JPH10275876A - Airtight terminal and sensor provided therewith - Google Patents

Airtight terminal and sensor provided therewith

Info

Publication number
JPH10275876A
JPH10275876A JP9080658A JP8065897A JPH10275876A JP H10275876 A JPH10275876 A JP H10275876A JP 9080658 A JP9080658 A JP 9080658A JP 8065897 A JP8065897 A JP 8065897A JP H10275876 A JPH10275876 A JP H10275876A
Authority
JP
Japan
Prior art keywords
base
sensor element
hole
sensor
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9080658A
Other languages
Japanese (ja)
Other versions
JP3426909B2 (en
Inventor
Hiroaki Sonoda
博昭 園田
Hidenori Nakama
英徳 中間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP08065897A priority Critical patent/JP3426909B2/en
Publication of JPH10275876A publication Critical patent/JPH10275876A/en
Application granted granted Critical
Publication of JP3426909B2 publication Critical patent/JP3426909B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Measuring Fluid Pressure (AREA)

Abstract

PROBLEM TO BE SOLVED: To lessen an airtight terminal in size by a method, wherein a through- hole provided in a ceramic base is filled up with high-melting metal wire and/or paste, and the ceramic base is burned. SOLUTION: An airtight terminal 10 is composed of a cylindrical base 11 of ceramic provided with four through-holes 11a which extend in an axial direction and four high-melting metal wires 12, inserted into the through-holes 11a and burned to be airtightly sealed up to serve as a continuity part. A recess 11b, where a sensor element is installed is provided in the tip of the base 11, a flat 11c where a signal amplifying integrated circuit is placed is provided in the rear edge, and a flange 11d is provided in the peripheral part. By this setup, an airtight terminal 10 of this constitution can be hermetically sealed up, eliminating each gap between a continuity part formed of high-melting metal and the base 11. Thus the airtight terminal 10 can be lessened in size, and moreover an integrated circuit may be mounted directly on the ceramic base 11 or various electric circuits may be formed directly on the base 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、各種センサ、及び
このセンサの容器において、気密封止を維持したまま容
器の内外を導通させるための気密端子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various sensors, and a hermetic terminal for electrically connecting the inside and outside of the container while maintaining hermetic sealing in the container of the sensor.

【０００２】[0002]

【従来の技術】従来より、圧力センサ、温度センサ、湿
度センサ、ＣＯセンサ等の各種センサが使用されてい
る。これらのセンサでは、センサ素子を気密封止すると
ともに、このセンサ部と外部の信号増幅用等の集積回路
との間を気密端子を介して接続する構造となっている。2. Description of the Related Art Conventionally, various sensors such as a pressure sensor, a temperature sensor, a humidity sensor, and a CO sensor have been used. These sensors have a structure in which the sensor element is hermetically sealed, and the sensor section is connected to an external integrated circuit for signal amplification or the like via an airtight terminal.

【０００３】例えば圧力センサの構造を図７に示すよう
に、気密端子１０は、ステンレス等の金属からなる基体
１４の貫通孔１４ａに、導通部として４２アロイ等の金
属からなる線状体１２を挿入し、貫通孔１４ａとの隙間
にガラスペースト又はガラス粉を充填した後、窒素雰囲
気にてガラスを溶かして溶着し、ガラス層１５を形成し
て気密封止した構造となっている。For example, as shown in FIG. 7, the structure of a pressure sensor is such that a hermetic terminal 10 has a linear body 12 made of a metal such as a 42 alloy as a conductive portion in a through hole 14a of a base 14 made of a metal such as stainless steel. After a glass paste or a glass powder is filled into a gap between the glass substrate and the through hole 14a, glass is melted and welded in a nitrogen atmosphere to form a glass layer 15 and hermetically seal the structure.

