing object according to the present invention is in the lip-deep schematic diagram of outer cover.
Figure 16 is the schematic diagram according to upper cover contraposition back up pad of the present invention and outer cover.
Figure 17 is that upper cover according to the present invention is fixed in the schematic diagram on back up pad and outer cover.
Figure 18 system is according to the schematic diagram that lifts the upper cover of combination of the present invention.
Figure 19 is the schematic diagram that removes the rubber diaphragm on outer cover according to of the present invention.
Figure 20 is that upper cover according to the present invention is fixed in the schematic diagram on back up pad and outer cover.
Figure 21 is according to the upper cover of combination and the schematic diagram of outer cover of lifting together of the present invention.
Figure 22 is that chip disk according to the present invention is placed in the schematic diagram on back up pad.
Figure 23 is that wherein Figure 23 A is the part enlarged diagram in Figure 23 according to the schematic diagram of chip disk to separate with back up pad that lift of the present invention.
Figure 24 is the schematic diagram of back up pad according to a second embodiment of the present invention.
Figure 25 is that chip disk according to the present invention is placed in the schematic diagram in the back up pad cavity.
Figure 26 is that outer cover according to the present invention is fixed in the schematic diagram on back up pad and chip disk.
Figure 27 is the schematic diagram that screening glass according to the present invention fits in outer cover.
Figure 28 is that transfer belt according to the present invention is attached at the schematic diagram on outer cover.
Figure 29 is the lip-deep schematic diagram that press strip according to the present invention is placed in transfer belt.
Figure 30 is schematic diagram transfer belt lifted according to of the present invention.
Figure 31 is the schematic diagram that removes the screening glass on outer cover according to of the present invention.
Figure 32 is attached to the schematic diagram on outer cover according to of the present invention by transfer belt.
Figure 33 is the schematic diagram that removes press strip according to of the present invention.
Figure 34 is that upper cover according to the present invention is put and is fixed in the schematic diagram on back up pad and outer cover.
Figure 35 is the schematic diagram that removes upper cover according to of the present invention.
Figure 36 is the schematic diagram that tears up transfer belt according to of the present invention.
Figure 37 tears up according to of the present invention the schematic diagram that transfer belt stays back up pad and outer cover.
Figure 38 is that upper cover according to the present invention is placed in the schematic diagram on back up pad and outer cover.
Figure 39 is according on of the present invention pressing down, being placed on the schematic diagram on back up pad and outer cover.
Figure 40 is outer cover according to the present invention upwards lifts together with upper cover schematic diagram.
Figure 41 is the schematic diagram according to back up pad of the present invention and outer cover.
Figure 42 is the schematic diagram that core diaphragm according to the present invention sticks the upper surface of miniature video camera chip.
Figure 43 is the schematic diagram that core diaphragm according to the present invention sticks the upper surface of miniature video camera chip.
Primary clustering symbol description in accompanying drawing:
Back up pad 100, 200, accommodation space 101, 201, tenon 102, 108a, 202, mortise 103, 104, 108, 117, 203, 209, 217, chip disk 105, 204, miniature video camera chip 106, 205, outer cover 107, 206, small embossment 109a, 109b, 208a, 208b, trellis pothole 110, 209a, alignment mark 111, 207, screening glass 112, 210, opening 113a, 113b, diaphragm pattern 114, 211, upper cover 115, 215, the miniature video camera chip 106a that diaphragm is arranged, 205a, secure component 116, down the application of force 118, up the application of force 119, rubber diaphragm 120, pressing plate 130, lug boss 131, secure component 132, 216, transfer belt 212, press strip 213.
Specific implementation method
The present invention will coordinate its preferred embodiment and accompanying drawing to be specified in down.Should the person of understanding be only the use of illustration for all preferred embodiments in the present invention, not in order to restriction.Therefore the preferred embodiment in literary composition, the present invention also can be widely used in other embodiment.And the present invention is not limited to any embodiment, should be with claim and equivalent fields thereof and determine.
Below, will arrange in pairs or groups with reference to corresponding accompanying drawing, describe in detail according to preferred embodiment of the present invention.More viewpoints and advantage about novel concept of the present invention, will propose in the following description, and make those skilled in the art can understand its content and implement according to this.
The invention provides the formation method of a kind of diaphragm on the miniature video camera chip, it can be applied to miniature video camera module (Compact Camera Module:CCM) and garden chip level module (Wafer Level Module:WLM) product.
