JPH10223993A - Electronic circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit board which can be smoothly divided into subordinate substrates along breaking grooves at a high yield. SOLUTION: An electronic circuit board 10 is provided with an ceramic insulating substrate 2, breaking grooves 3, assumed boundary lines 6, and conductor patterns 11. The patterns 11 are formed so that the widths of the patterns 11 may become the narrowest at the parts A crossing the grooves 3, namely, at the parts corresponding to the boundary lines 6. The circuit board 1 is divided into individual subordinate substrates along the grooves 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic circuit board on which electronic circuits such as conductive patterns and electronic circuit components are arranged.

[0002]

2. Description of the Related Art Conventionally, when manufacturing an electronic circuit board suitable for a thick-film hybrid integrated circuit, a conductive pattern, a resistor pattern, and the like are printed on a single semi-baked ceramic insulator substrate. Forming a desired plurality of independent electronic circuit patterns,
And an electronic circuit is formed by fixing each pattern to a ceramic insulator substrate.

[0003] The electronic circuit board thus produced is
Since the ceramic becomes brittle by firing, it can be cut for each electronic circuit, and each cut electronic circuit is connected to other circuit elements and lead wires to form a thick film hybrid integrated circuit. Therefore, a large number of different types or the same type of electronic circuits can be formed on a single electronic circuit substrate, and mass production of a thick-film hybrid integrated circuit can be achieved.

By the way, in order to cut an electronic circuit board and divide it into each electronic circuit, the electronic circuit board must be cut along a boundary between the electronic circuits. For this purpose, a break groove is provided in advance along a boundary line assumed on the ceramic insulator substrate before semi-firing, and after the firing, it can be divided along the break groove by pressing or the like.

FIG. 5 is a top view showing a conventional electronic circuit board 1, wherein 2 is a ceramic insulator substrate, 3 is a break groove, 4 is a conductor pattern, 5 is a resistor pattern, and 6 is an assumed boundary line. Is shown. This electronic circuit board 1 has respective regions a, b, c, d divided by an assumed boundary line 6.
Then, an electronic circuit is formed by the conductive pattern 4 and the resistor pattern 5. 6 (a) and 6 (b) are an enlarged top view of a portion A ′ shown in FIG. 5 and a cross-sectional view taken along line BB of FIG. 6 (a). Since the break groove 3 is provided along each boundary line 6, the electronic circuit board 1 completed by firing is completed.
When the pressure is applied to the electronic circuit board 1, the electronic circuit board 1 is easily cut along the boundary line 6, and can be divided into each of the regions a, b, c, and d, that is, into each of the sub-boards having each electronic circuit.

[0006] Although not shown, a side surface electrode electrically connected to the conductive pattern 4 on the surface is provided on the side surface of each daughter board.

[0007]

However, in the above-mentioned conventional electronic circuit board, it is necessary to perform electroplating on the conductor pattern in order to reduce the resistance of the conductor pattern. The conductor pattern in each region is formed over the break groove so that plating is performed on all the conductor patterns in the process. However, when the electronic circuit board is divided into the respective regions, a portion straddling the break groove of the conductor pattern becomes an obstacle, and is not smoothly divided along the break groove, and chipping or cracking occurs in each child substrate. There's a problem.

Further, when the electronic circuit board is divided into the respective sub-boards, a defect that the conductive pattern is peeled off occurs, and the yield of the sub-boards is deteriorated.

The present invention has been made to solve such a problem, and has been made to solve such a problem. The present invention has been made to smoothly divide a child substrate along a break groove. It is another object of the present invention to provide an electronic circuit board having a high yield of the sub-board and a good yield.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention comprises forming a plurality of independent electronic circuits, forming break grooves along respective boundaries of the electronic circuits, In the electronic circuit board cut and divided for each of the electronic circuits along the boundary line, a plurality of conductor patterns constituting the electronic circuit are formed to be narrow at a portion straddling the break groove. I do.

According to the electronic circuit board of the present invention, since the conductor pattern is formed to be narrow at a portion straddling the break groove, it can be divided smoothly along the break groove.