【０００４】そして、この気密端子１０の一方端側にセ
ンサ素子２１を載置して上記線状体１２とワイヤボンデ
ィングし、またセンサ素子２１を載置した空間をＯリン
グ２３を介してシリコン等のダイヤフラム２４ａで覆っ
て気密封止してある。一方、気密端子１０の他方端側に
は、別の基体１６を接合して、この基体１６上に信号増
幅用等の集積回路２２を備え、上記線状体１２とＴＡＢ
接続等で導通させ、リード取り出し部２６から信号線を
引き出している。[0004] A sensor element 21 is mounted on one end of the hermetic terminal 10 and wire-bonded to the linear body 12. A space in which the sensor element 21 is mounted is filled with silicon or the like via an O-ring 23. And hermetically sealed with a diaphragm 24a. On the other hand, another base 16 is joined to the other end side of the hermetic terminal 10, and an integrated circuit 22 for signal amplification or the like is provided on the base 16.
The connection is made conductive and the signal line is drawn out from the lead take-out portion 26.

【０００５】この圧力センサの作動は、上記ダイヤフラ
ム２４ａに加えられた外部の圧力をセンサ素子２１で感
知し、この信号を集積回路２２で増幅してリード取り出
し部２６から取り出すようになっている。The operation of this pressure sensor is such that the external pressure applied to the diaphragm 24a is sensed by the sensor element 21, and this signal is amplified by the integrated circuit 22 and taken out from the lead take-out portion 26.

【０００６】[0006]

【発明が解決しようとする課題】これらのセンサでは、
小型化、ハイブリッド化が求められているが、上記のよ
うな構造のセンサではこれらの要求特性を満足できなか
った。SUMMARY OF THE INVENTION In these sensors,
Although miniaturization and hybridization are required, a sensor having the above structure cannot satisfy these required characteristics.

【０００７】即ち、従来の構造では、気密端子１０にお
ける金属製の線状体１２と基体１４との熱膨張差を吸収
するためにガラス層１５を厚く設定する必要があり、そ
の結果、全体を小型化することが困難であった。また、
気密端子１０の基体１４が金属からなるため、この上に
直接、部品結線等の回路を形成したり、あるいは信号増
幅用の集積回路２２を載置したりすることができず、別
の基体１６を接合する必要があり、小型化できなかっ
た。That is, in the conventional structure, it is necessary to set the glass layer 15 to be thick in order to absorb the difference in thermal expansion between the metal linear body 12 and the base 14 in the hermetic terminal 10, and as a result, the entire structure is required. It was difficult to reduce the size. Also,
Since the base 14 of the hermetic terminal 10 is made of metal, it is not possible to directly form a circuit such as component connection or mount the integrated circuit 22 for signal amplification on this base. Must be joined, and the size cannot be reduced.

【０００８】また、上記気密端子１０は、完全に気密封
止しておく必要があるが、例えば高温になるとガラス層
１５による気密封止の信頼性が劣化する恐れがあった。The hermetic terminal 10 needs to be completely hermetically sealed. For example, when the temperature becomes high, the reliability of hermetic sealing by the glass layer 15 may be deteriorated.

【０００９】さらに、センサ素子２１と基体１４の熱膨
脹率が異なるため、両者の間に緩衝材を介在させる必要
があった。Further, since the thermal expansion coefficients of the sensor element 21 and the base 14 are different, it is necessary to interpose a buffer between them.

【００１０】[0010]

【課題を解決するための手段】そこで本発明は、セラミ
ックスからなる基体の貫通孔中に、高融点金属の線状体
及び／又はペーストを充填して同時焼成することによっ
て、気密封止された導通部を形成した気密端子を得るこ
とを特徴とする。SUMMARY OF THE INVENTION Accordingly, the present invention provides a hermetically sealed by filling a linear body and / or a paste of a high melting point metal into a through-hole of a base made of ceramics and firing them simultaneously. It is characterized in that an airtight terminal having a conductive portion is obtained.

