JPH10270454A5 - - Google Patents

Info

Publication number
JPH10270454A5
JPH10270454A5 JP1997068225A JP6822597A JPH10270454A5 JP H10270454 A5 JPH10270454 A5 JP H10270454A5 JP 1997068225 A JP1997068225 A JP 1997068225A JP 6822597 A JP6822597 A JP 6822597A JP H10270454 A5 JPH10270454 A5 JP H10270454A5
Authority
JP
Japan
Prior art keywords
temperature
heater
temperature sensor
reaction tube
measured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997068225A
Other languages
English (en)
Japanese (ja)
Other versions
JP4358915B2 (ja
JPH10270454A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06822597A priority Critical patent/JP4358915B2/ja
Priority claimed from JP06822597A external-priority patent/JP4358915B2/ja
Publication of JPH10270454A publication Critical patent/JPH10270454A/ja
Publication of JPH10270454A5 publication Critical patent/JPH10270454A5/ja
Application granted granted Critical
Publication of JP4358915B2 publication Critical patent/JP4358915B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP06822597A 1997-03-21 1997-03-21 半導体製造システム Expired - Lifetime JP4358915B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP06822597A JP4358915B2 (ja) 1997-03-21 1997-03-21 半導体製造システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06822597A JP4358915B2 (ja) 1997-03-21 1997-03-21 半導体製造システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009163640A Division JP5184455B2 (ja) 2009-07-10 2009-07-10 半導体製造システム、半導体製造方法、温度制御方法及び半導体製造装置のコントローラ

Publications (3)

Publication Number Publication Date
JPH10270454A JPH10270454A (ja) 1998-10-09
JPH10270454A5 true JPH10270454A5 (enrdf_load_html_response) 2005-02-17
JP4358915B2 JP4358915B2 (ja) 2009-11-04

Family

ID=13367665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06822597A Expired - Lifetime JP4358915B2 (ja) 1997-03-21 1997-03-21 半導体製造システム

Country Status (1)

Country Link
JP (1) JP4358915B2 (enrdf_load_html_response)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4878801B2 (ja) * 2005-09-26 2012-02-15 株式会社日立国際電気 基板処理装置、半導体装置の製造方法
JP5510991B2 (ja) * 2007-09-06 2014-06-04 株式会社日立国際電気 半導体製造装置及び基板処理方法
JP2012231145A (ja) * 2012-05-22 2012-11-22 Hitachi Kokusai Electric Inc 半導体製造システム、半導体製造方法、温度制御方法、温度制御装置及び半導体製造装置のコントローラ
CN113272940B (zh) * 2019-01-07 2024-03-26 株式会社国际电气 基板处理装置、半导体装置的制造方法以及加热器单元
US11056372B2 (en) * 2019-04-30 2021-07-06 Applied Materials, Inc. Low temperature biasable substrate support
JP2023141135A (ja) * 2022-03-23 2023-10-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
KR20250129622A (ko) * 2022-12-26 2025-08-29 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 시스템, 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램

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