As shown in Figure 1, it shows the schematic diagram according to the back up pad of the first embodiment of the present invention.One back up pad 100, comprise an accommodation space 101, a plurality of tenon 102, mortise 103 and mortise 104 on it.It should be noted that back up pad 100 of the present invention comprises that accommodation space 101 is positioned at central authorities' (heart) zone, is for example back up pad cavity 101, is beneficial to the carries chips dish, and the position of fixed chip dish.In the present embodiment, tenon 102, mortise 103 and mortise 104 lay respectively in two sides up and down of back up pad 100, are beneficial to provide the joint of follow-up accessory.With reference to figure 2, chip disk 105, comprise on it that a plurality of potholes are beneficial to a plurality of miniature video camera chips 106 and are embedded in wherein, and miniature video camera chip 106 is for example image sensor 106.Image sensor comprises electronic pads, and its upper surface has a sensing region, and in order to receive image strip, electronic pads is the sensing region interface that signal output (entering) to (certainly) is extraneous.Miniature video camera chip 106 is to be disposed on chip disk 105 with array way.Chip disk 105 is that contraposition back up pad cavity 101 is beneficial to be positioned on back up pad 100.Then, chip disk 105 is placed in the cavity 101 of back up pad 100, with reference to figure 3.
One outer cover (housing) 107, comprise an alignment mark 111, small embossment 109a and 109b, tenon 108a, mortise 108 and pothole 110, with reference to figure 4 on it.Outer cover 107 can change for different products its structure, and it is in order to limit the position of miniature video camera chip and screening glass.Alignment mark 111, be for example a circular mark (also can be other shape, look closely and use and determine), is positioned at upper left hand corner (also can be other position, look closely and use and determine) and is beneficial to aligning.The contraposition that two sides up and down that small embossment 109b and 109a lay respectively at outer cover 107 are beneficial to follow-up diaphragm with engage, left and right two sides of 108 outer covers 107 of mortise, trellis pothole 110 is positioned at the zone line of outer cover 107.Then, outer cover 107 is put and is fixed on back up pad 100 and chip disk 105, wherein tenon 108a embeds to engage mortise 104, trellis pothole 110 is to hold one to one (correspondence) miniature video camera chip 106, this trellis pothole 110 needs in fact and 106 contrapositions of miniature video camera chip, the degree of depth of pothole 110 can make miniature video camera chip 106 be passed on it, with reference to figure 5.
One screening glass 112, be for example protective tapes 112, on it, comprises a plurality of diaphragm patterns 114, and upper and lower two side angles of screening glass 112 fall to comprising opening 113a and 113b, be beneficial to outer cover 107 on small embossment 109a and the 109b contraposition with engage, with reference to figure 6.For an embodiment, screening glass 112 is consisted of two layer of material, and for example ground floor is pi rete (polyimide layer), and a plurality of diaphragm patterns 114 are arranged on it; The second layer is pad (liner), and pi diaphragm pattern 114 sticks on pad.Afterwards, the contraposition by opening 113a and 113b and small embossment 109a and 109b with engage, screening glass 112 fits on the surface of outer cover 107, each diaphragm pattern 114 each miniature video camera chip 106 in contraposition pothole 110 in fact wherein, with reference to figure 7.
One upper cover (cover plate) 115, comprise mortise 117, secure component 116, with reference to figure 8 on it.In the present embodiment, a pressing plate (press plate) 130 is positioned under the lower surface of upper cover 115, and pressing plate 130 has lug boss 131 matrix-like and is formed in wherein, and pressing plate 130 utilizes a secure component 132 to be fixed under upper cover 115.Upper cover 115 can change its structure for different products, and it can be pressed by the alignment mark of outer cover more accurately in order to carry pressing plate 130.Similarly, pressing plate 130 can change its structure for different products, its be with so that diaphragm (adhesive tape) tightly be attached on the miniature video camera chip.For an embodiment, upper cover 115 can be constructed according to integrated mode with pressing plate 130.Mortise 117 is arranged in two sides up and down of upper cover 115, and secure component 116 is arranged in four corners of upper cover 115, is beneficial to and the engaging of back up pad 100 and outer cover 107.Then, embed mortise 108 by secure component 116, mortise 117 engages tenon 102, and upper cover 115 is put and is fixed on back up pad 100 and outer cover 107, and then, down the application of force 118 is in upper cover 115, with reference to figure 9.In carrying out down the application of force 118 before the step of upper cover 115; miniature video camera chip 106 is aimed at and the groove of fitting slightly; then down the suitable application of force make miniature video camera chip 106 up be embedded in groove in, diaphragm pattern 114 transfer printing immediately forms (paste/attach) upper figure with reference to Figure 10 on miniature video camera chip 106.For example, the size of groove equates with the size of diaphragm pattern 114 is rough, and the configuration of a plurality of grooves is corresponding one by one with a plurality of diaphragm patterns 114.Then up the application of force 119 to lift outer cover 107, with reference to figure below of Figure 10.Upper cover 115 and outer cover 107 based on combination; after miniature video camera chip 106 breaks away from upper cover 115; upper cover 115 lifts with outer cover 107; staying chip disk 105 is placed on back up pad 100; now on miniature video camera chip 106, existing diaphragm pattern 114 sticks thereon; 106a means with label, with reference to Figure 11.In the present embodiment, diaphragm pattern 114 sticks thereon.Next; separate upper cover 115 and outer cover 107; and remove the screening glass 112 on (peeling off) outer cover 107; now the diaphragm pattern 114 on screening glass 112 is to be transferred on miniature video camera chip 106; make diaphragm pattern position original on screening glass 112 stay vacancy (opening) 121, with reference to Figure 12.107 pairs of outer covers are positioned at chip disk 105 and back up pad 100, with reference to Figure 13.The upper of back up pad 100 put and be incorporated into to above-mentioned outer cover 107, with reference to Figure 14.