【００１１】即ち、本発明は、気密端子の基体をセラミ
ックスで形成し、高融点金属からなる導通部を同時焼成
で形成することによって、両者間の隙間を無くして気密
封止できることから小型化することができ、しかもセン
サ素子とセラミックス製の基体の熱膨脹率が近いことか
ら、基体に直接センサ素子やその他の集積回路を載置し
たり、各種電気回路を直接形成することもできる。That is, according to the present invention, the base of the hermetic terminal is formed of ceramics, and the conductive portion made of a high melting point metal is formed by simultaneous firing, whereby a gap between the both can be eliminated and hermetic sealing can be achieved, thereby reducing the size. Since the thermal expansion coefficients of the sensor element and the ceramic base are close to each other, the sensor element and other integrated circuits can be directly mounted on the base, and various electric circuits can be formed directly.

【００１２】また本発明は、上記貫通孔の両端部に高融
点金属の線状体を備え、中間部に高融点金属のペースト
を充填して同時焼成することを特徴とする。Further, the present invention is characterized in that a linear body of a high-melting-point metal is provided at both ends of the through hole, and a paste of the high-melting-point metal is filled in an intermediate portion and fired simultaneously.

【００１３】即ち、同時焼成時に、高融点金属のペース
トにセラミックス中のガラス成分が拡散することによ
り、さらに高い気密封止構造とすることができる。That is, the glass component in the ceramic is diffused into the paste of the high melting point metal during the simultaneous firing, so that a higher hermetic sealing structure can be obtained.

【００１４】また、本発明は、上記の気密端子における
基体の、貫通孔の一方端側にセンサ素子を搭載し、他方
端側に上記センサ素子の信号増幅用等の集積回路を搭載
し、これらを導通部で導通させてセンサを構成したこと
を特徴とする。Further, according to the present invention, a sensor element is mounted on one end side of a through hole of a base of the hermetic terminal, and an integrated circuit for amplifying a signal of the sensor element is mounted on the other end side. Are conducted by the conducting portion to form a sensor.

【００１５】さらに、本発明は、貫通孔を有するセラミ
ックス製の基体に、上記貫通孔を覆うようにセンサ素子
を搭載し、これと同じ面上にセンサ素子の信号増幅用等
の集積回路を搭載してセンサを構成したことを特徴とす
る。Further, according to the present invention, a sensor element is mounted on a ceramic base having a through hole so as to cover the through hole, and an integrated circuit for amplifying a signal of the sensor element is mounted on the same surface as the sensor element. Thus, the sensor is configured.

【００１６】[0016]

【発明の実施の形態】以下本発明の実施形態を図によっ
て説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

【００１７】図１（ａ）（ｂ）に示す気密端子１０は、
セラミックスからなる円柱状の基体１１に軸方向に４本
の貫通孔１１ａを備え、この貫通孔１１ａ中に高融点金
属からなる線状体１２を挿入した状態で、同時焼成して
気密封止することにより、導通部と成したものである。The airtight terminal 10 shown in FIGS.
A cylindrical base 11 made of ceramics is provided with four through holes 11a in the axial direction, and a linear body 12 made of a high melting point metal is inserted into the through holes 11a, and simultaneously fired and hermetically sealed. Thus, a conductive portion is formed.

【００１８】また、基体１１の先端面には、センサ素子
を載置するための凹部１１ｂを有し、後端部には信号増
幅用等の集積回路を載置するための平面部１１ｃを有
し、外周部にはフランジ部１１ｄを備えている。The base 11 has a concave portion 11b for mounting a sensor element on a front end surface thereof, and a flat portion 11c for mounting an integrated circuit for signal amplification or the like on a rear end portion thereof. The outer peripheral portion is provided with a flange portion 11d.

【００１９】次に、上記気密端子１０を用いた圧力セン
サの例を示す。Next, an example of a pressure sensor using the hermetic terminal 10 will be described.

【００２０】図２に示すように、上記の気密端子１０の
先端面の凹部１１ｂにセンサ素子２１を載置し、線状体
１２の先端部とワイヤボンディングする。一方、基体１
１の後端部の平面部１１ｃに信号増幅用等の集積回路２
２を載置し、線状体１２の後端部と接続する。また、基
体１１のフランジ部１１ｄにＯリング２３を介してダイ
ヤフラム２４ａを備えた上部金具２４を取り付け、下部
金具２５を螺着して固定してある。As shown in FIG. 2, the sensor element 21 is placed in the concave portion 11b on the distal end surface of the hermetic terminal 10 and wire-bonded to the distal end of the linear body 12. On the other hand, the base 1
An integrated circuit 2 for signal amplification or the like is provided on the flat portion 11c
2 is placed and connected to the rear end of the linear body 12. Further, an upper metal fitting 24 having a diaphragm 24a is attached to a flange portion 11d of the base 11 via an O-ring 23, and a lower metal fitting 25 is screwed and fixed.

