JPH10270622A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH10270622A JPH10270622A JP7134597A JP7134597A JPH10270622A JP H10270622 A JPH10270622 A JP H10270622A JP 7134597 A JP7134597 A JP 7134597A JP 7134597 A JP7134597 A JP 7134597A JP H10270622 A JPH10270622 A JP H10270622A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- lead
- leads
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体装置のリー
ドフレームに係わり、樹脂封止時の樹脂−リードフレー
ム間での密着性、樹脂の均一性、応力の均等化等の改善
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame of a semiconductor device, and relates to improvement of adhesion between resin and lead frame at the time of resin sealing, resin uniformity, stress equalization and the like. .
【０００２】[0002]
【従来の技術】樹脂封止型半導体に用いられるリードフ
レームはプレス、またはエッチングを施すことで加工成
形されている。従来のリードフレームの一例を図３
（ａ），（ｂ）にそのリード部の断面図で示す。４はプ
レス加工でのリード断面、５はエッチング加工でのリー
ド断面である。４，５ともにその断面形状には角が存在
する。2. Description of the Related Art A lead frame used for a resin-encapsulated semiconductor is processed and molded by pressing or etching. FIG. 3 shows an example of a conventional lead frame.
(A), (b) is shown in sectional drawing of the lead part. Reference numeral 4 is a lead cross section obtained by press working, and 5 is a lead cross section obtained by etching. Both 4 and 5 have corners in their cross-sectional shapes.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
構成では、図３（ａ），（ｂ）に示すように、リード断
面４，５に角が存在するため、樹脂封止時の樹脂の流れ
を乱し、樹脂成分が不均一となりリードフレームと樹脂
の界面の密着性が低下する。またリードフレームへの応
力が不均等となりうる。However, in the conventional structure, as shown in FIGS. 3 (a) and 3 (b), since there are corners in the lead cross sections 4 and 5, the flow of the resin at the time of resin sealing is reduced. And the resin component becomes non-uniform, and the adhesiveness at the interface between the lead frame and the resin deteriorates. In addition, the stress on the lead frame may be uneven.
【０００４】本発明は上記課題に鑑みてなされたもの
で、リードフレームの一部に加工を施すことにより、樹
脂封止時の樹脂の流れを安定させ、樹脂成分の均一化、
リードフレームと樹脂の密着性の改善、応力の均等化等
を図ることを目的とする。The present invention has been made in view of the above problems. By processing a part of the lead frame, the flow of the resin during resin sealing is stabilized and the resin components are made uniform.
It is an object of the present invention to improve the adhesion between a lead frame and a resin, equalize stress, and the like.
【０００５】[0005]
【課題を解決するための手段】この課題を解決するため
に本発明のリードフレームは、リードの断面が角を持た
ない丸みを帯びた構造を有している。To solve this problem, the lead frame of the present invention has a rounded structure in which the cross section of the lead has no corners.
【０００６】これにより、樹脂封止時の樹脂の流れの安
定化を図り、信頼性の高い半導体装置が得られる。As a result, the flow of the resin during resin sealing is stabilized, and a highly reliable semiconductor device is obtained.
【０００７】[0007]
【発明の実施の形態】本発明はリードフレームの少なく
とも一部の断面構造を丸みを帯びた構造にすることによ
り、樹脂封止時の樹脂の流れを安定させ、樹脂成分の均
一化、リードフレームと樹脂の密着性の改善、応力の均
等化を図る機能を有する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention uses a rounded cross-sectional structure of at least part of a lead frame to stabilize the flow of resin during resin encapsulation, to homogenize resin components, and to lead frame. It has the function of improving the adhesiveness of the resin and equalizing the stress.
【０００８】以下、本発明の一実施形態について、図面
を参照しながら説明する。図１、図２は本発明の一実施
形態を示すリードフレーム平面およびリードの断面概略
図である。図１，２において、１はダイパッド、２はリ
ード、３はリード部のリード断面である。以上のように
構成されたリードフレームについて以下にその効果を説
明する。Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 are a schematic cross-sectional view of a lead frame and a lead showing an embodiment of the present invention. 1 and 2, 1 is a die pad, 2 is a lead, and 3 is a lead cross section of a lead portion. The effects of the lead frame configured as described above will be described below.
【０００９】本実施形態では、リードフレームのリード
部分の断面形状を丸みを帯びた形状にすることより、樹
脂封止時の樹脂の流れを乱さないので、ボイドの発生を
防ぎ、樹脂とリードの密着性が向上し、外部からの水分
の浸入を防ぐ働きがある。In this embodiment, since the cross-sectional shape of the lead portion of the lead frame is rounded, the flow of the resin at the time of resin sealing is not disturbed. It has the function of improving the adhesion and preventing the intrusion of moisture from the outside.
【００１０】また、樹脂成分が均一化されるので、樹脂
の固化時にリードと樹脂間の応力を均一とする事ができ
る。Further, since the resin component is made uniform, the stress between the lead and the resin can be made uniform when the resin is solidified.
【００１１】[0011]
【発明の効果】以上のように本発明は、リードフレーム
の構造の一部を丸みを帯びた構造にすることにより、耐
湿性、密着性などの信頼性に優れたリードフレームを実
現するものである。As described above, the present invention realizes a lead frame having excellent reliability such as moisture resistance and adhesion by making a part of the structure of the lead frame round. is there.
【図１】本発明のリードフレームの一実施形態を示す平
面図FIG. 1 is a plan view showing an embodiment of a lead frame of the present invention.
【図２】本発明のリードフレームの一実施形態を示す断
面図FIG. 2 is a sectional view showing an embodiment of the lead frame of the present invention.
【図３】従来のリードフレームを示す断面図FIG. 3 is a sectional view showing a conventional lead frame.
１ ダイパッド ２ リード ３ リード断面 ４ リード断面（プレス加工） ５ リード断面（エッチング加工） 1 Die pad 2 Lead 3 Lead cross section 4 Lead cross section (press processing) 5 Lead cross section (etching processing)
Claims (1)
た形状にしたリードフレーム。1. A lead frame having at least a part of a cross-sectional shape rounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134597A JPH10270622A (en) | 1997-03-25 | 1997-03-25 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7134597A JPH10270622A (en) | 1997-03-25 | 1997-03-25 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10270622A true JPH10270622A (en) | 1998-10-09 |
Family
ID=13457826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7134597A Pending JPH10270622A (en) | 1997-03-25 | 1997-03-25 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10270622A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108279A (en) * | 2004-10-04 | 2006-04-20 | Matsushita Electric Ind Co Ltd | Lead frame and its manufacturing method |
| JP2009099871A (en) * | 2007-10-18 | 2009-05-07 | Toppan Printing Co Ltd | Lead frame and manufacturing method thereof, and resin-sealed semiconductor device and manufacturing method thereof |
| JP2016105506A (en) * | 2016-02-24 | 2016-06-09 | シャープ株式会社 | Light-emitting device |
-
1997
- 1997-03-25 JP JP7134597A patent/JPH10270622A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108279A (en) * | 2004-10-04 | 2006-04-20 | Matsushita Electric Ind Co Ltd | Lead frame and its manufacturing method |
| JP2009099871A (en) * | 2007-10-18 | 2009-05-07 | Toppan Printing Co Ltd | Lead frame and manufacturing method thereof, and resin-sealed semiconductor device and manufacturing method thereof |
| JP2016105506A (en) * | 2016-02-24 | 2016-06-09 | シャープ株式会社 | Light-emitting device |
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