[0012]

FIG. 1 (a) is a top view showing an embodiment of an electronic circuit board according to the present invention, and shows an enlarged view of the vicinity of a break groove of the electronic circuit board. FIG. 1 (b)
1 shows a cross-sectional view taken along the line BB in FIG. The same parts as those in the conventional example are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 1, a break groove 3 is provided along an assumed boundary 6 of the ceramic insulator substrate 2, and a portion A where the conductor pattern 11 straddles the break groove 3, that is, a portion corresponding to the boundary 6, is the most. It is formed so as to be narrow. Then, the electronic circuit board 10 is divided into the respective sub-boards 12 along the break grooves 3. Thereafter, as shown in FIG. 2, a side electrode 13 electrically connected to the conductor pattern 11 on the surface is formed on the side surface of each daughter board 12 by a method such as screen printing.

In order to manufacture such an electronic circuit board 10, a ceramic material is kneaded and pressed to form a ceramic insulator substrate 2. First, a break groove is formed along an assumed boundary line 6. When the ceramic insulator substrate 2 is pressed using the mold for forming the groove 3, the break groove 3 is formed at the same time. Next, the pressed ceramic substrate 2 is semi-baked, and after printing a pattern of an electronic circuit by the conductive pattern 11 and the resistor pattern 5, it is completely baked.

According to the electronic circuit board of the present embodiment as described above, the conductor pattern provided on the electronic circuit board is formed so as to be narrowest at a portion straddling the break groove, that is, at a portion corresponding to the boundary 6. Therefore, the electronic circuit board can be divided smoothly, and chipping or cracking does not occur in the sub-board. Therefore, the yield is improved in the manufacturing process of obtaining the sub-board from the electronic circuit board.

In addition, when the electronic circuit board is divided into the sub-boards, the occurrence of defects such as peeling of the conductive pattern is reduced. Therefore, a highly reliable child substrate can be obtained.

FIGS. 3 and 4 show the electronic circuit board 10 of FIG.
FIG. 4 shows a top view in the case where the daughter board obtained from FIG.

The electrodes 21 arranged on the motherboard 20 and the side electrodes 13 arranged on the side surfaces of the daughter board 12 have the same pitch so as to face each other. Then, the electrodes 21 on the motherboard 20 and the side electrodes 13 on the side surfaces of the child substrate 12 are formed.
Are fixed by solder 14 by reflow soldering or the like. At this time, the solder 14 creeps up along the side electrode 13 and has a large soldering area, so that a mechanically strong solder can be obtained.

Note that a protective layer 15 made of a resin potting layer is provided on the sub-substrate 12 in order to protect the elements mounted on the sub-substrate 12.

[0020]

According to the electronic circuit board of the present invention, since the conductor pattern provided on the electronic circuit board is formed so as to be narrow at a portion straddling the break groove, the electronic circuit board can be smoothly moved along the break groove. It can be divided, and chipping and cracking do not occur in the child substrate. Therefore, the yield is improved in the manufacturing process of obtaining the sub-board from the electronic circuit board.

In addition, when the electronic circuit board is divided into the sub-boards, the occurrence of defects such as peeling of the conductive pattern is reduced. Therefore, a highly reliable child substrate can be obtained.

[Brief description of the drawings]

FIG. 1A is a partially enlarged plan view showing an embodiment of an electronic circuit board according to the present invention, and FIG.

FIG. 2 is a partially enlarged perspective view of a child board obtained from the electronic circuit board of FIG.

FIG. 3 is a top view when the child board of FIG. 2 is mounted on a motherboard.

FIG. 4 is a sectional view taken along line IV-IV in FIG. 3;

FIG. 5 is a top view showing a conventional electronic circuit board.

6A is a partially enlarged plan view showing part A of the electronic circuit board of FIG. 2, and FIG. 6B is a cross-sectional view taken along line BB.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 3 Break groove 6 Boundary line 10 Electronic circuit board 11 Conductor pattern A Narrow part

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Koki Nishimura 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Kenji Kubota 2-26-10 Tenjin, Nagaokakyo-city, Kyoto Stock (72) Inventor Toshiro Adachi 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd.

Claims (1)

[Claims] 1. A plurality of independent electronic circuits are formed, break grooves are formed along respective boundaries of the electronic circuits, and cut and divided for each of the electronic circuits along the boundaries. An electronic circuit board, wherein a plurality of conductor patterns constituting the electronic circuit are formed to be narrow at a portion straddling the break groove.