【００２１】この圧力センサを使用する場合は、上記ダ
イヤフラム２４ａから加わった圧力をセンサ素子２１で
感知し、この信号を信号増幅用等の集積回路２２で増幅
して、不図示のリード取り出し部から外部に導出するこ
とができる。When this pressure sensor is used, the pressure applied from the diaphragm 24a is sensed by the sensor element 21, and this signal is amplified by an integrated circuit 22 for signal amplification or the like, and the signal is amplified by a lead extraction unit (not shown). Can be derived externally.

【００２２】このとき、気密端子１０は、線状体１２と
基体１１を同時焼成で気密封止してあるため、完全に気
密を維持することができ、しかも従来例のようなガラス
層が必要ないため気密端子１０自体を小型化できる。ま
た、基体１１自体に直接、集積回路２２を載置したり、
その他の回路を形成することができるため、センサを小
型化することができる。At this time, the hermetic terminal 10 can be completely hermetically sealed because the linear body 12 and the base 11 are hermetically sealed by simultaneous firing, and requires a glass layer as in the conventional example. Since there is no airtight terminal 10, the airtight terminal 10 itself can be downsized. Further, the integrated circuit 22 is directly mounted on the base 11 itself,
Since other circuits can be formed, the size of the sensor can be reduced.

【００２３】なお、上記基体１１を成すセラミックスと
しては、アルミナ（Ａｌ2 Ｏ3 ）、ジルコニア（ＺｒＯ
2 ）、炭化珪素（ＳｉＣ）、窒化珪素（Ｓｉ3 Ｎ4 ）等
を主成分とし、それぞれ公知の焼結助剤を含有してなる
セラミックス、あるいはその他のさまざまなセラミック
スを用いることができる。また、線状体１２としては、
タングステン（Ｗ）、モリブデン（Ｍｏ）、マンガン
（Ｍｎ）等の高融点金属を用いる。あるいは、基体１１
として低温焼成セラミックスを用いれば、線状体１２と
して、Ｎｉ，Ｎｉ−Ｆｅ，コバー等の金属材を用いるこ
ともできる。The ceramics forming the substrate 11 include alumina (Al 2 O 3 ) and zirconia (ZrO 2 ).
2 ), ceramics containing silicon carbide (SiC), silicon nitride (Si 3 N 4 ) or the like as a main component, each containing a known sintering aid, or various other ceramics can be used. Moreover, as the linear body 12,
A high melting point metal such as tungsten (W), molybdenum (Mo), and manganese (Mn) is used. Alternatively, the base 11
If a low-temperature fired ceramic is used, a metal material such as Ni, Ni—Fe, Kovar can be used as the linear body 12.

【００２４】次に、上記気密端子１０の製造方法を説明
する。まず、上記のセラミックス原料を用いて、プレス
成形法等の公知の方法で成形した後、必要に応じて切削
加工を施して、図１に示す形状の基体１１を作製する。
この基体１１の貫通孔１１ａに、上記の高融点金属から
なる線状体１２を挿入し、必要に応じて線状体１２と貫
通孔１１ａの間に同じ高融点金属のペーストを介在させ
る。この状態で、基体１１を焼成すれば、貫通孔１１ａ
が収縮して線状体１２との間が気密封止された状態で同
時焼成され、本発明の気密端子１０を得ることができ
る。Next, a method of manufacturing the hermetic terminal 10 will be described. First, the above-mentioned ceramic raw material is formed by a known method such as a press forming method, and then, if necessary, a cutting process is performed to produce the base 11 having the shape shown in FIG.
The linear body 12 made of the above-described high-melting-point metal is inserted into the through-hole 11a of the base 11, and the same high-melting-point metal paste is interposed between the linear body 12 and the through-hole 11a as necessary. If the base 11 is fired in this state, the through holes 11a
Are simultaneously fired in a state where the airtight terminal 10 and the linear body 12 are hermetically sealed, and the hermetic terminal 10 of the present invention can be obtained.

