JPH10303522A - 回路基板 - Google Patents

回路基板

Info

Publication number
JPH10303522A
JPH10303522A JP9108786A JP10878697A JPH10303522A JP H10303522 A JPH10303522 A JP H10303522A JP 9108786 A JP9108786 A JP 9108786A JP 10878697 A JP10878697 A JP 10878697A JP H10303522 A JPH10303522 A JP H10303522A
Authority
JP
Japan
Prior art keywords
circuit board
metal plate
insulating material
electronic circuit
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9108786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10303522A5 (enExample
Inventor
Reiji Konno
令二 今野
Masaki Suzumura
政毅 鈴村
Hiroyuki Handa
浩之 半田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9108786A priority Critical patent/JPH10303522A/ja
Publication of JPH10303522A publication Critical patent/JPH10303522A/ja
Publication of JPH10303522A5 publication Critical patent/JPH10303522A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP9108786A 1997-04-25 1997-04-25 回路基板 Pending JPH10303522A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9108786A JPH10303522A (ja) 1997-04-25 1997-04-25 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9108786A JPH10303522A (ja) 1997-04-25 1997-04-25 回路基板

Publications (2)

Publication Number Publication Date
JPH10303522A true JPH10303522A (ja) 1998-11-13
JPH10303522A5 JPH10303522A5 (enExample) 2005-03-03

Family

ID=14493454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9108786A Pending JPH10303522A (ja) 1997-04-25 1997-04-25 回路基板

Country Status (1)

Country Link
JP (1) JPH10303522A (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068800A (ja) * 1999-05-22 2001-03-16 Trw Lucasvarity Electric Steering Ltd 電子回路
JP2002134870A (ja) * 2000-10-24 2002-05-10 Yonezawa Densen Kk 大電流用回路基板、その製造方法及び複合回路基板
DE10302922A1 (de) * 2003-01-24 2004-07-29 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
JP2008085744A (ja) * 2006-09-28 2008-04-10 Nippon Dempa Kogyo Co Ltd 表面実装用の圧電発振器
US7643296B2 (en) 2006-01-16 2010-01-05 Mitsubishi Electric Corporation Motor drive circuit and outdoor unit for air conditioner
JP2011181570A (ja) * 2010-02-26 2011-09-15 Keihin Corp トランス及びスイッチング電源
JP2011254020A (ja) * 2010-06-03 2011-12-15 Yazaki Corp 配線基板及びその製造方法
JP2012015475A (ja) * 2010-06-03 2012-01-19 Yazaki Corp 配線基板及びその製造方法
JP2012015492A (ja) * 2010-06-03 2012-01-19 Yazaki Corp 積層配線基板及びその製造方法
JP2012094693A (ja) * 2010-10-27 2012-05-17 Yazaki Corp 配線基板及びその製造方法
US20140268581A1 (en) * 2010-06-03 2014-09-18 Yazaki Corporation Wiring substrate and manufacturing method thereof
KR101537319B1 (ko) * 2009-05-20 2015-07-16 한국단자공업 주식회사 메탈코어 인쇄회로기판
JP2019096769A (ja) * 2017-11-24 2019-06-20 株式会社オートネットワーク技術研究所 回路構成体
CN111263515A (zh) * 2020-01-07 2020-06-09 深圳市江霖电子科技有限公司 高隔热翻页式pcb模组
US12500402B2 (en) 2021-09-24 2025-12-16 Sumitomo Wiring Systems, Ltd. Circuit assembly and electrical junction box

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068800A (ja) * 1999-05-22 2001-03-16 Trw Lucasvarity Electric Steering Ltd 電子回路
EP1056318A3 (en) * 1999-05-22 2002-04-17 TRW LucasVarity Electric Steering Ltd. Improvements relating to electrical circuits
US6680546B1 (en) 1999-05-22 2004-01-20 Trw Lucasvarity Electric Steering Ltd. Electrical circuits
JP2002134870A (ja) * 2000-10-24 2002-05-10 Yonezawa Densen Kk 大電流用回路基板、その製造方法及び複合回路基板
DE10302922A1 (de) * 2003-01-24 2004-07-29 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US7643296B2 (en) 2006-01-16 2010-01-05 Mitsubishi Electric Corporation Motor drive circuit and outdoor unit for air conditioner
JP2008085744A (ja) * 2006-09-28 2008-04-10 Nippon Dempa Kogyo Co Ltd 表面実装用の圧電発振器
KR101537319B1 (ko) * 2009-05-20 2015-07-16 한국단자공업 주식회사 메탈코어 인쇄회로기판
JP2011181570A (ja) * 2010-02-26 2011-09-15 Keihin Corp トランス及びスイッチング電源
US20140268581A1 (en) * 2010-06-03 2014-09-18 Yazaki Corporation Wiring substrate and manufacturing method thereof
US9480142B2 (en) 2010-06-03 2016-10-25 Yazaki Corporation Wiring substrate and manufacturing method thereof
US9980364B2 (en) 2010-06-03 2018-05-22 Yazaki Corporation Wiring substrate and manufacturing method thereof
JP2012015475A (ja) * 2010-06-03 2012-01-19 Yazaki Corp 配線基板及びその製造方法
US20140262451A1 (en) * 2010-06-03 2014-09-18 Yazaki Corporation Wiring substrate and manufacturing method thereof
JP2011254020A (ja) * 2010-06-03 2011-12-15 Yazaki Corp 配線基板及びその製造方法
US20160205763A1 (en) * 2010-06-03 2016-07-14 Yazaki Corporation Wiring substrate and manufacturing method thereof
JP2012015492A (ja) * 2010-06-03 2012-01-19 Yazaki Corp 積層配線基板及びその製造方法
US9888558B2 (en) 2010-06-03 2018-02-06 Yazaki Corporation Wiring substrate and manufacturing method thereof
JP2012094693A (ja) * 2010-10-27 2012-05-17 Yazaki Corp 配線基板及びその製造方法
JP2019096769A (ja) * 2017-11-24 2019-06-20 株式会社オートネットワーク技術研究所 回路構成体
CN110012601A (zh) * 2017-11-24 2019-07-12 株式会社自动网络技术研究所 电路构成体
CN111263515A (zh) * 2020-01-07 2020-06-09 深圳市江霖电子科技有限公司 高隔热翻页式pcb模组
CN111263515B (zh) * 2020-01-07 2021-06-04 深圳市江霖电子科技有限公司 高隔热翻页式pcb模组
US12500402B2 (en) 2021-09-24 2025-12-16 Sumitomo Wiring Systems, Ltd. Circuit assembly and electrical junction box

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