JPH10270506A5 - - Google Patents

Info

Publication number
JPH10270506A5
JPH10270506A5 JP1997068286A JP6828697A JPH10270506A5 JP H10270506 A5 JPH10270506 A5 JP H10270506A5 JP 1997068286 A JP1997068286 A JP 1997068286A JP 6828697 A JP6828697 A JP 6828697A JP H10270506 A5 JPH10270506 A5 JP H10270506A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
lead
lead members
contact point
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997068286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10270506A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9068286A priority Critical patent/JPH10270506A/ja
Priority claimed from JP9068286A external-priority patent/JPH10270506A/ja
Priority to US08/895,557 priority patent/US6147398A/en
Priority to KR1019970041051A priority patent/KR100271011B1/ko
Publication of JPH10270506A publication Critical patent/JPH10270506A/ja
Publication of JPH10270506A5 publication Critical patent/JPH10270506A5/ja
Pending legal-status Critical Current

Links

JP9068286A 1997-03-21 1997-03-21 半導体装置 Pending JPH10270506A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP9068286A JPH10270506A (ja) 1997-03-21 1997-03-21 半導体装置
US08/895,557 US6147398A (en) 1997-03-21 1997-07-16 Semiconductor device package
KR1019970041051A KR100271011B1 (ko) 1997-03-21 1997-08-26 반도체장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9068286A JPH10270506A (ja) 1997-03-21 1997-03-21 半導体装置

Publications (2)

Publication Number Publication Date
JPH10270506A JPH10270506A (ja) 1998-10-09
JPH10270506A5 true JPH10270506A5 (enExample) 2005-02-24

Family

ID=13369384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9068286A Pending JPH10270506A (ja) 1997-03-21 1997-03-21 半導体装置

Country Status (3)

Country Link
US (1) US6147398A (enExample)
JP (1) JPH10270506A (enExample)
KR (1) KR100271011B1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360655B2 (ja) * 1999-07-08 2002-12-24 日本電気株式会社 半導体装置
JP2001223323A (ja) * 2000-02-10 2001-08-17 Mitsubishi Electric Corp 半導体装置
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US6576992B1 (en) * 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
SG120123A1 (en) * 2003-09-30 2006-03-28 Micron Technology Inc Castellated chip-scale packages and methods for fabricating the same
US6940013B2 (en) * 2003-11-14 2005-09-06 Vlt, Inc. Surface mounting a power converter
EP2291858B1 (en) * 2008-06-26 2012-03-28 Nxp B.V. Packaged semiconductor product and method for manufacture thereof
JP5303443B2 (ja) * 2009-12-07 2013-10-02 新電元工業株式会社 基板の積層固定構造、及び、基板の積層固定方法
EP2390909A1 (en) * 2010-05-24 2011-11-30 Jerry Hu Miniature packaging for discrete circuit components
DE102010062547B4 (de) * 2010-12-07 2021-10-28 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung einer Schaltungsanordnung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2565360B2 (ja) * 1987-12-25 1996-12-18 日本テキサス・インスツルメンツ株式会社 半導体装置
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
EP0423821B1 (en) * 1989-10-20 1995-12-20 Matsushita Electric Industrial Co., Ltd. Surface-mount network device
US5397916A (en) * 1991-12-10 1995-03-14 Normington; Peter J. C. Semiconductor device including stacked die
JP3232697B2 (ja) * 1992-09-14 2001-11-26 ソニー株式会社 樹脂封止型半導体装置
US5413970A (en) * 1993-10-08 1995-05-09 Texas Instruments Incorporated Process for manufacturing a semiconductor package having two rows of interdigitated leads
JPH088389A (ja) * 1994-04-20 1996-01-12 Fujitsu Ltd 半導体装置及び半導体装置ユニット
US5665648A (en) * 1995-12-21 1997-09-09 Hughes Electronics Integrated circuit spring contact fabrication methods

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