【００２５】次に、気密端子１０の他の実施形態を説明
する。Next, another embodiment of the hermetic terminal 10 will be described.

【００２６】図３に示すように、基体１１の貫通孔１１
ａの両端部に線状体１２を取り付け、中間部には両端の
線状体１２同士を接続するように高融点金属のペースト
１２ａを充填して同時焼成することによって、貫通孔１
１ａ内に導通部を形成したものである。このようにすれ
ば、中間部の高融点金属のペースト１２ａに基体１１を
成すセラミックス中のガラス成分が拡散してより気密度
の高い接合ができる。As shown in FIG.
a at the both ends of the through hole 1, the intermediate portion is filled with a high melting point metal paste 12 a so as to connect the linear members 12 at both ends and fired at the same time.
A conductive portion is formed in 1a. By doing so, the glass component in the ceramics forming the base 11 diffuses into the intermediate high-melting-point metal paste 12a, and bonding with higher airtightness can be performed.

【００２７】この実施形態の気密端子１０を製造する場
合は、線状体１２の先端に高融点金属のペースト１２ａ
を塗布して、焼成前の基体１１の貫通孔１１ａの両側か
ら挿入するか、又は予めインジェクター等で、貫通孔１
１ａの中間部に上記ペースト１２ａを充填しておいて、
両側から線状体１２を挿入し、その後、全体を同時焼成
すれば良い。When manufacturing the hermetic terminal 10 of this embodiment, a paste 12a of a high melting point metal is
Is applied and inserted from both sides of the through-hole 11a of the base material 11 before firing, or the through-hole 1 is
The intermediate portion of 1a is filled with the paste 12a,
The linear body 12 may be inserted from both sides, and then the whole may be simultaneously fired.

【００２８】さらに、図４（ａ）に示すように両端の線
状体１２の位置をずらせて配置し、両者間を高融点金属
のペースト１２ａで接続した構造の気密端子１０とする
こともできる。このような気密端子１０を製造する場合
は、図４（ｂ）に示すように、必要な基体１１の半分の
形状のセラミックス成形体１１’を作製し、この端面に
スクリーン印刷又は転写等の方法で、線状体１２間を接
続するためのペースト１２ａによるパターンを形成し、
貫通孔１１ａに線状体１２を挿入する。このような成形
体１１’を２個作製し、両方のパターン１２ａ同士を合
致させるように合わせて、必要に応じて密着液を介在さ
せて密着させ、全体を同時焼成することによって、図４
（ａ）に示すような気密端子１０を得ることができる。
この実施形態では、さらに、気密度を高くすることがで
きる。Further, as shown in FIG. 4 (a), the linear members 12 at both ends are displaced from each other, and the hermetic terminals 10 having a structure in which the linear members 12 are connected to each other by a paste 12a of a high melting point metal can also be provided. . When such an airtight terminal 10 is manufactured, as shown in FIG. 4B, a ceramic molded body 11 'having a half shape of a required base 11 is produced, and a method such as screen printing or transfer is applied to the end face. Then, a pattern is formed by the paste 12a for connecting the linear bodies 12,
The linear body 12 is inserted into the through hole 11a. By forming two such molded bodies 11 ′, aligning both patterns 12 a so as to match each other, interposing an adhesive liquid as necessary, and adhering them together, and simultaneously firing the whole, FIG.
An airtight terminal 10 as shown in FIG.
In this embodiment, the airtightness can be further increased.

【００２９】また、図５に示すように、基体１１の貫通
孔１１ａ全体に高融点金属のペースト１２ａを充填して
同時焼成して通電部を形成し、気密端子１０とすること
もできる。As shown in FIG. 5, the airtight terminal 10 can be formed by filling the entire through hole 11a of the base 11 with a paste 12a of a high melting point metal and firing it simultaneously to form an energized portion.