Thereupon, optionally by a pressing object 120, for example rubber diaphragm 120, put or are attached on the surface of outer cover 107, and rubber diaphragm 120 is attached the diaphragm pattern 114 on the miniature video camera chip 106 in chip disk 105, with reference to Figure 15.
In like manner, upper cover 115 contraposition back up pads 100 and outer cover 107, with reference to Figure 16.Upper cover 115 is down put and is fixed on back up pad 100 and outer cover 107, and down the suitable upper cover 115 that forces in, utilize the pressing of rubber diaphragm 120, makes diaphragm 114 attach tightly miniature video camera chip 106, with reference to Figure 17.Afterwards, lift the upper cover 115 of combination, stay outer cover 107, chip disk 105 and back up pad 100, and remove the rubber diaphragm 120 on outer cover 107, with reference to Figure 18.
After removing rubber diaphragm 120, upper cover 115 down contraposition is put and is fixed on back up pad 100 and outer cover 107, its contraposition and fixed form as previously mentioned, with reference to Figure 19 and Figure 20.Then, upwards lift together the upper cover 115 and outer cover 107 of combination, stay chip disk 105 and be placed on back up pad 100, with reference to Figure 21 and Figure 22.
Next step is separating chips dish 105 and back up pad 100, now on miniature video camera chip 106, completes clean diaphragm pattern 114 and sticks thereon to protect its pollution that avoids particle, with reference to Figure 23.
It should be noted that contraposition between said apparatus of the present invention, in conjunction with and the step such as separate and can complete by mode manually or automatically.
As shown in figure 24, it shows the schematic diagram according to the back up pad of the second embodiment of the present invention.One back up pad 200, comprise an accommodation space 201, a plurality of tenon 202 and mortise 203 on it.Accommodation space 201 is positioned at central authorities' (heart) zone, is for example back up pad cavity 201, is beneficial to the carries chips dish.In the present embodiment, tenon 202 and mortise 203 lay respectively at two sides up and down of back up pad 200, are beneficial to the joint of follow-up accessory.With reference to Figure 25, chip disk 204, comprise on it that a plurality of potholes are beneficial to a plurality of miniature video camera chips 205 and are embedded in wherein, and miniature video camera chip 205 is for example image sensor.Miniature video camera chip 205 is to be disposed on chip disk 204 with array way.Chip disk 204 is that contraposition back up pad cavity 201 is beneficial to be positioned on back up pad 200.Chip disk 204 is placed in the cavity 201 of back up pad 200, with reference to Figure 25.
One outer cover 206, its structure is similar with Fig. 4 or identical, on it, comprises an alignment mark 207, small embossment 208a and 208b, tenon (similar tenon 108a), mortise 209 and pothole 209a, with reference to Figure 26.Alignment mark 207, be for example a circular mark, is positioned at upper left hand corner and is beneficial to aim at.The contraposition that two sides up and down that small embossment 208a and 208b lay respectively at outer cover 206 are beneficial to follow-up diaphragm with engage, left and right two sides of 209 outer covers 206 of mortise, pothole 209a is positioned at the zone line of outer cover 206.Then, outer cover 206 is put and is fixed on back up pad 200 and chip disk 204, wherein tenon (similar tenon 108a) embeds to engage mortise 203, pothole 209a is the miniature video camera chip 205 of arranging in pairs or groups one to one, this pothole 209a needs in fact and 205 contrapositions of miniature video camera chip, the degree of depth of pothole 209a can make miniature video camera chip 205 be passed on it, with reference to Figure 26.
