JPH10223704A5 - - Google Patents

Info

Publication number
JPH10223704A5
JPH10223704A5 JP1997034368A JP3436897A JPH10223704A5 JP H10223704 A5 JPH10223704 A5 JP H10223704A5 JP 1997034368 A JP1997034368 A JP 1997034368A JP 3436897 A JP3436897 A JP 3436897A JP H10223704 A5 JPH10223704 A5 JP H10223704A5
Authority
JP
Japan
Prior art keywords
contactor
semiconductor wafer
ring
electrodes
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997034368A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10223704A (ja
JP3648699B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP03436897A priority Critical patent/JP3648699B2/ja
Priority claimed from JP03436897A external-priority patent/JP3648699B2/ja
Publication of JPH10223704A publication Critical patent/JPH10223704A/ja
Publication of JPH10223704A5 publication Critical patent/JPH10223704A5/ja
Application granted granted Critical
Publication of JP3648699B2 publication Critical patent/JP3648699B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP03436897A 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法 Expired - Lifetime JP3648699B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03436897A JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03436897A JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

Publications (3)

Publication Number Publication Date
JPH10223704A JPH10223704A (ja) 1998-08-21
JPH10223704A5 true JPH10223704A5 (enExample) 2004-12-24
JP3648699B2 JP3648699B2 (ja) 2005-05-18

Family

ID=12412240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03436897A Expired - Lifetime JP3648699B2 (ja) 1997-02-03 1997-02-03 ウエハの一括検査装置及びウエハの一括検査方法

Country Status (1)

Country Link
JP (1) JP3648699B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6498504B2 (en) 2000-08-28 2002-12-24 Nec Corporation Wafer inspection device and wafer inspection method
JP3921163B2 (ja) * 2000-09-26 2007-05-30 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
WO2002082528A1 (en) * 2001-04-04 2002-10-17 Fujitsu Limited Contactor device for semiconductor device and method of testing semiconductor device
EP1461628B1 (en) * 2001-12-27 2008-04-09 FormFactor, Inc. Cooling assembly with direct cooling of active electronic components
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6842029B2 (en) * 2002-04-11 2005-01-11 Solid State Measurements, Inc. Non-invasive electrical measurement of semiconductor wafers
JP4563700B2 (ja) * 2004-03-16 2010-10-13 東京エレクトロン株式会社 真空プローブ装置及び真空プローブ方法
JP5539033B2 (ja) * 2010-05-31 2014-07-02 株式会社日本マイクロニクス 半導体測定装置及び測定方法
JP5675239B2 (ja) * 2010-09-15 2015-02-25 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
TWI644109B (zh) * 2017-05-18 2018-12-11 漢民科技股份有限公司 半導體測試裝置
CN116654624B (zh) * 2023-05-06 2023-12-05 大可精密齿轮(浙江)有限公司 一种包括曳引驱动减速器的晶圆输送装置

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