【００３０】次に、本発明のセンサの他の実施形態を説
明する。Next, another embodiment of the sensor of the present invention will be described.

【００３１】図６に示すように、セラミックス製の基体
１３には何も充填しない導入孔１３ａを備え、この導入
孔１３ａを覆うように、基体１３の一方の端面にセンサ
素子２１を載置し、同じ端面に信号増幅用等の集積回路
２２を載置し、両者間を端面上に形成した導電パターン
で接続する。なお、センサ素子２１を基体１３上に接合
する際は、例えば基体１３の表面に金メッキ等を施して
おいて、シリコンとの共晶合金により接合すれば良い。As shown in FIG. 6, the ceramic base 13 is provided with an introduction hole 13a filled with nothing, and the sensor element 21 is mounted on one end face of the base 13 so as to cover the introduction hole 13a. The integrated circuit 22 for signal amplification and the like is mounted on the same end face, and the two are connected by a conductive pattern formed on the end face. When the sensor element 21 is bonded to the base 13, for example, gold plating or the like may be applied to the surface of the base 13, and the sensor element 21 may be bonded using a eutectic alloy with silicon.

【００３２】一方、基体１１のセンサ素子２１と反対側
の端部を覆うように、導入孔２４ａを備えた上部金具２
４をロウ付け又はガラス付けで接合し、後端部を下部金
具２５で覆い、この下部金具２５には上記の信号増幅用
等の集積回路２２に接続したリード取り出し部２６を取
り付けている。On the other hand, the upper metal fitting 2 having the introduction hole 24a so as to cover the end of the base 11 on the side opposite to the sensor element 21.
4 are joined by brazing or glassing, and a rear end portion is covered with a lower metal fitting 25, and a lead extracting portion 26 connected to the integrated circuit 22 for signal amplification or the like is attached to the lower metal fitting 25.

【００３３】いま、このセンサを圧力センサとして用い
る場合は、上部金具２４の導入孔２４ａと基体１３の導
入孔１３ａを経由した圧力をセンサ素子２１で感知し、
これを信号増幅用集積回路２２で増幅してリード取り出
し部２６で外部に導出することができる。このとき、セ
ンサ素子２１と信号増幅用集積回路２２を同じ端面に配
置してあるため、両者の接続を容易に行うことができ
る。When this sensor is used as a pressure sensor, the sensor element 21 senses the pressure passing through the introduction hole 24a of the upper fitting 24 and the introduction hole 13a of the base 13, and
This can be amplified by the signal amplification integrated circuit 22 and led out to the outside by the lead extraction unit 26. At this time, since the sensor element 21 and the signal amplification integrated circuit 22 are arranged on the same end face, the connection between them can be easily performed.

【００３４】なお、上記図２、図６に示した本発明のセ
ンサは、圧力センサに限らず、温度センサ、湿度セン
サ、ＣＯセンサ等の各種センサとして使用できる。The sensors of the present invention shown in FIGS. 2 and 6 can be used not only as pressure sensors but also as various sensors such as temperature sensors, humidity sensors, and CO sensors.

【００３５】[0035]

【実施例】以下本発明の実施例を説明する。Embodiments of the present invention will be described below.

【００３６】図１に示す気密端子１０を作製した。基体
１１としてＡｌ2 Ｏ3 含有量９３％で残部がＳｉＯ2 、
ＭｇＯ等からなるアルミナセラミックスを用い、線状体
１２としてタングステンを用いた。最終的な基体１１の
寸法は、直径１０ｍｍ、長さ１０ｍｍとし、４個の貫通
孔１１ａに、直径０．８ｍｍの線状体１２を同時焼成に
より接合した。The hermetic terminal 10 shown in FIG. 1 was manufactured. The substrate 11 has an Al 2 O 3 content of 93% and the remainder SiO 2 ,
Alumina ceramics made of MgO or the like were used, and tungsten was used as the linear body 12. The final substrate 11 had a diameter of 10 mm and a length of 10 mm, and a linear body 12 having a diameter of 0.8 mm was bonded to the four through holes 11a by simultaneous firing.