One screening glass 210, its structure is similar with Fig. 6 or identical, is for example protective tapes 210; on it, comprise a plurality of diaphragm patterns 211; upper and lower two side angles of screening glass 210 fall opening is all arranged, be beneficial to outer cover 206 on small embossment 208a and the 208b contraposition with engage, with reference to Figure 27.For an embodiment, screening glass 210 is consisted of two layer of material, and for example ground floor is the pi rete, and a plurality of diaphragm patterns 211 are arranged on it; The second layer is pad (liner), and pi diaphragm pattern 114 sticks on pad.Afterwards, the contraposition by opening and small embossment 208a and 208b with engage, screening glass 210 fits on the surface of outer cover 206, each diaphragm pattern 211 each miniature video camera chip 205 in the contraposition pothole in fact wherein, with reference to Figure 27.
One transfer belt (transfer tape) 212 is attached on outer cover 206, its pattern of diaphragm across screening glass 210 211 (pi rete) region.Transfer belt 212 rough with screening glass 210 arranged perpendicular, and transfer belt 212 must guarantee all zones of complete covering protection film figure 211, as shown in figure 28.Then, a press strip (press kit) 213 is placed on the surface of transfer belt 212, as shown in figure 29.Based on diaphragm pattern 211, be to configure upward, after forcing in press strip 213, transfer belt 212 lifted, now diaphragm pattern 211 will be transferred on transfer belt 212, as shown in figure 30.Afterwards, remove the pad of the screening glass 210 on outer cover 206, as shown in figure 31.
Subsequently, have diaphragm pattern 211 transfer belt attached to it 212 and return back on outer cover 206, now diaphragm pattern 211 will be pasted on the surface of miniature video camera chip 205, shown in figure 32.Then, remove press strip 213, as shown in figure 33.Afterwards, embed mortise 209 by secure component 216, mortise 217 engages tenon 202; upper cover 215 is put and is fixed in the upper of back up pad 200 and outer cover 206, then, down forces in upper cover 215; make diaphragm pattern 211 attach to tightly the upper of miniature video camera chip 205, as shown in figure 34.Upper cover 215 on outer cover 206 is removed, as shown in figure 35.Afterwards, then tear up transfer belt 212, as shown in figure 36.After tearing up transfer belt 212, stay back up pad 200 and outer cover 206, diaphragm pattern 211 attaches on miniature video camera chip 205, as shown in figure 37.
Next, embed mortise 209 by secure component 216, mortise 217 engages tenon 202, and upper cover 215 is placed on back up pad 200 and outer cover 206, as shown in figure 38.Then, press down upper cover 215, as shown in figure 39.Outer cover 206 is upwards lifted together with upper cover 215, as shown in figure 40.On miniature video camera chip 204, have diaphragm pattern 211 and stick thereon, 205a means with label.After removing outer cover 206 and upper cover 215, stay back up pad 200 and outer cover 206, as shown in figure 41.
Similarly, pick up chip disk 204 with back up pad 200, to separate, now on miniature video camera chip 205, complete clean diaphragm pattern 211 and stick thereon to protect it to avoid the pollution of particle.
As shown in figure 42, it shows the schematic diagram according to the third embodiment of the present invention.The step (as shown in Figure 7) that fits in outer cover 107 surfaces at screening glass 112 afterwards; directly add (pressing) and press the core of the diaphragm pattern of screening glass 112; make core diaphragm (band) stick tightly the upper surface of miniature video camera chip 106; then remove other screening glass material, the core diaphragm will be stayed the upper surface of miniature video camera chip 106.Core diaphragm (diaphragm pattern) attaches to miniature video camera chip 106 and means with label 106a, as shown in figure 43.
There is shortcomings in the formation method of traditional type diaphragm on the miniature video camera chip; diaphragm of the present invention is better than the formation method of traditional type diaphragm on the miniature video camera chip in the formation method on the miniature video camera chip, and have the formation method of traditional type diaphragm on the miniature video camera chip can't expected effect.
Diaphragm of the present invention device on the miniature video camera chip and forming method thereof from the foregoing, its feature and advantage comprise:
1, utilize the collocation of multiple tool, therefore can promote the attaching efficiency of diaphragm and the degree of accuracy of assembling.
2, utilize the assembling mode of tool, can easily assemble diaphragm on the miniature video camera chip, and diaphragm is attached on the miniature video camera chip equably.
3, can allow diaphragm to put (joining) according to the mode of a group and put, and the single protective tapes of unconventional indivedual storing is on one chip.
4, utilize lower cost assembling diaphragm on the miniature video camera chip, to save the cost of product.