【００３７】このようにして得られた気密端子１０の線
状体１２の接合部について、ヘリウムリークテストを行
ったところ、１０-9ａｔｍ・ｃｍ3 ／ｓｅｃ以下であ
り、十分な気密性を有していることが確認された。A helium leak test was performed on the joint of the linear member 12 of the hermetic terminal 10 thus obtained. The result was 10 −9 atm · cm 3 / sec or less, indicating a sufficient hermeticity. It was confirmed that.

【００３８】[0038]

【発明の効果】以上のように本発明によれば、セラミッ
クスからなる基体の貫通孔中に、高融点金属の線状体及
び／又はペーストを充填して同時焼成することにより、
気密封止された導通部を形成した気密端子を得ることに
よって、高融点金属からなる導通部と基体間の隙間を無
くして気密封止できることから小型化することができ、
しかもセラミックス製の基体に直接集積回路を載置した
り、各種電気回路を直接形成することもできる。As described above, according to the present invention, a linear body and / or a paste of a high melting point metal is filled into a through-hole of a substrate made of ceramics and fired simultaneously.
By obtaining a hermetically sealed terminal formed with a hermetically sealed conducting portion, it is possible to eliminate the gap between the conducting portion made of a high melting point metal and the base, so that the hermetic sealing can be performed, so that the size can be reduced.
In addition, an integrated circuit can be directly mounted on a ceramic base or various electric circuits can be directly formed.

【００３９】また本発明は、上記貫通孔の両端部に高融
点金属の線状体を備え、中間部に高融点金属のペースト
を充填して同時焼成して気密端子を形成することによっ
て、同時焼成時に、高融点金属のペーストにセラミック
ス中のガラス成分が拡散することにより、さらに高い気
密封止構造とすることができる。Further, according to the present invention, a linear body of a high-melting-point metal is provided at both ends of the through hole, and a paste of the high-melting-point metal is filled in an intermediate portion and simultaneously fired to form an airtight terminal. During firing, the glass component in the ceramics diffuses into the paste of the high melting point metal, so that a higher hermetic sealing structure can be obtained.

【００４０】また、本発明は、上記の気密端子における
基体の、貫通孔の一方端側にセンサ素子を搭載し、他方
端側に上記センサ素子の信号増幅用等の集積回路を搭載
し、これらを導通部で導通させてセンサを構成したこと
によって、気密を維持したまま、小型のセンサを構成す
ることができる。Further, according to the present invention, a sensor element is mounted on one end side of the through hole of the base of the hermetic terminal, and an integrated circuit for amplifying a signal of the sensor element is mounted on the other end side. Is conducted by the conducting portion to form a sensor, whereby a small-sized sensor can be constructed while maintaining airtightness.

【００４１】さらに、本発明は、貫通孔を有するセラミ
ック体に、上記貫通孔を覆うようにセンサ素子を搭載
し、これと同じ面上にセンサ素子の信号増幅用等の集積
回路を搭載してセンサを構成したことによって小型のセ
ンサを構成することができる。Further, according to the present invention, a sensor element is mounted on a ceramic body having a through hole so as to cover the through hole, and an integrated circuit for amplifying a signal of the sensor element is mounted on the same surface as the sensor element. By configuring the sensor, a small sensor can be configured.

【図面の簡単な説明】[Brief description of the drawings]

【図１】（ａ）は本発明の気密端子を示す端面図、
（ｂ）は（ａ）中のＸ−Ｘ線断面図である。FIG. 1A is an end view showing an airtight terminal of the present invention,
(B) is a sectional view taken along line XX in (a).

【図２】本発明の気密端子を用いたセンサを示す断面図
である。FIG. 2 is a cross-sectional view showing a sensor using the hermetic terminal of the present invention.

【図３】本発明の気密端子の他の実施形態を示す断面図
である。FIG. 3 is a sectional view showing another embodiment of the hermetic terminal of the present invention.

【図４】本発明の気密端子の他の実施形態を示しており
（ａ）は断面図、（ｂ）は製造工程の斜視図である。4A and 4B show another embodiment of the hermetic terminal of the present invention, wherein FIG. 4A is a sectional view, and FIG. 4B is a perspective view of a manufacturing process.

【図５】本発明の気密端子の他の実施形態を示す断面図
である。FIG. 5 is a sectional view showing another embodiment of the hermetic terminal of the present invention.

【図６】本発明のセンサを示す断面図である。FIG. 6 is a sectional view showing a sensor of the present invention.

【図７】従来の圧力センサを示す断面図である。FIG. 7 is a sectional view showing a conventional pressure sensor.

【符号の説明】[Explanation of symbols]

１０：気密端子 １１：基体 １１ａ：貫通孔 １２：線状体 １２ａ：ペースト １３：基体 ２１：センサ素子 ２２：集積回路 ２３：Ｏリング ２４：上部金具 ２５：下部金具 10: Hermetic terminal 11: Base 11a: Through hole 12: Linear body 12a: Paste 13: Base 21: Sensor element 22: Integrated circuit 23: O-ring 24: Upper bracket 25: Lower bracket

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】セラミックスからなる基体の貫通孔中に、
金属の線状体及び／又はペーストを充填して同時焼成す
ることによって、気密封止された導通部を形成してなる
気密端子。In a through hole of a substrate made of ceramics,
An airtight terminal formed by filling and filling a metal linear body and / or paste and simultaneously firing to form a hermetically sealed conductive portion. 【請求項２】上記貫通孔の両端部に高融点金属の線状体
を備え、中間部に高融点金属のペーストを充填し同時焼
成してなることを特徴とする請求項１記載の気密端子。2. The hermetic terminal according to claim 1, wherein a linear body of a high melting point metal is provided at both ends of the through hole, and a paste of the high melting point metal is filled in an intermediate portion and fired simultaneously. . 【請求項３】請求項１記載の気密端子における基体の、
貫通孔の一方端側にセンサ素子を搭載し、他方端側に上
記センサ素子の信号増幅用等の集積回路を搭載し、これ
らを導通部で導通させてなるセンサ。3. The base of the hermetic terminal according to claim 1,
A sensor in which a sensor element is mounted on one end side of a through hole and an integrated circuit for amplifying a signal of the sensor element is mounted on the other end side, and these are made conductive by a conductive part. 【請求項４】貫通孔を有するセラミックス製の基体に、
上記貫通孔を覆うようにセンサ素子を搭載し、これと同
じ面上にセンサ素子の信号増幅用等の集積回路を搭載し
てなるセンサ。4. A ceramic base having a through hole,
A sensor in which a sensor element is mounted so as to cover the through hole, and an integrated circuit for amplifying a signal of the sensor element is mounted on the same surface as the sensor element.
JP08065897A 1997-03-31 1997-03-31 Airtight terminal for sensor and sensor using the same Expired - Fee Related JP3426909B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08065897A JP3426909B2 (en) 1997-03-31 1997-03-31 Airtight terminal for sensor and sensor using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08065897A JP3426909B2 (en) 1997-03-31 1997-03-31 Airtight terminal for sensor and sensor using the same

Publications (2)

Publication Number Publication Date
JPH10275876A true JPH10275876A (en) 1998-10-13
JP3426909B2 JP3426909B2 (en) 2003-07-14

Family

ID=13724469

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3426909B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010504528A (en) * 2006-09-19 2010-02-12 ローズマウント エアロスペイス インコーポレイテッド Heat-resistant solid state pressure sensor
CN107677323A (en) * 2017-11-16 2018-02-09 北京科技大学 A kind of experimental rig of obturation multi- scenarios method maintenance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010504528A (en) * 2006-09-19 2010-02-12 ローズマウント エアロスペイス インコーポレイテッド Heat-resistant solid state pressure sensor
CN107677323A (en) * 2017-11-16 2018-02-09 北京科技大学 A kind of experimental rig of obturation multi- scenarios method maintenance

Also Published As

Publication number Publication date
JP3426909B2 (en) 2003-07-14

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