For those skilled in the art, though the present invention illustrates as above with preferred embodiments, so it is not in order to limit spirit of the present invention.The modification of doing within not breaking away from spirit of the present invention and scope and similarly configuration, all should be included in the claim of the present patent application, and this scope should cover all similar modifications and similar structures, and should do the broadest annotation.
Claims (6)
1. one kind forms the method for diaphragm on chip, and its key step comprises:
One back up pad is provided, be used to carrying a chip disk, to fix the position of this chip disk, configurable a plurality of chips on this chip disk;
Utilize an outer cover to fix this back up pad and to expose the plurality of chip;
Attach a screening glass to being positioned at the plurality of chip;
Diaphragm on this screening glass of transfer printing is on the plurality of chip, and wherein this transfer step is to carry out by a pressing plate;
Attach a pressing object on the surface of this outer cover;
This pressing plate that pressurizes makes this diaphragm attach more tightly this chip on this pressing object; And
Remove this pressing object, and utilize a upper cover to fix this outer cover, separate afterwards this upper cover, this outer cover and this chip disk and this back up pad.
2. one kind forms the method for diaphragm on chip, and its key step comprises:
One back up pad is provided, be used to carrying a chip disk, to fix the position of this chip disk, a plurality of chips of configuration on this chip disk;
Utilize an outer cover to fix this back up pad, and expose the plurality of chip;
Attach a screening glass to being positioned on the plurality of chip;
Attach upper in this outer cover of a transfer belt, its region of diaphragm across this screening glass;
Stress on this transfer belt, this diaphragm is transferred on this transfer belt;
Remove this screening glass on this outer cover, this diaphragm on this transfer belt of transfer printing, to the surface of the plurality of chip, is attached on the surface of the plurality of chip this diaphragm; And
Remove this transfer belt.
3. the method for formation diaphragm as claimed in claim 2 on chip, wherein, comprise and utilize a upper cover to fix this outer cover, and this upper cover that separates afterwards combination separates with this chip disk and this back up pad with this outer cover.
4. one kind forms the method for a plurality of chip protection films on chip, and its key step comprises:
One back up pad is provided, be used to carrying a chip disk, to fix the position of this chip disk, a plurality of chips of configuration on this chip disk;
Utilize an outer cover to fix this back up pad;
Attach a screening glass on the surface of this outer cover; And
Pressurize diaphragm pattern on this screening glass, make this diaphragm pattern be attached to the upper surface of the plurality of chip.
5. one kind forms the device of diaphragm on chip, and its key step comprises:
One chip disk, comprise on it that a plurality of potholes are beneficial to a plurality of miniature video camera chips and are embedded in wherein, and the plurality of miniature video camera chip is to be disposed on this chip disk with array way;
One back up pad, be used to carrying this chip disk, to fix the position of this chip disk;
One outer cover, in order to fix this back up pad, this outer cover comprises a trellis pothole, this trellis pothole is to hold one to one the plurality of miniature video camera chip;
One screening glass, be used to attaching the surface of this outer cover; And
One pressing plate, be needed on the plurality of miniature video camera chip the diaphragm on this screening glass in order to pressurization.
6. the device of formation diaphragm as claimed in claim 5 on chip, wherein, comprise that a pressing object is attached on the surface of this outer cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101295276A CN102194654B (en) | 2010-03-03 | 2010-03-03 | Device and method for forming protective film on mini-camera chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101295276A CN102194654B (en) | 2010-03-03 | 2010-03-03 | Device and method for forming protective film on mini-camera chip |
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| Publication Number | Publication Date |
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| CN102194654A CN102194654A (en) | 2011-09-21 |
| CN102194654B true CN102194654B (en) | 2013-11-27 |
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| CN2010101295276A Active CN102194654B (en) | 2010-03-03 | 2010-03-03 | Device and method for forming protective film on mini-camera chip |
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| CN106535495A (en) * | 2016-10-17 | 2017-03-22 | 芜湖赋兴光电有限公司 | Camera chip SMT(surface mount technology) process |
| CN106658991A (en) * | 2016-11-29 | 2017-05-10 | 芜湖赋兴光电有限公司 | Mounting process for camera chip element |
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| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN101123173A (en) * | 2007-09-20 | 2008-02-13 | 株洲南车时代电气股份有限公司 | Spraying and erosion local protection method and device for semiconductor part chip table |
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| US6926057B2 (en) * | 2001-09-25 | 2005-08-09 | Dainippon Screen Mfg. Co., Ltd. | Thin film forming apparatus and thin film forming method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN101123173A (en) * | 2007-09-20 | 2008-02-13 | 株洲南车时代电气股份有限公司 | Spraying and erosion local protection method and device for semiconductor part chip table |
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